organic and printed electronics

5th Edition

A working group within

Organic and Printed ElectronicsApplications, Technologies and Suppliers

6th International Exhibition and Conference

for the Printed Electronics Industry

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Messe München, Germany

Conference: May 26–28, 2014

Exhibition: May 27–28, 2014

2nd picture from above: Audi AGOrganic solar cell: Fraunhofer ISE

May

Organic and Printed ElectronicsApplications, Technologies and Suppliers

2 ORGANIC AND PRINTED ELECTRONICS

03 Editorial

Printed Electronics in Your Hands!

04 Welcome to the OE-A

10 OE-A Roadmap for Organic and Printed Electronics

30 The Future of Printed Products – Interactive Cover Page

32 Organic and Printed Electronics:

OE-A Demonstrators Illustrate the Potential

34 Market for Organic and Printed Electronics

36 List of OE-A Members Represented

102 Competence Matrix

114 OE-A Members

120 Imprint

ContentsContents

ORGANIC AND PRINTED ELECTRONICS 3

Printed Electronics in Your Hands!

A special edition of this issue includes an interac-

tive cover page, which can light up! In keeping

with our tradition of providing functional give-

away demonstrators in our brochure, we are

pleased to present to you a multifunctional

printed electronics device that is directly inte-

grated in the cover page for the first time. This

impressively shows how thin, lightweight and

flexible printed electronics can add functionality

to traditional print products such as journals or

packages, thus enabling a completely new class

of products and possibilities – applications in

advertising and marketing are just a few exam-

ples. The interactive cover page was produced

by OE-A members in an automated process; it

shows that this new technology has reached the

manufacturing state in which is can be inte-

grated into real products.

This industry is moving at an impressive speed,

is acting globally and is now witnessing new

products entering the market. The combination

of printed and classical electronics and the inte-

gration of printed electronics into systems are

general trends that are taking place in major

fields like automotive, consumer electronics,

printing and packaging, architectural, pharma-

ceutical and medical applications as well as in

textiles and fashion.

More and more products are entering our daily

life. OLED displays and lighting, packages that

light up, touch screens and switches for a variety

of surfaces, flexible solar cells and batteries, self-

dimming rear-view mirrors in cars, or printed

sensors in diabetes test strips and smart packag-

ing for the pharmaceutical industry are just a few

examples in which organic and printed electron-

ics reaches everybody.

At this point in the cycle, it is even more impor-

tant for our community to have an international

platform for the exchange of information, for

collaboration and cooperation. Our supply chains

are international and globally linked, and the

OE-A facilitates the establishment of these sup-

ply chains through a variety of activities which

ultimately help the industry to grow. The start of

international standardization activities under the

leadership of IEC – and supported by the OE-A –

is another important signal that this emerging

industry is entering a next level of maturity.

The OE-A is the key international industry associa-

tion for organic and printed electronics, and it is

growing constantly. With more than 215 members

from 31 countries in Europe, North America, Asia,

and Australia, we cover the entire value chain and

are a unique network of world-leading companies

and research institutes, with growth in member-

ship increasingly from end-user industries.

This brochure will be published at LOPE-C. At this

event, we provide the premier international

marketplace for the community covering the full

spectrum: commercialization, applications,

technology and science of organic and printed

electronics.

The OE-A roadmap summary is a compilation of

the views of its members on the future develop-

ment of this industry. The fifth edition of this

roadmap, which has been expanded and updated

in this issue, is included here. In this brochure you

will also find information about the OE-A, our

members and their respective products and com-

petencies, as well as a market forecast for these

emerging electronics.

We hope this industry directory for Organic and

Printed Electronics will serve as a launch pad to

help you find the right partners for your business.

June 2013

Dr. Stephan KirchmeyerChairman OE-A Board, Heraeus Precious Metals GmbH & Co. KG

Dr. Stephan Kirchmeyer Dr. Klaus Hecker

Welcome to the fifth edition of the OE-A brochure.

Dr. Klaus HeckerManaging Director, OE-A


The vision of the OE-A (Organic and Printed Elec-

tronics Association) is to build a bridge between

science, technology and applications to grow

an industry of emerging electronics. The OE-A

enables and fosters collaboration by members of

the value chain – starting from research to inte-

gration into final end-products – by coordinating,

harmonizing and facilitating their activities.

The global interest in organic and printed elec-

tronics is booming. Almost every sector of our

economy will be affected, if not revolutionized, by

organic and printed electronics. Initial products

have entered the market. The technology has

huge potential, but materials, equipment, pro-

cesses and applications still have to be developed

and improved.

OE-A – The Organization

The membership of OE-A is growing fast.

Founded in December 2004, more than 215

members in 31 countries from Europe, Asia,

North America and Australia have joined OE-A.

Welcome to the OE-A

„Emerging electronics“ means electronics beyond the

classical silicon approach, including: flexible, printed electronics

from organic, polymeric or inorganic materials.

Figure 2: OE-A involves the whole value chain of organic and printed electronics.

Figure 1: Membership development of the OE-A. The network of the OE-A has been growing rapidly worldwide since its formation in December 2004.

Membership Development of the OE-A

200

150

100

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12/2

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12/2

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12/2

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Competencies of the OE-A Members

Material Suppliers: 20 %

Equipment Manufacturers: 21 %

Device Manufacturers:13 %

Services: <1 %

End-Users: 7 %

Research Institutes: 19 %

Universities: 19 %

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Our members are:

• component and material suppliers

• equipment and tool suppliers

• producers / integrators

• system integrators and distributors

• end-users

• research institutes and universities

OE-A is a working group within VDMA, the

German Engineering Federation. The OE-A head-

quarters is located in Frankfurt, Germany, and our

North American office is in Pittsburgh, PA., USA.

What OE-A Can Do for You

Networking – Our International Approach

Creating the right partnerships is essential to

companies and research institutes and OE-A’s

strength is its global reach.

With frequent Working Group Meetings in

Europe, North America and Asia, OE-A supports

its members with an effective networking and

communication platform, fostering collaboration

and promoting information exchange among all

players along the value chain worldwide.

Market and Technology Information /

Roadmap

Being well-informed enables you to make the

right decisions. It’s all about keeping track of

today’s ever-increasing information flow.

OE-A provides its members with up-to-date

market and technology information. Dedicated

The OE-A is assigned to the VDMA division “Innovative Business”,

which includes such related associations as Productronics (Produc-

tion Equipment for Microelectronics), Photovoltaic Equipment,

German Flat Panel Display Forum (DFF), Battery Production and

Micro Technology. These partner associations provide sector-

specific expertise to their member companies, many of which are

business partners to the organic and printed electronics industry.

Our internal network also provides us with excellent contacts to

the printing and packaging as well as plastics and paper equip-

ment industries.

The German Engineering Federation (VDMA) is one of the key

industry associations in Europe and offers the largest engineering

industry network in Europe. With more than 3,100 member

companies, predominantly small and medium-sized enterprises,

VDMA represents 38 fields throughout the entire investment

goods industry – from the classical machinery sector to high-tech

fields like robotics and automation. VDMA is located in Frankfurt,

Germany, with branch offices in Berlin, Brussels, Tokyo, Beijing,

Shanghai, Moscow, Kolkata, New Dehli and Mumbai.

Strengthening Synergies – the VDMA Innovative Business Division

working groups focused on applications and

technologies help to create a roadmap for organic

and printed electronics. These experts provide a

forecast for the main application areas and tech-

nologies for organic and printed electronics and

identify the major hurdles yet to be overcome.

A summary of the 5th edition of the OE-A Road-

map for organic and printed electronics is

Figure 3: Meet new business partners and increase your organization’s industry exposure at OE-A Working Group Meetings in Europe, North America and Asia.


included in this brochure. The OE-A has addressed

the increasing requirement for information on

the growing market of next generation technolo-

gies for pharmaceutical packaging, medical tech-

nology and well-being by recently adding the

new healthcare roadmap.

Our expertise arises not only from our member-

ship, but also from close cooperation with lead-

ing market intelligence companies and related

international associations.

Promoting Research Activities

Research and development plays a strategic role

in leveraging this emerging technology. The OE-A

fosters and promotes the expansion of R&D

activities on several different levels. We are in

close contact with national and European fund-

ing authorities, and we work with them to define

future R&D funding programs. Another one of

the OE-A’s important tasks is to support and to

help coordinate industrial R&D for the entire

organic and printed electronics sector.

In addition, the OE-A organizes projects that

develop giveaway and multifunctional demon-

strators. This time, a special edition of this

brochure with an interactive cover page was

developed and produced by OE-A members.

More than 20 companies and institutes continue

to provide a unique set of devices and materials

for the OE-A Toolbox which represents the state-

of-the-art of organic and printed electronic

components.

The OE-A sponsors an annual demonstrator com-

petition which awards the best demonstrators in

categories ranging from research to prototypes

and design concepts.

The OE-A is the perfect platform to find the right

partner for your business or for bi- or multilateral

R&D projects.

Figure 4: Summary of the 5th edition of the OE-A Roadmap for organic and printed electronics.

Portable chargers

Flexible segmented displays integrated into smart cards, price labels, bendable colour displays

Design projects

Primary single-cell batteries, memory for interactive games, ITO-free transparent conductive films

Garments with integrated sensors, anti theft, brand protection, printed test strips, physical sensors

Existing until 2013

Consumer electronics, customized mobile power

Bendable OLEDs, plastic LCD, in-moulded displays, large-area signage, rollable color displays

Transparent and decorative lighting modules

Rechargeable single-cell batteries, transparent conductors for touch sensors, printed reflective display elements

Integrated systems on garment), large-area physical sensor arrays and mass market intelligent packaging

Short term 2014–2016

Specialized building integration, off grid

Rollable OLEDs with OTFT, (semi-) transparent rollable displays, flexible consumer electronics

Flexible lighting

Printed multi-cell batteries, integrated flexible multi-touch sensors, printed logic chips

Textile sensors on fibre, dynamic price displays, NFC / RFID smart labels, disposable monitoring devices

Medium term 2017–2020

Building integration, grid connected PV

Rollable OLED TVs, telemedicine

General lighting technology

Directly printed batteries, active and passive devices to Smart Object

OLEDs on textile, fibre-electronics, health monitoring systems and smart buildings

Longer term 2021+

OE-A Roadmap for Organic and Printed Electronics Applications

Organic Photovoltaics

Flexible Displays

OLED Lighting

Electronics & Components

Integrated Smart

Systems

© OE-A 2013


Figure 6: Printed electronic devices (Source: Kurz)

Education and Training

Highly qualified employees are the key to success.

To help the community find employees with

expertise in this emerging technology, the OE-A

initiated the “Education and Training” project. In

it, experts work together to develop education

and training programs that meet the industry’s

needs.

Quality Control and Standardization

With the installation of mass-production capacity

for organic and printed electronics, standardiza-

tion and consistent characterization of devices

and high-throughput in-line quality control are

increasingly becoming a focus for companies.

The OE-A supports moving organic and printed

electronics into the market by organizing a work-

ing group that deals with quality control and

measurement; the group also develops dedicated

guidelines for device characterization as well as

testing methods for encapsulation systems.

The OE-A has been a major supporter of the

international standardization process under the

leadership of IEC (International Electrotechnical

Commission) and promotes the activities of

the Technical Committee IEC-TC 119 “Printed

Electronics”.

Upscaling Production

The transfer of lab-type processes to mass pro-

duction of organic and printed electronics – “lab-

to-fab” – is supported by the OE-A Working Group

“Upscaling Production”. Experts with a strong

background in production and development

collaborate in this group to develop concepts for

moving from the laboratory through pilot lines to

full-scale manufacturing, thereby supporting

OE-A members in upscaling production. To pro-

vide a unique insight into the industrial processes

of organic and printed electronics, the OE-A

Working Group “Upscaling Production” initiated

the LOPE-C Demo Line. Material suppliers, equip-

ment manufacturers and process developers

have consolidated their efforts to manufacture a

functional take-home demonstrator as part of

the LOPE-C exhibition.

Green Electronics

“Green” and sustainability aspects are key factors

for the acceptance and success of an emerging

technology. Factors relating to sustainability for

organic and printed electronic materials, processes,

products and applications include the efficient

use of materials, environmentally friendly

production, power efficiency of the products as

well as recyclability and disposal of products. The

OE-A Working Group “Green” provides guidelines

and methodologies for sustainability analysis.

Figure 5: Smart blister packaging (Source: Holst Centre)


Increasing Your Visibility

The OE-A promotes its members’ innovations

through a multitude of media outlets. This bro-

chure – Organic and Printed Electronics, now

published in its fifth edition – is just the tip of the

iceberg. Other examples are the OE-A Video,

“Printed Electronics – Ready to Go”, that intro-

duces our industry to a broad audience, the

OE-A Newsletter, and the globally distributed

OPE Journal.

The OE-A arranges contacts with the interna-

tional press and with trade show and conference

organizers around the world for members. More-

over, we represent our members at international

trade fairs and conferences.

LOPE-C – Large-area,

Organic & Printed Electronics Convention

One of the key tasks of the OE-A is to provide the

premier international marketplace for organic

and printed electronics. Along with our partner

Messe Munich, we have developed the leading

international trade show and conference for the

organic and printed electronics community.

LOPE-C is the premier event for end-users, manu-

facturers, investors, engineers and scientists in

organic and printed electronics and covers the

latest commercial and technological achieve-

ments.

Electronics Everywhere – Big Opportunities

The combination of specialty materials with low-

cost, large-area fabrication processes (such as

printing) enables thin, lightweight, flexible and

low-cost electronics. This means that integrated

circuits, sensors, displays, memory, photovoltaic

cells or batteries can be made out of plastic.

Applications like flexible solar cells, flexible dis-

plays, lighting, RFID tags (radio frequency identi-

fication), single-use diagnostic devices or simple

consumer products and games are only a few

examples that represent a future multi-billion

Euro market. Smart objects (e. g., smart packag-

ing that integrates multiple organic and printed

devices) or smart textiles are additional examples

of applications in organic and printed electronics.

OLED displays, e-readers, printed electrodes for

several medical applications as well as printed

light sources, electrochromic rear-view mirrors,

and printed antennae for automotive applica-

tions have been on the market on a large scale for

several years.

Organic photovoltaics and OLED lighting-based

products, smart packaging, flexible batteries,

printed memory, transparent conductive films as

an ITO substitute for touch displays, smart phar-

maceutical blister packages for field trials and

smart cards with built-in displays for password

applications have become available. Within 3 to 4

years, additional products are expected to be

available to a mass market, and all of the above

mentioned applications, as well as several more,

will be available in large volumes.

Tremendous opportunities are opening up for

companies that invest in this field, regardless of

whether they are material suppliers, equipment

manufacturers, producers or system integrators.

Large-scale production capacity is presently

installed in Europe, the U.S., and Asia. On the

other hand, large-scale efforts and close collabo-

ration of all partners along the value chain

remain necessary to make organic and printed

electronics a true success story.

Cooperation and information exchange will lead

to mutual advantages. The OE-A provides the

international platform for the organic and

printed electronics community and helps the

industry to grow.

Curious? Don’t hesitate to ask us for details!

Figure 7: LOPE-C is the premier marketplace for the organic and printed electronics industry.

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Messe München, GermanyConference: May 26–28, 2014Exhibition: May 27–28, 2014

LOPE-C is the leading international trade fair and conference for printed electronics in the high-tech business location of Munich. The exclusive business platform addresses manufacturers and users of a technology of the future across a wide range of

Organic solar cell: Fraunhofer ISE

industry sectors. It is innovative, fl exible, cost-effective and thus suitable for mass-market production. As the representative trade fair of this sector, LOPE-Chighlights current trends, presents innovative products,points to market opportunities for industry and promotes

Manufacturing

processes

Assembly and packaging

technology, system

integration

Inspection and

test systems

optical, chemical characterization

Devices

diodes

Applications

systemsServices

trade associations

capitalization

Materials

materials and resins

LOPE-C Exhibition: The entire value chain for printed electronics.

LOPE-C – Conference: One Congress – Many Components.

Plenary session: delivered by international experts

Business conference and Investor forum: with focus on commercialization

Technical conference: with focus on new technologies and applications

Scientifi c conference and Poster session: delivered by established and young scientists

Short courses: featuring established industry and academic experts

Visitor target groups:

Automotive

Chemical

Consumer electronics

Energy

Lighting

Logistics

Mechanical engingeering

Medical and pharmaceutical

Packaging

Printing and graphic arts

Textiles and fashion

the development of new materials, manufacturing processes and applications. This makes the event the most important gathering in the fi eld of printed electronics.


Organic and printed electronics is based on the

combination of new materials and cost-effective,

large-area production processes that open up

new fields of application. Thin, lightweight,

flexible and environmentally friendly electronics

– that’s what organic electronics aims to deliver.

It also enables a wide range of electrical

components that can be produced and directly

integrated in low-cost reel-to-reel processes.

Intelligent packaging, OLED lighting, printed

multi functional systems, rollable displays, flex-

ible solar cells, disposable diagnostic devices or

games, flexible touchscreens, and printed

batteries are just a few examples of promising

fields of application for organic electronics based

on new large-scale processable electrically con-

ductive and semi-conducting materials. Organic

electronics can be used by itself, but also as part

of a heterogeneous system combining printed

and organic components and silicon, each where

they make the most sense. These heterogeneous

systems will be especially important in the first

generations of products.

In the following pages, you will find an updated

overview of the organic and printed electronics

applications, technologies and devices, as well as

a discussion of the different technology levels

that can be used in producing organic electronic

products. We have taken account of the exciting

technical progress made since the last edition

and the appearance of first products, and have

made some changes to the grouping of applica-

tions within clusters. In particular, we have

included EL lighting now into Electronics and

Components, fitting with its areas of commercial

applications, and moved RFID into Integrated

Smart Systems, as organic RFID is expected to

find its primary application in smart systems

rather than as a competitor to Si-based EPC

applications in the near future.

At the time of the last roadmap, products were

starting to enter the market, and this trend has

continued, so that commercial products are

available in all of the key technology areas. First

organic electronic products reached the market a

number of years ago, e.g., passive ID cards that

are mass-printed on paper and are used for tick-

eting or toys. Flexible lithium polymer batteries

– produced in a reel-to-reel process – have been

available for several years and can be used for

smart cards and other mobile consumer prod-

ucts. Printed electrodes for glucose test strips or

for electrocardiograms are common. Organic

photovoltaics (OPV) modules integrated into bags

to charge mobile electrical devices are commer-

OE-A Roadmap for Organic and Printed Electronics

The roadmap for organic and printed electronics is a key activity of

the OE-A. Organic electronics is a platform technology that enables

multiple applications that are based on organic electronics but

vary widely in their specifications. This technology is still in its early

stage; while increasing numbers of products are available and

some are in full production, many applications are still in lab-scale

development, prototype activities or early production. Nonetheless,

it is important to develop a common opinion about what kind of

products, processes and materials will be available and when.

For this fifth version of the OE-A Roadmap, key teams of experts in

five application clusters and three technology areas developed

roadmaps for their fields, which were presented to and discussed

with the OE-A members during association meetings. The resulting

roadmap is a synthesis of these results representing common

perspectives of the groups.

We present here a summary of the fifth version of the roadmap,

which is a supplement to and improvement on the fourth version

presented in 2011.

The goal of this roadmap is to help the industry, government agen-

cies and scientists plan and align their R&D activities and product

plans, for example, by identifying promising applications and key

challenges requiring breakthroughs. Roadmapping, especially in

such a young industry, is an ongoing process and the OE-A will

continue this key activity.

A White Paper explaining the 2011 roadmap in more detail is

already available for download from the OE-A website

(www.oe-a.org), and a White Paper for the current version will

be released later in 2013. For further details please contact the

OE-A secretariat.

The OE-A Roadmap


cially available. Printed antennae are commonly

used in (still Si-based) RFID tags. Large-area

organic pressure sensors for applications such as

retail logistics have recently been introduced.

First organic LED (OLED) lighting based products

became available just before the last edition of

the roadmap and have grown, with the number

of both commercial OLED lighting products and

large-scale installations at lighting trade fairs

much larger than at the time of the last edition

of the roadmap. User tests of smart cards with

built-in displays for one-time password applica-

tions were already started before the last road-

map and have started to be commercialized. New

products such as flexible, roll-to-roll-produced

e-paper price labels have been commercially

installed into stores, printed RF-driven smart

objects have become commercially available, and

printed non-volatile memory is being sold to

product developers. Recently, printed systems

incorporating organic electronics have also

become commercial; for example, a rechargeable

battery-powered flashlight containing OPV to

recharge the battery, first shown as an OE-A

demonstrator in 2011, can now be purchased.

Organic electronics has appeared in everyday

products where many people are not even aware

that they contain organic electronics, e.g., self-

dimming rearview mirrors in cars or OLED dis-

plays in smart phones. While we do not explicitly

investigate these already existing products in this

forward-looking roadmap, they are evidence that

organic electronics is already becoming an

industry.

Unbreakable displays with OTFT (organic thin

film transistor) backplanes have been piloted,

but full product introduction has been delayed;

however, development of unbreakable and even

rollable displays has continued. While no organic

electronic products have truly achieved full mass

market introduction, with the possible exception

of OLED displays, it appears that this is likely for

some products within the next few years.

Organic electronics is based on the combination of a new class of

materials and large-area, high-volume deposition and patterning

techniques. Often terms like emerging, printed, plastic, polymer,

flexible, printable inorganic, large-area or thin film electronics or

abbre viations like OLAE or FOLAE (Flexible and/or Organic Large

Area Electronics) are used, which essentially all mean the same

thing: electronics beyond the classical approach. For simplicity, we

have used the term organic electronics in this roadmap, but keep

in mind that we are using the term in this broader sense.

Organic Electronics

Figure 1: Overview of the OE-A Roadmap for organic and printed electronics applications.


today

© OE-A 2013

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In the applications section which follows, we

have updated our forecast for the market entry

on larger scales for various applications and

reviewed the appearance of first products. We

have also re-examined the key application and

technology parameters and principle challenges

(so-called red brick walls) seen for further devel-

opment of organic electronics. In the technology

section we also take account of recent progress in

new materials and improved processes.

Applications

Organic and printed electronics is a platform

technology that is based on organic conducting

and semi-conducting as well as printable

inorganic materials. It opens up new possibilities

for applications and products. As in previous

roadmap editions, some key applications have

been chosen to demonstrate the needs from the

application side, identify major challenges, cross-

check with the possibilities of the technology and

forecast a time frame for the market entry in

large volumes.

Below, we continue to look at applications

discussed in the previous edition of the roadmap,

clustered into the five groups OLED Lighting,

Organic Photovoltaics, Flexible Displays,

Electronics and Components (printed memory,

batteries, active devices and logic, and passive

devices) and Integrated Smart Systems (smart

objects, RFID, sensors and smart textiles). Figure 1

gives an overall view of the expected develop-

ment of the five clusters.

The large number of applications reflects the

complexity of the topic and the wide possible

uses for organic electronics, and it is likely that

the list will even grow in the future. This is one

reason for grouping applications into related

clusters in order to make it possible to maintain

an overview. The application fields and specifica-

tions cover a wide range, and although several

parameters like accuracy of the patterning

process or electrical conductivity of the materials

are of central importance, the topic cannot

currently be reduced to one or two simple scaling

laws such as the increase in transistors per chip

for silicon formulated by Moore in 1965. Regard-

less, we will watch the trends and find out

whether it will be possible to find an analogue to

Moore’s law for organic electronic. Some poten-

tial scaling trends are starting to be visible, such

as higher resolution patterning processes and

increased charge carrier mobilities, which can

improve device packing density and performance

in a similar way that has been observed in

Si electronics.

The question whether there is one “killer applica-

tion” for organic electronics still cannot be

answered with certainty. There are many differ-

Figure 2: OLED lighting product. (Source: OSRAM)


ent fields in which the advantages of organic

electronics might result in the right application

to become a “killer application”, but at this point,

it is too early to predict where this is most likely

to happen, though OLED displays are making

strong progress. Past experience with new tech-

nologies has shown that the predicted “killer

applications” are frequently not the ones that

really open up the largest markets. Therefore, one

has to continue the work on the roadmap, as is

planned, follow the current trends and take

account of new developments as they occur.

In fact, with the increasing diversity of organic

electronics it is unclear whether there will be a

single “killer app” or if gradual market penetra-

tion in a variety of areas is more likely. At the

moment, we are starting to see market penetra-

tion in a variety of areas and it looks as if, for the

near future, organic growth in many areas is a

more likely scenario than an explosive “killer app”

in only one or two areas.

Applications Roadmap

OLED Lighting is an example of Solid State Light-

ing (SSL), which also includes LED-based lighting

and is seen as the most promising approach for

future lighting due to lack of hazardous materi-

als, flexible form factor, high energy efficiency

and long lifetime. The LED lighting industry is

growing rapidly, but OLED lighting continues to

make progress both technically and toward com-

mercialization. OLED lighting has grown out of

the technical progress made in developing the

OLED display industry but has increasingly

focused on the specific properties of OLEDs that

are relevant to lighting. OLED lighting products

promise novel features in the longer term: large-

area, very thin and optionally flexible or non-

planar form factor, and variable color are all

feasible with OLED lighting, and new lighting

applications can be expected to take advantage

of these properties, for example, embedded light-

ing or homogeneous area lighting.

While OLED lighting has not yet reached the

mass market, limited-release prototypes and

commercial products have become available to

demonstrate the potential and allow interested

users to try out OLED technology (Figure 2). A

number of European and Japanese companies

have shown advanced prototype products, and in

the USA the Department of Energy has supported

OLED lighting development strongly. Though

both vacuum deposited and solution processed

OLEDs are possible, vacuum deposited devices are

more efficient and dominate the market, though

much development is ongoing in improving solu-

tion processed OLEDs. The market is expected to

grow, especially if some key challenges such as

lowering the production cost and developing

reliable and cost-effective encapsulation are met.

Organic Photovoltaics (OPV) comprises both

hybrid systems (e.g., combining titania and dyes)

as well as systems using only organic semicon-

ductors. Flexible dye-sensitized titania and poly-

mer-based OPV modules have been available for

some years now, and products integrating

flexible OPV modules have been commercially

available since 2010. These applications target

low-power consumer applications, e.g., modules

for battery chargers for mobile electronics such

as cell phones, PV-powered computer keyboards,

or the mobile laser pointer shown in Figure 3.

Despite the difficult market for PV in general in

the last couple of years and the significant set-

back of the loss of a key OPV pioneer, both techni-

cal and commercial development is continuing.

Laboratory scale cells have now reached efficien-

cies that can compete with thin film silicon, while

the number of pilot and small production lines

has increased. OPV shows a combination of

unique points: lightweight, flexible design with

options for color and semi-transparency, good

performance in low and diffuse light, reduced

environmental footprint and customizable

formats which allow them to address market

niches not in direct competition with crystalline

silicon technologies. Short term applications will Figure 3: Battery powered laser pointer with OPV charger. (Source: Mekoprint)


be mostly in consumer electronic and portable

power sources. In the medium term, novel forms

of building-integrated OPV will appear. The long-

term perspective of energy generation remains

a driving vision, while novel business models

are also appearing to address unconventional

markets and channels to market.

Flexible Displays are an extension of flat panel

displays, which have had tremendous success in

replacing conventional displays such as cathode

ray tubes (CRTs) for use in computers and televi-

sions, and in enabling new products such as lap-

top and tablet computers, e-readers and smart

mobile phones. Flexible displays can dispense

with some key issues of current flat displays, such

as the presence of (breakable and relatively

heavy) glass and inability to be bent, rolled or

used with other than flat form factors. The

requirements for flexible displays depend

strongly on the intended type of use, e.g., of the

flexible displays roadmap we focus on the follow-

ing key types of use, e.g., information and signage

(conformal and lightweight is more important

than being bendable or rollable), reading (rug-

gedness, light weight and optionally bendability

or rollability are desired) or entertainment/multi-

media (where video rate, color and resolution are

critical in addition to the above factors).

The flexible display market has not developed

commercially as quickly as had been hoped,

partially due to industry restructuring and com-

petition from tablet computers, but there have

been advances as well. For example, flexible, roll-

to-roll-produced e-paper-based shelf tags have

been commercialized at a Finnish electronics

superstore chain, garnering very positive recep-

tion. Plastic Logic announced a new business

strategy, enabling the company to move beyond

the e-reader market into a variety of new markets

and applications, driven by flexible display solu-

tions. On the technology side, many of the key

players in the display market have showcased

prototypes of OLED-driven flexible displays,

including active matrix backplanes driven by

novel materials like oxide semiconductors. E Ink

has also announced flexible active-matrix EPD-

driven displays, and color EPD display prototypes

with organic TFT backplanes have been shown

(Figure 4). While simple signage is already avail-

able, we expect flexible commercial e-readers in

the near future, followed by trends to larger size,

higher resolution and full color as well as flexible

OLEDs in the future.

The Electronics and Components cluster in the

OE-A Roadmap encompasses printed memory,

flexible batteries, and active and passive devices.

These are the building blocks or “toolkit” out of

which future organic electronic products can be

made.

Printed memory is needed for applications where

the user is required to store and process informa-

tion. If the user wants to change the information

stored in the memory after production, a rewrit-

Figure 5: Printed addressable memory array with transistor logic. (Source: PARC and Thin Film Electronics ASA)

Figure 4: Flexible color e-reader display with organic TFT backplane. (Source: Plastic Logic)


able memory, either write once read many (WORM)

or rewritable random-access memory (RAM) is

necessary. Furthermore, for many applications

without constant power, the memory needs to

be non-volatile (NV). ID devices and promotional

cards using read-only memory (ROM), WORM or

NV-RAM were already hitting the market at the

time of the last roadmap and have continued to

make headway. Reference designs of toys using

NV-RAM memory have been launched, and appli-

cations using printed memory for brand protec-

tion (i.e., anti-fraud, anti-counterfeit uses) have

also emerged recently. Printed memory will be an

important component in future integrated smart

systems (see below), and technology develop-

ment is proceeding this way. For example, a

recently presented NV-RAM that includes CMOS

(Figure 5), and showed successful integration of

a sensor, a display, memory and transistor logic in

December 2012. The future is expected to bring

applications in increasingly complex systems,

moving from simple gaming and anti-fraud

applications into ticketing, display memory and

electronic products.

Most organic electronics applications target

mobile devices, and here power supply is a key

issue. Therefore flexible batteries (Figure 6) are of

central importance to leverage this technology.

A large variety of thin and even printed batteries

are commercially available. They are available for

discontinuous use today and will be constantly

improved in capacity, enabling continuous use.

Currently, non-rechargeable zinc-carbon batteries

are predominant for printed batteries, but there

is significant development in rechargeable bat-

teries, e.g., based on lithium, as well as research

activity on printed miniature supercapacitors,

which are a kind of cross between batteries and

conventional capacitors. There will be a progres-

sion from batteries that use printed parts,

through batteries that are fully printed in sepa-

rate processes, to batteries that are printed as

part of an integrated process for printing elec-

tronic systems, as well as a progression from sin-

gle charge through rechargeable batteries and

from single cells to multicell integration. In the

longer term, batteries will also be integrated

directly in textiles and packages.

Figure 6: Roll of printed Ni metal hydride batteries. (Source: VARTA Microbattery)

Figure 7: Printed logic circuit. (Source: Holst Centre)


Active devices are electronic components which

contain a semiconductor or other parts that cre-

ate “active” feedback on applying electric power.

In this edition of the roadmap we primarily are

looking at transistors, diodes, logic circuits, and

display elements. Organic Thin Film Transistors

(OTFT) are a basic component for electric switch

elements or integrated circuits, and can be used

as single component to amplify a current or

combined with other transistor as integrated

circuits or logic. The current flow between source

and drain electrode is switched, depending on

the voltage applied at the gate electrode. They

are typically not products by themselves but part

of other products like smart objects or integrated

systems. Diodes are rectifying devices which

allow current to flow at a positive voltage but

block it at negative voltages, and in addition to

their special uses in OLEDs and OPV are also

relevant in devices such as RF tags or energy har-

vesting systems. In the area of printed/organic

circuits (logic), multibit microprocessors have

been demonstrated by a number of research labs

and companies, as well as logic circuits for RFID

tags and organic memory control. Key factors and

challenges for future development and appear-

ance in more complex products include scaling

laws on thickness, lateral dimensions and charge

carrier mobility.

Display elements are further active components

for system integration, which can convert an

electrical signal into optical information. In

particular, both electrochromic and electro-

luminescent elements are being included.

Printed passive components based on printable

conductors and dielectrics have been used in

electronics manufacturing for some time now.

Due to the rapid development of printable elec-

tronics materials and corresponding processes,

such applications are becoming more and more

visible on the market. Resistors, capacitors and

inductors can also be printed. A special applica-

tion in this field is a printed code detectable by

touch sensors. Printed silver paste is the mostly

used conductive material to print conductive

tracks, but other metal or carbon pastes, nano-

carbon materials, or conductive polymers are see-

ing increased interest. A special case of capacitors

seeing increased interest for printed electronics

are supercapacitors, which can be used for

interim storage of energy, have much higher

capacitance than plate capacitors but higher

cycle life than batteries, and in the best case

essentially consist only of plastic, metal, carbon,

water and salt. A range of approaches to printed

antenna manufacturing (Figure 9) has also been

applied, including direct printing, plating, and

etch resist printing.

Electroluminescent films (EL) are available as

commercial lighting products used in low inten-

sity lighting such as backlighting, decoration and

advertising panels. EL lighting offers a number of

key user advantages: bendable, fast prototyping,

printable and easy product integration. EL light-

ing is focused on illuminating specific objects in

order to highlight them or create special effects.

It is not concerned with illumination of space. EL

is especially useful where complex form factors

(bending, thin shapes) are involved, limited edi-Figure 9: Printed antenna for RFID tags. (Source: Fraunhofer ENAS)

Figure 8: Smart shelf incorporating electrochromic display elements. (Source: Ynvisible)


Figure 10: Package featuring printed EL films. (Source: Karl Knauer)

tions, e.g., in packaging (Figure 10) specific after-

market and original equipment manufacture

(OEM) car models, and for fast product execution,

e.g., in advertising or exhibitions.

