rfid in the world of printed electronics
DESCRIPTION
RFID in the world of Printed Electronics Application/Cost/Supply ChainTRANSCRIPT
RFID in the world of Printed Electronics
Application/Cost/Supply Chain
Dr. Andreas Schaller
ASC Andreas Schaller Technology Consulting
Dr. Andreas Schaller
RFID in the world of Printed Electronics1
SMT Hierarchy
RFID in the world of Printed Electronics2
Connections between physically separate
systems such as host computer to
terminals, computer to printers, and so on.Level 5 Connections between systems
Level 4 Subassembly
Level 3 Connections between PWBs
Level 2 Printed Wiring Board (PWB)
Level 1 Integrated Circuits
Level 0 Monolithic Silicon Chip Gate-to-gate interconnections on a
monolithic silicon chip
Connections between two subassemblies.
For example, a rack or frame may hold
several shelves of subassemblies that
must be connected together to make up a
complete system.
Connections between PWBs, including
PWB-to-PWB interconnections or card-to-
motherboard interconnections.
Printed wiring board (PWB) level of
interconnections. Printed conductor paths
connect the device leads of components
to PWBs and to the electrical edge
connectors for off-the-board
interconnection.
Packaging of silicon chips into dual-in-line
packages (DIPs), small outline integrated
circuit (SOICs), chip carriers, multichip
packages, and so on, and the chip-level
interconnects that join the chip to the lead
frames.
PET Hierarchy
RFID in the world of Printed Electronics3
Level 5 Connections between systems Ambient Intelligence
Level 4 Subassembly System Integration
Level 3 Connections between PWBs Smart System
Level 2 Printed Wiring Board (PWB) System-in-Foil
Level 1 Integrated Circuits Functional Layers
Level 0 Monolithic Silicon Chip Printable InkSilver Ink
Printed
Antenna
RFID Label
Battery Assisted
Label
Smart Package
RFID System
SMT PET Example
PET Applications and KPI
RFID in the world of Printed Electronics4
PET Products
Large Area Printing
Small Feature Printing
min
PET Market Players examples only
RFID in the world of Printed Electronics5
PET Benefits beyond cost
RFID in the world of Printed Electronics6
Smart Objects are driven by LEVEL 5
(Content driven) Connectivity enables an object to become ”smart”
Flexible Electronics is driven by LEVEL 4
Customer Benefits is flexible-to-install vs. flexible-to-use
Integrated Smart Systems are driven by LEVEL 3
Application driven system integration
Large Area Electronics is driven by LEVEL 2
Macro electronics for functional area maximization (vs. microminiaturization)
Printed Electronics is driven by LEVEL 1
Low cost and environmental preferred manufacturing
Organic(Inorganic) Electronics is driven by LEVEL 0
Multi-functional materials for electronic and sensing functions
Printed RFID Markets
RFID in the world of Printed Electronics7
Ticketing (Disposable)
(Integrated Smart System)Pharma (New Services )
(Smart Objects)
ehealth ( Hygiene )
(Integrated Smart System)
eMarketing ( HMI )
(Large Area Electronics )
Games (New Services)
(Smart Objects)
All use cases are disposable !
System Integration (SMT)
RFID in the world of Printed Electronics8
<
40
<
20
<
10
Gross Margin in %
System Integration (RFID)
RFID in the world of Printed Electronics9
Packaging
Battery
> 0,10 €
< 5 €
System Integration (pRFID V1)
RFID in the world of Printed Electronics
10
R2R Q↑
Battery
Packaging Packaging
> 10 €
€ TBD
System Integration (pRFID V2)
RFID in the world of Printed Electronics
11
S2S Q↑
Battery
Packaging Packaging
~ 0,10 €
System Integration (pRFID V3)
RFID in the world of Printed Electronics
12
R2R
Battery
Packaging Packaging
€ TBD
> 10 €Packaging
System Integration (PET)
RFID in the world of Printed Electronics13
Additional Printed RFID Components
RFID in the world of Printed Electronics14
Contact Readout Conductive Readout RF Readout
Passive
Active
(Sensing)
ROM /WORM
RAM ROM /WORMROM /WORM
WORM / RAM
Primary Batteries Primary / Secondary Batteries
Sensing !
Smart Packaging Examples
RFID in the world of Printed Electronics15
Smart Packaging
Non-Inductive Tag Printed EAS Tag Printed RFID Tag UHF RFID Tag Hybrid Tag
Comparison
………… …… …………
Smart Packaging Costs
RFID in the world of Printed Electronics16
Ink
(Organic and/or Inorganic)
Foils and/or Paper Inkjet / Gravure / Screen
Printing
Assembly
(Lamination)
Lamination
Labeling
(none if integrated)
Battery and/or IC
Antenna and/or Sensor
Connectingwire / wireless
Tagged Object
( included in BOM)
Costs Comparison
RFID in the world of Printed Electronics17
RFID
RFID
Optimized Costs
RFID in the world of Printed Electronics18
RFID
RFID
Printing
Foils
Inks
Added Value ?
Active Systems
RFID in the world of Printed Electronics19
Active
System
Smart Packaging Cost Drivers
RFID in the world of Printed Electronics20
Component System
Passive Harvesting Active
Active
Passive
Driven by Higher PET Levels
Driven b
y L
ow
er
PE
T L
evels
Level 0 / Level 1 / Level 2 / Level 3 Level 0 / Level 1 / Level 2 / Level 3 Level 0 / Level 1 / Level 2 / Level 3
Cost %
Cost %
TBD TBD
Printed Sensor Tag
RFID in the world of Printed Electronics21
System-in-Foil
Write
Function : SensingEnergy Harvesting
Even
tD
ata
Function : Storing
Info
rmat
ion
Function : Computing
Function : ConnectingEnergy Harvesting
Kn
ow
led
ge
Rea
d / W
rite
Cost Breakdown
RFID in the world of Printed Electronics22
Passive System
Running Costs
Foils
Row Material Ink
Screen Gravure
Alignment Lamination
% Cost = Bill Of Material (BOM) + Conversion Costs (CC)
Bill Of Material (BOM)= cost of purchased row materials, sub-assemblies, components, parts
Conversion Costs (CC)= cost of changing row materials into finished or semi-finished products
Optimization Potential (Theoretical)
RFID in the world of Printed Electronics23
Level Action Potential for Reduction
• Level 5 : Update only Infrastructure Firmware
• Level 4 : Integrate Automated Inline Customization - 50%
• Level 3 : Focus on Passive Solutions
• Level 2 : Reduce Numbers of Layers (Avoid Alignment) - 85%
• Level 1 : Switch from Batch to Inline Printing Processes - 50%
• Level 0 : Change from Contactless (13.56 MHz) to a
Sweep/Contact Readout - 40%
Passive System
Running Costs
Foils
Row Material Ink
Screen Gravure
Alignment Lamination
- 60%
% Cost = Bill Of Material (BOM) + Conversion Costs (CC)
Net Present Value Breakdown
RFID in the world of Printed Electronics24
% Net Present Value (NPV)
Net Present Value (NPV) = Method for using the time value of money to appraise long-term projects
Interest Rate =15%
Profit Margin [Level]
Questions ?
RFID in the world of Printed Electronics25
Andreas Schaller Technology Consulting Unternehmergesellschaft (haftungsbeschränkt)
Dr. Andreas Schaller
Email : [email protected]
Andreas Schaller Technology Consulting Unternehmergesellschaft (haftungsbeschränkt)
Office : Schulstr. 11, 95676 Wiesau
Management : Dr. Andreas Schaller
District Court : AG Weiden, HRB 3499