2x2 module & stave layouts

2 options

• “Small chip”• “Big chip”• Boundary between “small” and “big” is determined by the

6” sensor wafer layout that must be compatible with bump bonding (will become clear later)

• “Small” chip has also a more natural number of rows & columns, but this is probably a minor issue for chip design.

Parameters

# cols total

# rows total

# ganged rows

# long cols

Long col width

Small chip 64 324 0 0 0

Small 2x2 tile 128 654 6 4 450um

Small active edge

1x1 tile

64 324 0 2 450um

big chip 70 348 0 0 0

big 2x2 tile 140 702 6 4 450um

big active edge

1x1 tile

70 348 0 2 450um

Normal col. width x row height = 250um x 50um

“Small” 4-chip module

34.8

34.8

37.5

Active 32.8 x 32.8

10.0

15.0Flex pigtail (connector plugs into page)

Pixel orientation

Flex down to chip w-bonds

0.2

(vertical inter-chip gap 0.1mm)

“Big” 4-chip module

37.1

37.8

39.9

Active 35.8 x 35.1

10.0

15.0Flex pigtail (connector plugs into page)

Pixel orientation

Flex down to chip w-bonds

0.2

(vertical inter-chip gap 0.1mm)

Loaded module

20 position connector would be used. Replace 10.22 dimension by 6.52

glue

chips

sensorflex

conn

ecto

rReduced scale

1.0

mm

stiffener

“Small” module outer stave

…

End of stave card serving 8 modules (half a stave) along ZCan serve one face only (top or bottom) => 4 cards per staveOr can be a wrap-around end of stave card and serve both faces => 2 cards per stave.This way identical staves (including bus cable) design can be used over a wide radial range: 4 cards/stave at lower radius and 2 wrap-around cards per stave at higher radius

34.8 26.8

Module on back

986mm

38.4

“Big” module outer stave

…

End of stave card serving 7 modules (half a stave) along Z (or 8 modules for 1082mm active length)

Can serve one face only (top or bottom) => 4 cards per staveOr can be a wrap-around end of stave card and serve both faces => 2 cards per stave.This way identical staves (including bus cable) design can be used over a wide radial range: 4 cards/stave at lower radius and 2 wrap-around cards per stave at higher radius

37.8 29.8

Module on back

946mm

39.9

“Small” sensor 6 inch wafer

• Active area = 7508 mm^2

• Sensor tiles shown with darker line

• Wafer scale flip chip compatible. Chips shown with lighter line.

• The name “small” 2x2 tile comes from the wafer layout.

– A slightly larger chip and therefore larger 2x2 tile is possible, but only 6 such “large” 2x2 tiles will fit on a 6” wafer.

“Big” sensor 6 inch wafer

• Active area = 7539 mm^2• Sensor tiles shown with darker line

• Wafer scale flip chip compatible.

Chips shown with lighter line.

• OPTION to make 4 6-chip modules per wafer instead of 6 4-chip modules.

“Small” single chip module

• Using same chip as 4-chip module (hence “small”)• Active edge sensor• 2-side abuttable format

16.4

16.2

16.218.7

active

“Big” single chip module

• Using same chip as 4-chip module (hence “small”)• Active edge sensor• 2-side abuttable format

17.9

17.7

17.419.9

active