An area that has seen intense activity recently is

that of transparent conductive films. Today, ITO

(indium tin oxide) is still the most widely used

transparent conductive material, which is used in

nearly all optical devices like displays, OLEDs, OPV,

EMI shielding and especially in the rapidly

increasing market of touch sensor applications.

There is a huge market demand for ITO substi-

tutes, as it is quite brittle and relatively expen-

sive, so there is need for alternatives. Numerous

flexible and lower cost alternatives are coming

into the market. The alternative approaches to

transparent conductive films can be based either

on novel transparent conductive materials (see

technology section) or on the patterning of thin

metal films (metal mesh) on flexible polymer

substrates into high resolution transparent

conductive meshes (Figure 11); some of these

approaches have also seen market introduction

recently.

Integrated Smart Systems (ISS) bring together

multiple core functionalities to perform complex,

automated tasks without the need for external

electronic hardware. As organic electronics tech-

nology progresses, the applications will become

ever more challenging and complex. Typical func-

tionalities that one will expect to see on such

systems will be power (batteries, miniaturized

fuel cells, PV), input devices (physical, chemical

and biological sensors) and output devices Figure 11: Capacitive multitouch sensor based on printed metal mesh transparent conductive films. (Source: PolyIC)


(displays, visual, audible or haptic interfaces and

wireless communications), with these linked

together by sophisticated logic circuits and

memory. The addition of various forms of sample

processing and fluid handling will also involve

the integration of microfluidics into some

systems. Thus, the variety of applications for such

systems will be immense, made far greater by

their potential deployment into so many new

areas of application, from smart textiles to auto-

motive, aeronautical and environmental to health

and well-being. The component technologies

underpinned by the organic electronics field will

be essential to the success of such systems.

Sensors are the means by which the environment

is detected. Many of the characteristic features of

organic and printed electronics, such as high-

throughput parallel production including screen

printing, have already been used in the develop-

ment of printed sensors, and these exist already

as stand-alone products. Future development is

related to integration of sensors with other func-

tionalities into an integrated smart system. Both

optical and electrical/electrochemical sensor

components will be used, and we expect a

progression from currently available test strips

and physical sensor arrays (Figure 12) through

disposable test strips and integration of other

functionalities such as control electronics,

memory or display readouts in the medium term,

to smart buildings and skins in the longer term.

The key challenges to be faced are related to inte-

gration of different components and especially

interfacing to printed electronic circuitry.

Smart objects combine multiple electronics com-

ponents and functions to create innovative inte-

grated systems. A key advantage of organic and

printed electronics is the possibility to use low-

cost production methods to make these smart

objects light, flexible, cheap and even disposable.

Functional printing allows the integration of

Figure 13: RF activated smart objects. (Source: PolyIC)

Figure 12: Printed touch sensor array. (Source: plastic electronic)


different devices such as sensors, transistors,

memory, batteries or displays onto one substrate.

This integration may be realized either by one

process or by a combination of several separately

produced components. Sensor tags, dynamic

price display and rewritable RF tags are all exam-

ples of applications for smart objects. Since the

last edition of the roadmap, new products have

emerged, such as RF-driven smart object cards

(Figure 13) and printed electronic systems with

rewritable memory. A number of technology

developers have demonstrated increasingly com-

plex printed RFID tags as well. The roadmap for

smart objects and printed RFID, as a whole, is

more complex than for other areas of printed

electronics. However, these products make full

use of the cost and scalability advantages inher-

ent in this new set of production methods, and

thus, are potentially the most revolutionary. The

products in this chapter will likely not show con-

tinuous, step-wise improvement but rather, the

emergence of products of greater and greater

complexity (i.e., the emergence of entirely new

product families) as manufacturing processes

improve.

Smart textiles are fabrics that are able to alter

their characteristics to respond to external

stimuli (mechanical, electrical, thermal, and

chemical). In addition, functionalities such as

communication, displays, sensors, or thermal

management can be integrated into fabric to

enable wearable electronics. By taking advantage

of organic and printed electronics, the field of

smart textiles can make important technological

advances in the future. In the coming years

though, the use of standard electronic technol-

ogy such as Si chips or LEDs may still be required

in combination with printed components, and

heterogeneous integration will be common until

sufficiently high performance and integration

can be achieved for organic and printed electron-

ics and logic. Currently, much of this field is still in

the development or prototype stage, with signifi-

cant work going into areas such as stretchability

and hybrid integration. First products are expected

around 2014 (washable textile EL, Figure 14),

with evolution to more complex systems and

applications such as OLEDs coming later.

These application scenarios are summarized in

the OE-A Roadmap for organic electronics appli-

cations in Figures 1 and 15. In Figure 15 we show,

for each of the five application clusters, products

that have entered the market and are expected to

enter the market in the short (2014–2016),

medium (2017–2020) and longer (2021+) term.

Such a summary is by necessity not detailed.

These figures provide a high-level overview for

the whole field of organic and printed electronics

that has been distilled from the individual road-

maps.

Figure 14: Demonstrator of waterproof textile EL lighting on a high-visibility vest. (Source: Cetemmsa)

This list of products reflects the ideas from

today’s point of view. Past experience of new

technology shows us that we are most likely to

be surprised by unexpected applications, and this

will almost certainly happen in the exciting but

nascent field of organic electronics. Therefore,

the technology and the market in this field will

continuously be watched and the roadmap will

be updated on a regular basis.

While we focus on clusters of applications based

on functions, organic electronics may contribute


to innovation in different industrial branches

such as automotive or health care (Figure 16)

with products covering a range of functions. For

this reason, OE-A has also begun to look at these

branches, and a roadmap for organic electronics

in health care is in preparation.

Significant progress has been made in the last

several years and first generations of products

have reached the market in significantly larger

numbers than at the time of the last roadmap.

On the other hand, growth had not yet been as

rapid as was predicted by many market research-

ers a number of years ago, which has led in some

circles to a degree of disillusionment. This report

indicates, however, that organic electronics is

indeed still moving ahead and is becoming an

industry, and the market analysis presented on

pages 34 and 35 in this brochure shows as well

that markets are being reached and will continue

to grow. Nonetheless, in order to fulfill the more

demanding specifications of more complex

future generations of products, further improve-

ment of materials, process, design and equip-

ment is necessary. In the next section, we look at

some of the main application parameters whose

development will be key to enabling future

product generations. After that, we will look at

the main technologies in organic electronics and

discuss the key technology parameters under-

lying the application parameters.

Key Application Parameters

The viability of each application or product will

depend on fulfillment of a number of parameters

that describe the complexity or performance of

the product (application parameters). For the

applications above, groups of specialists identi-

Figure 15: OE-A Roadmap for organic and printed electronics, with forecast for the market entry in large volumes (general availability) for the different applications. The table is a further development of and update to the fourth version of the OE-A Roadmap presented in 2011.

Portable chargers

Flexible segmented displays integrated into smart cards, price labels, bendable colour displays

Design projects

Primary single-cell batteries, memory for interactive games, ITO-free transparent conductive films

Garments with integrated sensors, anti theft, brand protection, printed test strips, physical sensors

Existing until 2013

Consumer electronics, customized mobile power

Bendable OLEDs, plastic LCD, in-moulded displays, large-area signage, rollable color displays

Transparent and decorative lighting modules

Rechargeable single-cell batteries, transparent conductors for touch sensors, printed reflective display elements

Integrated systems on garment), large-area physical sensor arrays and mass market intelligent packaging

Short term 2014–2016

Specialized building integration, off grid

Rollable OLEDs with OTFT, (semi-) transparent rollable displays, flexible consumer electronics

Flexible lighting

Printed multi-cell batteries, integrated flexible multi-touch sensors, printed logic chips

Textile sensors on fibre, dynamic price displays, NFC / RFID smart labels, disposable monitoring devices

Medium term 2017–2020

Building integration, grid connected PV

Rollable OLED TVs, telemedicine

General lighting technology

Directly printed batteries, active and passive devices to Smart Object

OLEDs on textile, fibre-electronics, health monitoring systems and smart buildings

Longer term 2021+



Flexible Displays

OLED Lighting

Electronics & Components

Integrated Smart

Systems

© OE-A 2013


Figure 16: Printed temperature sensor tag for pharmaceutical applications. (Source: Thin Film Electronics ASA)

fied the most important application and technol-

ogy parameters and requirements for different

generations of products. Here we list only a small

excerpt of the key application parameters that

have been identified as relevant to several of the

applications. Not surprisingly, the key application

parameters across the five application clusters

have not changed since the last edition or even

the one before that. The following list is in no

particular order since the relevance of the differ-

ent parameters varies for the diverse applications.

• Complexity of the device

The complexity of the circuit (e.g., number of

transistors) as well as the number of different

devices (e.g., circuit, power supply, switch, sen-

sor, display) that are integrated have a crucial

influence on reliability and production yield.

• Operating frequency of the circuit

With increasing complexity of the application

(e.g., increasing memory capacity) higher

switching speeds are necessary.

• Lifetime / stability / homogeneity / reliability

Lifetime (shelf and operation), the environmen-

tal stability, stability against other materials

and solvents, and homogeneity of the materi-

als are an issue due to the intrinsic properties

of the materials.

• Operating voltage

For mobile devices powered by batteries, PV or

radio frequency, it is essential to have low oper-

ating voltages (<10V).

• Efficiency

The conversion efficiency of light to electricity

or electricity to light is a key parameter for

photo-voltaic cells and photodiodes or OLEDs,

and power efficiency of circuitry is also impor-

tant for many applications, especially those

which are mobile and need to be light weight.

• Cost

Although most applications target new appli-

cations and markets rather than replacements,

costs have to be low. For some applications,

such as rollable displays, a cost premium over

conventional rigid displays may be accepted,

while for other applications, e.g., in packaging,

low cost will be a major driving factor.

Technology

As we have mentioned before, we use the term

organic electronics for brevity to refer to the field

of electronics beyond classical silicon approaches,

but include concepts such as large-area or flexible

circuits and printed inorganic materials. Although

some classic device concepts are used, materials,

including substrates, and patterning processes

are very different from those used in the conven-

tional electronic industry. In this section we

review key materials, processes and devices for

organic electronics and discuss the key technol-

ogy parameters that are critical for development

of future products.


Functional Materials

Organic and printed electronics rely on electri-

cally active materials that have conducting,

semi-conducting, luminescent, electrochromic or

electrophoretic properties. The materials have to

be carefully selected, since process conditions

and the interplay of the active material with

other layers such as dielectrics and passivation

materials in the device stack can greatly influence

the performance of the final device. Of the avail-

able materials there is a choice between organic

or inorganic, solution based or evaporated; the

selection of a specific material depends both on

the demands of the device application and the

choice of manufacturing technique employed. It

is very likely that in a final application several

approaches will be used in parallel.

Organic semiconductors have found uses in

active devices such as OLEDs, OPV, diodes and

transistors. Currently available materials can be

split into three classes: small molecules, amor-

phous polymers and semi-crystalline polymers.

The charge transport properties of these organic

semiconductors, which are dictated by their mor-

phologies and tendency for crystallization,

strongly depend on the deposition conditions

used. Both p-type and n-type organic semicon-

ductors have been developed, and research into

n-type materials has been increased over the past

years, due to their importance in the production

of CMOS circuits in combination with p-type

materials and matching dielectrics.

The charge carrier mobility of organic semicon-

ductors has improved dramatically in recent years

although it is still much lower than crystalline

silicon, but starting to be competitive with amor-

phous silicon. It is expected that the performance

of organic semiconductors will approach or

match polycrystalline silicon (poly-Si) in coming

years (Figure 17), first in research where mobili-

ties of up to 15 cm2/Vs have been reported, and

some time later in commercial products such as

the next generation of large format OLED displays.

In fact, the growth in charge carrier mobilities

might soon begin to appear as a kind of scaling

law in organic electronics, comparable to the

transistor density scaling according to Moore’s

law in microelectronics. As development moves

toward products, processability and reproducibil-

ity as well as mobility have become increasingly

important in order to enable real-world device

production. Leading material companies in the

field have spent ever increasing efforts focusing

on evaluation and improvement of these charac-

teristics, reaching a level where the first genera-

tions of products using these materials are

expected to launch in the near future.

Figure 17: OE-A Roadmap for the charge carrier mobility of semiconductors for organic and printed electronics applications. The values for amorphous silicon (a-Si) and polycrystalline silicon (poly-Si) are given for comparison.

Mobility of Semiconductors for Organic and Printed Electronics Applications

Ch

arge

car

rier

mob

ility

100

10

1

0.1

0.01 Existing Short term Medium term Longer term (until 2013) (2014-2016) (2017-2020) (2021+)

μ [cm2/Vs]

The values refer to materials that are available in commer-cial quantities and to devices

that are manufactured in high- throughput processes.

Poly-Si

a-Si

Small m

olecules,

Precursors,

Polymers

NEW CONCEPTS

Inorganics, Nano-m

aterials

© OE-A 2013


There has also been strong progress in materials

for OPV, where power conversion efficiencies

have now gone above 9 %, and 12 % in vacuum-

deposited devices, to be competitive with a-Si.

However, significant work remains in the transla-

tion of small-area, lab-scale cell performance into

the large-area, stable and inexpensive produc-

tion-level modules required on the market. From

a semiconductor perspective, this challenge

requires the development of materials that can

be easily and cost-effectively scaled, and which

can maintain high-power conversion efficiencies

(PCEs) over extended lifetimes when exposed to

real-world environmental conditions.

In addition to organic materials, inorganic semi-

conductors such as ZnO and IZO and new materi-

als such as carbon nanotubes or nanowires are of

growing interest. Recent developments have

shown several semiconductors in these classes

which can be processed from solution as a disper-

sion or precursor or deposited in vacuum or vapor

phase at low temperature. More recently,

graphene, a 2D monatomic sheet of carbon

atoms, has gathered a lot of attention, and

exhibits a number of properties that enable its

potential use as a functional material including

extremely high mobility. It has been explored for

applications in transistors, sensors, transparent

conductors and supercapacitors, among others.

The key challenge for graphene at the moment is

processing while maintaining the extraordinary

physical properties.

Printable conductors may be metallic, metal

oxides, organic or based on carbon nanostruc-

tures. The choice of conducting materials is

strongly dependent on their application. For high

“metal-like” conductivity it is still necessary to

use filled materials such as silver inks. If conduc-

tivity is needed in combination with high trans-

parency, e.g., for OPV or OLEDs, special inorganic

materials like ITO or the polymeric PEDOT:PSS

represent state of the art solutions. Transparent

organic conductors still show inferior conductivi-

ties in comparison to metal oxides like ITO but

are continuing to improve in performance and

become more competitive. The polymers allow

for wet processing, and the flexibility of the poly-

mer coatings makes them attractive candidates

for the replacement of brittle inorganic materials.

Recently, significant progress has been made on

transparent inorganic conductors, with solution-

processable materials such as carbon nanotubes,

graphene, and nanomaterial based inks (e.g.,

silver nanowires) showing excellent conductivity

and transparency in addition to improved

mechanical properties over ITO.

Printable metallic conductors, which have been

commercial for many years in the form of screen-

printable silver pastes for numerous applications,

have continued to develop, with progress in

nanostructured and precursor inks, replacement

of silver by copper, advances in photonic sinter-

ing, and improvements in formulation that have

enabled stretchable conductive inks (Figure 18).

Carbon inks have seen increased applications,

including temperature sensitive resistors.

Figure 18: Formable and stretchable ink for 3D circuitry. (Source: DuPont)


Dielectrics are passive materials, which are used

in many active and passive devices. Numerous

dielectrics are solution-processable and can be

printed. There are a number of different material

classes that can be used as dielectrics, from ther-

moplastic to thermosetting plastic polymers, and

they can be thermally or UV-curable. The dielec-

tric (e.g., thickness and dielectric constant) can

play an extremely important role in performance

of devices, and this has been extensively studied

in OTFTs, where the dielectric-semiconductor

interface is critical for optimal carrier mobility

and on/off ratio. Significant work on optimal

dielectrics for both p- and n-type OTFTs has been

done, and this has, next to improvements in the

semiconductors, been a significant factor in

improvement of OTFT performance.

Encapsulation materials are often required to

protect organic electronic systems against envi-

ronmental influences to insure sufficient shelf

and operational lifetime. This protection is, for

example, critical for OPV and OLEDs, where highly

reactive metal electrodes may be used, but also

important in other aspects of organic electronics.

In some cases water vapor transmission rates

below 10–6 g m–2 d–1 (at 20 °C / 50 RH) and oxygen

transmission rates lower than 10–6 cm3 m–2 d–1

bar-1 are needed, but the materials need to be

transparent as well for OPV and OLEDs. Encapsu-

lation materials are either passive or active.

Active materials, or getters, are designed to

absorb water or oxygen (typically zeolites, reac-

tive metal oxides) before they can reach and

damage the active device stacks. In combination

with passive materials, they enable shelf and

operational lifetime of currently commercially

available OLED devices. Passive materials include

organic UV or thermally curable adhesives for

edge or monolithic sealing of devices typically

sandwiched between glass or engineered flexible

substrates. Flexible substrates often comprise

planar diffusion barriers, materials include silicon

oxides, silicon nitrides, silicon oxynitrites or

alumina layers. For encapsulations where a

higher transmission rate is possible, e.g., for

OTFTss, it is possible to use polymers filled with

nanoparticles or nanoflakes.

Substrates

Most organic and printed electronics devices

target the use of flexible and potentially low-cost

substrates to enable large area and/or more

rugged products with a higher freedom of design.

Since the device manufacturing process usually

starts with the substrate onto which several lay-

ers of active and passive material are deposited,

the surface needs to be compatible and to guaran-

tee processability in subsequent production steps

© OE-A

Gravure Printing

Impression cylinder

Gravure cylinder

Image elements are equally spaced but variable in depth and area

Blade

Ink

© OE-A

Ink-jet Printing

Piezo Transducer

Ink Orifice

Substrate

Figure 19: Rotogravure printing process. Figure 20: Screen printing process.

Figure 21: Ink-jet deposition mechanism (piezo).

Screen Printing

Squeegee

Sreen mesh

Ink Frame

Substrate Base plate (stationary)© OE-A


and of course functionality in the final applica-

tion. The numerous flexible electronics applica-

tions all have their own specific requirements,

and therefore suitable substrate solutions within

one application group can still differ over a wide

range. In general, glass and metal (stainless steel,

aluminum foil or the like) are still the only

substrates readily available with high and reliable

barrier properties – a key requirement for many

applications (OLED lighting, display, organic

photovoltaics). Among the polymer films, the

polyester grades (PET, PEN) are most widely used

today in organic and printed electronics, but also

other polymers, paper, cardboard and textiles

have been utilized in these applications. Plastic

materials like PET, PEN or PC (polycarbonate) can

be tailor-made to adjust physical and surface

properties over a wide range so that they can

serve as all-round solutions. Other plastics like

polyimide (PI), polyethersulfone (PES) or poly-

etheretherketone (PEEK) are specialties and

hence higher priced materials with special advan-

tages like increased heat or chemical stability.

Patterning Processes

A wide range of large-area deposition and

patterning techniques can be used for organic

electronics. Most prominent in this context are

various printing techniques that are well known

from the graphic arts industry and enable reel-

to-reel processing.

Examples of two high-volume printing processes

are rotogravure (Figure 19) and screen (Figure 20).

Other mass printing processes are offset,

lithography or flexography. The lateral resolution

(smallest feature that can be printed) typically

ranges from 20 μm to 100 μm depending on

process, throughput, substrate and ink proper-

ties. Film thicknesses can range from well under

1 μm to tens of μm. Each process has its own

strengths, e.g., screen is excellent for stacking

multiple thick films, while gravure combines high

throughput with robust printing forms and can

deliver homogeneous thin films. These printing

processes can have enormous throughput and

low production cost but place demanding

requirements on the functional inks in terms of

properties like viscosity, and cannot correct for

issues like substrate distortion. Mass printing will

be an important production process especially for

applications where large area, high volumes and

low costs are important. Recently, there has been

progress in improving the resolution of mass

printing processes, e.g., through new screen

materials or laser-assisted etching of gravure

forms.

Ink-jet printing (Figure 21) has received growing

interest as a way to deposit functional materials.

As a digital printing process, it enables variable

printing since no printing plate is needed, and

can thus correct in-line for distortion. Ink-jet

printing head developers have continued to

develop finer and finer printing heads, which are

Figure 22: Throughput vs. feature size for a range of typical production processes.

Hig

h (>

1)M

ediu

m(0

.01-

1)

Thro

ugh

put

(m2 /s

)

Minimum feature size (μm)

1 10 100 500

Gravure

Flexo

Low

(<0.

01)

High Resolution (< 10 μm) MediumResolution(10-50 μm) Low Resolution (> 50 μm)

100

1

10-2

10-4

© OE-A 2013

Xerography

Throughput vs. Feature Size for Typical Production Processes

Offset

Screen

Laser ablationR2R

PhotoLitho-graphyR2R

Ink-jet


starting to enable features on the order of a few

μm, and throughput is improving with the devel-

opment of multi-head printers. Recently, aerosol-

jet printing has also received a lot of attention,

and super ink-jet printing, a related process, has

claimed ability to get to micron features without

pre-patterning the substrate. Progress in increas-

ing the resolution and registration of printing

processes will be a critical step to dimensional

scaling of organic electronics, which could be of

similar importance to the scaling of photolitho-

graphy processes for silicon electronics, the

driving force behind Moore’s Law.

Related to volume printing are unpatterned

solution coating techniques such as slot-die or

wire bar coating. Slot-die coating in particular

has gathered significant interest, because it can

be non-contact, pre-metered and work with a

sealed system, which is useful especially for

solvent-based materials. Slot-die coating can

operate in either bead/meniscus mode or in

curtain mode.

Laser ablation, laser induced forward transfer,

large area vacuum deposition, soft lithography

and large area photolithography are further

patterning and deposition techniques. Some of

these processes are subtractive, i.e., involve

removing unwanted material from a large area

unpatterned film, while others are additive, i.e.,

only deposit material where it is wanted. Sub-μm

patterning techniques such as nanoimprint

lithography and microcontact printing have

gained a good deal of attention recently but are

still primarily used in research. Pad printing, hot

stamping, xerography and surface energy

patterning are also receiving substantial atten-

tion. Each method has its individual strengths,

and in general, processes with a higher resolution

have a smaller throughput, though there has

been some progress in this area (Figure 22).

There are no single standard processes in exis-

tence today. Deciding which printing or other pat-

terning process is used depends on the specific

requirements of a particular device. In general,

different processes have to be used for subse-

quent steps of a multilayer device in order to

optimize each process step. The above mentioned

processes differ strongly with regard to e.g., reso-

lution and throughput, and one system may

require some high-throughput steps followed by

high resolution processes, e.g., deposition of large

amounts of material using coating or mass print-

ing followed by fine patterning of a small portion

of the surface using laser ablation.

Process Technology Levels

The technologies that are used in organic elec-

tronics range from batch, clean-room, etching-

based processes to mass printing processes that

are capable of deposition of square meters of

substrates per second. Here is a rough classifica-

tion of the technologies in three different tech-

nology levels:

The wafer level technology includes batch pro-

cessing, typically film substrates on a carrier. An

adapted semiconductor line is used for process-

ing. High resolution can be achieved by vacuum

deposition and/or spin coating followed by

photolithography and wet or dry etching. The

production cost is relatively high and the process

is not compatible for conversion to in-line sheet-

to-sheet or reel-to-reel processes.

Under hybrid technologies, we summarize com-

binations of processes including large-area pho-

tolithography, screen printing or printed circuit

board (PCB) technologies that make use of flex-

ible substrates (e.g., polymer films or paper).

Deposition of materials is achieved by spin coat-

ing, blade coating or large-area vacuum deposi-

tion, in some cases also partly by printing. Ink-jet

printing and laser patterning are further technol-

ogies that are grouped in the hybrids and enable

production at a medium cost level. At the

moment, hybrid appears to be possibly the most

promising technology for further market penetra-

tion in the next few years, and it could also be

combined with some amount of silicon for

specific functions in heterogeneous integration.

Fully printed means continuous, automated

mass-production compatible printing and coat-

ing techniques (flexo, gravure, offset, slot-die,

etc.), flexible substrates and reel-to-reel technol-

ogy (Figure 23). Although all-printed devices do

not yet show as high resolution or performance

as those made using wafer or hybrid processes,

mass printing has great potential for very low

cost production and will be able to deliver

extremely large numbers of products. At the

same time it requires significant volumes of

materials even for trials, and will need large-

volume applications to properly utilize such high-

throughput equipment.


Key Technology Parameters

The detailed application parameter specifications

for the different applications and product genera-

tions help define the requirements that have to

be fulfilled from technology side. The technology

parameters are more “fundamental” and describe

fundamental material, device or process proper-

ties. As with the application parameters, we only

list a small excerpt of the key technology param-

eters identified for the various applications,

focusing on those that are relevant to a number

of applications. As was the case with application

parameters, the same key things are important

as in the last edition.

• Mobility / electrical performance (threshold

voltage, on/off current)

The performance (operating frequency, current

driving capacity) of the circuits depends on the

charge carrier mobility of the semiconductor,

the conductivity of the conductor and the

dielectric behavior of the dielectric materials.

• Resolution / registration

The performance (operating frequency, current

driving capacity) and reliability of the circuits

depend on the lateral distance of the elec-

trodes (resolution) within the devices (e.g.,

transistors) and the overlay accuracy (registra-

tion) between different patterned layers.

• Barrier properties / environmental stability

The lifetime depends on a combination of the

sensitivity of the materials and devices to

oxygen and moisture and the barrier properties

of protective layers, substrates and sealants

against oxygen and moisture. The necessary

barrier properties vary for the different applica-

tions over several orders of magnitude.

• Flexibility / bending radius

Thin form factors and flexibility of the devices

are key advantages of organic electronics. In

order to achieve reliable flexibility and even

rollable devices, materials, design and process

have to be chosen carefully.

• Fit of process parameters (speed, temperature,

solvents, ambient conditions, vacuum, inert

gas atmosphere)

In order to have a sufficient working system, it

is important to adjust the parameters of the

different materials and devices used to build

organic electronics.

• Yield

Low-cost electronics in high volumes are only

possible when the processes allow production

at high yields. This includes safe processes,

adjusted materials and circuit designs as well

as an in-line quality control.

Figure 23: Reel-to-reel printing of electronic devices. (Source: 3D-Micromac)


Principle Challenges

One goal of the roadmap is to identify red brick

walls – principle challenges that can only be over-

come by major breakthroughs beyond the expec-

tations of standard technology development. For

each application, the requirements for product

generations were compared with expected tech-

nology development and the key challenges were

identified and discussed. Like the key application

and technology parameters, the red brick walls

may vary for the different applications. Those

discussed below are valid for all applications and

summarize the most important ones.

A common feature of all future generations of

the different products is that the complexity and

overall size of logic circuits is increasing. In

certain cases, the applications include millions of

transistors, other combine various different elec-

tronic devices like circuit, power supply, sensors,

displays and switches. In the future, more and

more higher and higher performance compo-

nents will have to be fit into smaller and smaller

areas, which for other applications high-perfor-

mance components will have to be placed pre-

cisely over large areas, up to a few square meters.

At the same time, wafer level processing will not

in the longer term be a commercially viable

approach for a number of applications and hybrid

or fully printed processes will need to be used.

Based on the above considerations and the

results of the work of the application and tech-

nology groups, we believe that major break-

throughs in the following areas are absolutely

necessary:

• Materials need to be improved concerning elec-

trical performance, processability and stability

− Charge carrier mobilities of above

5–10 cm2/Vs in printable commercially

available materials for both n- and p-type

semiconductors are needed to address

more complex applications. While there is

progress in this area, commercially viable

materials are still missing

− In addition to high champion mobilities,

materials that can be processed to create

highly uniform devices are critical

− Improved processability, especially formula-

tions in non-toxic solvents, is urgently needed

for many materials

− Materials need improved environmental

stability to enable operation in more robust

environments and to reduce barrier require-

ments

• Processes: resolution, registration, uniformity

and characterization improvements are needed

− Higher resolution and registration are needed

to improve performance and reduce

footprint of complex circuits, to lead to

scaling of devices in a similar way to that

observed in silicon

− Uniformity over large areas need to be

improved especially for applications such

as lighting, OPV and displays

− High-throughput in-line electrical

characterization of devices is needed to

guarantee product performance, and is

simply not available for many applications

• Encapsulation:

− While there has been progress, barrier

properties of flexible, low-cost encapsulation

need to be strongly improved to enhance

lifetime of the devices

− In particular, achieving flexible, transparent

barriers at low cost continues to be a

challenge

• Existing standards and regulations for classical

electronics do not address specifics for organic

and printed electronics

− Complying with standards developed for

Si-based electronics appears extremely

difficult in many applications, and does

not actually reflect the application needs

− Defining new standards specifically for

organic and printed electronics is highly

challenging

The key challenges cannot be treated indepen-

dently since they depend on each other. Improved

materials may reduce encapsulation require-

ments; resolution and registration accuracy

depend on various patterning techniques and

may vary even within a technique depending on

throughput.

A key reason to identify red brick walls is to help

the organic electronics community align its

efforts to solve the most pressing problems.

Longer-term strategies, funding and new partner-

ships along the value chain are necessary to over-

come the red brick walls.


Summary and Outlook

Organic and printed electronics is a versatile plat-

form technology that enables fresh electronic

applications in many fields, such as interactive

toys, RFID-tags, sensors, lighting, rollable displays

or flexible solar cells, which are now entering the

market. With this fifth version of the OE-A Road-

map, we have updated and expanded the infor-

mation about our view of the developments in

this field. We have analyzed the progress and

roadmap for five clusters of applications, seen

that products have entered the market in more

application areas than at the last roadmap and

updated the technological and business develop-

ment status. We have looked at key parameters

and expected technology development for them

and used this updated information to identify the

key challenges, which we call red brick walls, and

found that the key issues are mostly the same,

though some challenges are starting to be met.

We have also tried to bring the basic information

together to a relatively simple picture of the main

developments in this field from the application

and technology point of view.

The technology has achieved enough market

penetration to start to qualify as an industry,

albeit a nascent one, even though market devel-

opment was not as quick as expected some years

ago. Since the last edition of the roadmap, the

number of products and the range of applications

where organic electronics is reaching the market

have increased. Mass markets are not yet there,

with the possible exception of OLED displays for

mobile phones, but could be reached in the near

future; this will depend on progress in the fields

of material, equipment, processes and device

design. Some of this progress will be straightfor-

ward, while we have identified some areas where

breakthroughs will be needed.

For example, materials need to continue to be

improved not only in terms of performance but

also processability, uniformity and stability.

Improved patterning processes with high resolu-

tion, registration, and uniformity are needed for

future product generations, as are in-line electri-

cal performance testing methods. Encapsulation

materials, while performance has improved, still

need to become high performance at low cost.

The challenge of developing standards suitable

for organic electronics needs to be addressed.

Organic electronics is beginning to be an indus-

try, and we are beginning to see some key trends,

namely:

• Mobility of organic semiconductors,

conductivity of printed conductors and

efficiency of OPV materials are continuing

to increase rapidly

• Patterning processes are being scaled to

smaller dimensions

• Hybrid processing and heterogeneous integration

of printed and silicon-based components show

promise of leading to new products

• Flexible, lightweight, mobile electronic

products are starting to enter the market,

enabled by organic electronics

• Applications in intelligent packaging and

smart textiles are starting to appear.

However, some questions remain open; for exam-

ple, we have not yet been able to define a simple

“Moore’s law” for organic electronics or identify a

“killer application” in the longer term, though

there are indications that progress in mobilities

and in resolution of printing and patterning could

possibly lead to scaling laws in the future.

Although there are many fascinating applications,

it is still too early to tell which of these – or new

ones we have not yet thought of – will turn into a

“killer application”, or if gradual market penetra-

tion in a variety of areas within the diverse and

complex field of organic electronics is more likely.

Organic and printed electronics is now in the

market and has great potential for further

growth.

We will continue to follow the developments to

find the major trends. The roadmap is an ongoing

task and key activity of the OE-A and its mem-

bers. A more detailed presentation of the road-

map will be published as a White Paper later in

2013 and will be available from OE-A.

Organic and printed electronics is a disruptive

technology that will create a wealth of new

products that we cannot even think of today.

OE-A will keep you updated.


The integration of thin and flexible electronics

opens up new possibilities for classically printed

products. Light, sound, displays, power or sensors

can be integrated into traditional print products

like journals, brochures or packaging, thereby

enhancing their functionality. Interactive print

products provide additional functionality and new

possibilities for industries such as advertising.

In order to illustrate new possibilities, the limited,

special edition of the OE-A brochure boasts an

interactive cover page which gives you a feeling

for the next generation of electronics: enabling

new applications that are thin, lightweight,

flexible and produced at low cost. The functional

cover page is an impressive example of this

emerging technology and came about as part

of the OE-A demonstrator project.

More than 4,000 samples were produced by two

teams from the Munich University of Applied

Sciences and Chemnitz University of Technology.

OE-A members

• DuPont Microcircuit Materials,

• DuPont Teijin Films,

• Enfucell,

• Fraunhofer ENAS,

• Fraunhofer ISIT,

• Schoeller Technocell and

• THIEME

were additional partners on this project. The

demonstrator illustrates the versatility that

organic and printed electronics can offer in terms

of scalability, miniaturization, adaptability,

manufacturability, integration, complexity and

high technical yield.

Experience the bright future of organic and

printed electronics!

Technology and Process

A major benefit of organic and printed electronics

is the ability to automatically integrate different

electronic devices into a complex system by

making use of high-throughput production

processes.

The project was coordinated by the Munich

University of Applied Sciences which also led one

of the project teams and designed the layout of

the demonstrator. The interactive cover page

combines screen-printed electronic circuitry,

a printed zinc/manganese dioxide battery, a

printed push button and four green light-emit-

ting diodes. As a first step, the project team at

the Munich University of Applied Sciences

charges THIEME with screen printing the conduc-

tive circuitry using a silver ink from DuPont

The Future of Printed Products – Interactive Cover Page

Figure 1: Interactive cover page of the 2013 OE-A brochure.


