CERN SPD meeting, 4/06/2002V. Manzari for Bari SPD-Group

1

Half-stave assemblyHalf-stave assembly

Gluing procedure & glue characteristicsStatus of dummy components

CERN SPD meeting, 4/06/2002V. Manzari for Bari SPD-Group 2

Half-stave assembly Carrier Bus

MCM+ optical fiber

Ladder 1

Extender Bus

Gluing A

Gluing B

Carbon fiber sectorGluing C

Ladder 2

- Schematic view of half-stave components and assembling

- Draft version of a Glue Requirement Document ready

Grounding Foil

CERN SPD meeting, 4/06/2002V. Manzari for Bari SPD-Group 3

Gluing AMCM and Ladders to Carrier-bus

Electrical insulating

Thermal conductive

Removable ?Proper gluing underneath wire bonding pads and module planarity

Elasticity modulus to reduce mechanical stress

No Pressure required for gluing

Max cure temperature <100°C

Thickness < 100 µm

Gluing A: glue characteristics

Carrier BusLadder 2

Ladder 1

MCM+ optical fiber

Extender Bus

CERN SPD meeting, 4/06/2002V. Manzari for Bari SPD-Group 4

Gluing A Assembly procedure

Step 2-A1 glue deposition layer

Step 1-Alignment

Step 3- Carrier-bus + A support alignment and contact

Multilayer Carrier-bus + A support

Ladder 2 Ladder 1 MCM

5V. Manzari for Bari SPD-Group CERN SPD meeting, 4/06/2002

Step 4- A support separation and A2 glue layer deposition

Extender (LV & Bias)

Supporto B

Step 6- B support clumpingLadder2 Ladder1

MCM

Optical fiber

Multilayer Carrier bus Extender (L

V &

Bias)

Multilayer Carrier bus Extender (L

V &

Bias)

Step 5- Extender alignment and contact

CERN SPD meeting, 4/06/2002V. Manzari for Bari SPD-Group 6

Gluing BAssembly A to Grounding-foil

Electrical conductive

Thermal conductive

Removable ?

Proper gluing on whole interface and good planarity

Elasticity modulus to reduce mechanical stress

Thickness, temperature step and required pressure as gluing A

Glue B characteristics:

Currier Bus

Grounding FoilMCM + optical

fiber Ladder 1

Extender BusLadder 2

CERN SPD meeting, 4/06/2002V. Manzari for Bari SPD-Group 7

Gluing BAssembly A to Grounding-foil

Good glue control to avoid FE chip wet (bumps and pads)

possible solution (under-filling, mechanical protection …..)

Grounding-foil equipped with sensor temperature ? (1 for FE chip)

To be studied

CERN SPD meeting, 4/06/2002V. Manzari for Bari SPD-Group 8

Gluing CHalf-stave to Sector

Electrical insulating

Thermal conductive

Extremely smooth for a good thermal coupling

Good gluing rigidity for a good clamping between the half-stave and carbon fiber sector

Necessary removable for reworking

Glue A characteristics:

Padova competence

CERN SPD meeting, 4/06/2002V. Manzari for Bari SPD-Group 9

Glue Overview

Producer name Glue Name Application / description

PropertiesThermal Conductivity

(W/m°C)gluing type Status

AAVID Thermalloy

thermalbond Epoxyelectrical insulating

1,34 gluing A available

paltier technik NEE001 siliconelectrical insulating

0,2 gluing A available

Ciba-Geigy Araldite 2001Epoxy with Boron-

Nitrideelectrical insulating

0,87 gluing A available

Eccobond 45 flexible

Epoxyelectrical insulating

0,35 gluing A to cantact

Ablefilm 5025film thick

50,75,100 micronelectrical

conductivegluing B to cantact

Cookson Electronics

Staystik 541 Thermoplasticelectrical insulating

gluing A-B to cantact

AIT gluing A-B to cantact

Emerson cuming

Technical consult with minute that explain the

half-stave assembly requirement.

CERN SPD meeting, 4/06/2002V. Manzari for Bari SPD-Group 10

Thermoplastic filmsCookson (Staystic)

TYPICAL PROPERTIES 541 642 442 842Filler Material Silver AIN NONE ALUMINIA

Attach Temparautre Range 100°C 150°C 100°C 150°C 100°C 150°C 100°C 150°C

Continuous Range -65°C 100°C -65°C 100°C -65°C 100°C -65°C 100°C

Max Excursion Temperature 200°C 200°C 200°C 200°C

Thrmal Conductivity (W/m°K) >3.0 >1.0 <0.25 <0.6

Volume Resistivity (ohm*cm) <5x10 -̂2 >1x10 9̂ >1x10 9̂ >1x10 9̂

Die Shear Adhesion @25°C >1000psi >1000psi >1000psi >1000psi

Elastic Modulus (psi) >400000 >400000 >400000 >400000

Glass Transition Temp. (Tg) >16°C >16°C >16°C >16°C

Shelf Life @25°C 1 Year 1 Year 1 Year 1 Year

CERN SPD meeting, 4/06/2002V. Manzari for Bari SPD-Group 11

Dummies production statusfor glue test

Ladders

MCM ?

Carrier bus

Extender Bus

Grounding foil

several glass samples 150 and 300 μm thick

silicon sensor ladders 300 μm thick + FE chips 750 μm thick

multilayer Al foils

ordered AP 9121 ( kapton foil 50 μm thick with a copper layer on each side 35 μm thick)

To be defined

CERN SPD meeting, 4/06/2002V. Manzari for Bari SPD-Group 12

Glass dummies production for glue studies

CERN SPD meeting, 4/06/2002V. Manzari for Bari SPD-Group 13

Glass dummies production for gluestudies

Diamond saw

CERN SPD meeting, 4/06/2002V. Manzari for Bari SPD-Group 14

Micrometric measurement system

Mitutoyo Apex 9166(Fully dedicated to ALICE- SPD activities)

Suitable to be equipped with a Vision Probe device for no-contact measurements in all 3 axis.

CERN SPD meeting, 4/06/2002V. Manzari for Bari SPD-Group 15

What next?

Define the missing dummies Bump-bonded ladders MCM Grounding foil

Contact glue producer Available glues:

Araldite 2011, Thermalbond, NEE001……. Next: thermoplastic adhesive films and paste

Start a campaign of tests with dummies and different glues