Tower Electronics Module and Tower Power Supply

EM Tower Electronics Module (TEM) before coating/staking

TEM & TPS assembly

• Close to 60 TEM & TPS assemblies in the field used as EGSE for CAL, TKR, DAQ, FSW, I&T

• All flight drawings released

• Flight PCB’s fabricated

• All enclosures fabricated

• One flight PCB loaded at SLAC with flight-lot components for testing; passed tests

• Flight assembly contract in place

• All components kitted, will be sent to assembler 9/22/04

GASU (Global Trigger, ACD, Signal-Distribution Unit)

EM GASU (before harness routing)

GASU Assembly

• 15 GASU assemblies in the field used as EGSE for ACD, DAQ, FSW, I&T

• All flight drawings submitted for review/release

• Flight PCB’s contract in procurement

• SOW for GASU assembly in progress

• All components ordered

• Components to be kitted end of September

PDU (Power Distribution Unit)

EM PDU (before harness routing)

PDU Assembly

• 5 PDU assemblies in the field used as EGSE for DAQ, FSW, I&T

• All flight drawings submitted for review/release

• Flight PCB’s requisition in progress

• SOW for PDU assembly in progress

• All components ordered

• Components to be kitted end of September

PDU (Power Distribution Unit)

EM SIB

SIU/EPU Crate Assembly

• 5 cPCI SIU/PDU assemblies in the field for DAQ, FSW, I&T

– Enclosure– PCI Backplane– Crate Power Supply Board– Storage Interface Board (SIB)– LAT Communication Board (LCB)– BAE Processor Board

• Mechanical flight drawings submitted for review/release

• Electrical flight drawings almost ready for review/release

• All components ordered

• Components to be kitted by end of October