Microcircuit Materials. The substrate consists of

thin modified photo paper (p_e:smart®) by

Schoeller Technocell. After curing the ink by air-

drying or using a low-heat drying technique, an

entirely automated process is in place at Fraun-

hofer ISIT to position, then affix the low-current

LEDs to the printed silver contacts using a

conductive adhesive.

The total thickness of the components is only

0.7 millimeters, so the electronics are barely

noticeable. Finally, the printed zinc/manganese

dioxide battery from Enfucell and the printed

push button are mounted by the Munich

University of Applied Sciences.

The project team at Chemnitz University of

Technology prints conductive lines and the cur-

rent collector of the battery on plactic substrate

provided by DuPont Teijin Films with commercial

carbon ink. Using zinc as an anode and manga-

nese dioxide as a cathode, the materials are

printed on dedicated areas on top of the current

The picture on the cover page shows an aircraft marshaller with

electronics integrated into his safety jacket. One application for

organic and printed electronics is smart textiles. The ability to inte-

grate smart textiles has already been demonstrated by several

OE-A member companies and institutes. Integrating electronics

such as lighting, sensors, batteries or photovoltaics into fabrics

enables a wealth of new options in fashion, sports, medical, health

care or automotive applications.

collector. Next, the LEDs are attached to the

conductive circuitry using the automated process

mentioned above. In the meantime, the comple-

mentary part of the demonstrator, including the

remaining electrodes and a printed push-button

that is part of the embedded circuitry, are printed

on the same Schoeller Technocell substrate as in

the other project team. The two parts of the

demonstrator are then combined with an

electrolyte and a separator between the anode

and cathode materials. Three battery cells are

connected in series. This way, a fully integrated

solution is manufactured without having to sepa-

rately interconnect components. The capacity of

the printed batteries from Enfucell and the

Chemnitz University of Technology is sufficient to

operate the four LEDs on the cover page for one

second more than 2,000 times.

We hope that you will find this demonstrator

useful – and that you will come to appreciate

how far organic and printed electronics has come

as a technology enabling new applications.

For more information, please visit

www.oe-a.org/interactive-cover-page

Discover the possibilities enabled

by mass- produced, printed electronics!

www.oe-a.org/interactive-cover-page


Organic and printed electronics carries great

potential for multiple applications. The goal of

the OE-A Demonstrator Group is to illustrate the

potential of this emerging technology and to

foster cooperation among OE-A members. Since

the working group was formed in 2005, an

increasing number of project teams from Europe,

North America and Asia have worked together on

a variety of demonstrators.

OE-A Toolbox for Organic and Printed Electronics

The OE-A Demonstrator team developed the

“OE-A Toolbox for Organic and Printed Electronics”

in 2010. It provides the opportunity to develop

and build new applications and integrated smart

systems by using organic and printed electronics

components.

Organic and Printed Electronics: OE-A Demonstrators Illustrate the Potential

The OE-A Toolbox includes more than 25 different

organic and printed electronic devices, from sen-

sors to solar cells and paper to transparent films

or plastic substrates. The OE-A Toolbox continues

to be expanded on a regular basis. Consequently,

the Toolbox represents the state-of-the-art of

organic and printed electronic components.

Figure 2: OE-A Toolbox with more than 25 different components.

Figure 1: OE-A Demonstrator projects 2006–2013.

Organic and Printed Electronics: OE-A Demonstrators Illustrate the Potential

2013© OE-A 2013

2006 2007 2008

2009

201020112012


OE-A Demonstrator Competition

The OE-A Demonstrator Group started a competi-

tion in four different categories which is open to

universities and research institutes as well as to

companies. OE-A members and non-members

can enter the competition in the form of func-

tional demonstrators or design concepts.

The university competition gives young engineers

and scientists the opportunity to design creative

new products utilizing components from the

Toolbox. By providing a set of devices from the

OE-A Toolbox, the OE-A offers contestants the

opportunity to build demonstrations of visionary

applications in organic and printed electronics by

making use of its unique features: thin, light-

weight, flexible, robust and produced at low cost.

The category “Freestyle Demonstrator” is open to

OE-A members only; a functional demonstrator

utilizing organic and printed electronics has to be

submitted.

To assist with the dissemination process of

publicly funded project demonstrators, the

OE-A Demonstrator Group included the category

“Publicly Funded Project Demonstrators”.

In the category “Design Competition”, designers

or students at a university for design are invited

to submit posters, films, models or a functional

demonstrator that develops new applications or

improves existing product concepts.

All demonstrators and concepts that have been

submitted will be presented to the worldwide

community at LOPE-C, and the best demonstrator

in each category will be awarded during the

LOPE-C Dinner.

In 2011, the first place was awarded to the

Munich University of Applied Sciences for an

interactive children’s book. The student team

integrated printed electrochromic displays, laser-

structured electroluminescent displays, OLEDs,

printed conductive lines, laser-structured push

buttons, an RFID power supply as well as a solar

cell power supply.

In 2012, the OE-A received more than 50 func-

tional demonstrators and design concepts as

entries in the competition. The prizes for the best

demonstrators in each category were awarded to

an inkjet graphene biosensor from Merck, Japan;

a printed digital white board from Hochschule

der Medien, Stuttgart, Germany; a remote-

controlled toy car with a printed pyroelectric

infrared sensor and a printed piezo sensor for the

protection of drivers and pedestrians from the

EU project 3PLAST; and finally, design concepts

for electroactive polymer applications from the

University College West Flanders, Belgium.

In 2013, the demonstrator initiative has been

expanded. A limited edition OE-A brochure

featuring an interactive front page with inte-

grated organic and printed electronics has been

produced (see article on page 26). 19 functional

demonstrators and ten design concepts have

been submitted to the OE-A competition for

multifunctional demonstrators.

Outlook

The demonstrator project is a key activity of the

OE-A. State-of-the-art concepts in organic and

printed electronics are realized by combining the

competence of several partners in the fields of

materials, processes and devices to produce more

and more complex and integrated systems – which

will ultimately become the products of the future!

Figure 3: Award Ceremony at LOPE-C.


For many industries, the ability to create elec-

tronics based on inexpensive and abundant mate-

rials, using simple printing processes, is a dream.

So too is the idea that flexible electronics could

be integrated in new ways, from packaging labels

to wearable devices. Yet recent developments

suggest that this dream of printed and organic

electronics is beginning to turn into reality.

Towards the end of the last decade, the plastic

electronics industry could be forgiven for feeling

as though its opportunity was slipping away. The

mid-2000s had seen printed and organic elec-

tronics generate a great deal of hype, as a coming

revolution in the way electronic devices are

manufactured and integrated into things.

What followed, in terms of commercial successes,

did not compare to the industry’s vision. The

high-profile technology push from developers

had grabbed the attention of potential integra-

tors. Yet the technologies needed to realize many

of the concepts envisaged were found wanting.

The toolkit was not in place. Excitement turned

to disillusionment.

The picture in 2013 is better. OLED displays have

become a standard bearer for organic electronics,

and flexible – or, at least initially, glass-free –

displays have injected renewed enthusiasm in

those outside the plastic electronics community

who can see value in the unique proposition of

robust, lightweight flexible screens (though

interest in fully flexible or rollable, display-based

products is less clear).

Market for Organic and Printed ElectronicsBy Adam Page, Smithers Pira

Projections

Smithers Pira estimates the global market for

plastic and printed electronics to be worth some

US$ 7 – 9 billion in 2012, and forecasts it will

grow to US$ 190 billion, but not until 2025. There

have been many over-optimistic estimates on the

market potential published, but these have not

come to pass. This is partly through the travails of

a largely stalled world economy; but the perfor-

mance of many early systems has not been good

enough or reliable enough too. There are estab-

lished businesses using the technology to

produce high volumes of displays and various

electronic components, leveraging their printing

skills. Smithers Pira forecasts low, but steady,

growth for the rest of the decade, with adoption

growing faster afterwards.

The main drivers for this growth are the improved

capability of printed items, as developers produce

more efficient end-use products – with econom-

ics that are difficult to ignore. New functionality,

linked with drives toward sustainability across

the lifetime of products are making end-users

look for alternative solutions, and printing elec-

tronics certainly provides many benefits over

traditional silicon based electronics and tradi-

tional lighting and photovoltaics.

The end-use applications are only limited by the

imagination, with displays, energy harvesting,

lighting, sensors and circuitry now coming to the

market. Car manufacturers are developing whole

new instrument panels and interior lighting

systems, while totally new lighting systems are

being developed for homes, workplaces and pub-

lic buildings. Consumer products are innovating;

the quality of smart phone, computer and tablet

devices has greatly improved over the past few

years that push consumer expectations and

demands.

Displays

These developing customer requirements change

the expectation for various products, such as

displays, one of the reasons for low take-up of

printed displays. Markets for novel displays

should be understood in the context of high-

volume versions in consumer electronics.

Smithers Pira is the worldwide authority on the packaging, paper

and print industry supply chains. It was originally established in

1930 as the Printing Industry Research Association. It provides

market reports, consultancy, books, publications, events, member-

ship and testing. A new report on the future of plastic electronics

will be published later in 2013.

www.smitherspira.com

Smithers Pira


Amazon’s Kindle reader is now available for

US$ 100, a sum within the reach of most

consumers (at least in higher income regions).

The Retina displays on new Apple products are

very high quality and a major selling point – so it

looks like the prospect for plastic paper readers

has evaporated. There are applications in shelf

signage for instantly updateable information, but

these are not finding the market uptake that has

been expected, with few stores using them.

Smaller displays can be used in different areas.

Smart cards, for example, offer one chance of

showing the benefits of including printed elec-

tronics in various everyday items. Proponents say

this can show an account balance in real time or

generate a one-time passcode for cardholder not

present transactions.

With mobile banking an account balance can be

seen in great detail on a mobile phone, and this

could easily contain an app to get the passcode.

Merchants will have to have the capability of

entering – and validating – this code, demanding

new systems. If a card is stolen, there will be a

window for the thief to use the code: it will limit

the opportunities for a card number fraud, but is

not a totally secure solution. So it is not easy to

determine real business benefits.

Packaging

There are new developments and innovative

ideas still being explored and shown. Getting a

large packaging company on board may prove to

be a key step to commercialize the technology,

and grow the market. The printed electronic label

consists of printed memory, sensor and logic,

detects the property and records data about the

product history for later retrieval and display.

One of the first applications is temperature

sensing – this is a practical example of intelligent

packaging, a concept that has been discussed for

many years but has yet to break through.

Evaluate

As the technology improves and develops, the

fledgling companies have to scale up laboratory

results, produce pilot products and build a cus-

tomer base. On this path to a fully working

product that can be manufactured without any

surprises, there are various technical hurdles to

overcome.

There are solid businesses based on printing elec-

tronics, the markets mainstream electronics, with

small displays and touch screens for mobile

devices faring well. There are many mind-blowing

technology demonstrations, but many are a long

way from being successful commercial products.

Uses are ever-widening: in displays and lighting,

for packaging and labels, for power harvesting, in

security, sensor monitoring, in automotive and

homes and offices. The business benefits behind

these are less well defined.

Printed electronic developers need a killer appli-

cation, where the new technology provides

significant cost or functional improvements over

existing alternatives. The other route is to invent

a need and fulfill it, but this is much higher risk

and more difficult to accomplish. Developers

have been facing the harsh reality of a global

recession that has hampered early adoption.

The markets will grow significantly, as more

partnerships bring business benefits to manu-

facturers, and end-consumers.

Figure 1: Global market for plastic electronics, US$ billion (2010-2025).(Source: Smithers Pira)

Global Value of Printed Electronic Products (US$ Billion)

200

150

100

50

02010 2011 2012 2013 2014 2015 2016 2017 2018 2019 2020 2021 2022 2023 2024 2025


www.oe-a.org

List of OE-A Members Represented

Research Institutes

79 Acreo Swedish ICT

80 CEA LITEN

79 CeNTI – Centre for Nanotechnology and Smart Materials

81 The Centre for Process Innovation – CPI

81 CETEMMSA Technological Centre

83 CSEM

83 CSIRO

84 CTP – Centre Technique du Papier

84 ENEA UTTP-NANO

85 EPFL IMT SAMLAB – Ècole Polytechnique Fédérale de Lausanne

85 Fontys University of Applied Sciences

86 Fraunhofer COMEDD

86 Fraunhofer Research Institution for Modular Solid-State Technologies EMFT

87 Fraunhofer Institute for Electronic Nano Systems ENAS

87 Fraunhofer Institute for Applied Polymer Research IAP

88 Fraunhofer Institute for Laser Technology ILT

88 Fraunhofer Institute for Manufacturing Engineering and Automation IPA

89 Fraunhofer Institute for Solar Energy Systems ISE

89 Fraunhofer Institute for Silicon Technology ISIT

90 Fraunhofer Alliance POLO®

90 Georgia Tech – Center for Organic Photonics and Electronics

91 Holst Centre

91 IK4-CIDETEC

92 InnovationLab

93 JOANNEUM RESEARCH

93 Johannes Kepler Universität Linz – LIOS

94 LCPO – Université de Bordeaux

94 LTFN – Aristotle University of Thessaloniki

96 NanoTecCenter Weiz

95 NRC Printable Electronics

96 PARC – Palo Alto Research Center

97 pmTUC – Chemnitz University of Technology

97 Printable Electronics Research Center – PERC

98 Quebec Institute of Graphic Communications – QIGC

98 Swansea University – WCPC

99 Technische Universität Darmstadt

99 TOPIC – Thailand Organic and Printed Electronics Innovation Center

100 University of Leeds – Centre of Industrial Collaboration

100 University of Novi Sad

101 University of West Bohemia – RICE

101 VTT

Companies

37 3D-Micromac

38 adphos Digital Printing

39 Agfa-Gevaert

40 AIXTRON

42 ALTANA

41 ARJOWIGGINS CREATIVE PAPERS

44 BASF New Business

45 Beneq

46 Ceradrop

47 Coatema Coating Machinery

48 cynora

49 DOWA HD Europe

50 DuPont Microcircuit Materials

51 DuPont Teijin Films

52 EXAKT Advanced Technologies

53 Felix Schoeller

54 FUJIFILM Dimatix

55 Heraeus Precious Metals

56 HNP Mikrosysteme

57 IDAM INA – Drives & Mechatronics

58 KAMMANN Maschinenbau

59 Karl Knauer

60 KROENERT

61 Mekoprint

62 Merck

63 Next Energy Technologies

64 NovaCentrix

65 Novaled

66 PolyIC

67 SAES Getters

68 SAFC Hitech

69 Soligie

70 SOLVAY Organic Electronics platform

71 SunaTech

72 Teknek

73 Thin Film Electronics

74 TSE Troller

75 VARTA Microbattery

76 VDL FLOW

77 Xenon Corporation

78 Ynvisible

3D-MICROMAC 37

3D-Micromac AG develops and manufactures

highly efficient state-of-the-art laser microma-

chining systems and innovative coating and

printing technologies. As stand-alone or inte-

grated solutions, the systems are suitable for the

digital fabrication of flexible electronics, e.g.

RFID, OPV and OLED. On demand, 3D-Micromac

also develops new processes and technologies.

Laser competence

Since its founding, 3D-Micromac has gained an

established position in international markets

with sales and service partners in North America,

Asia and Europe. The company’s original compe-

tence is grounded in laser micromachining.

Extremely precise positioning systems and inno-

vative beam-delivery concepts, as well as numer-

ous process monitoring methods, offer the high-

est possible process reliability and a maximum

machining speed.

Roll-to-roll processing

Due to an increased demand on the market for

systems to process flexible thin-film substrates,

3D-Micromac developed the microFLEXTM pro duct

family. The systems work with a roll-to-roll

process guaranteeing high throughput and are

able to reduce the cost and effort of device pro-

duction. The company’s excellent laser processing

competence is thereby fully utilized. The modular

design of microFLEXTM ensures high flexibility

regarding different fields of flexible, organic com-

ponent production. 3D-Micromac is thus able to

deliver complete production lines for the manu-

facturing of flexible electronics, from the raw

materials to encapsulated products.

Laser processing, printing and coating tech-

niques, like ink-jet printing, rotary screen printing

and slot die coating, as well as a manufacturing

execution system (MES) can be integrated. The

modular design is ideal for an individual adjust-

ment of the system to the requirements of the

customer. Areas of application include flexible

solar cells, on CIS/CIGS and organic standards,

flexible LED and OLED illumination and rollable

display technologies, the semiconductor industry,

microsystems technology, RFID and printed

batteries.

3D-Micromac AG – First Choice in Micromachining

3D-Micromac AG Technologie-Campus 8 • 09126 Chemnitz • GermanyPhone +49 371 40043-0 • E-Mail [email protected] www.3d-micromac.com

38 ADPHOS

adphos – a leading engineering company for

thermal processes, like drying, curing, sintering

and others – has developed the company-owned

adphosNIR®-technology, a widely patented,

photonic energy-based process technology.

It is one of the fastest growing thermal process-

ing technologies for ink jet printing and coatings

application technologies, particularly for water-

based applications. adphos has pioneered the

technology and enhanced its output to provide a

very high power density for the ink or coating

film, leaving the paper and plastic substrate

largely unaffected by this energy. The high power

density found at this particular wavelength drives

out the water (or solvent) and, if necessary, also

sinters or cures very rapidly, ensuring that the

print or coating is dry within a very small foot-

print. This ensures that production machinery

can include an efficient drying as well as thermal

process system without taking up excessive

amounts of machinery or shop floor space.

adphos is a world leader in the design, develop-

ment and supply of drying and thermal process

systems. Working together with coating machine

manufactures, adphos can allow customers to

enter the world of printed electronics without

compromise to substrate and running speed.

The focus of the adphos group lies in applications

of thermal processes for drying and heating

and the distribution of standard components

for lab to fab conditions (NIR drying and heating

modules). The group can also offer the design

and engineering of special purpose machines

and offer its application center for R + D-tests,

pilot productions and production process

demonstrations.

No matter the difficulty of the application needs,

adphosNIR®-technology can provide:

• Drying within seconds or even

within milliseconds

• Defined controlled and reproducible

thermal processes

• Drying on temperature sensitive materials

• Energy efficiency and affordability!

Our target is to provide our customers with

optimum solutions and provide them with high

added value output. Therefore, the needs and

requirements of our customers always have

priority.

Photonic Drying and Sintering – From Lab to Fab Solutions

adphos Digital Printing GmbHBruckmühler Str. 27 • 83052 Bruckmühl/Heufeld • GermanyPhone +49 8061 395 100 • E-Mail [email protected] www.adphos.de

AGFA-GEVAERT 39

ORGACON™ is the portfolio of proprietary materi-

als, developed and produced within the Advanced

Coatings & Chemical Business group of Agfa

Materials. ORGACON products show a unique

combination of conductivity, high transparency,

flexibility and processability that is not matched

by other conductive materials.

The ORGACON products line consists of water-

borne dispersions and solvent-dispersible PEDOT/

PSS, ready to coat and print (screen and inkjet

inks) materials for manufacturing transparent

flexible electrodes for display devices, capacitive

touch sensors, organic photovoltaics, and other

printed electronics applications. Our products can

be customized and joint-development of coated

film is possible.

Competence in Organic Electronics

More than 20 years ago, the photographic film

industry started to investigate more robust

solutions than the existing antistatic material,

resulting in the first synthesis of PEDOT/PSS by

Agfa-Gevaert. The first synthesis invention was a

breakthrough for using intrinsically conducting

polymers, already known for several decades,

but limited by their processability. This shortly

came into application at Agfa-Gevaert, who

coated several hundred millions of square meters

of antistatic layer on PET film each year. This

experience led to the development of higher-

performance grades used in a variety of appli-

cations like display, lighting and sensing devices.

Based on its expertise in film manufacturing

and coating processes, Agfa is also investigating

the manufacturing of advanced transparent

electrodes design on flexible substrates.

What We Make is Clearly Conductive, What We Do is More

Agfa-Gevaert NV c/o Dr. Frank LouwetSeptestraat 27 • 2640 Mortsel • BelgiumPhone +32 3444 3250 • E-Mail [email protected] Internet www.agfa.com/orgacon

40 AIXTRON

AIXTRON offers technologies for controlled depo-

sition of organic small molecules and polymer

thin films. Organic Vapor Phase Deposition

(OVPD®) is a technology for the thin film depo-

sition of organic “small molecules” based on the

gas phase transport principle. Polymer Vapor

Phase Deposition (PVPD®) is used for the

controlled deposition and in situ formation of

polymer-based thin film structures. These

patented processes improve process inspections,

reproducibility and operating costs.

Organic Vapor Phase Deposition (OVPD®)

AIXTRON’s proprietary OVPD® process allows for

the deposition of organic semiconductor materials

used in OLEDs and flexible electronics suitable for

the manufacturing of OLED displays and lighting,

as well as other semiconductor applications.

The basic concept of OVPD® was developed and

patented by Prof. Stephen R. Forrest at Princeton

University, USA. The US-based Universal Display

Corp. (UDC) holds the usage rights for the

OVPD® patents, and licensed them exclusively

to AIXTRON. In adding its patented Close Cou-

pled Showerhead® (CCS) technology, AIXTRON

has added free scalability to the OVPD® baseline

principles.

Polymer Vapor Phase Deposition (PVPD®)

This technology is geared toward the deposition

of functional thin film structures and is able to

implement various polymerization processes in a

scalable procedure. PVPD® technology is based

on the principle of carrier gas-supported gas

phase deposition. The precursor materials, gener-

ally consisting of monomers, are vaporized in

specially optimized source systems and supplied

to the deposition process via an inert carrier gas.

Utilizing the CCS technology, this process is

scalable to any substrate size and can be used in

batch-based procedures, as well as continuous

inline or roll-to-roll processes. The ability to

precisely control the composition of the supplied

materials enables the deposition of complex

compounds, e.g., by means of controlled

co-polymerization.

Production Technology for Organic Displays, Lighting and ElectronicsNovel organic electronics devices by OVPD® or PVPD®

AIXTRON SE Kaiserstr. 98 • 52134 Herzogenrath • GermanyPhone +49 241 8909-0 • E-Mail [email protected] Internet www.aixtron.com

ARJOWIGGINS CREATIVE PAPERS 41

ARJOWIGGINS CREATIVE PAPERS is one of the

world’s leading manufacturers of fine and

technical papers. Innovation and creativity coupled

with a profound desire to be eco-responsible are

what guide us in our ongoing quest to find unique

new ways of responding to the diverse needs of

the market. To this end, we have developed

POWERCOAT – a revolutionary and award-winning

paper dedicated to printed electronics.

POWERCOAT outperforms even the best

plastics, making it the perfect sustainable choice

for printed electronics.

POWERCOAT is a unique cellulosic

formulation and coating process

that provides an ultra-smooth,

flexible, highly sustainable sub-

strate for printed electronics,

giving you:

• unprecedented, polymer-like

surface smoothness for optimum

conductivity and reduced ink

consumption.

• high thermal stability for control

over sintering behavior, thereby

promoting excellent conductivity.

• excellent sintering behavior: POWERCOAT

shows no noticeable change in its physical

characteristics in high temperature sintering.

As a result, printing can be carried out much

faster, particularly with photonic and flash cur-

ing techniques.

• improved control over electronic layer adhesion

• superior stability in roll-to-roll processing:

its impressive thermal and roll-to-roll stability

allow printed electronics and printed graphics

to be integrated in a single process, using exist-

ing pressroom environments.

• reduced overall production costs thanks to

reduced ink consumption and faster printing

speeds.

• a recyclable and biodegradable solution for all

your printed electronics needs: POWERCOAT

contains NO plastics whatsoever, and is FSC

(Forest Stewardship Council) certified, meaning

that pulp is sourced from responsibly managed

forests.

Performance

POWERCOAT allows any solution-based electronic

layer to be printed using various techniques,

including inkjet, gravure and screen printing. It is

an ideal substrate for laser lithography of high

resolution patterning using organic semiconduc-

tors, metallic inks, nanoparticles, nanotubes and

much more.

Applications

• integration of intelligent functionality

in disposable labels and packaging

• more efficient production of RFID antennae

using less ink

• resistors, capacitors, self-inductance and

other passive components

• lighting and display circuitry compatible

with large area flexible products

• battery electrodes, sensing technology…

POWERCOAT: Energizing Paper

ARJOWIGGINS CREATIVE PAPERS32, avenue Pierre Grenier • 92 517 Boulogne Billancourt • FrancePhone +33 157 759100 • E-Mail [email protected] www.arjowigginscreativepapers.com • www.powercoatpaper.com

42 ALTANA

The name ALTANA AG represents a global

specialty chemical group. It comprises the hold-

ing company ALTANA AG and four operating

divisions: ELANTAS Electrical Insulation, ECKART

Effect Pigments, BYK Additives and Instruments

and ACTEGA Coatings and Sealants.

The four divisions occupy a leading position in

their target markets with respect to quality,

product solution expertise, innovation and ser-

vice. Products made by companies in the ALTANA

Group are sold in over 100 countries and their

quality has earned us an outstanding reputation

amongst our customers as a valuable partner.

The exchange of technology and know-how

between the decentralized companies of the

division as well as the corporate culture of

ALTANA AG – focused on markets, service and

innovations – makes us a preferred supplier for

very different industries worldwide. Our strength

is offering customized solutions and specialty

products that create added value for our

customers.

ELANTAS develops and produces wire enamels,

impregnating resins, sealing compounds, confor-

mal coatings and casting resins, which are used

for the insulation of electric motors, generators,

printed circuit boards, sensors and electronic

modules.

ECKART is the world market leader for gold and

silver effects for the coatings and graphic arts

industry. The product portfolio contains: alu-

minum pigments for silver effects, brass and

copper pigments for gold effects, mica and glass

pigments for pearly and sparkling effects.

BYK-Chemie is one of the world’s leading suppli-

ers in the additive sector. The additives can opti-

mize viscosity, wetting, foaming, flocculation, as

well as scratch resistance and gloss. BYK additives

are applied in coatings, printing inks, plastics and

paper coatings.

ACTEGA is the market leader in overprint var-

nishes, sealing compounds, UV adhesives and

coatings for flexible packaging. These coatings

not only offer an appealing finish to printing

products but also guarantee longer freshness for

the packed product, scratch resis tance or water

tightness.

Ink Solutions for Printed Electronics

ALTANA 43

ELANTAS Beck GmbHGrossmannstr. 105 • 20539 Hamburg • Germany Phone +49 40 78946 231 • E-Mail [email protected] www.altana.com/innovation/printed-electronics.html

Platform laboratory

For strengthening the R & D activities in this area,

the cross-divisional ALTANA Technology Platform

Printed Electronics was established and an inter-

disciplinary application laboratory was installed

at ELANTAS Beck in Hamburg. The existing print-

ing and coating equipment enables the in-house

fabrication of functional films as well as elec-

tronic devices. Flexo, gravure and screen printing

machines cover all common printing processes. In

addition, several test facilities are available for

physical characterization and environmental

stress testing of respective films and devices. We

develop and produce for the printed and organic

electronics industry: dielectrics and insulators,

encapsulation and barrier materials, glues,

conductive and magnetic inks, functional inks

and special additives. Our ALTANA Technology

Platform Printed Electronics, as well as our sub-

sidiaries are always open for cooperation.

44 BASF NEW BUSINESS

BASF New Business GmbH is a wholly-owned

subsidiary of BASF SE. Operating globally, the

company aims to create technology-driven,

forward-looking businesses with above-average

growth rates that go beyond BASF’s current activ-

ities. BASF New Business works closely together

with technology leaders, start-up companies,

potential customers and a network of industrial

and academic partners to successfully develop

material systems suiting the needs of the emerg-

ing industries. BASF New Business is responsible

for BASF’s activities in Organic Electronics.

Printed electronics enable new

attributes and applications

BASF is working on printable

material systems for thin film

transistor applications. Low

temperature printing processes

will enable direct deposition on

plastic substrates in a sustainable,

cost-competitive manner.

In the display field, printed backplanes will

facilitate innovative new display attributes, such

as lightweight, robust, conformable and even

flexible panels.

Complimentary n- and p-channel semiconductor

systems will enable printed circuits suitable for

a broad range of applications incl. RFID, sensors,

and CMOS.

Efficient blue phosphorescent emitter

for OLEDs

OLED technology offers a paradigm shift for

both display and lighting markets enabling thin,

flat form factors, transparent and even flexible

devices. As a result, new applications are

expected to emerge.

BASF is developing and commercializing materi-

als for OLED, focusing on phosphorescent

material stacks which demonstrate the highest

energy efficiency. Our deep blue phosphorescent

emitter developments address the needs of the

OLED industry for improved energy efficiency

and lifetime for lighting applications.

Chemical Solutions for Electronics in a Connected World

BASF New Business GmbH4. Gartenweg Z 25 • 67063 Ludwigshafen • GermanyPhone +49 621 60-76811 • E-Mail [email protected] www.basf-new-business.com

BENEQ 45

Beneq is a premier supplier of industrial pro-

duction and research equipment for thin film

coatings. The company’s equipment is used in

flexible and organic electronics, photovoltaics,

strengthened glass and other emerging appli-

cations. Applications include encapsulation of

OLEDs and flexible ultra-barrier films, improving

the efficiency of crystalline silicon and thin

film solar cells, producing TCO-coated glass and

making touch screen glass more durable.

A breakthrough in industrial-scale

OLED encapsulation

Beneq has introduced several

revolutionary and unique thin film

innovations, including true roll-to-

roll atomic layer deposition (ALD)

and high-yield atmospheric aerosol

coating (nAERO®).

Beneq WCS 500 Roll-to-Roll ALD system

for flexible coatings

The need for efficient moisture and oxygen

barrier films is a major challenge in flexible and

organic electronics, of which organic light

emitting diode (OLED) based displays and lighting

as well as organic photovoltaics (OPV) are typical

applications. Conventional thin film barrier

deposition techniques are incapable of producing

barrier layers with a low enough water vapor

transmission rate (WVTR) at affordable cost. To

supply this need, ALD-based Beneq nCLEAR®

single-layer barrier films offer superior properties

and complete solutions for the industry.

Beneq nCLEAR® inorganic barrier films are

deposited with ALD, which creates extremely

dense thin films with very low pinhole density. As

a result, ALD films provide unique single-layer

barrier properties. Beneq has more than thirty

years of experience in using ALD in industrial

production and can provide high-performance

nCLEAR® barriers based on proprietary nano-

laminates. nCLEAR® ultra-barrier films can be

integrated into production either as a batch

production routine for rigid substrates or as Roll-

to-Roll coating for flexible webs.

Beneq ALD Barrier Coatings for Flexible and Organic Electronics

Beneq OyP.O. Box 262 • 01511 Vantaa • FinlandPhone +358 9 7599 530 • E-Mail [email protected] Internet www.beneq.com

46 CERADROP

Ceradrop is an innovative company that designs,

manufactures and sells inkjet equipment for digi-

tal manufacturing of components (printed elec-

tronics and green power). Ceradrop’s equipment

enables high accuracy multi-materials printing

(both 2D and 3D). A key feature of the Ceradrop

team is that it has its origins not in the graphic

arts but rather in materials science and compo-

nent engineering. This background enables

Ceradrop to provide an exclusive approach to

inkjet processes, entirely devoted to device and

material problem solving.

CeraSlice – from CAD files to print scripts

CeraSlice revolutionizes print script generation.

Thanks to its bottom-up approach, printing param-

eters can be defined according to material and

component design characteristics (splat diameter,

layer thickness, filling strategy, droplet pattern...).

All parts or subparts of the component can have

their own set of printing parameters, without limi-

tation, to address all possible situations without

compromise. CeraSlice provides the quickest direct

route to a functional component.

CeraPrinter – versatile multi-material inkjet printer

CeraPrinter is a high-accuracy inkjet deposition sys-

tem. The equipment is designed for advanced appli-

cations, allowing the user to manage and under-

stand the entire process. The equipment is based on

a patented technology that can print on up to three

materials with any discrete resolution thanks to

automated printhead switching and orientation.

The system is built around industrial printhead

technology, thus allowing high process repeatability,

high jetting accuracy and a wide range of material

compatibility. Our printer can integrate a wide range

of printheads from different manufacturers and

easily embed the last generation of curing systems.

Customer support – a wide range of services

A powerful and adaptable printer is necessary to

obtain an efficient inkjet manufacturing process

but, on its own, this is not enough. Ink formulation,

printing strategy definition, pre and post process,

conditions and anticipation of needs and require-

ments for process upscaling are critical points that

should not be neglected to ensure a successful

conclusion. In this context, Ceradrop provides its

customers with a unique process support and

enables to make easier inkjet printing techno-

logy for printed electronics, all around the world.

Ceradrop: Disruptive Solutions for Inkjet

Ceradrop • Headquarters and production site Ester Technopole • 32, rue de Soyouz • 87 068 Limoges • FrancePhone +33 555 382 696 • E-Mail [email protected] www.ceradrop.fr

COATEMA COATING MACHINERY 47

Coatema offers mechanical engineering and R&D

for coating, printing and laminating plants for

R2R and S2S applications. For almost 40 years

Coatema has been delivering solutions to a wide

range of markets. Coatema offers lab units, pilot

plants and entire turn-key production solutions

for coating, printing and laminating of flexible or

rigid substrates.

Since more than a decade plants for

the development and production

of organic and printed electronics

belong to Coatema’s product port-

folio. The combination of conven-

tional coating technologies and

the targeted use of electronic func-

tions are made possible by units

from Coatema. The competence

of covering the entire spectrum is made obvious

by 2 plants: the Smartcoater and the PrintoCent

Production Line, which was inaugurated in Finland

in 2012.

The Smartcoater is a compact and multifunctional

small-scale coating unit with various application

systems. Complex products can be produced with

a working width starting at 100 mm, a wide range

of coating applications and production speed

with a minimum use of substrate and chemistry.

The base unit offers a 5-in-1 coating module with

slot die, knife, dipping (foulard), micro-roller and

engraved roller. In addition other modules are

being added rapidly including: screen printing;

flexo printing; UV spraying and others.

