c. haber 6-mar-08 integrated stave electrical/mechanics/cooling update march 6, 2008
TRANSCRIPT
C. Haber 6-Mar-08
Integrated StaveElectrical/Mechanics/Cooling
UpdateMarch 6, 2008
C. Haber 6-Mar-082
6 x 3 cm, 6 chips wide
10 x 10 cm, 10 chips wide
1 meter, 3 cm strip, 30 segments/side192 Watts (ABCD chip), ~2.4 % Xo + support structure
1 meter, 2.5 cm strip, 40 segments/side200-250 Watts (@0.25 W/chip) ~1.9 – 2.2 % Xo + support
Stave-07
Stave-06
60 cm, 9 cm strip, 6 segments/side
Stave-08
Prototypes and Designs
Build and test
Study
C. Haber 6-Mar-083
Introduction
• With regard to the Single Sided approach, the arguments about simplicity, material, and cost, have been presented already.
• This effort is tightly coupled to the alternative powering efforts, in particular serial, but we would hope to include aspects of DC-DC as well, in the future.
• We are concerned that in a large, for example, serial system, grounding, shielding, and modularity issues may be critical
• Our goal, therefore, is to build and test a realistic scale system early-on, and include enough options and flexibility to be useful.
• With regards to the above, and also to assembly and production issues, we want to confront as much of the full problem as possible, now.
C. Haber 6-Mar-084
Aspects
• Status overview
• Components
• Fixtures
• Electrical testing
• Additional critical tests
• Alternatives
C. Haber 6-Mar-085
Issues From Valencia
• Progress on testing and fabrication of Stave-07
• Irradiation of hybrids glued directly on silicon surface
• Thermal performance of bridged hybrid
• Planning for Spring 2008 module review
C. Haber 6-Mar-086
Status Overview
• Central goal is assembly and test of Stave-2007. Confront assembly, test, and measurement issues relevant to future
• Have built ~30 hybrids , and operated 5 in a serial chain with good performance
• Have built and are studying 4 modules with hybrid on the silicon and 1 “reference” module with hybrid off the silicon
• Effort on gluing and alignment procedures implicit in module building
• Bus cable has been fabricated– Extra clock lines have been added to allow options for clock
distribution included 1 clock for 30 module or 1 clock for 10 modules
• All components required to build Stave-2007 are in-hand.• Bridged hybrid has been further simulated and clarified• Irradiation plans underway
C. Haber 6-Mar-087
Components
• 3 cm p-in-n sensors based upon ATLAS-98
• Fanouts – from SCT
• 6 ABCD chip, serial powered ceramic hybrid– Approx 30 built and tested with good yield
• Stave mechanical core– Ready and waiting
• Assembly fixtures– In use
• Interface pc boards
• Bus cable fabrication complete, delivered
• DAQ system (NI-PXI card + LV software)
• Power supplies
C. Haber 6-Mar-088
6 ABCD BeO Ceramic Hybrid
• ~30 fabricated and tested
• Yield is (surprisingly) good!
• Represents a density maxima
• Includes HV-GND options within serial scheme
• Analog performance is right-on-target
• Ceramic flatness is engineered by printing but not perfect.
Groundlayer
Powerlayer
Analog power
Digital power
Analog current
LVDS section Serial power section
C. Haber 6-Mar-089
Hybrid HV-GND options
HV in
HV Gnd
AV-MOD
AG-MODAC gnd
C. Haber 6-Mar-0810
Fixtures for Assembly AND Test
C. Haber 6-Mar-0811
Module Assembly and Test Fixture
volve asingle fixture for assembly, bonding, inspection, and test.
C. Haber 6-Mar-0812
Bus Cable Signal Layout
Serial current linkSerial currentreturn
HV distribution
Clock &Commandlines
DataReadout1/hybrid
Port Card
C. Haber 6-Mar-0813
Bus Cable: Shielding
l foil, 50 um thick, canbe grounded to each hybrid
C. Haber 6-Mar-0814
DAQ
C. Haber 6-Mar-0815
HV Supply for 30 step serial system
• GENH 150-5
• 0-150 V
• 0-5 A
• Constant current or constant voltage mode
• 30 step ABCD system will require ~120 V and 0.75 A.
