2x2 module & stave layouts

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2x2 module & stave layouts. 2 options. “Small chip” “Big chip” Boundary between “small” and “big” is determined by the 6” sensor wafer layout that must be compatible with bump bonding (will become clear later) - PowerPoint PPT Presentation

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  • 2x2 module & stave layouts

  • 2 optionsSmall chipBig chipBoundary between small and big is determined by the 6 sensor wafer layout that must be compatible with bump bonding (will become clear later) Small chip has also a more natural number of rows & columns, but this is probably a minor issue for chip design.

  • ParametersNormal col. width x row height = 250um x 50um

    # cols total# rows total# ganged rows# long colsLong col widthSmall chip64324000Small 2x2 tile12865464450umSmall active edge 1x1 tile6432402450umbig chip70348000big 2x2 tile14070264450umbig active edge 1x1 tile7034802450um

  • Small 4-chip module34.834.837.5Active 32.8 x 32.810.015.0Flex pigtail (connector plugs into page)Pixel orientationFlex down to chip w-bonds0.2(vertical inter-chip gap 0.1mm)

  • Big 4-chip module37.137.839.9Active 35.8 x 35.110.015.0Flex pigtail (connector plugs into page)Pixel orientationFlex down to chip w-bonds0.2(vertical inter-chip gap 0.1mm)

  • Loaded module20 position connector would be used. Replace 10.22 dimension by 6.52gluechipssensorflexconnectorReduced scale1.0 mmstiffener

  • Small module outer staveEnd of stave card serving 8 modules (half a stave) along ZCan serve one face only (top or bottom) => 4 cards per staveOr can be a wrap-around end of stave card and serve both faces => 2 cards per stave.This way identical staves (including bus cable) design can be used over a wide radial range: 4 cards/stave at lower radius and 2 wrap-around cards per stave at higher radius

    34.826.8Module on back986mm38.4

  • Big module outer staveEnd of stave card serving 7 modules (half a stave) along Z (or 8 modules for 1082mm active length)Can serve one face only (top or bottom) => 4 cards per staveOr can be a wrap-around end of stave card and serve both faces => 2 cards per stave.This way identical staves (including bus cable) design can be used over a wide radial range: 4 cards/stave at lower radius and 2 wrap-around cards per stave at higher radius

    37.829.8Module on back946mm39.9

  • Small sensor 6 inch waferActive area = 7508 mm^2Sensor tiles shown with darker lineWafer scale flip chip compatible. Chips shown with lighter line. The name small 2x2 tile comes from the wafer layout.A slightly larger chip and therefore larger 2x2 tile is possible, but only 6 such large 2x2 tiles will fit on a 6 wafer.

  • Big sensor 6 inch waferActive area = 7539 mm^2Sensor tiles shown with darker lineWafer scale flip chip compatible. Chips shown with lighter line.

    OPTION to make 4 6-chip modules per wafer instead of 6 4-chip modules.

  • Small single chip moduleUsing same chip as 4-chip module (hence small)Active edge sensor2-side abuttable format 16.416.216.218.7active

  • Big single chip moduleUsing same chip as 4-chip module (hence small)Active edge sensor2-side abuttable format 17.917.717.419.9active