In comparison, the PrintoCent Production Line

appears enormous: it includes as inline process

on two floors all needed printing, coating and

other steps to manufacture large area printed

electronic devices. This allows a R2R mass pro-

duction from lab to fab. Built by Coatema in close

cooperation with VTT who established PrintoCent

the line is equipped with interchangeable printing

and coating units: gravure and reverse gravure,

rotary screen, flexography and slot die. Additional

processes such as hot embossing, plasma treat-

ment, lamination, rotary die cut, hot air drying

and UV crosslinking as well as an automatic regis-

tration are included. The line with a working

width of 300 mm and running with an operation

speed of up to 30m/min.

A wide variety of Coatema equipment offers

the following processes for Large Area Printed

Electronics: Web Treatment, Etching, Printing,

Coating, Laminating, Nano Imprinting, Hot

Embossing and Laser Patterning.

Coatema Offers Lab and Production Plants for Organic and Printed Electronics

Coatema Coating Machinery GmbH Roseller Str. 4 • 41539 Dormagen • Germany Phone +49 2133 9784-0 • E-Mail [email protected] www.coatema.de

48 CYNORA

cynora GmbH offers optoelectronic solutions

for application in Organic Light-Emitting Diodes

(OLEDs). These solutions involve concepts for

devices with excellent performance either from

vacuum-based or solution-based multilayer

deposition.

cynora’s Singlet Harvesting technology offers

several advantages over currently used emissive

materials. Both kinds of excitons (singlet and

triplet) produced during device operation can be

used for light generation, which is necessary for

efficient current-to-light conversion. Singlet

Harvesting does not require heavy metals such

as iridium for this transformation. In addition,

this process is perfectly suitable for increasing

the emission energy, i. e. achieving deep blue

emission, which is still a challenge in the field

of OLED materials.

cynora’s optoelectronic solutions also enable our

customers to produce efficient OLEDs via conven-

tional vacuum-processing as well as printing or

coating techniques. Solution-based deposition is

becoming more and more important while large-

area OLED devices gain more interest. By using

cynora’s technology, our customers have no need

to adjust the materials to their process, we are

there to assist! Accordingly, instant ink mixtures

can be customized in terms of emission color and

solubility in specific solvents.

cynora’s proprietary materials are being devel-

oped, tested and optimized in-house to ensure

that the customers’ needs are addressed properly.

The individual ink or material composition is

tested in devices in cynora labs prior to shipment.

This way, we can ensure the best support

possible for our customers during the evaluation

and implementation of new material sets.

For most recent information and to discuss

your individual optoelectronic solution, please

visit our website www.cynora.com or contact us

directly via [email protected].

cynora – Optoelectronic Solutions

cynora GmbHHermann-von-Helmholtz-Platz 1, Geb. 717 • 76344 Eggenstein-Leopoldshafen • GermanyPhone +49 721 60829112 • E-Mail [email protected] www.cynora.com

DOWA HD EUROPE 49

DOWA is a Japanese smelting firm and DOWA

Electronics Materials is an established manufac-

turer of various materials such as silver/copper/

zinc/iron powder for electronic devices and

semiconductor wafer/LED, with an annual revenue

of about USD 4.5 billion. We focus on new func-

tional materials, nano-size particles, and silver

coated alloy powder (copper zinc/copper nickel

zinc) for printed electronics.

About DOWA

We at DOWA HD Europe GmbH are

a member of DOWA Holdings Co.,

Ltd. (Japan). Our main activity is to

promote the products of DOWA HD

and to expand the business region

in Europe. DOWA HD supplies

materials and services to a broad

range of businesses, including

nonferrous metals, environmental management

and recycling, electronic materials, metal-

processing, and heat treatment, with an aim

toward enhancing the quality of life. DOWA was

founded in 1884 as a smelting company. Since

our foundation, we have made the transition to

higher technologies. DOWA Electronics Materials

Co., Ltd. in particular, also a member of DOWA HD

Co., Ltd., supplies semiconductors, conductive

materials and magnetic materials which are all

based on nonferrous metals.

Functional powder materials technology

Functional powder materials technology is one of

our competencies. We are competitive in design-

ing the particles and manufacturing at low cost.

For particle design, we can control not only size

(nm-μm) and shape (sphere, flake and agglom-

eration), but also surface treatment (hydrophilic

or hydrophobic). And we can provide silver,

copper, zinc and alloy powders. In addition,

concerning manufacturing methods, we have

both liquid and dry systems to manufacture

powders in mass production. Especially in the

case of nano-size particles, we can apply the

same method and equipment used in producing

micron-size powders. This will make Printed

Electronics more competitive and developed

worldwide in the near future.

Technology scouting

For the printed and organic electronics industry, it

is necessary to integrate some elemental technol-

ogies. For example, for functional conductive ink,

the elements of materials, formulations and

printing methods need to be considered at the

very least, while the properties of conductive ink

strongly depend on processing and applications.

From this point of view, we are looking to find

potential partners for technological collaboration

or even to offer financial support to.

DOWA Can Provide the Noble Materials You Want!

DOWA HD Europe GmbHOstendstr. 196 • 90482 Nuremberg • GermanyPhone +49 911 5698932 0 • E-Mail [email protected] Internet www.dowa.co.jp/index_e.html • www.dowa.co.jp/en/jigyo/electronics_summary.html

50 DUPONT MICROCIRCUIT MATERIALS

DuPont Microcircuit Materials (MCM) has been a

major supplier to the printed electronics industry

for nearly 50 years and has become a global

leader in low temperature curing inks for flexible

substrates—a position it owes to its broad

experience in materials science, chemistry, fine

powder technology and polymer chemistry.

Material families

DuPont MCM manufactures a wide range of inks

and pastes for printed electronics applications.

• Silver – highly conductive fine resolution screen

and flexographic inks for connecting lines, bus

bars and grid lines. These are typically used in

applications such as printed RFID antennae,

membrane switches, smart packaging, photo-

voltaics, OLEDs and touch screens. A new range

of formable, flexible Ag inks has recently been

introduced for in-mold electronics and

capacitive switches.

• Silver alloys and copper inks – to counter the

increasing cost of silver metal, a range of high

performance low cost screen inks are available

for many printed electronics applications.

Special photonic curing formulations for

increased throughput and conductivity have

recently been introduced.

• Silver/silver chloride inks – for reliable and

stable reference electrodes for amperometric

biosensors and drug delivery patches.

• Gold – low temperature gold inks for inert

high performance and reliability, especially

in diagnostic biosensors.

• Carbon – cost-effective carbon screen and

flexographic formulations for overprints,

connecting lines, resistors, medical electrodes

and self-regulating PTC heaters.

• Dielectric – both solvent based and UV curing

screen printable dielectric formulations for

insulating layers and cross-overs in multiple

applications.

• Phosphor – screen printing pastes for

AC electroluminescent lamps.

Innovating for the future

DuPont Microcircuit Materials’ global R&D

laboratories are producing customizable

speciality materials for the next generation of

inks. Our scientists are developing novel binder

systems for improved performance on multiple

substrate types, new fine powders for advanced

conductors and a technology platform suitable

for multiple deposition techniques including

screen, flexography, gravure and ink-jet.

Leading Printed Electronics Materials Supplier

DuPont Microcircuit Materials Bristol Business Park • Coldharbour Lane, Frenchay • Bristol, BS16 1QD • United KingdomPhone +44 117 931 3191 • E-Mail [email protected] Internet http://mcm.dupont.com

Printed RFID antennae — an additive process Self-limiting heater on flexible substrate Printed biomedical sensors

Formable and stretchable inks for 3D circuitry

DUPONT TEIJIN FILMS 51

DuPont Teijin Films is a world-leading

manufacturer of high performance PET and

PEN polyester films for flexible and printed

electronic applications.

The trusted brand

Melinex®, Mylar® and Teonex® brands are the

substrates of choice for precise registration and

dimensional control. Our wide range of stabilized

films are strong and flexible with excellent resist-

ance to heat, abrasion, chemicals and moisture.

Continuous innovation

As the world changes, DuPont Teijin Films contin-

ues to develop new and innovative products to

meet the demands of a rapidly evolving market.

New planarized PET films have smooth, clean

surfaces that are ideal for ITO sputtering and other

optical coatings. Thermally stabilized grades of

planarized PET film offer excellent registration and

flatness.

High performance Teonex® PEN film

Teonex® PEN films are a high performance

extension to the existing range of Melinex® and

Mylar® polyester film products and bridge the

gap between price and performance for polyester

and other polymeric substrates.

Surface-engineered, optical quality film for the

most demanding flexible display and electronics

applications.

Teonex® is the substrate of choice for demanding

flexible display applications, such as high perfor-

mance touch screens, flexible OLEDs, e-paper,

high-barrier flexible substrates, flexible micro-

electronics and TFTs. Teonex® provides superior

performance, including excellent dimensional

control and improved hydrolytic stability for

applications requiring exposure to extreme heat

or harsh chemicals.

Innovative Film Solutions for Flexible Electronics Applications

DuPont Teijin Films BP – 1681 • 1016 Luxembourg • LuxembourgPhone +352 2616 4004 • E-Mail [email protected] www.dupontteijinfilms.com

Heat stabilised films

Glass Transition Temperature

Haze %

Moisture absorption 20oC, 40%RH

Youngs Modulus 20oC

Youngs Modulus 150oC

MD Shrinkage 150oC / 30 mins

Upper processing temp

120oC

180-220oC

18-20

0.02%

1000ppm

0.7%

150oC 0.1%

5GPa

3GPa

CTE ppm/oC

0.7%

1000ppm

1GPa

78oC

20-25

PEN

PET

4GPa

DuPont Teijin Films is at the forefront of innovation and future developments.

Our films are already key components in devices used in our daily lives.

We are now inventing new films for the products and markets of tomorrow.

52 EXAKT

EXAKT designs and produces Precision Three Roll

Mills providing a definable dispersion process to

realize the specific functional properties of smart

materials.

Utilizable for example via silk screen printing in

flexible batteries or capacitors, dye solar cells,

flexible displays, sensors, MLCCs and other elec-

tronic components, EXAKT Precision Three Roll

Mills are particularly well suited for:

• conductive/resistive pastes

• thermal compounds

• polymer paste for contact elements in

keyboards, switches, shields, resistors, etc.

• functional inks and coatings of many kinds

that are applied in layers of 6 to 50 μm in thick-

ness (wet).

Dispersions are critical phase systems, whether

as a precursor with specific working properties,

as part of a composite, or as a final product.

The quality of a dispersion and its processing

determines the quality of the final product.

Critical to the quality of the dispersion are a

defined, absolutely homogeneous particle size

and distribution as well as the preservation of

particle structure and function.

Particles tend to agglomerate, but only when

homogeneously separated can they develop their

specific characteristics. Also, the degree of sepa-

ration defines the function of the final product.

This requires precise processing and control.

EXAKT is engaged in various application projects

like InnoCNT or OE-A, to provide sustained practi-

cal feasibility for present and future needs, com-

bined with technical expertise and dedication in

engineering and the production of precision

processing equipment made in Germany.

EXAKT Precision Three Roll Mills:

• realize defined functional characteristics

of dispersions

• control the process and enable reproducibility

• shorten time to market in R&D

• enable consistent production

EXAKT – Defined Dispersion to Govern the Functional Properties of Smart Materials

EXAKT Advanced Technologies GmbHRobert-Koch-Str. 5 • 22851 Norderstedt • GermanyPhone +49 40 529560-0 • E-Mail [email protected] www.exakt.de

Copyright EXAKT Advanced Technologies GmbH

FELIX SCHOELLER 53

The Osnabrück-based Felix Schoeller Group has

been developing and manufacturing high-quality

specialty papers and coatings for specialized

applications for over 110 years.

With its high level of technological competence

and outstanding innovative strength, the company

is now a market leader in its main areas of

business: imaging and decor papers. Alongside

existing markets, we are now also turning our

attention to building and consolidating new busi-

ness areas. An example of this is p_e:smart – a

range of papers that has been specially developed

for the printed electronics sector.

High-precision coating gives us the edge

in competency

Printing electronic elements requires a substrate

that has an extremely smooth surface and spe-

cific surface properties, particularly when organic

inks are used. High-precision coating draws

together all the know-how in terms of products,

recipes, processes and technologies that the Felix

Schoeller Group has acquired over more than two

decades: in other words, extensive knowledge in

the field of developing and producing high-end

inkjet papers for photographic applications. High-

precision coating involves applying several thin,

technologically sophisticated layers – some of

them containing nano particles – to paper webs

using ultramodern coating technology.

p_e:smart means better dimensional stability

Printing organic circuits requires high register

accuracy to achieve the desired result. Conven-

tional films have only a limited degree of dimen-

sional stability, which makes it difficult to build

multilayer systems. The name of our innovative

and groundbreaking solution is p_e:smart.

These are papers whose fiber structure produces

high dimensional stability, which in turn means

significantly less breakage when constructing

printed transistors. High dimensional stability

combined with a film-like surface appearance

results in the leading edge in the market of

printed electronics.

An extremely smooth surface, dimensional

stabili ty, high purity and consistent quality from

reel to reel make p_e:smart a very convincing

product.

p_e:smart: New Markets Based on Established Core Competencies

Felix Schoeller Holding GmbH & Co. KGBurg Gretesch • 49086 Osnabrück • GermanyPhone +49 541 3800-0 • E-Mail [email protected] www.Felix-Schoeller.com

54 FUJIFILM DIMATIX

SAMBA™ is a piezo, grayscale printhead built

using proprietary Silicon micro-electromechanical

system (MEMS) fabrication techniques. Silicon is

used for its resistance to mechanical abrasion,

tolerance of high temperatures and robustness

against chemical attack. MEMS, in this case,

describes processes used to sculpt and assemble

integrated circuit-sized structures. The techniques

to fabricate SAMBA printheads have been field-

proven by cartridges used in Dimatix Materials

Printers.

2048 individually addressable nozzles are

arranged in a matrix array. This enables SAMBA

printheads to be placed adjacent to each other

to form integrated, wide-width printbars.

Ideal for sheet and roll-based single-pass designs,

SAMBA provides stability, uniformity, maintaina-

bility and scalability in one compact package.

Unlike others, SAMBA isolates its piezoelectric

(PZT) actuators from the path of jetting fluids.

Its PZT is sputtered onto a thin silicon membrane

atop the ink channel to form the pumping

chamber as a single monolithic structure.

Using VersaDrop™ jetting technology, SAMBA’s

high frequency response is enhanced with

customizable waveforms to accommodate a wide

range of fluid characteristics. Waveforms of

varying amplitude are also used to form variable

sized drops (grayscale) with no compromise in

productivity.

SAMBA’s unique nozzle shape addresses two

challenges to jetting accuracy and uniformity. This

design has resulted in higher drop placement

accuracy over greater throw distances with drop

sizes from 10 to less than 1 picoliter.

Continuous fluid recirculation at the nozzle as

well as use of a non-wetting coating on its silicon

nozzle plate provides fast start-up, high frequency

jetting and non-stop operation, even with difficult

or fast drying fluids.

An exceptionally wide range of applications is pos-

sible with this technology. These include deposit-

ing liquid silver and organics onto surfaces such as

flexible substrates, flat panel and flexible displays

and printable electronics, bioscience, and even the

transfer of UV, aqueous, and solvent-based inks

onto paper, plastics, ceramics and textiles.

A Breakthrough in Drop-on-Demand Inkjet for Deposition Applications

FUJIFILM Dimatix, Inc. 2250 Martin Avenue • Santa Clara, California 95050-2704 • USAPhone +1 408 565-9150 • E-Mail [email protected] Internet www.dimatix.com

HERAEUS PRECIOUS METALS 55

Delivering Innovation

As the team that invented

PEDOT:PSS, the Heraeus Conduc-

tive Polymers Division stands in a

unique position in the develop-

ment, production and delivery of

commercially available Clevios™

conductive polymer materials and

formulations for electronics.

Clevios™ PEDOT:PSS - poly(3,4-ethylene-

dioxythiophene)-poly(styrenesulfonate) prod-

ucts start with antistatic Clevios™ P and go

through to highly conductive Clevios™PH1000

(1000S/cm or ca. 200 Ohm/sq). The range also

includes Clevios™ hole injection materials.

Conductivity, flexibility, transparency and “ease-

of-use” permit a broad range of applications in

electronics.

Printable Conductivity

All Clevios™ PEDOT:PSS products are printable.

Formulations such as Clevios™ FE-T and SV3

can be printed to <50 um line width and to

<200 Ohm/sq. Printing methods include slot-die,

gravure, screen, and ink jet, as well as spraying,

dip and spin coating.

Touch Screens

As an ITO electrode alternative, Clevios™ PH1000

can be coated onto substrates such as PET,

polycarbonate and paper. Flexible, durable and

with a high transmission, economic PH1000

offers major opportunities in touch technologies.

Clevios™ can be patterned using a masking

agent – Clevios™ SET – along with Clevios™ Etch.

The smooth conductive patterns are almost

invisible.

OLEDs and Solar Cells

Clevios™ water and solvent-based hole injection

(HIL) and electrode materials are offered for

OLED display/lighting and organic solar cells.

Clevios™ HIL-E, which combines HIL and elec-

trode properties, has been developed for OLED

lamps. Optimized formulations for OPVs, such as

Clevios™ HTL Solar, are also available.

Heraeus Conductive Polymers

Clevios™: Conductive, Transparent and Flexible Polymers

Heraeus Precious Metals GmbH & Co. KG, Conductive Polymers DivisionB202, Chempark • 51368 Leverkusen • Germany Phone +49 214 3026718 • E-Mail [email protected] www.clevios.com • www.heraeus.com

56 HNP MIKROSYSTEME

HNP Mikrosysteme develops,

manufactures and markets

pumps worldwide which dose

small amounts of liquids fast and

accu rately. Fields of application are

analytical instrumentation,

mechanical and plant engineering

and chemical and pharmaceutical

process engineering, as well as in

new markets like fuel cells or biotechnology,

organic electronics or aerospace.

High precision – low pulsation

Micro annular gear pumps are characterized by

low pulse delivery and minimal dead volume.

They are precise, with long service life and small

dimensions, made from ultra-hard materials and

easy to maintain. The hermetic inert series has

been specially conceived to fulfill the most

challenging tasks in chemical processing, mini

plant and flow chemistry. The rotor sets of this

pump series are made from partially stabilized

zirconium dioxide, further functional parts

consist of aluminium oxide or tungsten carbide.

These materials, recognized for their high chemi-

cal resistance, allow for pump use with oxidizing

and reducing liquids, acids, bases and solvents,

while at the same time showing excellent resist-

ance to wear. SSiC has been used as shaft and

bearing material and the body consists of alloy

C22 or stainless steel. Versions made from

tantalum or titanium are available. The pump

is hermetic due to the use of a fully encapsulated

magnetic NdFeB coupling.

mzr®-pumps and organic electronics

Micro annular gear pumps are utilized from

beginning to end in organic electronics, feeding

reactors in intensified chemical processes as well

as printing devices or slot dies in roll-to-roll

processes. Available volume flow rates range from

a few μl/min to 1 l/min.

Micro Annular Gear Pumps for Dosing and Metering Applications

HNP Mikrosysteme GmbHBleicherufer 25 • 19053 Schwerin • GermanyPhone +49 385 52190-347 • E-Mail [email protected] Internet www.hnp-mikrosysteme.de

Courtesy of Coatema Coating Machinery GmbH

HNP Mikrosysteme develops, manufactures and

markets pumps worldwide which dose small

amounts of liquids fast and accurately. These

micro annular gear pumps are utilized from

beginning to end in organic electronics, feeding

reactors in intensified chemical processes as

well as printing devices or slot dies in roll-to-roll

processes. Available volume flow rates range

from a few μl/min to 1 l/min.

INA – DRIVES & MECHATRONICS 57

In the electronics manufacturing sector,

INA Drives & Mechatronics AG & Co. KG (IDAM)

supplies drive systems for manufacturing organic

electronic circuits. The manufacturing of these

components requires extremely high levels of

cleanliness, which means direct drive technology

is particularly suitable for these applications

since it is free from wear. Ready-to-fit single and

two-axis drive systems from IDAM configured to

each specific application are highly dynamic, and

free of wear and contamination. They make a

convincing case due to their precision, high

repeat accuracy and high acceleration capacity.

IDAM products can be found in the

following applications in the elec-

tronics sector in particular

• in wafer printing machines in

the manufacture of solar panels

(planar motors)

• in rotary tables in machines for

manufacturing semiconductors

(torque motors)

• in wafer positioning systems

and circuit board testing

systems (linear motors)

IDAM is a Schaeffler Group company and a

specialist for direct drive technology. Its product

range includes not only linear and torque motors

and two-coordinate direct drives in a wide range

of sizes and power ratings, but also the electronic

subassemblies required for their operation. These

volume-produced products are complemented by

customer-specific high-performance multi-axis

systems. IDAM not only has extensive experience

in the machine tool and manufacturing machin-

ery sectors, but also in automation technology,

electronics manufacturing and measuring and

medical technology.

Schaeffler, with its brands INA, LuK, and FAG and

around 76,000 employees, is a leading global

provider of rolling bearings, plain bearings, and

linear and direct drive products. We supply

components and systems as well as application

support and services to the automobile sector

and around 60 sectors of industry via our world-

wide organization with close market proximity.

Close interdisciplinary collaboration within the

Schaeffler Group enables us to develop direct

drive positioning systems of the highest perfor-

mance level possible worldwide. They offer the

best technical and most cost-effective solution

for every application. Schaeffler system solutions

are available for every motor series that includes

motors, bearing supports/

guidance systems and sensor

systems.

IDAM Direct Drives: Clean, Dynamic, Precise.

INA – Drives & Mechatronics AG & Co. KGMittelbergstr. 2 • 98527 Suhl • GermanyPhone +49 3681 7574-0 • E-Mail [email protected] www.idam.de

58 KAMMANN

Dedicated to advanced functional printing,

KAMMANN takes pride in its ability to build ultra-

precise roll-to-roll equipment for the Printed Elec-

tronics / Functional Printing industry worldwide.

Printing, drying, laminating, stamping/cutting –

whatever it takes, we provide know-how and

technology to produce functional devices today.

A unique platform strategy ensures accuracy,

speed, consistency and flexibility. We enable

customers to integrate their equipment into our

product line or – vice versa – integrate our

machines into their production environment.

KAMMANN has been a partner of the industry

in a variety of projects involving:

• Disposable Medical Devices

• Industrial Heat Transfers

• Membrane Switches

• Medical Electrodes

• Touch Display Components

Customers appreciate KAMMANN’s high-end flat

screen printing technology as an essential core

component in many functional printing applica-

tions. Additionally, a wide range of modules for

drying and converting allows for individual

process adaptation. Flexibility matters!

From sheet-fed to roll-fed

An important part of our strategy is to help

customers up-scale their processes (lab-to-fab) as

well as enhancing existing production by going

from sheet to roll. In functional printing, roll-to-

roll has proven to be a means to boost both

productivity and profitability. It takes knowledge,

experience and expertise to understand the

dynamics of a moving web. Technical issues can

arise that may not be concerns in slower sheet-

based application; processes such as dryer dwell

times, material strain, register accuracies, quality

inspection, etc. are routinely solved by our

engineers. KAMMANN is always happy to share

their expertise with customers engaging in roll-

to-roll technology. Involve us!

Made in Germany at its best

Deeply rooted in the Westfalian area of Germany,

we produce machines with 170 highly-skilled

employees in Bad Oeynhausen, a city between

Hannover and the Ruhr. The company was

founded in 1955 by Werner Kammann and has

been specializing in printing ever since.

Committed to Functional Printing

KAMMANN Maschinenbau GmbHBergkirchener Str. 228 • 32549 Bad Oeynhausen • GermanyPhone +49 5734 5140-0 • E-Mail [email protected] Internet www.kammann.de

KARL KNAUER 59

The Karl Knauer KG, with its two business

locations in Germany and Poland, is among the

leading suppliers for innovative packaging and

advertising material in Europe, as well as

prod ucing gift packaging made of cardboard,

corrugated cardboard and paper. We combine

broad know-how with a high level of specializa-

tion. Our customers, from both the globally

acting brand name and service industry and high

performance medium-sized companies through-

out Europe, benefit from our versatile compe-

tence and large vertical range of manufacture.

And have done for 75 years!

Competences

Our core competences are innovative packaging

solutions with the highest demands on function-

ality. The production is enhanced by consultation

and integrated services, for example: develop-

ment, logistics concepts, co-packing, artwork

management, and product protection & smart

packaging. In this way, Karl Knauer covers all

processes of integrated packaging management

as a service provider and producer.

Innovation

We at Karl Knauer see innovation as a continuous

improvement of what we do today, in order to

fulfill all customer requirements and needs.

Whether it’s packaging design and functionality,

logistics or processing techniques: solutions and

development by Karl Knauer are future-oriented

and individually customer-oriented.

Competence in organic electronics

Karl Knauer’s competence in organic electronics

is to offer the cost-effective integration of printed

electronics in packaging. Our aim is to provide

additional value for the consumer with smart

packaging. Therefore, we run different projects to

develop and evaluate printing technologies for

polymeric and organic inks. We are also engaged

in various activities concerning conductive

polymer technology.

A current project comprises the packaging for the

high-quality spirit “Bombay Sapphire” that is

probably the first freely available packaging with

printed illuminants. The packaging was developed

and implemented on the basis of the innovative

technology “HiLight – printed electronics” and has

already been awarded numerous prizes, such as

the iF packaging design award 2013 in gold.

Karl Knauer – Impressively Different

Karl Knauer KGZeller Str. 14 • 77781 Biberach/Baden • GermanyPhone +49 7835 7820 • E-Mail [email protected] Internet www.karlknauer.de

60 KROENERT

KROENERT in Hamburg/Germany has been

developing and building innovative, specialized

coating, printing and laminating machinery since

1903, and is the oldest company in this field

worldwide. More than a century of experience

definitely pays off! We at KROENERT have laid

down our values and norms in a corporate philos-

ophy intended not only to keep the company

functioning for decades, but to preserve its

identity. The proposition of customer benefit

remains in the foreground.

All lines are the result of expertise,

inventiveness and knowledge. We

understand quality and reliability

and guarantee the highest levels of

efficiency and a long service life in

production with minimal mainte-

nance costs. Further education and

training in technical and commer-

cial professions ensure high quality

for generations. The market of large area organic

printed electronics is in rapid development to

increase efficiency and quality as well as to fur-

ther lower the costs. In order to make the final

products more affordable and feasible pricewise,

but at the same time highly accurate, roll-to-roll

(R2R) production on flexible transparent polymer

substrates is the way to move forward in the

future.

KROENERT offers state-of-the-art-high-end print-

ing and coating R2R machines, techniques and

processes to the market, suitable for a laboratory

scale of up to 500 mm working width. However,

production scale machines with larger working

widths are also available.

In the case of printed electronics, customized

machine solutions and processes of the utmost

precision and accuracy are required, which in their

turn are based on standard machine components.

These comprise mainly:

• unwinding and rewinding units

• coating/printing heads

• dryers

• laminators as well as

• auxiliary equipment

The components themselves have to be precise

and must be easily operable and maintainable to

fulfil the demands of the printed electronics

industry. One further aspect is the versatility and

flexibility of the R2R equipment, regardless of

whether the machine is used in R&D institutes,

laboratories, start-ups or by industrial customers.

The expert support KROENERT offers, both theo-

retical and practical training, also forms a major

part of our success. Further, KROENERT offers a

R&D technology center with various machines, like

e.g. the LabCo, where the production of up-scaling

from lab-to-fab can also be demonstrated.

KROENERT – Experts in R2R Coating and Printing

KROENERT GmbH & Co. KGSchützenstr. 105 • 22761 Hamburg • GermanyPhone +49 40 85393 01 • E-Mail [email protected] www.kroenert.de

MEKOPRINT 61

Key benefits:

In-house automated R2R manufacturing in high

volumes; state-of-the-art screen and digital

printing technology; slot die coating for

advanced printed electronics; R2R post-process-

ing such as lamination, stamping, embossing,

laser cutting, SMD mounting, etc.; development

and innovation organization with expert know-

ledge; quality management

Mekoprint is a certified manufac-

turer of 100 % customized high-

quality solutions for industrial and

electro nic companies. Solutions

include user interfaces, roll-to-roll

(R2R) printed plastic foils, flexible

printed circuits (FPCs), organic solar

cells, metal processing and EMC

shielding.

Partner-based innovation

Cooperation with customers on product develop-

ment is a trademark of Mekoprint. Our partner-

based innovation is a combination of rational

product development and ongoing development

of the partnership with customers. The goal is

increased productivity and competitiveness –

for both parties.

R2R flexible printed circuits and ITO patterning

Mekoprint has more than 20 years’ experience in

developing and producing single and double-

sided FPCs. We have in-house R2R equipment to

screen print circuits and pattern copper or trans-

parent conducting oxides such as ITO by wet

etching flexible substrates. Advanced equipment

combined with a high degree of engineering

knowledge in development and production allows

Mekoprint to deliver customized solutions. FPCs

go through a systematic design-for-manufacturing

process in close cooperation with the customer

and end in a lean manufacturing process charac-

terized by high automation and quality. The

result is low cost with complex structures in high

volumes, high precision and high repeatability

benefitting our customers and making Mekoprint

competitive among suppliers worldwide, inclu-

ding low-cost Asian manufacturers.

Customized solutions

for international manufacturing

Our customers are research institutes and com-

panies within organic, functional electronics as

well as international customers within the

telecom, medico and manufacturing industries.

Together with customers we have realized

solutions for applications such as antennas and

loudspeakers for mobile phones as well as RFID

tags, safety labels, heating elements, flow meters,

and sensors.

Advanced R2R Manufacturing of Printed Electronics

Mekoprint A/SHermesvej 4 • 9530 Støvring • DenmarkPhone +45 9936 5600 • E-Mail [email protected] www.mekoprint.com

62 MERCK

Merck is a leading industrial supplier of Organic

Electronic (OE) materials and formulations. From

our state-of-the-art R&D center in the UK

through to large scale manufacturing facilities,

we have the capability to provide stable, high

performance organic electronic materials in

ready-to-use, easily processable formulations.

These formulations can be customized to target

specific requirements and are compatible with mass

production techniques, including spin coating, inkjet

printing, slot die coating, gravure and flexographic

printing. Scale-ups of our materials and formula-

tions are carried out under stringently controlled

conditions; these manufacturing facilities are lo-

cated at our headquarters in Darmstadt, Germany.

lisicon® – making the future flexible

Merck’s material offerings within the OE field

include organic semiconductor and dielectric

materials for organic thin film transistors which

enable fully flexible display concepts as well as

multiple functionality and complex circuitry.

Other key applications include organic photovol-

taics and organic photodetectors/sensors.

Merck’s materials are developed to enable high

functionality and simple production processes,

enabling new and innovative electronic devices.

Merck is your innovative material supplier with

pioneering spirit and expertise derived from dec-

ades of experience in development, scale-up and

production of advanced materials for high-tech

applications. Our reputation in the OE area is

founded on the capability to develop application-

oriented formulations with a customer-focused

approach. We believe that success in this emerg-

ing area can only be achieved through collabora-

tion and partnerships, thereby enabling innova-

tive applications across different industries.

About the Chilworth Technical Centre

Located in the Southampton Science Park, South-

ampton, UK, Merck established an R&D center in

2000. This state-of-the-art facility has a dedicated

Organic Electronic (OE) technical team with

expertise in key areas such as synthetic chemis-

try, material formulation, printing, device fabrica-

tion and device physics. We are dedicated to the

development of new advanced materials for

emerging technologies.

Merck Chemicals Ltd. (Organic Electronics)

University Parkway, Southampton SO16 7QD

Great Britain, Phone +44 23 8076 3321

E-Mail [email protected]

Merck Chemicals – Your Innovative Material Supplier

Merck KGaA (Headquarters)Frankfurter Str. 250 • 64293 Darmstadt • GermanyPhone +49 6151 7223718 • E-Mail [email protected] www.merck-performance-materials.com

NEXT ENERGY TECHNOLOGIES 63

Elegant, Featherweight, Flexible Solar Material with Limitless Integration Potential and Exceptional Value

Next Energy Technologies Inc. 5385 Hollister Avenue, #115 • Santa Barbara, CA 93111 • USAPhone +1 805.222.4546 • E-Mail [email protected] www.nextenergytech.com

Next Energy Technologies Inc. (NEXT) is develop-

ing an entirely new generation of ultra low-cost

photovoltaics based on proprietary organic semi-

conducting inks made from solution-processed

small molecules (SSM). These stable, scalable,

and low cost organic semiconductors can be

printed or coated onto conventional plastic sheets

to fabricate extremely inexpensive, lightweight,

and flexible solar cells that can be processed

roll-to-roll and used in both conventional and

innovative applications.

NEXT’s lightweight, flexible OPV has the potential

for an exceptionally low-cost and small environ-

mental footprint relative to conventional silicon

and thin film solar cells due to:

• Low energy and low-cost roll-to-roll processing

• Ultra-low capital cost production facilities

• Inexpensive, abundant, and non-toxic raw

materials

• Low installation, transportation and storage

costs

The soluble small molecules (SSMs) at the heart

of this organic photovoltaic (OPV) technology

uniquely enable NEXT to overcome development

barriers of polymer-based OPVs. While having all

the advantages of solution-based, low-cost

processing known to semiconducting polymer-

based OPVs, soluble small molecules (SSMs)

also have the advantages of molecular control

and uniformity, as well as ease of synthesis,

purification, and scalable production. We find

that SSM-OPV materials can be optimized to

demonstrate equivalent film forming quality of

polymeric materials.

NEXT’s proprietary materials have resulted in

devices with efficiencies that are not only the

highest published for solution processed small

molecules, but also competitive with the best

polymer solar cells. NEXT is the first company to

demonstrate the feasibility of this technology,

and to undertake the development and

manufacturing of solution-processed semi-

conducting small molecule solar cells for

commercial applications.

64 NOVACENTRIX

NovaCentrix supports all aspects of printed and

flexible electronics, including research, develop-

ment, and manufacturing. Our products are the

PulseForge® photonic curing tools, Metalon®

electrically conducting inks, SimPulse™ thermal

simulation software, and various nanomaterials.

We are also introducing our new contract print

manufacturing service.