• Supply is in-hand, preparing to test using hybrid test board daisy chain and then bus cable
C. Haber 6-Mar-0816
Electrical testing
• Hybrid performance– verified
• Serial powering with increasing drops– 5 OK, new supply allows full 30 drop test
• Data transmission in a multi-drop system– 5 test board system OK, now confront full bus cable, Santa Cruz
• Module performance– In progress, see slides
• Grounding and shielding on a stave– upcoming
• Effect of glue
• Radiation effects
C. Haber 6-Mar-0817
Module Performance
• Reference module (hybrid off silicon) shows excellent performance, low leakage, low noise, and correct gain
• Assembly of 4 “hybrid-on” modules has been a learning curve and not without incident
• One module shows good leakage and analog performance while the others have larger currents.
• Adopting additional safeguards and procedures in order to control performance.
• Note – for Stave-06 multiple good “glued-on” modules were built and characterized
Input noise @ 2fc
ref
Glued on
C. Haber 6-Mar-0818
continued
Ref Glued on
C. Haber 6-Mar-0819
Additional Critical Tests
• Glue studies– Once we get the module assembly process under-control, plan a
systematic glue testing program
– Temperature cycling
– Load with thermal filler (BN)
– …
– Needs to be repeated on n-in-p sensors as well.
• Irradiations– See slides
• Bridged hybrid– See slides
C. Haber 6-Mar-0820
Irradiation plans
• Irradiations are in planning phase both at BNL and LBNL• BNL is looking at BNL, Boston, and Los Alamos sites• LBNL would use on-site 55 MeV protons• Hope to have first runs in the next few months• A key set of questions here are what would constitute a
meaningful measurement?– Conditions– Particle type– Specifics of detector design
• One point of view holds this to be purely a surface issue which could be addressed with a gamma source…opinions?
• Ultimate skepticism?• Note: CDF and D0 have run with glued hybrids for >5 years
C. Haber 6-Mar-0821
Alternatives
• The bridged hybrid has always been the ATLAS preference
• FEA indicates reasonable performance for this alternative
• However the ultimate material reduction would come from reducing the hybrid substrate even more– A kapton flex or other thin film hybrid with essentially no substrate,
glued directly on the silicon, would minimize material
– We are not wed to the ceramic technology – it was convenient and low risk for us.
– We would be happy to see others pick this challenge up and move it forward!
– Since the 6 chip serial hybrid is known to work electrically, we are importing the layout into a fine-pitch printed board design which could be adopted for flex or other etched approaches. We can make this available to the community.
C. Haber 6-Mar-0822
FEA Models of Bridged Hybrid - I• Since the Valencia meeting we have completed FEA analysis of basic
thermal performance with bridged hybrid• Multiple models to achieve reliability and understanding• ¼ simple model, similar to ANSYS model by others, air treated as “solid”
under bridge• ½ model with air box to allow for 3D air effects (not just under bridge), no
air flow
Air gap
¼ model
Air box for 1/2
½ model
C. Haber 6-Mar-0823
FEA Models of Bridged Hybrid -II
Multi-hybrid model
• Multi-hybrid model, with air flow included(so far 0.01 m/sec)
• For simplicity, all studies so far done with tube wall temperature fixed at -28C, 0.25 W/IC and no detector heating.
• Goal is to compare first with glued hybrid under same conditions
• More details are here and here
C. Haber 6-Mar-0824
Short Summary• Good agreement among models
• Modest effect of gas flow
• Reduced K means lower than nominal K in structure. No optimization of structure yet
• For comparison, nominal design (hybrids glued on silicon) for comparable assumptions yields max sensor temperature of about -22.5C
Model IC Peak
Temp(C)
Bridge
Gradient(C)
Sensor
T Max(C)
¼ model -5.8 6.6 -20
½ model -6.3 6.8 -20.2
With air flow
-15C gas
-5.9 7.6 -18.7
¼ model
Reduced K
3.4 5 -16.7
C. Haber 6-Mar-0825
Conclusions
• Focused attempt to address the plans and issues discussed in Valencia
• All components for Stave-2007 are in-hand
• Approach is friendly to alternatives – bridges etc
• We welcome the participation, input, or suggestions of the community
• Look forward to preparing for the June review