STAVE ASSEMBLY- STATUS

•Drawings for half stave assembly jig are concluded

•The jig is assembled

•Test on1.Module gluing2.Module handling3.Module alignment

are starting

•Drawings of tools for module gluing test are concluded 1. for glue 2. for adhesive tape

•Tools have been fabricated.

•Drawings for stave assembly jig are ongoing

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• STAVE: assembly of 2 half-staves• HALF-STAVE:

• outer layers: 7 modules

• MODULE: 7x2 chips for all layers• FPC (Flex Printed Circuit): Al or Cu

on polymide (X/X0: ~ 0.8->1 %)• POWER BUS: Al on polymide

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BASE and RAILS

MODULE BOX

ALIGNMENT STATION

REMOVABLE BASE

HALF STAVE ASSEMBLY JIG

• The base and rails: to put the module in position

• The alignment station: to handling and aline the modules

• The module box: to store, carry and prealign the modules

• The removable base: to accomodate the cold plate, to interconnect the modules and to position the BUS cable

PROCEDURE FOR THE HALF STAVE ASSEMBLY (1)• The cold plate is put in position by two pins

and taken by vacuum on the removable base

Pin for cold plate positioning

Cold plate in taken position by vacuum

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• The glue (or adhesive tape is spread)

• With an alignment station the modules are taken from the box and positioned on the cold plate under a measuring machine.

Second module in the box ready to be aligned

First module positioning

Six module aligned

Last module positioning

module

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PROCEDURE FOR THE HALF STAVE ASSEMBLY (2)• The base holding the aligned modules

glued onto the cold plate can be removed for Module interconnection and BUS positioning

HALF STAVE ASSEMBLY JIG

The jig is completed and assembled under the Mytutoyo measuring machine. It will be used for:- Module handling test- Module alignment test- Half stave assembly

BASE and RAILS

MODULE BOX

ALIGNMENT STATION

REMOVABLE BASE

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FIRST HALF STAVE PROTOTYPE-FIRST DECISIONS

OPEN POINTS on JAN 2014:1. Module with carbon plate or not (?)2. Adhesive tape or glue (?) between cold

plate and modules. 3. Module marker on chips visible through

FPC or placed on FPC (?)4. Module box definition5. Mytutoyo or Poli measuring machine (?).

[The base is removable to cover the 1,5m stroke in case we use the Mytutoyo measuring machine].

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For the FIRST HALF STAVE PROTOTYPE:1. Modules without carbon plate2. Glue will be used, but test with adhesive tape

will be done.3. Module marker are on FPC for first dummy

modules, but then the marker will be on chips visible through FPC.

4. The Module box has been defined and prototypes are on going

5. Mytutoyo measuring machine will be used.

TEST ON MODULEGLUING TEST

Tools for module gluing test with glue and adhesive tape.Masks to use both solutions are in fabrication

First test with mask used by BARI group

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TEST ON MODULEHANDLING MODULE SYSTEMS [CAGLIARI]

Suction cups

springs

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TEST ON MODULEMODULE HANDLING and MODULE ALIGNMENT [with Cagliari]

FPC LAYOUT

REFERENCE POINTS

«dummy-dummy Modules!»

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STAVE ASSEMBLY JIG

Check the compatibility with masks for the reference points.

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NEXT STEPS

• Test on module gluing

• Test on adhesive tapes

• Test on module handling

• Half stave assembly

• Verify the compatibility between stave assembly jig and the mask for the positioning of the stave reference points on end wheels.

• Foresee the possibility to test the module just after gluing (the detectors are hidden by the cold plate and the FPC).

• Conclude drawings for stave assembly jig.

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Simple circuits for soldering tests

• Different pad dimensions: • 1,2 x 0,6 mm • 1 x 0,3 mm

• Different pad pitch• 0,4 mm • 0,3 mm

S. Beolè

connection bridge

Cu lines onkapton

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Pads for interconnection between FPCs

• home made kapton bridges: pads size can be chosen according to chip pad layout

kapton flex

FPC FPC

TIN

kapton flex

by Michele Sacchetti

• arrays of SMD resistors (0 W) 0603 –> W 1-1.6mm L= 2-3.2 mm P=0.5-0.8mm

S. Beolè