PulseForge® Photonic Curing Tools

The PulseForge® tools use patented photonic

curing to process high-temperature materials on

low-temperature substrates such as plastic and

paper. This means off-the-shelf inks as well as

new formulations can be processed at tempera-

tures from room temperature to > 1000 ˚C on

polymers such as PVC, PET, polyethylene, and oth-

ers, and also on paper, cardstock, and cardboard.

Types of materials processing includes drying,

sintering, annealing, and reacting.

Key PulseForge Tool Features and Capabilities

• Ability to process depositions >30 microns

• User-selected pulse durations in 1 ms increments

• User-selected pulse intervals in 1 ms increments

• Built-in pulse shaping: the ability to create

and save custom optimized pulse structures

• Water-cooling for longer component life

and higher delivered power

• Advanced touch interface

• Included bolometer for real-time pulse energy

measurement

The PulseForge Tool Family

We offer tools optimized for each development

phase, linked by sharing the same advanced

pulse control capabilities.

• PulseForge 1200: Low-cost tool with specific

advanced features for R&D use.

• PulseForge 1300: R&D tool with higher

power delivery, and includes SimPulse

Thermal Simulation.

• PulseForge 3200: wide-range tool for R&D,

scale-up, and full production at line speeds

> 100 meters/minute.

• PulseForge 3300: high-power tool for R&D,

scale-up, and full production.

Metalon® Conductive Inks

NovaCentrix offers a full line of high-performance

and low-cost electrically conductive inks. Silver is

a standard ink type, as is the innovative ultra-

low-cost copper-oxide reduction ink. All print

formats are supported.

Contract Functional Print Manufacturing Services

NovaCentrix is now offering contract functional

print manufacturing services based on the use

of an in-house AquaFlex 6-station flexographic

printer. Two rotary screen stations as well as post-

print lamination are also included. Web width is

52 cm. Full-width PulseForge tools are also inte-

grated. Inquire directly for additional details and

pricing.

Advancing the State of the Art for Processing Tools and Materials

NovaCentrixNCC Nano, LLC • 400 Parker Drive • Suite 1110Austin, TX 78728 • USAInternet www.novacentrix.com

NOVALED 65

Novaled is the company to trade with, work for

and invest in. The company offers its proprietary

organic materials and complementary innovative

technologies for superior OLEDs in display and

lighting and for further high performance

Organic Electronics (OE).

Novaled AG is a leader in the research, develop-

ment and commercialization of technologies and

materials that enhance the performance of

OLEDs (organic light-emitting diodes) and other

organic electronics. Novaled offers OLED product

manufacturers a unique combination of propri-

etary technology, materials and expertise, and

is currently the only company licensing and

selling organic conductivity doping technology

and materials for use in the commercial mass

production of display products in the OLED industry.

Novaled has developed strategic partnerships

with key OLED innovators and producers

throughout the world and, with a broad portfolio

of more than 500 patents granted or pending,

has a strong IP position in OLED technologies,

structures and materials. Commercially active

since 2003, Novaled was founded in 2001 as a

spin-off of the Technical University and the

Fraunhofer Institute of Dresden. Novaled is head-

quartered in Dresden with sales offices in Korea

and Japan.

For more information, please visit

www.novaled.com or contact us

directly.

Novaled – A Leading OLED Player

Novaled AGTatztberg 49 • 01307 Dresden • GermanyPhone +49 351 79658-0 • E-Mail [email protected] www.novaled.com/contact

Novaled has branch offices in South Korea and Japan.

Please visit www.novaled.com/contact

Novaled Japan Branch office:Ark Mori Building 12F1-12-32 Akasaka, Minato-kuTokyo, Japan 107-6012Mr. Michael HofmannPhone +81 3 4360 9110Mobile +81 90 1458 3417E-Mail [email protected]

Novaled Korea Branch office:Novaled AG • Branch Office South Korea3th Floor Namdo Bldg. • 12, Jangmun-roYongsan-gu, Seoul, 140-809,Dr. Andreas HaldiPhone +82 2 2276 0511Mobile +82 10 4097 5878E-Mail [email protected]

66 POLYIC

PolyIC develops and markets products based on

platform technology printed electronics: on the

basis of this technology, PolyIC offers products

from the fields “Touch Sensors & Passive Devices”

as well as “Printed Electronics & Displays”. The

three present product lines are called PolyTC®,

PolyLogo® and PolyID®. Leonhard Kurz Stiftung

& Co. KG is the parent company of PolyIC, which

results in excellent synergy in the fields of

decoration and function.

Printed Electronics

Printed electronics is a new

technology platform that has

progressed from fundamental

research to specific product classes

in recent years. It offers an

enormous range of opportunities

because it allows thin, flexible and

economical electronic components

to be manufactured in large quantities.

“Touch Sensors & Passive Devices”

Touch sensors based on the PolyTC® technology

offer a high optical transparency, conductivity,

structures with high resolution and flexible

possibilities for touch screens and capacitive

operating elements of all kinds. Furthermore, this

technology enables the setup of flexible circuit

structures as passive devices for a huge variety of

further applications. The highlight is the possibil-

ity of an easy integration process: for example,

the combination of decoration and function to

achieve a maximum of design flexibility, plus a

high efficiency due to the combined IML/IMD

process.

“Printed Electronics & Displays”

In connection with the PolyLogo® product line,

printed smart objects offer interesting possibili-

ties such as radio activated displays in the field of

marketing. Printed RFIDs with the brand name

PolyID® enable thin and flexible applications of

radio frequency identification. In the future,

Organic Photovoltaics (OPV) will make energy

harvesting possible.

PolyIC focuses on its expertise in materials, and

on new adapted chip design methods, as well as

mature and newly developed mass production

processes of roll-to-roll printing, in order to

develop and market this new technology.

PolyIC’s webpage is accessible at

www.polyic.com.

PolyIC GmbH & Co. KG –Smart and Flexible Printed Solutions

PolyIC GmbH & Co. KGTucherstr. 2 • 90763 Fuerth • GermanyPhone +49 911 20249-0 • E-Mail [email protected] www.polyic.com

SAES GETTERS 67

The SAES Group is a world leader in a wide

range of scientific and industrial applications for

more than seventy years. Its wide technological

and product portfolio enables the supply of hi-tech,

high quality and reliable solutions for organic

electronics, scientific and industrial applications

and NiTinol-based shape memory products for the

industrial and medical markets.

Through a soundtechnology base, the SAES Group

delivers a wide variety of advanced solutions to

prevent corrosion of conductive parts and fogging

of optical components by blocking moisture

transport across the edges and/or irreversibly

capturing it inside the devices.

DryPaste®

DryPaste air-printable dryers work as irreversible

moisture traps. DryPaste-G is a high capacity

dispensable dryer with a thermal curing process.

DryPaste-V is a family of high viscosity gel formu-

lations which do not require curing.

ZetaFillTM

ZetaFill is a new family of curable or no-curing

active filler materials specifically designed for

Dam & Fill and ODF processes. Proprietary engi-

neered nano-zeolites are mixed with different

polymer matrixes making ZetaFill compatible

with virtually any production process and device

architecture.

AqvaDry®

AqvaDry is a line of dryers that are optically trans-

parent and only visible during moisture adsorp-

tion. UV or thermally curable, AqvaDry can be

used as a film, but also as filler between the two

substrates of OLED devices.

ZeoGlue®

ZeoGlue is a UV curable dispersion of SAES Getters

proprietary engineered nano-zeolites in an epoxy

glue boosting an exponential increase of break-

through time.

AlkaMax®

To enhance efficiency and reduce power

consumption of OLED devices, the AlkaMax®

technology allows a controlled and reproducible

release of ultra-high pure alkali and alkaline earth

metals. AlkaMax products ensure safe handling

in any condition, thanks to the unique nature of

the metal precursors.

SAES Group: Solutions for Organic and Plastic Electronics

SAES Getters S.p.A. Viale Italia, 77 • 20020 Lainate MI • ItalyPhone +39 0293178285 • E-Mail [email protected] Internet www.saesgroup.com

68 SAFC HITECH

In an increasingly digitally-driven world, new

markets, new economies and new dynamics are

accelerating technological advances as never

before. Across applications as diverse as

communications, power generation and storage,

detection technologies, and LEDs for backlit

displays, architectural, automotive and solid-

state lighting, there are significant growth

opportunities for chemistry and electronic

materials innovation. At the forefront of this

wave of innovation, SAFC Hitech is delivering

unmatched expertise in advanced chemistries

and chemical delivery systems for emerging

technologies.

Deep collaborative relationships – from R&D

through to commercial scale-up – are at the

heart of our business, allied to our unique ability

to develop tailored chemistry for deposition

processes and delivery systems, guided by an

intimate understanding of customer needs.

As a problem solver and solutions provider, our

integrated approach to materials development

and unparalleled application and chemistry

knowledge is backed by a global supply infra-

structure with local knowledge and support.

Find out for yourself how SAFC Hitech is deliver-

ing functional performance that breaks new

boundaries, enabling technology, touching lives

and driving innovation for a better future.

SAFCHitech.com

SAFC Hitech Performance Materials: Supporting the Complete Chemistry Lifecycle for Semiconductors, Optoelectronics and Energy Markets

SAFC HitechPower Road • Bromborough CH62 3QF • United KingdomPhone +44 151 482 7230 • E-Mail [email protected] www.safchitech.com

SOLIGIE 69

Gain a competitive advantage by making your

products lighter, thinner, safer, more flexible,

more informative – more useful. Integrate

printed electronics to create new products that

offer more or better functionality. Soligie can

help you design, develop and manufacture high-

quality products to meet or exceed your

specifications and your customers’ expectations.

Soligie was founded in 2005 with

the goal of providing design,

development and manufacturing

services to the emerging printed

and flexible electronics market. For

the first 18 months, Soligie devel-

oped a variety of printing and

converting skill sets that comple-

mented the electronics design and

manufacturing experience of the employees. In

2007 Soligie relocated to Savage, MN, a suburb of

Minneapolis, where production and test equip-

ment was acquired. In addition, a quality man-

agement system was developed enabling Soligie

to become ISO 9001 and ISO 13485 certified.

As a wholly owned subsidiary of Taylor Corpora-

tion, Soligie is backed by a company with over

$ 1 billion in revenue per year. Taylor Corp. operates

in eight countries and employs approximately

10,000 people. Investments in Soligie by Taylor

Corp. have enabled the purchase of a customized

large scale roll-to-roll printing press used for both

product development and volume manufactur-

ing. Soligie is uniquely positioned as a design

engineering and product development services

company with high volume manufacturing capa-

bilities in-house. This means that Soligie applies

a manufacturing mindset early on in the product

development process.

Soligie’s vision:

To be the premier resource for advancing

programs to commercialization with our partners

by leveraging expertise and innovation in flexible

electronics.

Soligie’s mission:

We deliver comprehensive solutions by opti-

mizing, applying, and integrating technologies,

enabling our customers to realize successful new

products. This innovation and resulting differen-

tiation drive growth for Soligie and our partners.

Soligie – Inspiring Form, Function and Results

Soligie8647 Eagle Creek Parkway • Savage, MN 55378 • USAPhone +1 952 818-8300 • E-Mail [email protected] www.soligie.com

70 SOLVAY

Solvay is a supplier of high added value

materials and inks for OLED, OFET and OPV.

Our rapid development pace relies on an open

innovation model based on 3 pillars: academic

and applied research centers (e.g. Holst), innova-

tive start-ups (Plextronics, Polyera…) and internal

capabilities:

Our new laboratory (Brussels, B) is specifically

dedicated to this R&D field, in order to provide

the missing link between innovative ideas and

the marketing of manufactured products.

Furthermore, since the acquisition of Rhodia, new

competencies have been added in the fields of

formulation (Bordeaux, F), process upscaling and

optimization (Lyon-F), and transparent electrodes

(Bristol, USA).

Our Specialty Polymers development team

(Milano, I) optimizes the Solvene® EAP range of

materials which can be used in printable memo-

ries, energy harvesting, sensors and actuators,

and the amorphous fluoropolymer Hyflon AD for

gate dielectric and interlayer.

About SOLVAY

SOLVAY is an international chemical Group com-

mitted to sustainable development with a clear

focus on innovation and operational excellence.

Its recent acquisition of specialty chemicals

company Rhodia created a much larger player,

which is realizing over 90% of its sales in markets

where it is among the top 3 global leaders.

Solvay offers a broad range of products that con-

tribute to improving the quality of life and the

performance of its customers in markets such as

consumer goods, construction, automotive,

energy, water and environment, and electronics.

The Group is headquartered in Brussels, employs

about 29,000 people in 55 countries and

generated EUR 12.4 billion in net sales in 2012.

Developing Sustainable Solutions for the Future

SOLVAY Organic Electronics platformrue de Ransbeek 310 • 1120 Brussels • BelgiumPhone +32 2 264 21 11 • E-Mail [email protected] www.solvay.com

SUNATECH 71

With a broad arsenal of chemical building blocks

for organic electronic materials to choose from,

SunaTech is now ready to supply OPV polymers

useful for the development of large area printing

processes. From spin coating to R2R, SunaTech

helps make the transition.

Incorporated in 2008 and located in the Suzhou

Industrial Park, one of the most dynamic areas in

China, SunaTech Inc. is committed to providing

support for the R&D in a number of advanced

technological sectors, such as organic photovolta-

ics, organic light emitting diodes, OTFT, bioanalytics

and medical diagnostics. Since its incorporation,

SunaTech has established an international cus-

tomer base and has become a member of OE-A.

SunaTech supplies high quality chemicals/materi-

als and offers problem-solving solutions to the

rapidly developing field of organic electronics.

SunaTech’s products include luminescent metal

complexes, organic conductors and monomers/

intermediates for low bandgap OPV conducting

polymers.

The company also provides custom synthesis and

contract research for both academia and industry

under confidential agreements. Operated by

experienced chemists, who obtained degrees and

experience in Europe, North America and Japan,

SunaTech understands its customers’ desire for

confidentiality and has established policies to

protect its customers’ interest in the way it pro-

tects its own interest in order to conduct high

quality contract research.

While serving its customers, which range from

academia to industry and from organic electron-

ics to bioanalytics, SunaTech is also building its

expertise and developing technologies in collabo-

ration with its partners in multiple sectors.

SunaTech is looking for investors and strategic

partners to expand its R&D and business areas.

For customers in North America and Europe, please contact our representative:Rubipy Scientific Inc. • 880 Taylor Creek DriveOttawa, ON K1C 1T1 • CanadaPhone +1 613 216 1242 • Fax +1 613 590 0462E-Mail [email protected] • Internet www.rubipy.com

From Chemicals to Materials

SunaTech Inc. • 398 Ruoshui RoadbioBAY, Suzhou Industrial Park • Suzhou, Jiangsu Province, 215123 • P. R. ChinaPhone +86 512 6287 2180 • E-Mail [email protected] www.sunatech.com

SunaTech Inc.

72 TEKNEK

High Yields in Plastic Electronics

Teknek Ltd • River Drive • Inchinnan Business Estate • InchinnanRenfrewshire • PA9 4RT • United KingdomPhone +44 141 568 8100 • Fax +44 141 568 8101 Internet www.teknek.com

Delivering knowledge

Teknek originally developed

the concept of a contact

cleaning system for use in

the PCB sector. It comprises

a transfer process where

dry unattached particles

are removed from the substrate by a polymer

roller, which in turn is deposited on a reverse

wound adhesive roll. The system has been proven

to remove particles as small as 1 micron from

substrates. Most installations are positioned

inside existing clean rooms. Teknek has a current

installed base of over 19,000 machines world-

wide. The Teknek laboratories, fitted with testing

and measurement equipment, ensure that the

company fully understands the “science of clean-

ing”. The best cleaning core configuration is then

applied to the films and coatings that are used in

the plastic electronics sector.

Delivering innovation

Teknek continually develops its products. This

policy provides a number of new innovations in

the cleaning core technology and the delivery

systems that process the materials.

Recent innovations:

• Nanocleen polymer roller products, silicone

free contact cleaning solutions that remove

“Nano sized particles”.

• EcoFilm and EcoPaper adhesive products,

both are environmentally friendly.

• The CM8 platform machine – suitable for pro-

cessing multifunctional films at the assembly

stage of smart phones, tablets and LCDs.

• Wide web cleaning – applications up to

4 meters wide. Allows cleaning of primary

films used in flexible electronics.

• Teknek works with international research

groups, sharing the knowledge on cleaning

and processing multifunctional films.

• Teknek is the only company to manufacture

the polymer rollers and adhesive roller systems

in-house.

Delivering value

Teknek consistently delivers yield improvement

for the manufacturer. The yield gains are meas-

ured in a number of different ways: improved

quality, reduced downtime, increased production

speeds; but in each case the ROI model is short.

Teknek contact cleaning systems are proven for use

with multifunctional films that are currently used

in the manufacture of modern plastic electronics.

THIN FILM ELECTRONICS 73

Thinfilm is a leader in the production of commer-

cial printed memory and is now driving the devel-

opment of fully integrated printed systems, with

a particular focus on smart tag and sensor-related

applications.

Thinfilm is developing a line of intelligent labels

that will sense information and store data for a

tenth to a hundredth of the cost of conventional

electronics. Thinfilm’s memory catalyzes the Inter-

net of Things, making ordinary objects smart.

Time-Temperature sensor

The Thinfilm Time-Temperature Sensor provides

digital temperature and exposure information

for perishable products, at a price point that

competes with qualitative color change labels.

Sensor platform

Temperature sensing is one of many types of

tags that Thinfilm envisions as part of its road-

map. Together with its partners, Thinfilm is creat-

ing the first commercial library of printed logic,

increasing the functionality that can be delivered

on a single tag.

Bemis intelligent packaging platform

Bemis Company, a Fortune 500 company manu-

facturing over 200 billion packages annually, has

selected Thinfilm’s sensor tags as the basis for the

Bemis Intelligent Packaging Platform. Bemis is

working closely with Thinfilm to extend the core

sensing architecture to include additional sensors

of particular interest to their customer base.

Blood oxygen sensor

Thinfilm’s sensor tag architecture was selected as

a foundational component in a FlexTech Alliance

program to create a blood oxygen sensor that can

measure and store data on a single tag. The

program brings together work at the University of

California, Berkeley, PARC, and Thinfilm.

On the Path to Integrated System Products

Thin Film Electronics ASA, NorwayHenrik Ibsens gate 100 • P. O. Box 2911 Solli • 0230 Oslo • NorwayPhone +47 23 27 51 59 • E-Mail [email protected] www.thinfilm.no

74 TSE TROLLER

More than 50 years of know-how in the develop-

ment and production of premetered coating

dies have made TSE TROLLER a world-leading

specialist in the applied coating technology

sector. TSE has developed advanced coating

solutions which pave the way for the future.

Competences

TSE uses the most precise equipment for produc-

ing and measuring the dies in order to guarantee

the highest possible quality of the equipment.

Beside precision and surface quality, it is the

design of the cavities that plays a crucial role in

achieving superb die performance. TSE has wide-

ranging know-how in modeling different liquids.

The target of the dual cavity distribution system is

a uniform cross profile of the coated film, as well

as long intervals between die cleaning cycles, to

achieve high coating line efficiency – for a wide

range of applications – “from water to honey” with

the same dies, without any calibration of course.

TSE-TableCoater

When designing new products in the field of

flexible electronics, the appropriate components

of the coating liquids are often only available in

very limited quantities and are correspondingly

expensive.

Thus, the hold-up volume of the entire system is

very important to allow for economic develop-

ment. TSE coating dies achieve exactly this by the

customer-specific design of the internal distribu-

tion system.

In order to ensure the scale-up from the labora-

tory to a subsequent “roll-to-roll” process, the

same application process should be used from

the beginning. This requires bridging the gap

between the lab scale of the development labora-

tory on one hand and well-proven coating

processes on the other.

Often only a few samples of a new development

step are sufficient in order to analyze their func-

tionality, efficiency and other features. Neverthe-

less, the conditions of the experimental setup

should be comparable with later production runs,

to minimize risks.

For this purpose, TSE has devel-

oped a modular coating system.

For technical details just ask.

World‘s Most Precise Slide, Slot and Curtain Dies for Premetered Coating

TSE Troller AGAareweg 6 • 4853 Murgenthal • SwitzerlandPhone +41 62 917 40 10 • E-Mail [email protected] www.tse-coating.ch

TSE-TableCoater with single layer slot die TSE-TableCoater with flow box, enclosure and base frame

Dual layer slot die

VARTA MICROBATTERY 75

VARTA Microbattery is one of the world’s leading

battery manufacturers. With production facilities

and sales subsidiaries worldwide, we supply our

customers in more than 100 countries with high-

quality battery products. The company has its

headquarters in Ellwangen, Germany. We develop

and produce batteries comprising many electro-

chemical systems and cell geometries. As a global

system supplier, we are in a position to fulfill our

customers’ requirements all over the world.

Manufacturing for more than 125 years, VARTA is

partner to numerous innovative developments in

the energy sector. The company established a

joint venture with Volkswagen AG in 2009, the

Volkswagen VARTA Microbattery Forschungs-

gesellschaft. At its Ellwangen location the com-

pany develops efficient lithium-ion batteries for

electromobility. It is striving to develop a battery

that offers enhanced performance compared to

the models that are currently available for this

market segment.

The energy storage solutions developed by VARTA

Storage ensure that home-produced energy is

available just when you need it, regardless of the

time of day or weather. The integrated energy

management system optimizes the utilization of

the solar power. Depending on a household´s

requirement, it provides the power for home use,

or feeds it into the grid.

VARTA Microbattery is engaged in various

research projects which also cover printed

batteries; for example, the projects A3Ple and

FLEXIBILITY. The A3Ple team is developing a thin

and flexible sensor fully printed on a paper tag.

The aim of the project FLEXIBILITY is to establish

printed electronics in new markets like smart

tags and smart textiles.

Please visit us for more information at

www.varta-microbattery.com

VARTA Microbattery – The Energy Solution Specialist

VARTA Microbattery GmbHDaimlerstr. 1 • 73479 Ellwangen • GermanyPhone +49 7961 921-0 • E-Mail http://contact.varta-microbattery.comInternet www.varta-microbattery.com

76 VDL FLOW

VDL FLOW is a newly established enterprise

within the VDL Enabling Technologies Group

(VDL ETG), The Netherlands.

VDL FLOW is an original equipment manufac-

turer focusing on the development and supply

of high-performance roll-to-roll (R2R) and sheet-

to-sheet (S2S) production equipment for printed

electronics applications such as flexible solar

panels, OLED lighting, displays, sensors and

batteries. FLOW, in the name of the company,

stands for Functional Layers On Web.

VDL FLOW started under the umbrella of VDL ETG,

which already consisted of 6 companies, in order

to benefit from the exis tent know-how in the

handling and positioning of substrates and webs.

Through the years, this technical heritage posi-

tioned the parent company as one of the main

suppliers of integrated mechatronic solutions to

high-tech businesses like semiconductor manu-

facturing, electronic microscopy, analytical

chemistry and medical sectors, photovoltaic and

LED manufacturing industries.

As an original equipment manufacturer (OEM),

VDL FLOW leverages on key expertise areas

already present at its parent company in preci-

sion machining, extremely accurate positioning

of substrates and webs down to micrometer and

nanometer levels, vacuum and cleanroom tech-

nologies, and final integration and qualification

of highly complex systems.

The core activity of VDL FLOW is to specify, design

and manufacture primarily roll-to-roll production

lines that respond to cutting-edge requirements

for the deposition of functional materials on flex-

ible substrates. The business scope of VDL FLOW

extends generally to the system integration of

modules and subsystems needed in the printed

electronics industry and to the turnkey delivery of

such integrated projects. The business partners of

VDL FLOW are active in key technical areas like

conductive polymers, flexible sensors, thin-film

batteries, printed logic circuitry, or other compo-

nents based on the deposition and patterning of

functional materials that are known to require

dedicated manufacturing processes under

extreme specifications.

Global Leadership in Roll-to-Roll Equipment for Mass Manufacturing of Printed Electronics

VDL FLOWAchtseweg Noord 5 • 5651 GG Eindhoven • The NetherlandsPhone +31 40 2638777 • E-Mail [email protected] www.vdlflow.com

XENON CORPORATION 77

Xenon Corporation, worldwide leader in Pulsed

Light Technology designs, develops and manufac-

tures for photonic sintering of conductive inks.

The Sinteron family of products includes high-

energy pulsed light delivery systems that allow

precise control of the energy delivery by adjust-

ment of peak energy of pulsed light. In the

printed electronics industry, Xenon’s Sinteron

systems are used to rapidly dry and prepare

conductive inks at room temperature, making it

possible to print on heat-sensitive flexible sub-

strates such as PET and paper.

The Sinteron 2010 adds pulse width adjustment

and double pulse configurations where even

more precise control is required. These tools have

primarily been targeted towards the R&D market.

Xenon developed the Sinteron 5000 for high

volume roll-to-roll production. This system incor-

porates up to 10 lamp stages.

Xenon understands that successful deployment

of photonic sintering requires collaboration with

multiple technology groups. Xenon also produces

high-performance pulsed UV systems for applica-

tions in decontamination and UV curing. With

over 45 years of experience in pulsed light, Xenon

Corporation has thousands of systems operating

24/7 in industrial production lines worldwide.

Xenon has led the formation of a consortium of

manufacturers, integrators and universities called

Printed Electronics Test Network (PETN) which

includes 10 US and 12 international sites. These

sites offer laboratory, equipment and expertise to

develop printed electronic solutions.

Please visit www.xenoncorp.com for more

information.

Xenon Sheds Light on Sintering

Xenon Corporation37 Upton Drive • Wilmington, Massachusetts • 01887-1018 • USAPhone +1 978 661-9033 • E-Mail [email protected] Internet www.xenoncorp.com

78 YNVISIBLE

Ynvisible develops and markets interactive

solutions for everyday printed items.

The company was founded in 2010 with the

vision to bring everyday objects and surfaces to

life, making them more useful and enjoyable to

people. Ynvisible adapts functionalities familiar

to consumers from on-line / digital experiences

and applies these to physical (printed) objects.

Ynvisible operates at the cross-section of the

converging digital and physical worlds. The

company specializes in combining printed

electronics technologies with both traditional

printed graphics products and traditional

electronic components, to design and enable

interactive solutions for everyday printed items.

Ynvisible’s solutions deliver consumer experiences

to physical items that are as engaging and

interactive as those in the digital world.

Ynvisible’s first printed “interactive graphics”

solutions are based on electrochromics technology

combined with novel consumer

activation/interaction mechanisms.

These elements bring life and movement to

printed graphics, i.e. the graphical image changes

between different states through user activation.

Ynvisible combines technologies with graphics,

electronics and industrial design know-how, and

pilot production services to build and deliver first

products/solutions for its customers – an under

addressed function within the current printed

electronics value chain.

Ynvisible supplies brand owners with tailored

interactive solutions to their specific marketing

and product development needs. In order to build

complete customer solutions and products,

Ynvisible also partners with

3rd party technology suppliers

to integrate their technological

offerings into customer products.

Headquarters • Rua Mouzinho de Albuquerque, 7 • 2070-104 Cartaxo • PortugalR&D Center • Edif. YDreams, Madan Parque Sul • 2825-149 Caparica • PortugalPhone ++351 21 031 4000 • Fax +351 21 031 4001 Internet www.ynvisible.com • www.ynvisible.com/shop

INSTITUTES 79

Printed Electronics at Acreo Swedish ICT focuses

primarily on three application areas: packaging,

internet of things and health care. We have

established a platform of printed electronics

components consisting of displays, transistors,

diodes, and energy sources which can be

integrated into products, creating innovative

functionality. The platform is easy to integrate

and is manufacturable in high volume.

We work in close collaboration with Linköping

University (LiU), where LiU is responsible for

fundamental research and Acreo for refining the

research results into demonstrators, manufactur-

ing processes and prototypes. We also have print-

ing facilities for the development of prototypes

and small-scale production. Here the industry can

test the viability of Printed Electronics for new

applications.

We are also working with LiU and KI to develop

a set of bio-electronic components and corre-

sponding manufacturing routes. Together we

have the competence to create novel materials as

well as integrated systems and manufacturing,

with all kinds of applications, from active displays

and ion pumps for cell communication to switch-

able (bio-)surfaces for cell growth.

Acreo Swedish ICT

Acreo Swedish ICT ABPrinted Electronics • Box 787 • Bredgatan 34 • 601 17 Norrköping • SwedenPhone +46 11 20 25 00 • Fax +46 11 20 25 01 • Internet www.acreo.se

CeNTI – Centre for Nanotechnology and Smart Materials

CeNTI – Centre for Nanotechnology and Smart MaterialsRua Fernando Mesquita 2785 • 4760-034 VN Famalicão • Portugal Phone +351 252 104 152 • E-Mail [email protected] • Internet www.centi.pt

CeNTI is an institute for new technologies and

innovative products that provides, in a business

to business approach, applied R&D, engineering

and scaling-up production of innovative smart

materials and devices.

CeNTI’s special focus is on electronics (organic

electronics and embedded systems), polymers

(fibres and coatings), functional materials

(nanomaterials and processes) and final product

design and engineering. Main applications of the

Smart Materials and Solutions program include

printed and bulk sensor-actuators, biosensors,

OPVs, OLEDs, heating bands, supercapacitors,

electrochromic devices and integrated systems

in conventional everyday applications.

Key Technologies in-house

• Roll-to-roll (500 mm): plasma treatment, hot-

melt slot-die, CVD, AC/DC Sputtering, Metal

evaporation, Polymer Multilayer deposition w/

E-beam, Plasma enhanced ultrasonic spraying

with UV curing

• Thermal Evaporation Units (150x150 mm) for

small molecules and metals

• Roll-to-roll etching, screen printing,

engraved roller, slot-die, drying and laminating

(100 mm and 300 mm web)

80 INSTITUTES

CEA-LITEN has the role of developing printed

organic electronics for smart systems on foils

(e.g. sensors, OTFT, photovoltaic energy, energy

scavenging, storage). CEA-LITEN is developing a

new generation of materials and processes to

prepare final printed electronic devices (through

integration, characterization…).

CEA-LITEN performs feasibility studies and pilot

scale production. Thanks to the sheet-to-sheet

printing open platform “PICTIC” for the scale-up

of technologies from laboratory demonstrators to

product prototypes. The “PICTIC” platform facili-

tates the transfer to industrial partners. The

PICTIC tool set includes: inkjet and US spray, flat

screen, gravure press, slot die, lasers dedicated to

the development of inks and printing processes.

Portfolio of printed electronic devices

• Sensors: organic photodiodes, temperature,

pressure…

• OTFT: CMOS for digital & analog circuits

• OLED for signage and lighting devices

• Passive devices: RF filters, antenna

Targeted applications

• Intelligent smart systems

• Sensor arrays

• Human machine interface

• Ambient Intelligence

Thin batteries

Development and optimization of materials

(nanomaterials – nanopowders, etc.) for

advanced lithium batteries – flexible – substrates

(polymer, paper, etc.) – ambient intelligence con-

cept – longer lifetime – packaging.

Thin film technologies

for photovoltaic and thermoelectric systems

Miniature energy recovery technology – silicon

nanofibers – multiquantum wells – scavenging

high gradient temperature environment –

nanopowder technology – thin film technology.

Large area organic solar cells: flexible substrate –

device architecture – longer lifetime –

encapsulation – printing.

CEA-PICTIC: Isabelle Chartier, Printed Electronic

Business Developer, Phone +33 686 12 86 07,

[email protected]

CEA LITEN • CEA Centre de Grenoble17 rue des Martyrs • 38054 Grenoble • FrancePhone +33 438 783706 • E-Mail [email protected] www-liten.cea.fr

CEA-LITEN Performes Feasibility Studies and Pilot Scale Production

INSTITUTES 81

CPI is home to the National Printable Electronics Centre, a state-of-the-art design,

development and prototyping facility. CPI works with clients to bring new products

to market quickly and efficiently, by offering facilities and expertise that help to

reduce the levels of R&D risk capital investment.

Services: Prototyping and product scale up; materials investigation; product and

process development; consultancy; business and funding support; incubator space

Facilities: 1,250m2+ of cleanroom and laboratory space; reel-to-reel wet coating

prototyping; full lithography patterning suite; ink-jet and aerosol printers; batch and

continuous sputter coating for metal and metal oxide deposition; state-of-the-art

measurement and characterization equipment; Integrated Smart Systems line integrating

printing process with electronic components & pick and place technology;

Atomic Layer Deposition; Larger scale process development toolsets for OLED and

OPV applications including UV stepper exposure tool and CD and overlay measurement

capability

CPI – The UK’s National Printable Electronics Centre

The Centre for Process Innovation (CPI) Thomas Wright Way • NETPark • Sedgefield • County Durham • United KingdomPhone +44 1740 625700 • E-Mail [email protected] www.uk-cpi.com

We Strongly Believe in Printed Electronics

CETEMMSA • Technological Centre • Av. d’Ernest Lluch 36 Parc Científic i de la Innovació TecnoCampus • 08302 Mataró Barcelona • Spain • Phone +34 93 741-9100 E-Mail [email protected] • Internet www.cetemmsa.com

CETEMMSA is a technology center focused on the

applied research of surface treatments on flexible

substrates for the development of smart devices.

To achieve this goal, we mainly rely on printing/

coating techniques for smart device development,

and integration techniques for smart objects and

product development.

CETEMMSA’s know-how covers the following:

printing of electroluminescent panels on textiles,

hybrid LEDs, organic flexible photovoltaic panels;

printing of electronic circuits and components

over flexible substrates including textiles,

hybridization of silicon components, printing of

heating elements; development and integration

of printed pressure sensors, printed sensors for

biosignals, printed sensors for human kinematic

analysis; universal bioplatform development,

biomarker patterning on flexible substrates;

development of textiles with heating properties,

high mechanical resistance textiles, conductive

and electromagnetic shielding textiles, surface

treatment for enhancement of textile properties.

CETEMMSA is part of the Smart Textiles Group and

the Healthcare Group of the OE-A and contributes

to the development and dissemination of printed

organic electronics. The center also promotes and

coordinates the Spanish Flexible Organic and Large

Area Electronics and Photonics (FOLAEP) group and

is member of the Commercialization of Organic

and Large Area Electronics (COLAE) project.

The consortium brings together world leaders in complemen-tary fields of chemical synthesis, characterization and device assembly with industry players who are leaders in solar cell manufacture, lifetime testing, materials, substrates and printing. The consortium aims to produce prototype BHJ and DSSC solar cells printed on plastic substrates within 3 years.

Currently we produce 30 cm x 30 cm BHJ modules on flex-ible substrates using reel-to-reel process, and both BHJ and DSSC on glass and steel substrates using a semi-continuous batch process.

The combined capabilities of the core research partners; the University of Melbourne, Monash University and the CSIRO, exceed 80 chemists, physicists, engineers and printers with expertise in:

Modeling electronic structure, band-gap, etc. Design and synthesis of novel dyes, n-type and p-type materials Design and synthesis of novel monomers and polymers Scale-up, including flow chemistry Spectroscopy & characterization Device fabrication & testing Module manufacture, indoor accelerated and outdoor field-testing Reel-2-reel printing, spray deposition, evaporation

Rapid and efficient materials discovery is complemented by a dynamic manufacturing program featuring an array of traditional printing and spray-deposition techniques. Tight feedback loops between both these programs ensure efficient knowledge transfer and rapid progress.

The consortium has received long-term support from the Victorian State Government and the Australian Solar Institute as well as our industrial partners, BlueScope Steel, Securency International, Innovia Films (UK) and Robert Bosch SEA (Singapore).

We have flexible business models and we have developed strong collaborations with an international network of leading universities and corporations in Europe, the US and SE Asia.

Address:Dr David Jones, VICOSC Program Co-ordinator,Bio21 Institute, University of Melbourne30 Flemington RoadParkville, Victoria3010Phone +61 383442371Fax +61 383442384Mobile +61 0403520114E-Mail [email protected] www.vicosc.unimelb.edu.au

The Victorian Organic Solar Cell Consortium The Victorian Organic Solar Cell Consortium (VICOSC) is a collaboration between academia and industry based in Victoria, Australia. It was established in 2007 through funding from the Victorian Government’s Sustainable Energy Research and Development Initiative.

ADVERTISEMENT

INSTITUTES 83

CSEM offers custom-made innovative solutions

in micro-systems, surface engineering and

integrated devices. Our mission is to develop

and transfer microtechnologies to the industrial

sector.

The CSEM polytronics center is located in the

Basel area: a strategic innovation and production

hub in the heart of Europe.

CSEM realizes the following on a project basis:

characterization of printable electronic materials,

first-of-a-kind realization, process development,

and optical device design. Our expertise includes

light management, sensor devices and industrial

technologies. Our clean room facilities include:

ink-jet, gravure and screen printing, bar and slot

die coating, lithography, NIL, and replication, as

well as equipment for OLED, OPV and OTFT solu-

tion processing and characterization.

CSEM Polytronics Center Muttenz

CSEMTramstr. 99 • 4132 Muttenz • SwitzerlandPhone +41 61 690 6000 • E-Mail [email protected] www.csem.ch

CSIRO is Australia’s National Research Laboratory.

It has >6,000 staff working on areas of national

and global significance, bridging the gap

between academia and industry.

The Flexible Electronics Group builds on decades of successful R&D

in materials science and engineering. Our core competency is the

tight integration of chemists, physicists and engineers combined

with our state-of-the-art facilities. We provide end-to-end solu-

tions for our clients based on our expertise in theory, synthesis &

scale-up, materials characterization, device architecture, fabrica-

tion & testing, large format printing and lifetime testing.

We develop OPVs and hybrid devices for low-cost, lightweight

power, OLEDs for solid-state lighting and displays, and thin-film

transistors for flexible electronics.

We have flexible business models and collaborate with an interna-

tional network of leading universities and corporations in Europe,

the US and SE Asia.

Commonwealth Scientific and Industrial Research Organization (CSIRO)

CSIRO, Future Manufacturing FlagshipPrivate Bag 33 • Clayton South MDC • Victoria 3169 • AustraliaPhone +613 9545 2205 • E- Mail [email protected] www.csiro.au/flexibleelectronics

84 INSTITUTES

CTP is your industrial partner for paper and printing applied research,

consultancy, testing laboratories and training courses… CTP is

independent and impartial, with a high level of scientific expertise in:

• Lignocellulose chemistry

• Bio-based materials

• Health and safety applications

• Packaging of the future

• Printed electronics – Smart paper

• New value for recovered paper & board

• Water Energy

• Printed Communication

• Industrial performance

CTP helps create innovative products & processes at the lab,

pilot and industrial scale; develops knowledge and makes you

more competitive!

CTP… Innovate for the Future!

CTP • Centre Technique du Papier • Domaine Universitaire CS 90250 • Cedex 9 • 38044 Grenoble • France Phone +33 4761540-15 • E-Mail [email protected] Internet www.webCTP.com

ENEA UTTP-NANO is organized as a lab-scale full processing line

for simulation, design, fabrication and testing of FOLAE materials,

devices and systems; some activities are dedicated to the prepara-

tion of new polymeric transparent conductors, as well as studying

the recovery and recycling of valuable materials from waste, and

to support the SMEs.

The main focus is on OLEDs, OTFTs, OPVs, sensors,

and their integration. Available processes are:

photolithography and photo-masks preparation,

UV-NIL, vacuum evaporation, ALD, printing tech-

niques, sputtering, laser assisted deposition, etc.,

and several electro-optical and physical charac-

terization techniques.

General targets are the improvement of the

devices’ performance, the increase of their life-

time and stability, and to reduce the energy and

the materials consumption for their preparation.

ENEA UTTP-NANO – The “Laboratory of Nanomaterials and Devices”

UTTP-NANO – Laboratory of Nanomaterials and Devicesp.le Enrico Fermi no. 1 • 80055 Portici (NA) • ItalyPhone +39 0817723289 • E-Mail [email protected] Internet www.enea.it

INSTITUTES 85

High-performance, ultra-low power sensors

are co-integrated with electronic components

and power sources on foil to create energy

autonomous smart systems.

Our state-of-the-art foil pro-

cessing and printing platform

and our unique expertise in

microsystems at EPFL-SAMLAB

allow cutting-edge R&D on

foil-based smart systems.

We develop sensors, energy

harvesting and integration

technologies for the fabrication of energy efficient systems on

polymeric, cellulosic and biodegradable substrates. Sensing,

energy scavenging and storage, printing, and integration tech-

nologies for multi-foil and hybrid systems are our core activities.

We also have extended experience in transferring technology

from R&D into viable products and processes for industry.

Energy Autonomous Smart Sensing Systems on Foil

EPFL IMT SAMLAB Microcity • Maladière 71b • 2000 Neuchâtel • SwitzerlandPhone +41 32 720 5564 • E-Mail [email protected] http://samlab.epfl.ch/enviromems

The research group Thin Films and Functional

Materials at the Fontys University of Applied

Sciences cooperates with companies and

research institutes to gain knowledge on

application of functional materials with thin

film deposition techniques.

Examples of projects are inkjet printing of

polymers and nanoparticles, pre-treatment

of substrates with micro-plasma printing,

nanostructured surfaces with anti-reflective

properties, transparent conductive coatings

and easy-to-clean surfaces.

Students participate, individually or in groups,

in these projects and obtain practical training

on the equipment available in our laboratory.

This equipment, which includes inkjet printing,

micro-plasma printing, spin coating, sputtering

and vacuum evaporation, is also used for joint

(subsidized) research with companies.

Fontys Thin Films and Functional Materials

Fontys University of Applied Sciences • Expertise Centre Thin Films and Functional MaterialsRachelsmolen 1 • P. O. Box 347 • 5600 AH Eindhoven • The NetherlandsPhone +31 8850 74280 • E-Mail [email protected] www.fontys.nl/lectoraten/funmaterials

86 INSTITUTES

Fraunhofer COMEDD was founded as an inde-

pendent research institution of the Fraunhofer-

Gesellschaft in order to transfer research and

development results in the field of organic

materials and systems to production.

The institution combines research and develop-

ment works for the production, integration and

technology of organic electronic devices. The

focus of Fraunhofer COMEDD lies in customer-

and application-oriented research, development

and pilot fabrication of novel module concepts

and fabrication methods for these devices.

Fraunhofer COMEDD is a leading European pro-

duction-related research and development center

for organic semiconductors focusing on organic

light-emitting diodes and vacuum technology.

The COMEDD infrastructure is composed of

different pilot lines in several cleanrooms with

a unique vacuum coating line for the production

of OLED and OLED integration on silicon

substrates as well as a research line for a roll-to-

roll production on flexible substrates.

Fraunhofer COMEDD offers a wide range of

research, development and pilot production

options, especially for OLED lighting, organic

solar cells and OLED microdisplays.

We Shape the Light!

Fraunhofer COMEDDMaria-Reiche-Str. 2 • 01109 Dresden • GermanyPhone +49 351 8823 238 • E-Mail [email protected] www.comedd.fraunhofer.de

The Fraunhofer EMFT has long-term experience

in poly tronics research with special focus on

efficient fabrication technologies for plastic film

devices and systems.

One of our main topics is to integrate different

foil components, such as organic circuits, photo-

voltaic cells, printed batteries, displays, sensors

and ultra thin ICs, into smart flexible systems.

Current research activities also cover advanced

deposition and patterning of functional layers

and self-assembly of components.

Processing plays a key role for large-area systems

and cost-efficient manufacturing of plastic film

systems. Fraunhofer EMFT offers its expertise and

an excellent equipment platform for cooperation

with industry. Roll-to-roll fabrication and test

infrastructure are available. Different levels of

cooperation are possible, from processing services

to contract research and collaborative projects.

Electronic Systems on Plastic Films

Fraunhofer Research Institution for Modular Solid-State Technologies EMFTHansastr. 27d • 80686 München • GermanyPhone +49 89 54759-510 • E-Mail [email protected] Internet www.emft.fraunhofer.de

INSTITUTES 87

The department “Printed Functionalities” of the Chemnitz Fraunhofer ENAS success-

fully carries out research and development in the field of flexible, large area, organic

and printed electronics in close cooperation with the Digital Printing Group of the TU

Chemnitz. We call this informal alliance of R&D experts “Baumann Printing Research”.

Our main fields of research are printed functionalities, digital fabrication and hybrid

R2R printing system applications such as conductive, semiconductive or dielectric layers

for active and passive printed electronics, Radio Frequency Identification (RFID) and

printed batteries applications. At DRUPA 2012 in Düsseldorf, we demonstrated, in close

cooperation with industrial partners, the R2R process of manufacturing conductive

copper patterns on paper by inkjet, screen printing and photonic sintering on the

“microFLEXTM“ hybrid printing system. We are equipped with the most modern digital

and traditional printing systems forming the “Chemnitz Inkjet-Technikum”. This “Inkjet-

Technikum” allows joint projects with R&D partners as well as providing a chance for all

sizes of companies to try out first steps into the field of printed electronics and digital

fabrication without the risk of own initial investment. We offer hands-on training for

interested parties in appropriate technologies on certain pieces of equipment.

Fraunhofer Institute for Electronic Nano Systems ENASDepartment Printed Functionalities • Technologie-Campus 3 • 09126 Chemnitz • GermanyPhone +49 371 45001-0 • E-Mail [email protected] www.enas.fraunhofer.de

Fraunhofer IAP has been active in organic

electronic research over the past 20 years,

focusing on solution-processed devices with

applications in OLEDs, OTFT and OPV. The main

focus is on the synthesis of novel materials

with improved optoelectronic properties as

well as on device design and manufacture.

Our concentration is on solution-processible systems which can be

manufactured by area or digital printing techniques. In a large

clean-room environment, several processing techniques are avail-

able, from spin coating for material evaluation in lab devices up to

advanced processing techniques such as inkjet printing and high

precision slot die coating on a robot controlled S2S manufacturing

line where devices can be processed on a pilot scale in sizes up to

150 x 150 mm². The line includes thermal and e-beam evaporation

of metals as cathode materials, as well as organic or inorganic

materials as interlayers and an atomic layer deposition for thin film

encapsulation. Current issues for the development of OLED, OPV

and OTFT go into the design of flexible devices for signage, for

security applications and energy harvesting. One focus is on the

combination of different organic electronic devices such as OTFT

driven OLEDs or OPV powered OLEDs.

Printed Devices through Solution Processing

Fraunhofer Institute for Applied Polymer Research IAPGeiselbergstr. 69 • 14476 Potsdam-Golm • GermanyPhone +49 331 568 1910 • E-Mail [email protected] www.oled-forschung.de

88 INSTITUTES

Fraunhofer ILT is working on industrial laser manufacturing processes and the

related laser equipment.

The researchers in Aachen provide innovative solutions for flexible, high speed, high

resolution patterning of thin films. With laser wavelengths from UV to infrared and

pulse lengths from femto- to microseconds, specific optical properties of different

organic and inorganic materials can be utilized for micromachining of complex devices.

Laser joining is a versatile technology for encapsulation of organic electronic devices,

e.g., by novel laser glass soldering processes for glass substrates and high-speed

plastic welding for flexible materials.

Thin layers of conductors and semiconductors can be modified using high-speed

laser sintering or deposited by laser-induced forward transfer and laser metal transfer.

Laser ablation of ITO on flexible PET substrate

Innovative Laser-Processing for Organic Electronics

Fraunhofer Institute for Laser Technology ILTSteinbachstr. 15 • 52074 Aachen • GermanyDr. Arnold Gillner • Phone +49 241 8906-148 • E-Mail arnold.gillner@ ilt.fraunhofer.deInternet www.ilt.fraunhofer.de

Fraunhofer IPA is an internationally renowned

center of excellence in the field of production

processes conducted under cleanroom condi-

tions and in the field of digital 2-D/3-D printing

and additive technologies. We develop and

automate customized processes and equipment

for efficient and reliable manufacturing:

Handling of thin and small devices: solutions for

separation, transport, storage and feeding, e.g.

for thin wafer and foil substrates; qualification of

tools, e.g. feeder and gripper.

Selective surface cleaning: cleaning and activa-

tion of local surface areas by using CO2 snow-jet

cleaning and plasma technology.

2-D/3-D digital printing technology: process

development for selective coating applications

based on inkjet and electrophotographic printing

and dispensing technologies; processing of con-

ductive and non-conductive substances; additive

technologies (3-D printing) for micro components

and technical applications.

High precision assembly: solutions to mount

and connect small devices into highly integrated

and multifunctional plastic film and foil-based

systems.

Cleanliness technology: planning, design and

qualification of equipment for contamination-

critical manufacturing; Fraunhofer TESTED

DEVICE® certification.

Fraunhofer Institute for Manufacturing Engineering and Automation IPANobelstr. 12 • 70569 Stuttgart • GermanyPhone +49 711 970 1633 • E-Mail [email protected] Internet www.ipa.fraunhofer.de

INSTITUTES 89

Organic solar cells show great potential due to their low production costs and

mechanical flexibility – characteristics which open up a new range of solar cell

applications.

For the implementation and mass dissemination of organic solar cells, manufacturing

costs, efficiency and long term stability play a key role. Addressing these issues is the

main focus of the research activities on organic solar cells at Fraunhofer ISE. We develop

new types of solar cell concepts focusing on ITO-free architectures. We also work to

increase solar cell efficiency and minimize production expenses by using light trapping

structures, more cost-effective materials, and efficient manufacturing technologies. In

close co-operation with material developers, we investigate and optimize suitable

material systems. Further, we investigate the long term stability of solar cells. We

review aging processes as a whole. Then, under defined aging conditions, we examine

and analyze single components of organic solar cells, as well as sealing materials.

ITO-free organic photovoltaic module on a flexible substrate. ©Fraunhofer ISE


Fraunhofer Institute for Solar Energy Systems ISE Heidenhofstr. 2 • 79110 Freiburg • GermanyPhone +49 761 4588-5386 • E-Mail [email protected] www.ise.fraunhofer.de

The combination of conventional silicon circuits with organic electronic components

and digital functional printing techniques exploits the specific advantages of both

technology platforms (e.g. bendable displays with integrated memory).

For many years Fraunhofer ISIT has developed an advanced technology portfolio

around silicon based microelectronic and microsystem production, as well as

advanced packaging and connecting techniques.

Functional inkjet printing as a new and flexible electrical connecting technique is

opening new fields in application. Since ink and conductive glue curing temperatures

are much lower than in conventional soldering processes, functional inkjet printing

can be applied to less expensive substrates including paper and PET foils. Thermal

sensitive components such as flexible batteries can also be integrated into the pro-

duction process. This saves energy and lowers module costs. Overall, this expands

traditional rigid PCB production via low price flexible electronic module generation.

A binary clock on paper substrate. The inset shows a glue-assembled SMD-LED on printed silver lines.

Hybrid Fabrication of Electronic Modules

Fraunhofer Institute for Silicon Technology ISIT Dr.-Ing. Thomas Knieling • Fraunhoferstr. 1 • 25524 Itzehoe • GermanyPhone +49 4821 17-4605 • E-Mail [email protected] www.isit.fraunhofer.de

90 INSTITUTES

The Center for Organic Photonics and Electronics

(COPE) at Georgia Tech is a leading research and

educational center that creates new technologies

based on organic photonic and electronic materi-

als that have a positive impact on the quality and performance

of products in the telecommunications, energy, information tech-

nology, and defense industries.

COPE takes a team approach to successfully focus on challenging

projects and provide innovative solutions in areas such as OLEDs

for lighting and displays, organic and hybrid photovoltaics for port-

able power, energy storage, and printable organic transistors.

COPE brings together multiple expert perspectives from across the

Georgia Tech campus – seven Georgia Tech schools

and 35 faculty members – and also partners with an

international network of leading universities and

corporations.

Excellence in Education, Research, and Innovation

Center for Organic Photonics and Electronics901 Atlantic Dr. • Atlanta, GA 30332-0400 • USAPhone +1 404 385 3138 • E-Mail [email protected] Internet www.cope.gatech.edu

Fraunhofer POLO® is your one-stop shop for new technologies and materials for

the surface functionalization of polymers. We offer our extensive experience

and know-how for developing new concepts, innovative processes, and modern

materials based on the surfaces of polymers.

The flexible, transparent, high and ultra-high barrier films developed by Fraunhofer

POLO® belong to the best currently available on the marketplace. Combining

inorganic layers (e.g. Al2O

3) with inorganic-organic hybrid coatings (ORMOCER®s)

gives barrier films with extremely low permeability of gases and vapours:

water vapour transmission rate 2 x 10–4 g/(m2 d) (at 38°C and 90 % rel. hum.) on

commercially available standard PET film. This material is available as sample sheets

and as roll material (500 m, 460 mm width). On request, further functions (e.g. ITO)

can be added.

OLED with Fraunhofer POLO® ultra-barrier film encapsulation.

Cutting Edge Ultra-high Barrier Films now Available on Pilot-scale

Fraunhofer Alliance POLO®Geiselbergstr. 69 • 14476 Potsdam • GermanyDr. Andreas Holländer • Phone +49 331 5681404 E-Mail [email protected] • Internet www.polo.fraunhofer.de

INSTITUTES 91

Holst Centre is an independent open-innovation R&D centre that

develops generic technologies for wireless autonomous sensor

technologies and for flexible electronics. A key feature of Holst

Centre is its partnership model with industry and academia based

around shared roadmaps and programs. It is this kind of cross-

fertilization that enables Holst Centre to tune its scientific strategy

to industrial needs.

Holst Centre was set up in 2005 by imec (Flanders, Belgium)

and TNO (of the Netherlands) with support from the Dutch and

Flemish Governments.

Located at High Tech Campus Eindhoven, Holst Centre benefits

from, and contributes to, the state-of-the-art on-site facilities.

Holst Centre has over 170 research staff members with approxi-

mately 28 nationalities and commitments from more than

40 industrial partners.

Our research covers all enabling technologies and processes for roll-to-roll fabrication of flexible electronic devices, such as OLED lighting and displays, OPV…

Holst CentreHigh Tech Campus 31 • 5656 AE Eindhoven • The NetherlandsPhone +31 4040204-00 • E-Mail [email protected] Internet www.holstcentre.comOpen Innovation by imec and TNO

IK4-CIDETEC is a technological center addressing the design of specific inks,

large-area pressure sensors, printed electrochemical sensors, and all-plastic

electrochromic devices.

IK4-CIDETEC is a technological center focused on materials, energy and surfaces.

It was created in 1997 as a non-profit foundation whose mission is to serve the

industry by enhancing its competitiveness through the implementation of inno-

vative procedures and products.

IK4-CIDETEC’s know-how covers the design of new specific inks and the

manufacturing of Plastic Electronics based devices. Specifically:

• tailor-made nanomaterials and specific inks

• flexible large-area pressure sensor devices

• printed electrochemical sensors

• flexible all-plastic electrochromic devices

Technological Center Expert in the Design of Plastic Electronics Based Technologies

IK4-CIDETEC • Parque Tecnológico de San SebastiánPaseo Miramón 196 • 20.009 San Sebastián • SpainPhone +34 943 309022 • E-Mail [email protected] www.cidetec.es

IK4 CIDETECResearch Alliance

92 INSTITUTES

iL is an application-oriented research and transfer

platform of business and science in the Rhine-

Neckar Metropolitan region. Organized in the

form of a public-private partnership, all of iL’s

partners share the common goal of driving

innovation to market faster. A laboratory has

been set up that is unique worldwide, in which

academic scientists and industrial researchers

from various disciplines work together on the

development of organic electronics.

iL collaborates with its 28 part-

ners (18 companies, including

3 DAX-listed companies, and

10 universities & research

institutes) across disciplines

along the entire value chain in

order to create novel solutions.

The company is a crucial part

of the Forum Organic Electro-

nics’ strategy, a cluster which was awarded the

title of Leading-Edge Cluster (Spitzencluster) and

€ 40 million by the German Ministry of Education

and Research in September 2008.

The Forum Organic Electronics focuses on joint

research and the transfer of ideas into market-

able products, as well as the development and

implementation of educational programs.

The companies and universities involved share

three strategic goals:

• to become a world leader in the field of

organic electronics by integrating research,

development and production

• to become a world-leading innovation

incubator for the transfer of knowledge and

for start-up companies

• to be recognized as one of the most

attractive locations for young and experienced

researchers

The variety of collaborators enables the cluster

to operate in the following fields:

• Organic photovoltaics

• Organic logic and memory

• Organic sensors

• Organic light-emitting diodes

All activities in these main areas are based

on printing technology, enabling low cost mass

production. Additionally, these areas are

supported by five competence centers within iL:

simulation, synthesis, analytics, printing techno-

logy and device physics.

InnovationLab (iL) – A Unique Cooperation between Business and Science

InnovationLab GmbHSpeyerer Str. 4 • 69115 Heidelberg • GermanyPhone +49 6221 5419-100 • E-Mail [email protected] www.innovationlab.de

Sour

ce: H

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ruck

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Sour

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ruck

mas

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INSTITUTES 93

MATERIALS – Institute for Surface Technologies

and Photonics is an integral part of national

and international cooperation and networks

in the field of nanotechnology.

Around 70 employees focus on the development of (opto)electronic

(OTFTs, OPDs) and photonic components (LEDs, integrated optics)

and chemical and physical sensors on the basis of organic and

inorganic materials. Our methods and processes:

Nanoimprint Lithography (UV-NIL, Hot Embossing , R2R), Photo

Lithography, 3D-Laser Lithography, Electron Beam Lithography;

CVD, PVD, Aerosoljet, Inkjet, Screen Printing, Gravure Printing, SEM,

AFM, Surface Profiler; XPS, UPS; Electric characterization, Photo-

current measurement; Ellipsometry, UV-VIS-NIR Spectroscopy,

Fluorescence Spectroscopy, Photogonio-Spectrometry; Optical

Simulation: ASAP, FDTD Solutions, Zemax, Virtual Lab.

We offer R&D partnership in funded research programs as well as

bilateral R&D for industrial or commercial customers: cooperation

in Scientific Programs; Process development, device assembly;

Consulting: in organic and printed electronics in submitting research

proposals; Characterization techniques: as a service for partners.

JOANNEUM RESEARCH Forschungsgesellschaft mbHMATERIALS – Institute for Surface Technologies and PhotonicsFranz-Pichler-Str. 30 • 8160 Weiz • AustriaPhone +43 316876 3000 • E-Mail [email protected] www.joanneum.at/materials

Johannes Kepler Universität LinzAltenberger Str. 69 • 4040 Linz • Austria Phone +43 732 2468-8752 • E-Mail [email protected] www.lios.at

Physics and Chemistry of Organic Semiconductors:1. Photoexcited spectroscopy2. Photoconductivity3. Thin film characterization4. Nanoscale engineering5. Nanoscale microscopy (AFM, STM …)6. In situ spectro-electrochemistry

“Incubator” for small high tech spin-off companies

Plastic Solar CellsBio-Organic-

Field Effect Transistors and Electronics

Organic/InorganicHybrid

Solar Cells

CO2 recycling to

synthetic fuels

Sou

rce:

Joh

ann

es K

eple

r U

niv

ersi

tät

Lin

z

Linz Institute for Organic Solar Cells (LIOS)

Employees: 40

Turnover: 1,2 million euro

94 INSTITUTES

• Synthesis and characterization of macromolecular architectures

with designed functionalities

• Design of nano-structured functional materials for:

• Microelectronics (polymers for nano-lithography…)

• Information (memory, magnetic storage…)

• Communication (electrophoretic displays, OLEDs…)

• Energy (photovoltaics, thermoelectricity…)

Polymer facilities (chemistry and physical chemistry). Polymer particles from nanometer to micrometer size. Optoelectronic inks. Reactor in clean room. Flexible electrode.

Functional Polymers for the Emerging Information, Communication and Energy Technologies

Laboratoire de Chimie des Polymères Organiques, (LCPO, UMR 5629)Université Bordeaux 1 • B8 Avenue des Facultés • 33405 Talence • FrancePhone + 33 5 40 00 27 46 • E-Mail [email protected] www.lcpo.fr/wordpress

LTFN is established in the Aristotle University of

Thessaloniki and is internationally acknowl-

edged as a specialist in Organic Electronics (OEs),

Thin Films and Nanomaterials Technology,

Nanometrology and in novel optical monitoring

techniques for quality control.

Our unique know-how and expertise includes the

development and optimization of polymer and

small molecule organic semiconductors, inor-

ganic & polymer transparent electrodes as well

as barrier nano-layers for device encapsulation

onto rigid and flexible polymeric substrates. LTFN

core competences include thin film deposition

by vacuum, printing (roll-to-roll and inkjet) and

gas transport pilot lines. We provide excellence in

in-line and real-time optical sensing techniques

and modeling to correlate synthesis parameters,

film morphology and functional properties.

LTFN has strong collaborations and worldwide

networks, coordinates many EU & national pro-

jects, a cluster on OE, and organizes international

conferences, summer schools and exhibitions on

nanotechnology and OEs.

Lab for Thin Films, Nanosystems & Nanometrology (LTFN)

Aristotle University of Thessaloniki • Physics DepartmentLab for Thin Films – Nanosystems & Nanometrology • 54124, Thessaloniki • GreecePhone +30 2310 998174 • E-Mail [email protected] www.ltfn.gr

INSTITUTES 95

The National Research Council of Canada (NRC)

is the Government of Canada’s premier organiza-

tion for research and development. NRC partners

with industry to take research impacts from the

lab to the marketplace, where people can

experience the benefits. Each year our scientists,

engineers and business experts work closely with

thousands of firms, helping them bring new

tech nologies to market.

NRC’s PE research and development is delivering

functional inks and printing processes that will

enable production of electronic circuits by the

billions to be integrated into everyday objects.

NRC partners are global leaders engaged in each

of the three crucial segments of the printed

electronics value chain: producers of functional

film and ink materials; designers and fabricators

of PE devices and systems; and users of these

devices in the packaging, commercial printing

and security printing sectors. With established

strengths in materials, inks, printing equipment

and prototyping, as well as ICT and electronic

manufact uring capacity, NRC partners are able

to provide innovative products and services to

capture a significant share of the emerging

PE market. NRC’s multidisciplinary research

expertise and experience help existing busi-

nesses find the synergies they need to navigate

this promising new field.

NRC’s PE strengths lie in three areas:

• Functional materials: conductive and

semiconductive ink, scalable processes

• Functional devices: logic circuits, memory,

conductors, RFID and NFC

• Functional imprinting: innovative interactive

optical features for security printing

NRC PE prototyping capability provides industry

with the expertise and state-of-the-art equip-

ment to mitigate R&D risk and succeed in devel-

opment, manufacturing and deployment to

market. NRC provides design and prototyping of

PE components and systems for industry.

NRC Printable Electronics (PE)

NRC Printable Electronics • 1200 Montreal RoadBuilding M-50 • Ottawa, ON K1A 0R6 • CanadaPhone +1 613 990-8069 • E-Mail [email protected] www.nrc-cnrc.gc.ca

96 INSTITUTES

The NanoTecCenter Weiz Forschungsgesellschaft mbH (NTCW)

is a non-profit R&D center for Organic Optoelectronics and

Sensorics founded in 2006 (shareholders: JOANNEUM RESEARCH

Forschungsgesellschaft mbH, Graz University of Technology).

Research Focuses and the Know-How Background of NTCW:

• Development of inkjet technology-based graphic & electronic

applications at industrial level.

• R&D of (organic) (opto-)electronic and sensor devices (solar

cells, OLEDs, OTFTs, memory elements, (bio)sensor applications).

• R&D of basic organic semiconductor material properties

(structure-to-property relations, degradation, reliability).

• Contract work for the development & fabrication (lithography,

inkjet-printing, etc.) of electrical/optical test structures & devices.Most modern R&D facilities and demonstrator examples at NTCW.

NanoTecCenter Weiz Forschungsgesellschaft mbH

NanoTecCenter Weiz Forschungsgesellschaft mbHFranz-Pichler-Str. 32 • 8160 Weiz • AustriaPhone +43 316 876 8003 • E-Mail [email protected] Internet www.ntc-weiz.at

Practicing open innovation, PARC, a Xerox company, provides custom

R&D services, technology, expertise, best practices, and IP to Fortune 500 and

Global 1000 companies, startups, and government agency partners.

To help our clients realize the potential for both flexible and printed electronics,

PARC deploys its expertise in development and optimization of materials and devices

for applications such as displays, sensing, and processing; design and fabrication of

“proof-of-concept” level demonstrators; and full system prototyping, including

thin-film electronics elements.

To learn more and work with us, please visit

www.parc.com/fe&pe

PARC, a Xerox Company

PARC – Palo Alto Research Center3333 Coyote Hill Road • Palo Alto • California 94304 • USAPhone +1 650 812 4000 • E-Mail [email protected] www.parc.com

INSTITUTES 97

In-house printing plant for the production of electronic paper products.

Customer ideas for innovative printed applications become reality.

pmTUC, global leader in mass-printed polymer electronics, offers an in-house printing

service for the production of paper electronics. With this service, companies can try

out their ideas for innovative print products, equipped with electronic functionalities

or devices. These flexible, low-cost, environmentally friendly applications, printed on

substrates like paper or foil, promise high-volume market opportunities, e.g. for

advertising, packaging or medicine. The printing plant is a crucial step towards

commercialization of past research results. Research activities of pmTUC concentrate

on adapting conventional offset, gravure and flexo printing technologies to the

requirements of mass-printed electronics. Basic research focuses on the formulation

of functional inks as well as circuitry design, while applied research includes the

development of mass-printed solar cells, loudspeakers, sensors and other applications.

Print Service for Electronic Paper Products

pmTUC • Professorship Print Media TechnologyProf. Dr. Arved C. Hübler • Chemnitz University of Technology • Faculty of Mechanical EngineeringReichenhainer Str. 70 • 09126 Chemnitz • GermanyPhone +49 371 531-23610 • E-Mail [email protected] • Internet www.tu-chemnitz.de/pm

Printed electronics R&D at PERC is focused on the following areas:

• Synthesis of printable organic and inorganic materials for

electronics

• Printing technology and equipment development

• Printable field effect transistors, solar cells and light emitting

devices

• Encapsulation and packaging of printed electronic devices

• Engineering and prototyping of devices and applications

PERC puts a great emphasis on industrialization and commercializa-

tion of printed electronics, with the Suzhou NanoGrid Technology

(NGT) Ltd. as its industrial base. NGT has developed a proprietary

technology for manufacturing flexible transparent conductive films

which can be used to make touch panels for mobile phones and

tablet computers.

Printable Electronics Research Center (PERC)

Printable Electronics Research Center (PERC) • Suzhou Institute of Nanotech (SINANO)Chinese Academy of Sciences • Ruoshui Road 398, Suzhou Industrial park215123 Suzhou • China • Phone +86 512 62872705 • E-Mail [email protected] www.perc-sinano.com, www.sinano.cas.cn

98 INSTITUTES

The Quebec Institute of Graphic Communications (QIGC) is an integrated

technological and expertise center specialized in graphic communications and

printability, whose mission consists in supporting industrials and their employees

in their technological and commercial evolutions.

Founded 17 years ago, its facility gathers high tech labs to tag and dope materials

and to formulate encapsulation processes and printing presses (offset, flexo, screen,

gravure, inkjet), complemented in 2014 by an R2R hybrid web press made of

5 stations offering a total flexibility of printing and drying technologies.

In 2012, QIGC launched an initiative entitled “Impressions 2020” gathering a

consortium of 28 industrials and aiming to develop printed electronics. Also, the

QIGC is a member of the NRC consortium involved within the flagship program

dedicated to printed electronics.

The Quebec Institute of Graphic Communications

Quebec Institute of Graphic Communications999 Emile-Journault East • Montreal (Quebec) H2M 2E2 • Canada Phone +1 514 389-5061 ext. 258• E-Mail [email protected] • Internet www.icgq.qc.caContact person: Christine Canet, consulting and R&D manager

The Welsh Centre for Printing and Coating

(WCPC) College of Engineering, Swansea

University, is a world renowned research centre

dedicated to advancing the understanding and

productivity of printing and coating.

WCPC has comprehensive open access laborato-

ries that cover all printing processes, ink develop-

ment and print analysis. With multi disciplinary

staff from both industrial and academic back-

grounds, WCPC has expertise in the fundamental

printing science and its practical application to

new manufacturing techniques and improving

process productivity across all technology

readiness levels. WCPC employs a staff of around

25 post-doctoral and PhD researchers.

WCPC is one of the four UK government recog-

nized academic centres of excellence and partner

in the EPSRC Centre for Innovative Manufacture

in Large Area Electronics. It is also a partner in the

Swansea University Centre for Nano Health

where it is looking at the medical, health and

bio-sensing applications of printing.

WCPC is open to all forms of collaborative R&D from

prototype manufacture to large EU funded projects.

Printing, an Advanced Manufacturing Process

WCPC • College of Engineering • Swansea UniversitySingleton Park • Swansea • SA2 8PP • United KingdomPhone +44 1792 295634 • E-Mail [email protected] Internet www.wcpcswansea.com

INSTITUTES 99

Conventional and Digital Printing

Our research aim is to contribute significantly to

the scientific understanding of printing processes.

We analyze printing processes in terms of their

suitability for printing functional materials, and

recommend possible improvements. Our printing

laboratory is separated into three stages; at every

stage, equipment for the most important printing

processes – such as offset, gravure, screen, flexo-

graphy, and inkjet printing – is used. At the first

stage, the printability of functional materials

is tested. At the second stage, we print on sub-

strates up to DIN A4 in size. In addition, all printing

tests can be performed in a climatized laboratory.

At the third stage, functional materials can be

printed on the Gallus RCS 330-HD. This is a

customized industrial web-fed printing press

that can be used for all of the printing processes

listed above. Extensive laboratory equipment is

available to analyze homogeneity, wettability,

curing, rheology, and topography.

Institute of Printing Science and Technology

Technische Universität Darmstadt • Institute of Printing Science and Technology • Magdalenenstr. 2 • 64289 Darmstadt • GermanyPhone +49 6151 16-2132 • E-Mail [email protected] www.idd.tu-darmstadt.de

TOPIC is an innovation center supported by the National Science

and Technology Development Agency (NSTDA), aiming at fast-

growing technology, organic and printed electronics. Our focus is

on oxide-free graphene-based conductive ink, OLED, electro chromic

display, and printed bio-sensors. And we expand our researches in

their applications, ready for a “technology transfer”.

Taking a holistic view, we at TOPIC see ourselves as a key player

connecting R&D and industry, thus making commercialization easier.

Ready now for booking, 10 reserved R&D spaces are available for

private companies who need to work closely with TOPIC and its

strong partnership.Top (l. to r.): emitter, printed bio-sensor, electrochromic displayBottom (l. to r.): OLED, bio-sensor printing, organic materials

TOPIC – Thailand Organic and Printed Electronics Innovation Center

TOPIC – Thailand Organic and Printed Electronics Innovation Center112 Thailand Science Park • Pathumthani • Thailand • 12120Phone +66 2564 7200 ext. 5040 • E-Mail [email protected] www.topic.in.th

100 INSTITUTES

The Centre of Industrial Collaboration is based within the Colour Chemistry

department which is recognized globally for its world leading reputation and

over 100 years of experience in color, dyes, pigments and formulation.

Over the last 5 years we have applied our expertise in formulation to provide

innovations in the technology areas of: photovoltaics, lithium ion batteries,

dielectrics, organic semiconductors, RFID and technical textiles.

More recently, linking with the University’s expertise in medicine, we have created

bio and gas sensors that combine printed conductive carbon electrodes with

electrical impedance. In addition, we have unique capabilities in high value chemical

manufacturing scale-up, from batch or continuous production. Our group has

a proven record of successful collaboration with industry in many areas and at a

global level.

University of Leeds

Centre of Industrial Collaboration • Department of Colour ChemistryUniversity of Leeds • Leeds, LS2 9JT • United KingdomPhone +44 113 3432792 • E-Mail [email protected] www.digitalprintcic.com

University of Novi Sad (UNS) is the second largest

university in Serbia with more than 45000 students

and around 4000 employees. The Faculty of Tech-

nical Sciences (FTS) is the biggest faculty in Serbia,

possessing a high quality of human, material and

organizational capacities. Our expertise in areas

of interest to OE-A members includes:

• Design and fabrication of components, circuits

and systems on flexible and rigid substrates;

• Design, modeling, simulation and fabrication

of different types of sensors (temperature,

pressure, humidity, linear/angular position);

• Testing and characterization of electrical and

mechanical properties of different types of

electronic materials;

• Design of embedded systems.

Equipment: NovaCentrix Pulse Forge 3200;

Dimatix DMP-3000; LPKF Protomat S100; Agilent

Vector Network Analyzer N5230A; RF Wafer Probe

Station (PM5); HP4194A Impedance Analyzer;

HMS-3000 Hall Effect Measurement System;

Tektronix 576 Curve Tracer; Spectrum Analyzer HP

8590A; Nanoindenter G200, SEM JEOL 6460LV,

AFM. Projects: FP7 (APOSTILLE, SENSEIVER,

EMPhAtiC, SmartCoDe, MultiWaveS), EUREKA

(IPCTECH, METASENSE), TEMPUS (WBCInno,

WBC-VMnet), Bilateral projects. Interesting results:

Active shelf (prototype for detecting number of

products on shelves at stores). Eddy current sensor

with ink-jet printed flexible inductor. Flexible

Sierpinski carpet fractal antenna on a Hilbert slot

patterned ground. Cylindrical capacitive angular

position sensor with interdigitated plates.

UNIVERSITY OF NOVI SAD • Faculty of Technical SciencesLaboratory for printed and nano electronics • Trg Dositeja Obradovica 621000 Novi Sad • Serbia • Phone +381 21 4852552 • E-Mail [email protected] www.cimc.rs • www.apostille.rs

Inductive position sensor fabricated on flexible substrate

INSTITUTES 101

The Regional Innovation Centre for Electrical

Engineering (RICE) based in the University of

West Bohemia aspires to provide a full range

of research activities from theoretical research

and modeling to the production of samples or

prototypes and their testing.

The main research objective in the field of organic

and printed electronics is the identification of

materials and functional structures suitable for

production of sensors and electronic components.

Our activities cover the development of low cost

gas and vapor sensor elements on flexible subst-

rates, microcalorimetric sensors, resin hardening

sensors, organic transistors and embedded

components. Target applications include safety

systems for personal protection, smart textile

products and smart labeling.

University of West Bohemia/RICE

University of West Bohemia/RICE Univerzitni 8 • 306 14 Pilsen • Czech RepublicPhone +420 377 634 503 • E-Mail [email protected] www.rice.zcu.cz

VTT is a world-leading R&D center in the field of

printed intelligence. Technical services include

material formulation, roll-to-roll processing of

components and systems, and pilot production.

In addition, VTT can also offer expertise in product concept

realization and new business model development.

Key competences of VTT R&D and innovation services are:

• printed OLED and photovoltaics

• roll-to-roll processing in pilot factory facilities

• diagnostics, indicators and functional paper

• printed electronic components and system

• roll-to-roll integration of LEDs, chips and

components to flex substrates

• foil integration to flexible and 3D electronics

Find out what printed intelligence means to your business!

VTT – The Leading R&D Center in Printed Intelligence

VTT • P.O. Box 1100 • 02044 VTT • FinlandPhone +358 20 722 111 • E-Mail [email protected] www.vttprintedintelligence.fi

102 ORGANIC AND PRINTED ELECTRONICS ORGANIC AND PRINTED ELECTRONICS 103

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arch

an

d D

evel

opm

ent

3D-Micromac AG 37 3D-Micromac AG

adphos Digital Printing GmbH 38 adphos Digital Printing GmbH

Advantech US, Inc. Advantech US, Inc.

Agfa-Gevaert N.V. 39 Agfa-Gevaert N.V.

AIXTRON SE 40 AIXTRON SE

ALTANA AG 42 ALTANA AG

Arjowiggins Creative Paper SAS 41 Arjowiggins Creative Paper SAS

BASF New Business GmbH 44 BASF New Business GmbH

Beneq Oy 45 Beneq Oy

Bosch Rexroth AG Bosch Rexroth AG

Brückner Maschinenbau GmbH & Co. KG Brückner Maschinenbau GmbH & Co. KG

BST International GmbH BST International GmbH

Bundesdruckerei GmbH Bundesdruckerei GmbH

CERADROP 46 CERADROP

Coatema Coating Machinery GmbH 47 Coatema Coating Machinery GmbH

Coherent GmbH Coherent GmbH

Conductive Compounds Inc. Conductive Compounds Inc.

Coruna Printed Electronics GmbH Coruna Printed Electronics GmbH

Coveme Spa Coveme Spa

cynora GmbH 48 cynora GmbH

Dinema SpA Dinema SpA

DOWA HD Europe GmbH 49 DOWA HD Europe GmbH

Dr. Schwab Inspection Technology GmbH Dr. Schwab Inspection Technology GmbH

DuPont Microcircuit Materials 50 DuPont Microcircuit Materials

DuPont Teijin Films (UK) Ltd. 51 DuPont Teijin Films (UK) Ltd.

Eight19 Ltd. Eight19 Ltd.

ELANTAS Beck GmbH ELANTAS Beck GmbH

Enfucell Oy Ltd. Enfucell Oy Ltd.

ERSA GmbH ERSA GmbH

etifix GmbH etifix GmbH

Evonik Industries AG Evonik Industries AG

EXAKT Advanced Technologies GmbH 52 EXAKT Advanced Technologies GmbH

Faubel & Co. Nachfolger GmbH Faubel & Co. Nachfolger GmbH

Products & Services DirectoryCompetence Matrix

products & services competence

Products & Services Directory of OE-A members

in the organic and printed electronics sector.

Please refer to the company profile or the member

registry for more detailed information.

Also see www.oe-a.org

Core competence color code

Material supplier

Device manufacturer

End-user

Equipment manufacturer

Consulting & other services

R&D institute

University


Companies Com

pan

y p

rofi

le o

n p

age

Core

com

pet

ence

cod

e


Companiespap

er

pla

stic

met

al

glas

s

text

iles

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er s

ub

stra

tes

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nic

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du

ctor

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gan

ic c

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on n

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, bla

de)

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sist

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dio

des

pas

sive

s (e

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apac

itor

s, r

esis

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)

inte

grat

ed c

ircu

its

OLE

Ds

elec

troc

hro

mic

dis

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um

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cen

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ory

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as

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)

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into

pac

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/ c

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it o

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lifet

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envi

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men

tal t

esti

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qu

alit

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pro

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con

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chem

ical

ch

arac

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oth

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pri

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and

gra

ph

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pac

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con

sum

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ron

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ical

an

d p

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cal

ligh

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g

ener

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bu

ildin

g an

d a

rch

itec

ture

logi

stic

s

text

iles

and

fash

ion

oth

ers

tran

sist

ors

dis

pla

ys

ligh

tin

g

sen

sors

sola

r ce

lls

smar

t obj

ects

(e.g

. sm

art c

ards

, gam

es, g

adge

ts)

RFI

D

spea

kers

smar

t te

xtile

s

oth

ers

tech

nic

al c

onsu

ltin

g

bu

sin

ess

con

sult

ing

man

agem

ent

of R

&D

fu

nd

ing

pro

gram

s

Rese

arch

an

d D

evel

opm

ent

Felix Böttcher GmbH & Co. KG Felix Böttcher GmbH & Co. KG

FUJIFILM Dimatix, Inc. 54 FUJIFILM Dimatix, Inc.

Fusion UV Systems GmbH Fusion UV Systems GmbH

GENES’INK GENES’INK

Giesecke & Devrient GmbH Giesecke & Devrient GmbH

GP Solar GmbH GP Solar GmbH

GRT GmbH & Co. KG GRT GmbH & Co. KG

GSI Technologies GSI Technologies

Heliatek GmbH Heliatek GmbH

Heraeus Precious Metals GmbH & Co. KG 55 Heraeus Precious Metals GmbH & Co. KG

HNP Mikrosysteme GmbH 56 HNP Mikrosysteme GmbH

IDAM INA Drives & Mechatronics AG & Co. KG 57 IDAM INA Drives & Mechatronics AG & Co. KG

InkTec GmbH InkTec GmbH

InnoPhysics BV InnoPhysics BV

InovisCoat GmbH InovisCoat GmbH

Inside2Outside Ltd. Inside2Outside Ltd.

ISORG ISORG

ISOVOLTAIC AG ISOVOLTAIC AG

Janssen Pharmaceutica N.V. Janssen Pharmaceutica N.V.

JT International Germany GmbH JT International Germany GmbH

Kammann Maschinenbau GmbH 58 Kammann Maschinenbau GmbH

Karl Knauer KG 59 Karl Knauer KG

Klar Folien GmbH Klar Folien GmbH

KROENERT GmbH & Co. KG 60 KROENERT GmbH & Co. KG

KSG Leiterplatten GmbH KSG Leiterplatten GmbH

Leonhard Kurz Stiftung & Co. KG Leonhard Kurz Stiftung & Co. KG

LG Technology Center Europe LG Technology Center Europe

Liquid X Printed Metals Liquid X Printed Metals

M. Braun Inertgas-Systeme GmbH M. Braun Inertgas-Systeme GmbH

MEGTEC Systems, Inc. MEGTEC Systems, Inc.

Mekoprint A/S 61 Mekoprint A/S

Merck KGaA 62 Merck KGaA

MicroChem Corp. MicroChem Corp.









Material supplier

Device manufacturer

End-user



R&D institute

University


Companies Com

pan

y p

rofi

le o

n p

age

Core

com

pet

ence

cod

e


Companiespap

er

pla

stic

met

al

glas

s

text

iles

oth

er s

ub

stra

tes

orga

nic

con

du

ctor

inor

gan

ic c

ond

uct

or

p-t

ype

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nic

sem

icon

du

ctor

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ype

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nic

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icon

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ctor

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ic s

emic

ond

uct

or

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on n

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ub

es

grap

hen

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, bla

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des

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inte

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Ds

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dis

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ch s

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/ su

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cen

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oth

er d

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tech

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ogie

s

ph

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olta

ic c

ells

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sors

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ory

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as

bat

teri

es

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g (e

.g. f

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hip

)

lam

inat

ion

inte

grat

ion

into

pac

kagi

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elec

tric

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har

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ph

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op

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l ch

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zati

on

sim

ula

tion

/ c

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it o

pti

miz

atio

n

lifet

ime

envi

ron

men

tal t

esti

ng

qu

alit

y /

pro

cess

con

trol

chem

ical

ch

arac

teri

zati

on

oth

ers

pri

nti

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ph

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rts

pac

kagi

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con

sum

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ron

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an

d p

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g

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gy

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g an

d a

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logi

stic

s

text

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and

fash

ion

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tran

sist

ors

dis

pla

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tin

g

sen

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lls

smar

t obj

ects

(e.g

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art c

ards

, gam

es, g

adge

ts)

RFI

D

spea

kers

smar

t te

xtile

s

oth

ers

tech

nic

al c

onsu

ltin

g

bu

sin

ess

con

sult

ing

man

agem

ent

of R

&D

fu

nd

ing

pro

gram

s

Rese

arch

an

d D

evel

opm

ent

Mitsubishi Polyester Film GmbH Mitsubishi Polyester Film GmbH

M-Solv Ltd. M-Solv Ltd.

Mühlbauer, Inc. Mühlbauer, Inc.

Nanograde AG Nanograde AG

Next Energy Technologies, Inc. 63 Next Energy Technologies, Inc.

Nissha Europe GmbH, Frankfurt Branch Nissha Europe GmbH, Frankfurt Branch

NovaCentrix 64 NovaCentrix

Novaled AG 65 Novaled AG

nTact (FAS Holdings Group) nTact (FAS Holdings Group)

Ohio Gravure Technologies Inc. Ohio Gravure Technologies Inc.

Österreichische Staatsdruckerei Österreichische Staatsdruckerei

Oxford Advanced Surfaces Group PLC Oxford Advanced Surfaces Group PLC

PChem Associates Inc. PChem Associates Inc.

plastic electronic GmbH plastic electronic GmbH

Plastic Logic Plastic Logic

Plextronics, Inc. Plextronics, Inc.

Polyera Corporation Polyera Corporation

PolyIC GmbH & Co. KG 66 PolyIC GmbH & Co. KG

PolyPhotonix Ltd. PolyPhotonix Ltd.

Printcolor Deutschland GmbH Printcolor Deutschland GmbH

Printed Electronics Ltd. Printed Electronics Ltd.

Quantumatica srl Quantumatica srl

RK Siebdrucktechnik GmbH RK Siebdrucktechnik GmbH

S1 Optics GmbH / IST METZ S1 Optics GmbH / IST METZ

SAES Getters S.p.A. 67 SAES Getters S.p.A.

SAFC Hitech 68 SAFC Hitech

SCHNEIDER ELECTRIC SCHNEIDER ELECTRIC

Schneidler Grafiska AB Schneidler Grafiska AB

Schoeller Technocell GmbH & Co. KG 53 Schoeller Technocell GmbH & Co. KG

Schreiner Group GmbH & Co. KG Schreiner Group GmbH & Co. KG

Sihl GmbH Sihl GmbH

Solarmer Energy Inc. Solarmer Energy Inc.

Soligie 69 Soligie









Material supplier

Device manufacturer

End-user



R&D institute

University


Companies Com

pan

y p

rofi

le o

n p

age

Core

com

pet

ence

cod

e


Companiespap

er

pla

stic

met

al

glas

s

text

iles

oth

er s

ub

stra

tes

orga

nic

con

du

ctor

inor

gan

ic c

ond

uct

or

p-t

ype

orga

nic

sem

icon

du

ctor

n-t

ype

orga

nic

sem

icon

du

ctor

inor

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ic s

emic

ond

uct

or

die

lect

ric

carb

on n

anot

ub

es

grap

hen

e

oth

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thin

film

en

cap

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tion

pol

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film

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met

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qu

alit

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ch

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pac

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t te

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tech

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al c

onsu

ltin

g

bu

sin

ess

con

sult

ing

man

agem

ent

of R

&D

fu

nd

ing

pro

gram

s

Rese

arch

an

d D

evel

opm

ent

Solvay 70 Solvay

Sumitomo Chemical Co. Ltd. Sumitomo Chemical Co. Ltd.

SunaTech Inc. 71 SunaTech Inc.

Surteco SE Surteco SE

Suss Microtech – Tamarack Scientific Co., Inc. Suss Microtech – Tamarack Scientific Co., Inc.

Teknek Ltd. 72 Teknek Ltd.

THIEME GmbH & Co. KG THIEME GmbH & Co. KG

Thin Film Electronics ASA 73 Thin Film Electronics ASA

Toppan Printing Co. (UK) Ltd. Toppan Printing Co. (UK) Ltd.

TSE Troller AG 74 TSE Troller AG

VARTA Microbattery GmbH 75 VARTA Microbattery GmbH

VAST Films Ltd. VAST Films Ltd.

VDI/VDE Innovation + Technik GmbH VDI/VDE Innovation + Technik GmbH

VDL FLOW 76 VDL FLOW

Vestech Taiwan Corp. Vestech Taiwan Corp.

VITA-PRINT LTD VITA-PRINT LTD

Viva Developments S.L. Viva Developments S.L.

XAAR plc XAAR plc

Xenon Corporation 77 Xenon Corporation

YD Ynvisible, S.A. 78 YD Ynvisible, S.A.

Zeon Corporation Zeon Corporation

R&D Institutes R&D Institutes

Acreo Swedish ICT AB 79 Acreo Swedish ICT AB

Aristotle University of Thessaloniki (AUTh) – LTFN 94 Aristotle University of Thessaloniki (AUTh) – LTFN

BRNO University of Technology BRNO University of Technology

California Polytechnic State University California Polytechnic State University

CEA Liten-PICTIC 80 CEA Liten-PICTIC

CeNTI – Centre for Nanotechnology & Smart Materials 79 CeNTI – Centre for Nanotechnology & Smart Materials

Centre Microélectronique de Provence Centre Microélectronique de Provence

Cetemmsa 81 Cetemmsa

Cluster PEC4 Cluster PEC4

CSEM – Centre Suisse d’Electronique et de Microtechnique SA 83 CSEM – Centre Suisse d’Electronique et de Microtechnique SA









Material supplier

Device manufacturer

End-user



R&D institute

University


R&D Institutes Com

pan

y p

rofi

le o

n p

age

Core

com

pet

ence

cod

e


R&D Institutespap

er

pla

stic

met

al

glas

s

text

iles

oth

er s

ub

stra

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nic

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qu

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ical

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pac

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CSIRO 83 CSIRO

CTP Centre Technique du Papier 84 CTP Centre Technique du Papier

ECN Solar Energy ECN Solar Energy

ENEA C. R. Portici – UTTP-NANO 84 ENEA C. R. Portici – UTTP-NANO

EPFL 85 EPFL

Fontys University of Applied Sciences 85 Fontys University of Applied Sciences

Fraunhofer Alliance POLO 90 Fraunhofer Alliance POLO

Fraunhofer COMEDD 86 Fraunhofer COMEDD

Fraunhofer EMFT 86 Fraunhofer EMFT

Fraunhofer ENAS 87 Fraunhofer ENAS

Fraunhofer IAP 87 Fraunhofer IAP

Fraunhofer ILT 88 Fraunhofer ILT

Fraunhofer IPA 88 Fraunhofer IPA

Fraunhofer ISC Fraunhofer ISC

Fraunhofer ISE 89 Fraunhofer ISE

Fraunhofer ISIT 89 Fraunhofer ISIT

Friedrich Schiller University Jena Friedrich Schiller University Jena

Georg-Simon-Ohm University of Applied Sciences Nuremberg Georg-Simon-Ohm University of Applied Sciences Nuremberg

Georgia Tech – Center for Organic Photonics & Electronics 90 Georgia Tech – Center for Organic Photonics & Electronics

Ghent University Ghent University

Hochschule der Medien IAF, IAD Hochschule der Medien IAF, IAD

Holst Centre 91 Holst Centre

ICGQ 98 ICGQ

IK4-CIDETEC 91 IK4-CIDETEC

IMB-CNM (CSIC) IMB-CNM (CSIC)

InnovationLab GmbH 92 InnovationLab GmbH

Institut für Mikroelektronik Stuttgart Institut für Mikroelektronik Stuttgart

Instytut Technologii Elektronowej Instytut Technologii Elektronowej

JOANNEUM RESEARCH Forschungsgesellschaft mbH 93 JOANNEUM RESEARCH Forschungsgesellschaft mbH

Karlsruhe Institute of Technology (KIT) Karlsruhe Institute of Technology (KIT)

Kent State University Kent State University

KTH, Royal Institute of Technology, iPack KTH, Royal Institute of Technology, iPack

LIOS 93 LIOS









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Munich University of Applied Sciences Munich University of Applied Sciences

NanoTecCenter Weiz Forschungsgesellschaft mbH 96 NanoTecCenter Weiz Forschungsgesellschaft mbH

National Centre for Sensor Research National Centre for Sensor Research

National Research Council Canada 95 National Research Council Canada

NPL – National Physical Laboratory NPL – National Physical Laboratory

OMIC, University of Manchester OMIC, University of Manchester

parc (Palo Alto Research Center) 96 parc (Palo Alto Research Center)

pmTUC Professorship Print Media Technology of Chemnitz University of Technology 97 pmTUC Professorship Print Media Technology of Chemnitz University of Technology

Politehnica University of Bucharest Politehnica University of Bucharest

RWTH Aachen University – ITA RWTH Aachen University – ITA

SIMTech – Singapore Institute of Manufacturing Technology SIMTech – Singapore Institute of Manufacturing Technology

Suzhou Institute of Nanotech 97 Suzhou Institute of Nanotech

Tampere University of Technology Tampere University of Technology

Technische Universität Darmstadt – IDD 99 Technische Universität Darmstadt, IDD

TEI – Technological Educational Institute of Athens TEI – Technological Educational Institute of Athens

TOPIC – Thailand Organic and Printed Electronics Innovation Center 99 TOPIC – Thailand Organic and Printed Electronics Innovation Center

TU Dresden, IAPP TU Dresden, IAPP

Universitat Autònoma de Barcelona Universitat Autònoma de Barcelona

Universität zu Köln Universität zu Köln

University of Applied Sciences Bielefeld University of Applied Sciences Bielefeld

University of Bordeaux 1 / LCPO-UMR5629 94 University of Bordeaux 1 / LCPO-UMR5629

University of Cambridge University of Cambridge

University of Leeds 100 University of Leeds

University of Ljubljana University of Ljubljana

University of Novi Sad 100 University of Novi Sad

University of Pardubice University of Pardubice

University of the West of England University of the West of England

VTT Technical Research Centre of Finland 101 VTT Technical Research Centre of Finland

WCPC, Swansea University 98 WCPC, Swansea University









Material supplier

Device manufacturer

End-user



R&D institute

University


3D-Micromac AGTechnologie-Campus 8 09126 Chemnitz Germany Phone +49 371 400 430 Fax +49 371 400 4340 [email protected] www.3d-micromac.com

AAcreo Swedish ICT ABBredgatan 34 60221 Norrköping Sweden Phone +46 11 20 20 00 Fax +46 11 20 25 01 [email protected] www.acreo.se

adphos Digital Printing GmbHBruckmühler Str. 27 83052 Bruckmühl Germany Phone +49 8061 395 100 Fax +49 8061 395 110 [email protected] www.adphos.de

Advantech US, Inc.160 Industry Drive Pittsburgh, PA 15275 USA Phone +1 412 706 5400 Fax +1 412 706 5406 [email protected] www.advantechus.com

Agfa-Gevaert N.V.Orgacon Electronic Materials Septestraat 27 2640 Mortsel Belgium Phone +32 3444 3250 Fax +32 3444 7662 [email protected] www.agfa.com/orgacon

AIDO, Technological Institute of Optics, Colour and Imagec/ Nicolás Copérnico, 7 – 13 Parque Technológico 46980 Paterna (Valencia) Spain Phone +34 96 1318051 Fax +34 96 1318007 [email protected] www.aido.es

AIXTRON SEKaiserstr. 98 52134 Herzogenrath Germany Phone +49 241 8909 6986 Fax +49 241 8909 40 [email protected] www.aixtron.com

ALTANA AGAbelstr. 43 46483 Wesel Germany Phone +49 4078 946 231 Fax +49 4078 946 349 [email protected] www.altana.com

Aristotle University of Thessaloniki (AUTh) – Lab for Thin Films – Nanosystems & Nanometrology (LTFN)University of Thessaloniki, Physics Department 54124 Thessaloniki Greece Phone +30 2310 998 174 Fax +30 2310 998 930 [email protected] http://ltfn.physics.auth.gr

Arjowiggins Creative Papers SAS32 avenue Pierre Grenier 92100 Boulogne-Billancourt France Phone +33 1 57 75 91 00 Fax +33 1 57 75 91 91 [email protected] www.powercoatpaper.com

BBASF New Business GmbH4. Gartenweg, Z 25 67063 Ludwigshafen Germany Phone +49 621 60 44 739 Fax +49 621 60 6644 739 [email protected] www.basf-new-business.com

BAYER MaterialScience AGBuilding D208, Kaiser-Wilhelm-Allee 51368 Leverkusen Germany Phone +49 214 307 5066 Fax +49 214 304 7233 [email protected] www.bayermaterialscience.de

Beneq OyEnsimmäinen Savu 2 01510 Vantaa Finland Phone +358 9 759 9530 Fax +358 9 759 95310 [email protected] www.beneq.com

Bosch Rexroth AGBürgermeister-Dr.-Nebel-Str. 2 97816 Lohr am Main Germany Phone +49 9352 18 0 Fax +49 9352 4077 [email protected] www.boschrexroth.de/printing

Botest Systems GmbHReichenäcker 11 97877 Wertheim Germany Phone +49 9342 93551 0 Fax +49 9342 93551 19 [email protected] www.botest.com

BRNO University of TechnologyPurkynova 118 61200 Brno Czech Republic Phone +420 5 411 494 84 Fax +420 5 412 116 97 [email protected] www.materials-research.eu

Brückner Maschinenbau GmbH & Co. KGKoenigsberger Str. 5–7 83313 Siegsdorf Germany Phone +49 8662 63 99516 Fax +49 8662 63 9642 [email protected] www.brueckner.com

BST International GmbHHeidsieker Heide 53 33739 Bielefeld Germany Phone +49 5206 999 0 Fax +49 5206 999 999 [email protected] www.bst-international.com

Bundesdruckerei GmbHOranienstr. 91 10969 Berlin Germany Phone +49 30 2598 0 Fax +49 30 2598 2205 [email protected] www.bundesdruckerei.de

CCalifornia Polytechnic State University1 Grand Ave. San Luis Obispo, CA 93407 USA Phone +1 805 756 2500 Fax +1 805 756 7118 [email protected] www.printedelectronics.calpoly.edu

Cambridge Display Technology Ltd.2020 Cambourne Business Park Cambridge, CB23 6DW United Kingdom Phone +44 1984 713600 Fax +44 1984 713620 [email protected] www.cdtltd.co.uk

Carnegie Mellon University5000 Forbes Ave. Warner Hall 608 Pittsburgh, PA 15213 USA Phone +1 412 268 1180 Fax +1 412 268 2330 [email protected] www.cmu.edu

CEA LITEN – PICTICCentre de Grenoble 17 rue des Martyrs 38054 Grenoble France Phone +33 438 783 981 [email protected] www.cea.fr

CeNTI – Centre for Nano-technology & Smart MaterialsRua Fernando Mesquita, 2785 4760-034 VN Famalicão Portugal Phone +351 252 104 152 Fax +351 252 327 358 [email protected] www.centi.pt

Centre for Process Innovation Ltd. National Printable Electronics Centre Thomas Wright Way, NETPark, Sedgefield Co. Durham, TS213FG United Kingdom Phone +44 1740 625700 Fax +44 1740 625763 [email protected] www.uk-cpi.com/petec

Centre Microélectronique de Provence880, Av. de Mimet 13541 Gardanne France Phone +33 4 42 61 66 10 Fax +33 4 42 61 65 91 [email protected] www.cmp.emse.fr

CTP Centre Technique du PapierDomaine Universitaire BP 251 38044 Grenoble Cedex 9 France Phone +334 476 154 015 Fax +334 476 154 016 [email protected] www.webCTP.com

CERADROP32, rue de Soyouz 87068 Limoges France Phone +33 555 382696 Fax +33 555 381751 [email protected] www.ceradrop.fr

CetemmsaAv. d’Ernest Lluch 36 08302 Mataró, Barcelona Spain Phone +34 93 741 9100 Fax +34 93 741 9228 [email protected] www.cetemmsa.com

Cluster PEC4QC-0040, Engineering School, campus UAB E08193 Bellaterra (Barcelona) Spain Phone +34 935 814 964 Fax +34 935 813 033 [email protected] www.pec4.net

Coatema Coating Machinery GmbHRoseller Str. 4 41539 Dormagen Germany Phone +49 2133 9784 135 Fax +49 2133 9784 170 [email protected] www.coatema.de

Coherent GmbHHans-Boeckler Str. 12 37079 Göttingen Germany Phone +49 551 69390 Fax +49 551 68691 [email protected] www.coherent.com

Conductive Compounds Inc.17 Hampshire Drive Unit 8 Hudson, NH 3051 USA +1 603 595 6221 +1 603 595 6228 [email protected] www.conductivecompounds.com

Coruna Printed Electronics GmbHLindenbergstr. 5 5618 Bettwil Switzerland Phone +41 5666 721 31 [email protected] www.coruna.ch

Coveme SpaVia Emilia 288 40068 San Lazzaro Di Savena (BO) Italy Phone +39 0 51 62 26 11 1 Fax +39 0 51 62 26 201 [email protected] www.coveme.com

OE-A Members


CSEM – Centre Suisse d’Electronique et de Microtechnique SATramstr. 99 4132 Muttenz Switzerland Phone +41 61 690 6030 Fax +41 61 690 6000 [email protected] www.csem.ch

CSIROBayview Avenue VIC 3168 Melbourne Australia Phone +61 3 95 45 22 05 Fax +61 3 95 45 29 63 [email protected] www.csiro.au/flexibleelectronics

cynora GmbHHermann-von-Hemlholtz-Platz 1 Geb. 717 76344 Eggenstein-Leopoldshafen Germany Phone +49 721 6082 9007 Fax +49 721 6082 9030 [email protected] www.cynora.com

DDinema SpAVia San Polo 183 25124 Brescia (BS) Italy Phone +39 030 2300492 Fax +39 030 2300833 [email protected] www.dinema.it

DOWA HD Europe GmbHOstendstr. 196 90482 Nürnberg Germany Phone +49 911 56989 320 Fax +49 911 56989 3250 [email protected] www.dowa.co.jp/en/jigyo/ electronics_summary.html

DOWA International Corporation370 Lexington Avenue Suite 1002 New York, NY 10017 USA Phone +1 212 697 3217 Fax +1 212 697 3902 [email protected] www.dicny.com

Dr. Schwab Inspection Technology GmbHIndustriestr. 9 86551 Aichach Germany Phone +49 8251 9008 0 Fax +49 8251 8119 4 johann.ostermayer@ schwabinspection.com www.schwabinspection.com

DuPont Microcircuit MaterialsColdharbour Lane, Frenchay Bristol, BS161QD United Kingdom Phone +44 117 9313 191 Fax +44 117 9313 131 [email protected] http://mcm.dupont.com

DuPont Teijin Films (UK) Ltd.Wilton Centre Redcar, TS90 4RF United Kingdom Phone +44 1642 572 000 Fax +44 1642 572 128 [email protected] www.dupontteijinfilms.com

EECN Solar EnergyHigh Tech Campus 5 Eindhoven 5656 AE The Netherlands Phone +31 885 154 734 Fax +31 885 158 214 [email protected] www.ecn.nl

Eight19 Ltd.9A Science Park Cambridge, CB4 0FE United Kingdom Phone +44 1223 437 437 [email protected] www.eight19.com

ELANTAS Beck GmbHGrossmannstr. 105 20539 Hamburg Germany Phone +49 40 78946 231 Fax +49 40 78946 349 [email protected] www.elantas.com/beck

ELON Technologies, s.r.oU Pruhonu 40 170 00 Prague 7 Czech Republic Phone +420 607 688 282 Fax +420 25 51 536 [email protected] www.elontech.eu

ENEA C. R. Portici – UTTP-NANOp.le E. Fermi, 1 80055 Portici (NA) Italy Phone +39 081 7723 289 Fax +39 081 7723 344 [email protected] www.enea.it

Enfucell Oy Ltd.Petikontie 10 01720 Vantaa Finland Phone +358 45 120 6030 Fax +358 9 276 5040 [email protected] www.enfucell.com

EPFLRue de la Maladière 2000 Neuchâtel Switzerland Phone +41 32 720 5564 Fax +41 32 720 5711 [email protected] http://samlab.epfl.ch/enviromems

ERSA GmbHLeonhard-Karl-Str. 2 97877 Wertheim Germany Phone +49 9342 800 236 Fax +49 9342 800 320 [email protected] www.ersa.de

etifix GmbHRiedericher Str. 68 72661 Grafenberg Germany Phone +49 7123 382 0 Fax +49 7123 382 101 [email protected] www.etifix.com

Evonik Industries AGPaul-Baumann-Str. 1 45764 Marl Germany Phone +49 2365 49 59 33 Fax +49 2365 49 80 59 33 [email protected] www.evonik.com

EXAKT Advanced Technologies GmbHRobert-Koch-Str. 5 22851 Norderstedt Germany Phone +49 40 529 5600 Fax +49 40 524 9959 [email protected] www.exakt.de

FFaubel & Co. Nachfolger GmbHSchwarzenberger Weg 45 34212 Melsungen Germany Phone +49 5661 7309 100 Fax +49 5661 7309 199 [email protected] www.faubel.de

Felix Böttcher GmbH & Co. KGStolberger Str. 351–353 50933 Köln Germany Phone +49 221 4907 509 Fax +49 221 4907 510 gerhard.bartscher@ boettcher-systems.com www.boettcher-systems.com

Fontys University of Applied SciencesRachelsmolen 1 5612 MA Eindhoven The Netherlands Phone +31 877 87 4280 [email protected] www.fontys.nl/lectoraten/ funmaterials

Fraunhofer COMEDDMaria-Reiche-Str. 2 01109 Dresden Germany Phone +49 351 8823 309 Fax +49 351 8823 266 [email protected] www.comedd.fraunhofer.de

Fraunhofer Alliance POLOGeiselbergstr. 69 Potsdam Germany Phone +49 3315 681 404 [email protected] www.polo.fraunhofer.de

Fraunhofer-Einrichtung für modulare Festkörpertechnologien EMFTHansastr. 27d 80686 München Germany Phone +49 89 547 59 510 Fax +49 89 547 59 550 [email protected] www.emft.fraunhofer.de

Fraunhofer IAPGeiselbergstr. 69 14476 Potsdam-Golm Germany Phone +49 331 568 1910 Fax +49 331 568 3910 [email protected] www.oled-forschung.de

Fraunhofer Institute for Electronic Nano Systems ENASTechnologie-Campus 3 09126 Chemnitz Germany Phone +49 371 45001 0 Fax +49 371 45001 101 [email protected] www.enas.fraunhofer.de

Fraunhofer Institute Laser Technology ILTSteinbachstr. 15 52074 Aachen Germany Phone +49 241 8906 148 Fax +49 241 8906 121 [email protected] www.ilt.fraunhofer.de

Fraunhofer Institute for Manufacturing Engineering and Automation IPANobelstr. 12 70569 Stuttgart Germany Phone +49 711 970 1633 Fax +49 711 970 1007 [email protected] www.ipa.fraunhofer.de

Fraunhofer Institut für Siliziumtechnologie ISITFraunhoferstr. 1 25524 Itzehoe Germany Phone +49 4821 17 4605 Fax +49 4821 17 4250 [email protected] www.isit.fraunhofer.de

Fraunhofer ISCNeunerplatz 2 97082 Würzburg Germany Phone +49 931 41 00 551 Fax +49 931 41 00 559 [email protected] www.isc.fraunhofer.de

Fraunhofer ISEHeidenhofstr. 2 79110 Freiburg Germany Phone +49 761 4588 0 Fax +49 761 4588 9000 [email protected] www.ise.fraunhofer.de

Friedrich Schiller University JenaHumboldtstr. 10 07743 Jena Germany Phone +49 3641 948220 Fax +49 3641 948202 [email protected] www.schubert-group.com

FUJIFILM Dimatix, Inc.2250 Martin Avenue Santa Clara, CA 95050 USA Phone +1 408 565 9150 Fax +1 408 565 9151 [email protected] www.dimatix.com

Fusion UV Systems GmbHCarl-Zeiss-Ring 11–13 85737 Ismaning Germany Phone +49 89 899 6310 Fax +49 89 899 63110 [email protected] www.fusionuv.com

GGENES’INK24, Av. Gaston Imbert 13106 Rousset Cedex France Phone +33 442 370 585 Fax +33 442 200 703 [email protected] www.genesink.com


Georg-Simon-Ohm University of Applied Sciences NurembergWassertorstr. 10 90489 Nürnberg Germany Phone +49 911 5880 1082 Fax +49 911 5880 5109 marcus.reichenberger@ www.ohm-hochschule.de

Georgia Tech-Center for Organic Photonics and Electronics901 Atlantic Dr. Atlanta, GA 30332-0400 USA Phone +1 404 385 3138 Fax +1 404 894 8956 [email protected] www.cope.gatech.edu

Ghent University Technologiepark 907 9052 Ghent / Zwijnaarde Belgium Phone +32 9 264 5419 Fax +32 9 264 5831 [email protected] www.textiles.ugent.be

Giesecke & Devrient GmbHPrinzregentenstr. 159 81607 München Germany Phone +49 89 4119 0 [email protected] www.gi-de.com

GP Solar GmbHReichenaustr. 21 78467 Konstanz Germany Phone +49 7531 3610 4601 Fax +49 7531 3610 4610 [email protected] www.gpsolar.de

GRT GmbH & Co. KGGoorweg 14 59075 Hamm Germany Phone +49 2381 98 766 10 Fax +49 2381 98 766 19 [email protected] www.grt-gmbh.de

GSI Technologies311 Shore Drive Burr Ridge, IL 60527 USA Phone +1 630 325 8181 Fax +1 630 325 8197 [email protected] www.gsitech.com

HHeliatek GmbHTreidlerstr. 3 01139 Dresden Germany Phone +49 351 213 034 30 Fax +49 351 213 034 40 [email protected] www.heliatek.com

Heraeus Precious Metals GmbH Co. KGChempark B 202 51368 Leverkusen Germany Phone +49 214 30 26718 Fax +49 214 30 56284 [email protected] www.clevios.com

HNP Mikrosysteme GmbHBleicherufer 25 19053 Schwerin Germany Phone +49 385 52190 300 Fax +49 385 52190 333 [email protected] www.hnp-mikrosysteme.de

Hochschule der Medien IAF, IADNobelstr. 10 70569 Stuttgart Germany Phone +49 711 8923 2144 [email protected] www.hdm-stuttgart.de/iad

Holst CentreHigh Tech Campus 31 PO Box 8550, 5605 KN The Netherlands Phone +31 40 40 20 400 Fax +31 40 40 20 699 [email protected] www.holstcentre.com

IICGQ999 Emile Journault East Montreal (Québec) H2M 2E2 Canada Phone +1 514 389 5061 Fax +1 514 389 5840 [email protected] www.icgq.qc.ca

IDAM INA Drives & Mechatronics AG & Co. KGMittelbergstr. 2 98527 Suhl Germany Phone +49 9132 82 2392 Fax +49 9132 82 45 2392 [email protected] www.idam.de

IK4-CIDETECParque Tecnologico de San Sebastián Paseo Miramón 196 20009 San Sebastián Spain Phone +34 43 309022 Fax +34 43 309136 [email protected] www.cidetec.es

IMB-CNM (CSIC)Campus UAB – Bellaterra 8193 Cerdanyola del Vallès Spain Phone +34 935 947 700 Fax +34 935 800 267 [email protected] www.imb-cnm.csic.es

InkTec GmbHAm Hasenbiel 35 76297 Stutensee Germany Phone +49 7244 7330 310 Fax +49 7244 6081 20 [email protected] www.Ink-Tec.de

InnoPhysics BVFransebaan 592a Eindhoven, 5627 JM The Netherlands Phone +31 40 2484774 [email protected] www.innophysics.nl

InnovationLab GmbHSpeyerer Str. 4 69123 Heidelberg Germany Phone +49 6221 54 19 100 Fax +49 6221 54 19 110 [email protected] www.innovationlab.de

InovisCoat GmbHRheinparkallee 3 40789 Monheim am Rhein Germany Phone +49 2173 10144 0 Fax +49 2173 10144 199 [email protected] www.inoviscoat.de

Inside2Outside Ltd.Fenstanton Cambridge, PE28 9HU United Kingdom Phone +44 1480 498 297 Fax +44 1480 498 303 [email protected] inside2outside.co.uk

Institut für Mikroelektronik StuttgartAllmandring 30a 70569 Stuttgart Germany Phone +49 711 21855 0 Fax +49 711 21855 111 [email protected] www.ims-chips.de

Instytut Technologii ElektronowejZablocie 39 30-701 Krakow Poland Phone +48 12 656 5183 Fax +48 12 656 3626 [email protected] www.ite.waw.pl

ISORG17 rue des Martyrs, ISORG c/o CEA 38000 Grenoble France Phone +33 609 45 73 70 [email protected] www.isorg.fr

ISOVOLTAIC AGIsovoltastr. 1 8403 Lebring Austria Phone +43 5 9191 9961 [email protected] www.isovoltaic.com

ITRI – Industrial Technology Research Institute195 Chung Hsing Rd., Sec. 4 Chu Tung, Hsin Chu, 310, R.O.C. Taiwan Phone +886 3 591 8291 Fax +886 3 582 0093 [email protected] www.itri.org.tw/eng

JJacobs University Bremen gGmbHCampus Ring 8 28759 Bremen Germany Phone +49 421 200 3225 Fax +49 421 200 49 3225 [email protected] www.jacobs-university.de/directory/vwagner/

Janssen Pharmaceutica N.V.Turnhoutseweg 30 2340 Beerse Belgium Phone +32 1460 2959 [email protected] http://en.janssenpharmaceutica.be

JOANNEUM RESEARCH Forschungsgesellschaft mbHFranz-Pichler-Str. 30 8160 Weiz Austria Phone +43 316 876 2721 [email protected] www.joanneum.at

JT International Germany GmbHDiedenhofener Str. 30 54294 Trier Germany Phone +49 651 686 1115 Fax +49 651 686 22 1115 [email protected] www.jti.com

KKammann Maschinenbau GmbHBergkirchener Str. 228 32549 Bad Oeynhausen Germany Phone +49 5734 5140 0 Fax +49 5734 5140 130 [email protected] www.kammann.de

Karl Knauer KGZellerstr. 14 77781 Biberach Germany Phone +49 7835 7820 Fax +49 7835 3598 [email protected] www.karlknauer.de

Karlsruhe Institute of Technology (KIT)Kaiserstr. 12 76131 Karlsruhe Germany Phone +49 721 608 3765 Fax +49 721 608 43490 [email protected] www.kit.edu

Kent State University145 Cartwright Hall, PO Box 5190 Kent, OH 44242-0001 USA Phone +1 330 672 0732 Fax +1 330 672 7991 [email protected] www.kent.edu/research/

Klar Folien GmbHEbernhahner Str. 22 56428 Dernbach Germany Phone +49 260 280 071 Fax +49 260 2106 105 [email protected] www.klar-folien.de

Konkuk University FDRC1 Hwayang-dong, Gwangjin-gu Seoul 143 – 701 Korea Phone +82 2 450 3072 Fax +82 2 447 5886 [email protected] www.fdrc.re.kr

KROENERT GmbH & Co. KG Schuetzenstr. 105 22761 Hamburg Germany Phone +49 40 853 93 01 Fax +49 40 853 93 171 [email protected] www.kroenert.de

KSG Leiterplatten GmbHAuerbacher Str. 3–5 09390 Gornsdorf Germany Phone +49 3721 266 0 Fax +49 3721 266 101 [email protected] www.ksg.de

KTH, Royal Institute of Technology, iPackIsafjordsgatan 39 16440 Kista Sweden Phone +46 8 790 4118 Fax +46 8 751 1793 [email protected] www.ipack.kth.se


Leonhard Kurz Stiftung & Co. KGSchwabacher Str. 482 90763 Fürth Germany Phone +49 911 7141 830 Fax +49 911 7141 507 [email protected] www.kurz.de

LLG Technology Center EuropeHammfelddamm 3 41460 Neuss Germany Phone +49 2131 366 6437 Fax +49 2131 366 6459 [email protected] www.lgtce.com

LIOSAltenberger Str. 69 4040 Linz Austria Phone +43 732 2468 8752 Fax +43 732 2468 8770 [email protected] www.lios.at

Liquid X Printed Metals4400 Fifth Avenue Pittsburgh, PA 15213 USA Phone +1 412 268 3136 Fax +1 412 268 3136 [email protected] www.liquid-x.com

MM. Braun Inertgas-Systeme GmbHDieselstr. 31 85748 Garching Germany Phone +49 89 32669 0 Fax +49 89 32669 105 [email protected] www.mbraun.de

manroland AGMühlheimer Str. 341 63075 Offenbach Germany Phone +49 69 8305 0 Fax +49 69 8305 1440 [email protected] www.manroland.com

MEGTEC Systems, Inc.830 Prosper Rd. De Pere, WI 54115 USA Phone +1 920 339 2787 Fax +1 920 339 2793 [email protected] www.megtec.com

Mekoprint A/SHermesvej 4 9530 Støvring Denmark Phone +45 9936 56 00 Fax +45 9936 56 04 [email protected] www.mekoprint.dk/solar

Merck KGaAFrankfurter Str. 250 64293 Darmstadt Germany Phone +49 6151 72 7747 Fax +49 6151 72 91 7747 [email protected] www.merck.de

MicroChem Corp.90 Oak Street PO Box 426 Newton, MA 02464 USA +1 617 965 5511 +1 617 965 5818 [email protected] www.microchem.com

Mitsubishi Polyester Film GmbHKasteler Str. 45 65203 Wiesbaden Germany Phone +49 611 962 3486 Fax +49 611 962 9413 [email protected] www.m-petfilm.com

M-Solv Ltd.Unit 8 Oxonian Park Kidlington, OX5 1FP United Kingdom Phone +44 1865 844070 Fax +44 1865 844071 [email protected] www.m-solv.com

Muehlbauer, Inc.226 Pickett’s Line Newport News, VA 23603-1366 USA Phone +1 757 947 2820 Fax +1 757 947 2930 [email protected] www.muhlbauer.com

Munich University of Applied SciencesLothstr. 34 80335 München Germany Phone +49 89 1265 1567 Fax +49 89 1265 1502 [email protected] www.hm.edu

NNanograde AGWolfgang-Pauli-Str., PO Box 239 8093 Zürich Switzerland Phone +41 44 633 62 39 Fax +41 44 633 15 71 [email protected] www.nanograde.ch

NanoTecCenter Weiz Forschungsgesellschaft mbHFranz-Pichler-Str. 32 8610 Weiz Austria Phone +43 316 876 80 03 Fax +43 316 876 80 40 [email protected] www.ntc-weiz.at

National Centre for Sensor ResearchDublin City University Collins Avenue, Dublin 9 Ireland Phone +353 1 700 8821 Fax +353 1 700 8021 [email protected] www.dcu.ie/ncsr/

National Research Council Canada1200 Montreal Road, Bldg. M-50 Ottawa, K1A 0R6 Canada Phone +1 613 993 8061 [email protected] www.nrc.ca

Next Energy Technologies, Inc.5385 Hollister Ave., Bldg. 6, Ste. 115 93111 Santa Barbara, CA USA Phone +1 805 222 4546 Fax +1 805 852 2530 [email protected] www.nextenergytech.com

Nissha Europe GmbH, Frankfurt BranchMergenthalerallee 45, 4. OG 65760 Frankfurt Germany Phone +49 6196 96731 0 Fax +49 6196 96731 29 [email protected] www.nissha.co.jp/english

NovaCentrix400-B Parker Drive Austin, TX 78728 USA Phone +1 512 491 9500 (ext. 210) Fax +1 512 491 0002 [email protected] www.novacentrix.com

Novaled AGTatzberg 49 01307 Dresden Germany Phone +49 351 796 580 Fax +49 351 796 5829 [email protected] www.novaled.com

NPL – National Physics LaboratoryHampton Road Teddington, TW11 0LW United Kingdom Phone +44 208 977 3222 [email protected] www.npl.co.uk

nTact (FAS Holdings Group)10480 Markison Rd. 75238 Dallas, TX USA Phone +1 214 343 5300 Fax +1 214 343 5350 [email protected] www.nTact.com

OOhio Gravure Technologies Inc.1241 Byers Road Miamisburg, OH 45342 USA Phone +1 937 439 1582 Fax +1 937 439 1592 [email protected] www.ohiogt.com

OMEC – University of ManchesterOxford Road Manchester, M13 9PL United Kingdom Phone +44 161 275 14 21 [email protected] www.omec.org.uk

Österreichische StaatsdruckereiTenschertstr. 7 1239 Wien Austria Phone +43 206 66 Fax +43 206 66 100 [email protected] www.staatsdruckerei.at

Oxford Advanced Surfaces Group PLCCentre for Innovation & Enterprise, Begbroke Science Park, Sandy Lane Yarnton, OX5 2PF United Kingdom Phone +44 1865 85 48 07 [email protected] www.oxfordsurfaces.com

Pparc (Palo Alto Research Center)3333 Coyote Hill Road 94304 Palo Alto, CA USA Phone +1 650 812 4000 [email protected] www.parc.com

PChem Associates Inc.3599 Marshall Ln. – Suite D Bensalem, PA 19020 USA Phone +1 215 244 4603 Fax +1 215 689 2694 [email protected] www.nanopchem.com

Photonics Research Institute AISTHigashi 1-1-1 305-8565 Tsukuba, Ibaraki Japan Phone +81 29 8 61 63 06 Fax +81 29 8 61 63 06 [email protected] www.aist.go.jp/index_en.html

plastic electronic GmbHLunzerstr. 89 4030 Linz Austria Phone +43 732 65 20 30 [email protected] www.plastic-electronic.com

Plastic Logic322 Cambridge Science Park Cambridge, CB4 0WG United Kingdom Phone +44 1223 706 000 Fax +44 1223 706 006 [email protected] www.plasticlogic.com

Plextronics, Inc.2180 William Pitt Way Pittsburgh, PA 15238 USA Phone +1 412 423 2030 Fax +1 412 423 2049 [email protected] www.plextronics.com

pmTUC – Professorship Print Media Technology of Chemnitz University of TechnologyReichenhainer Str. 70 09126 Chemnitz Germany Phone +49 371 531 23610 Fax +49 371 531 23619 [email protected] www.tu-chemnitz.de/pm

Politehnica University of BucharestUPB-CETTI Splaiul Independentei, 313, sector 6 60042 Bucharest Romania Phone +40 21 411 6674 Fax +40 21 411 5182 [email protected] www.cetti.ro

Polyera Corporation8045 Lamon Avenue, Suite 140 Skokie, IL 60077 USA Phone +1 847 261 4657 [email protected] www.polyera.com


PolyIC GmbH & Co. KGTucherstr. 2 90763 Fürth Germany Phone +49 911 20 249 0 Fax +49 911 20 249 8001 [email protected] www.polyic.com

PolyPhotonix Ltd.Thomas Wright Way Sedgefield, County Durham, TS21 3FG United Kingdom Phone +44 1740 625 700 [email protected] www.polyphotonix.com

Printcolor Germany GmbHJosef-Baumann-Str. 39 44805 Bochum Germany Phone +49 234 687 190 Fax +49 234 687 1919 [email protected] www.printcolor.ch

Printed Electronics Ltd.Hedging Lane, Dosthill Tamworth, DE11 9RW United Kingdom Phone +44 1827 26 33 38 [email protected] www.printedelectronics.com

QQuantumatica srlvia Verdi 11 21057 Olgiate O. (va) Italy Phone +39 0331 649 409 Fax +39 0331 315 118 [email protected] www.quantumatica.com

RRambus Inc.255 Santa Ana Court Sunnyvale, CA 94089 USA Phone +1 408 462 8000 Fax +1 408 462 8001 [email protected] www.rambus.com

Risø DTU National Laboratory for Sustainable Energy Frederiksborgvej 399 4000 Roskilde Denmark Phone +45 46 774 798 Fax +45 46 774 791 [email protected] www.risoe.dk

RK Siebdrucktechnik GmbHNußbaumweg 31 51503 Rösrath Germany Phone +49 220 594 9970 Fax +49 220 5949 9777 [email protected] www.rk-siebdruck.de

RWTH Aachen University – ITAOtto-Blumenthal-Str. 1 52074 Aachen Germany Phone +49 241 80 234 00 Fax +49 241 80 224 22 [email protected] www.ita.rwth-aachen.de

SS1 Optics GmbH / IST MetzLauterstr. 14–18 72622 Nürtingen Germany Phone +49 7022 6002 471 Fax +49 7022 6002 775 [email protected] www.ist-uv.com

SAES Getters S.p.A.Viale Italia 77 20020 Lainate Italy Phone +39 02 93 17 82 85 Fax +39 02 93 17 83 20 [email protected] www.saesgetters.com

SAFC HitechPower Road Bromborough, CH62 3QF United Kingdom Phone +44 151 482 7230 [email protected] www.SAFCHitech.com

Samsung C & T Germany GmbHAm Kronberger Hang 6 65824 Schwalbach Germany Phone +49 6196 66 59 91 Fax +49 6196 66 53 33 [email protected] www.samsung.de

SCHNEIDER ELECTRIC35 rue Joseph Monier 92500 Rueil-Malmaison France Phone +33 1 41 29 70 00 Fax +33 1 46 99 71 00 [email protected] www.schneider-electric.com

Schneidler Grafiska ABMalaxgatan 1 16493 Kista Sweden Phone +46 86 325 000 [email protected] www.schneidler.se

Schoeller Technocell GmbH & Co. KGBurg Gretesch 49086 Osnabrück Germany Phone +49 541 3800 853 Fax +49 541 3800 981 853 [email protected] www.felix-schoeller.com

Schreiner Group GmbH & Co. KGBruckmannring 22 85764 Oberschleissheim Germany Phone +49 89 31584 5634 Fax +49 89 31584 5305 [email protected] www.schreiner-group.com

Schweizer Electronic AGEinsteinstr. 10 78713 Schramberg Germany Phone +49 7422 512 214 Fax +49 7422 512 398 [email protected] www.seag.de

Sihl GmbHKreuzauer Str. 33 52355 Dueren Germany Phone +49 2421 597 0 [email protected] www.sihl.de

SIMTech – Singapore Institute of Manufacturing Technology71, Nanyang Drive Singapore 638075 Singapore Phone +65 679 38 507 Fax +65 7922 779 [email protected] www.SIMTech.a-star.edu.sg

Solarmer Energy Inc.3445 Fletcher Ave. El Monte, CA 91731 USA Phone +1 626 4 56 8090 Fax +1 626 4 56 8082 [email protected] www.solarmer.com

Soligie8647 Eagle Creek Parkway Savage, MN 55378 USA Phone +1 952 818 8300 Fax +1 952 808 3266 [email protected] www.soligie.com

Soluxx GmbHGreinstr. 4 50939 Köln Germany Phone +49 221 99 55 99 46 Fax +49 221 99 55 99 47 [email protected] www.soluxx.de

Solvayrue de Ransbeek, 310 1120 Brussels Belgium Phone +32 2 264 2111 Fax +32 2 264 2455 [email protected] www.solvay.com

Sumitomo Chemical Co., Ltd.27-1, Shinkawa 2-chome, Chuo-ku 104-8260 Tokyo Japan Phone +81 3 5543 5156 Fax +81 3 5543 5909 [email protected] www.sumitomo-chem.co.jp/english/

SunaTech Inc. 398 Ruoshui Road Suzhou, 215125 P. R. China Phone +86 512 62 872 180 Fax +86 512 62 872 181 [email protected] www.sunatech.com

Sunchon National University315 Maegok Sunchon Korea Phone +82 61 750 3585 Fax +82 61 750 5450 [email protected] www.rrc.sunchon.ac.kr

Surteco SEBeisenstr. 50 45964 Gladbeck Germany Phone +49 2043 979 748 [email protected] www.surteco.com

Suss Microtech – Tamarack Scientific Co., Inc.220 Klug Circle Corona, CA 92880 USA Phone +1 951 817 3700 Fax +1 951 817 0640 [email protected] www.suss.com

Suzhou Institute of Nanotech398 Ruo Shui Road 215123 Suzhou P. R. China Phone +86 512 6287 2705 +86 512 6260 3089 [email protected] www.perc-sinano.com

TTampere University of TechnologyKorkeakoulunkatu 1 33101 Tampere Finland Phone +358 3311 511 [email protected] www.tut.fi

Technische Universität Darmstadt – IDDMagdalenenstr. 2 64289 Darmstadt Germany Phone +49 6151 16 2132 Fax +49 6151 16 3632 [email protected] www.idd.tu-darmstadt.de

Technische Universität Hamburg-HarburgTechnologiezentrum Hamburg-Finkenwerder Neßpriel 5 21129 Hamburg Germany Phone +49 40 42 878 8293 [email protected] www.tu-harburg.de/et7/

TEI – Technological Educational Institutions of AthensAg Spyridonos & Pallikaridi 12111 Aegaleo Greece Phone +30 693 23 600 63 Fax +30 210 99 38 97 4 [email protected] www.smartprintmedia.com

Teknek Ltd.River Drive Inchinnan, PA4 9RT United Kingdom Phone +44 141 568 8100 [email protected] www.teknek.com

THIEME GmbH & Co. KGRobert-Bosch-Str. 1 79331 Teningen Germany Phone +49 7641 583 0 Fax +49 7641 583 110 [email protected] www.thieme.eu

Thin Film Electronics ASAPO Box 2911 Solli 0230 Oslo Norway Phone +46 13 460 2400 Fax +46 13 460 2499 [email protected] www.thinfilm.no

TOPIC – Thailand Organic and Printed Electronics Innovation Center112 Thailand Science Park 12120 Pathumthani Thailand Phone +66 2564 7200 ext. 5040 thinnakorn.hanchana@ tmc.nstda.or.th www.topic.in.th


Toppan Printing Co. (UK) Ltd.128 Queen Victoria Street London, EC4V 4BJ United Kingdom Phone +44 207 213 0502 Fax +44 207 248 1078 [email protected] www.toppan.co.uk

TSE Troller AGAareweg 6 4853 Murgenthal Switzerland Phone +41 62 917 4010 Fax +41 62 917 4015 [email protected] www.tse-coating.ch

TU Dresden, IAPP01062 Dresden Germany Phone +49 351 463 34389 Fax +49 351 463 37065 [email protected] www.iapp.de

UUniversitat Autònoma de BarcelonaOffice QC-2088, Engineering School, campus UAB 08193 Bellaterra (Barcelona) Spain Phone +34 93 581 4892 Fax +34 93 581 3033 [email protected] www.uab.cat

Universität zu KölnLuxemburger Str. 116 50939 Köln Germany Phone +49 221 470 32 75 Fax +49 221 470 51 44 [email protected] www.meerholz.uni-koeln.de

University of Applied Sciences BielefeldDepartment of Engineering Sciences and Mathematics Wilhelm-Bertelsmann-Str. 10 33602 Bielefeld Germany Phone +49 521 106 7307 Fax +49 521 106 7168 [email protected] www.fh-bielefeld.de/fb3/zielke

University of Bordeaux1 / LCPO-UMR5629Avenue des facultés, B8 33405 Talence France Phone +33 540 002 674 Fax +33 540 003 083 [email protected] www.lcpo.fr/wordpress/

University of CambridgeElectrical Engineering Division 9 J J Thomson Avenue Cambridge, CB3 0FA United Kingdom Phone +44 1223 767880 Fax +44 1223 748342 [email protected] www.cikc.eng.cam.ac.uk

University of LeedsDP Centre of Collaboration Leeds, LS1 2AL United Kingdom Phone +44 113 34 32 792 Fax +44 113 34 32 947 [email protected] www.digitalprintcic.com

University of LjubljanaSnezniska 5 Ljubljana SI 1000 Slovenia Phone +386 1 2003 200 Fax +386 1 2003 270 [email protected] www.ntf.uni-lj.si

University of Novi SadTrg Dositeja Obradovica 6 21000 Novi Sad Serbia Phone +381 21 4852552 Fax +381 21 4750572 [email protected] www.cimc.rs

University of PardubiceStudentská 95 53210 Pardubice Czech Republic Phone +420 466 038 031 Fax +420 466 038 031 [email protected] www.upce.cz

University of West BohemiaUniverzitní 8 30614 Plzen Czech Republic Phone +420 377 634 533 Fax +420 377 634 502 [email protected] www.zcu.cz/en/

University of the West of EnglandColdharbour Lane Bristol, BS16 1QY United Kingdom Phone +44 117 328 2147 [email protected] www.uwe.ac.uk

VVARTA Microbattery GmbHDaimlerstr. 1 73479 Ellwangen Germany Phone +49 7961 921 432 [email protected] www.varta-microbattery.com

VAST FILMS Ltd.101 Aid Drive Darlington, PA 16115 USA Phone +1 724 827 8827 Fax +1 724 827 2020 [email protected] www.vastfilm.com

VDI/VDE Innovation + Technik GmbHSteinplatz 1 10623 Berlin Germany Phone +49 30 310 078 0 Fax +49 30 310 078 223 [email protected] www.vdivde-it.de

VDL FLOWBldg. AK, Achtseweg Noord 5 5651 GG Eindhoven The Netherlands Phone +31 402 638 777 [email protected] www.vdlflow.com

Vestech Taiwan Corp.3FL-1., 28, Sec. 3, Nanking E. Rd., 10489 Taipei, R.O.C. Taiwan Phone +886 2508 4765 ext. 11 Fax +886 2508 4763 [email protected] www.vestech-taiwan.com.tw

VITA-PRINT LTD13, Beketova str 603057 Nizhniy Novgorod Russian Federation Phone +7 831 412 32 17 Fax +7 831 278 60 03 [email protected] www.vita-print.com

VIVA DEVELOPMENTS S.L.Avenida Juan Carlos I, 12, floor 4 30800 Lorca (Murcia) Spain Phone +34 868 10 96 96 Fax +34 901 70 72 96 [email protected] www.vivainnova.es

VTT Technical Research Centre of FinlandKaitoväylä 1 90571 Oulu Finland Phone +358 40 820 5076 Fax +358 20 722 2320 [email protected] www.vttprintedintelligence.fi

WWCPC, Swansea UniversitySingleton Park Wales, SA2 8PP United Kingdom Phone +44 1792 29501 [email protected] www.wcpcswansea.com

Werner Blase GmbH & Co. KGBorsigstr. 8 32312 Lübbecke Germany Phone +49 5741 3299 0 Fax +49 5741 3299 19 [email protected] www.blase-gruppe.de

Windmöller & Hölscher KGMünsterstr. 50 49525 Lengerich Germany Phone +49 5481 14 0 Fax +49 5481 14 2649 [email protected] www.wuh-group.com

XXaar plc316 Science Park Cambridge, CB4 0XR United Kingdom Phone +46 8 580 88760 Fax +46 8 580 88777 [email protected] www.xaar.com

Xenon Corporation37 Upton Drive Wilmington, MA 01887 USA Phone +1 978 661 9033 Fax +1 978 661 9055 [email protected] www.xenoncorp.com

YYD Ynvisible, S.A.Rua Mouzinho de Albuquerque, 7 2070-104 Cartaxo Portugal Phone +351 24 310 3174 Fax +351 24 310 7367 [email protected] www.ynvisible.com

ZZeon Corporation1-6-2 Marunouchi, Chiyoda-ku 100-8246 Tokyo Japan Phone +81 3 3216 0590 Fax +81 3 3216 1827 [email protected] www.zeon.co.jp

Editor

Dr. Klaus Hecker

OE-A (Organic and Printed Electronics Association)

VDMA – The German Engineering Federation

Lyoner Str. 18

60528 Frankfurt am Main

Germany

Phone +49 69 6603-1336

Fax +49 69 6603-2336


Internet www.oe-a.org

Authors

Dr. Klaus Hecker and Dr. Sven Breitung, OE-A,

unless stated otherwise.

The chapter “OE-A Roadmap for Organic and

Printed Electronics” has been compiled with

the continued support of Prof. Dr. Donald Lupo,

Tampere University of Technology, Tampere,

Finland and Dr. Wolfgang Clemens, PolyIC GmbH

& Co. KG, Fürth, Germany.

Publisher

VDMA Verlag GmbH

Lyoner Str. 18


Germany

Phone +49 69 6603-1232

Fax +49 69 6603-2232


Internet www.vdma-verlag.com

Copyright 2013

VDMA Verlag GmbH,

Frankfurt am Main, Germany

Production

VDMA Verlag, www.vdma-verlag.com

Printing

h. reuffurth gmbh, Mülheim am Main

Cover picture

gettyimages®

Lester Lefkowitz

Pictures in figure 1 in Roadmap article

on page 11:

BASF SE

G24i Power, Ltd

Heliatek GmbH

Holst Centre

Karl Knauer KG

OSRAM GmbH

Plastic Logic GmbH

PolyIC GmbH & Co. KG

Samsung Group

Thin Film Electronics ASA

Acknowledgement

This compilation would not have been possible

without the large knowledge base and picture

pool members gave us access to nor the dedicated

help of numerous professionals from industry

and research. We want to express our sincere

thanks to all those who supported us in writing

and reviewing this brochure.

Attention!

Please remove and recycle the battery in the

interactive cover page appropriately before

recycling this brochure.

ImprintImprint

vf 9

1 60

13

OE-A (Organic and Printed Electronics Association)

A working group within VDMA

Lyoner Str. 18


Germany

Phone +49 69 6603-1336

Fax +49 69 6603-2336


Internet www.oe-a.org

www.oe-a.org

organic and printed electronics

Documents