intel process technology gaps june 2003 intel confidential paula goldschmidt ie- sbd mgr
TRANSCRIPT
Intel Intel Process Technology Process Technology
GapsGapsJune 2003June 2003
Intel Confidential
Paula GoldschmidtPaula GoldschmidtIE- SBD Mgr.IE- SBD Mgr.
Process Manufacturing -Technology Process Manufacturing -Technology Development Key IssuesDevelopment Key Issues
•Technology scaling difficulty increasing• New materials/architectures required vs. optional • More complex core technologies (ie trigate
transistors)• Maintain 2 year process development cycle • Increasing levels of process and device integration
•External constraints and competition increasing
• Declining ASP’s even though capital costs are increasing
• Growing competition • Keep One Generation Ahead Leadership
LITHOGRAPHYLITHOGRAPHY
IS THE MAJOR CHALLENGEIS THE MAJOR CHALLENGE
Litho Taxonomy
Lenses manufacturer
Lenses manufacturer
MaskRET,
Inspection,Software
Light Sources
Scanners
Optics/LensElements
Optical Materials
ChemicalsResists
Tracks
EUV capabilityEUV capability
Materials for lenses Manufacturing
Materials for lenses Manufacturing
Track Manuf.
Track Manuf.
Mask manuf.Mask RepairInspection capab.Mask writing SW
Mask manuf.Mask RepairInspection capab.Mask writing SW
Source – VLSI Research Feb 2003, First Call, Company websites
New resistsNew resists
EUV light sources manufacturers
EUV light sources manufacturers
IntelIntelFocused on Silicon Focused on Silicon
TechnologyTechnology
Merging Merging
Computing and CommunicationsComputing and Communications
Realizing The VisionRealizing The Vision
WirelessWireless
ExcellenceExcellencein in
Silicon ResearchSilicon ResearchLogicLogic
OpticalOptical
BiologicalBiological SensorsSensors
FluidicsFluidics
MechanicalMechanical
MemoryMemory
Intel I/E-SBD Collaboration Objectives:: • Enable One Generation Ahead (OGA) through
Collaboration:• Collaborate with Academic Research For Early engagement
in Process/Tech development.• Time and IP advantage.• Improved supplier execution.• Limited financial downside risk.• Price and royalty benefits of supply.
• Collaborate with Start-up/Spin-off companies:• Demonstrate enabling technology to fill Next technologies
roadmap gaps• Disruptive technologies to create roadmap options
Intel Capital TeamIntel Investment body to enable technologies availability
Silicon Technology Gaps
– Extend Moore’s Law. Silicon base, varied toppings with new materials and devicesExtend Moore’s Law. Silicon base, varied toppings with new materials and devices
– Develop more productive technologyDevelop more productive technology
– Low power/high speed devicesLow power/high speed devices
– Continue to introduce a new technology generation every two yearsContinue to introduce a new technology generation every two years
I/E-SBD areas of interestI/E-SBD areas of interest
Alternatives to Silicon
Nanotechnology
Process & FabTechnology
Assembly/TestSupply, Capacity& Components
Start Materials
TMG Process technology collaboration taxonomy
MEMS+
Potential Areas of InterestPotential Areas of Interest
In Si Technologies : 3-5 yrs to MarketIn Si Technologies : 3-5 yrs to Market Transistor PerformanceTransistor Performance
– High KHigh K– Low KLow K– InterconnectsInterconnects– StructuresStructures
Litho EUVLitho EUV– Masks: manufacturing, cleaning, inspectionMasks: manufacturing, cleaning, inspection
MemoriesMemories– New MaterialsNew Materials– New StructuresNew Structures
NanotechnologiesNanotechnologies– Application Technologies/Integration into productsApplication Technologies/Integration into products
MEMSMEMSPotential Areas of InterestPotential Areas of Interest
Communication DevicesCommunication Devices– Performance Performance – ReliabilityReliability
MEMS packaging MEMS packaging – Hermetic packagingHermetic packaging
How to contact usHow to contact us Send a Abstract of relevant projects to:Send a Abstract of relevant projects to:
– for Assembly/Test & MEMS for Assembly/Test & MEMS [email protected]@Intel.com
– for Litho/Yield/Defects & Clean roomfor Litho/Yield/Defects & Clean room [email protected]@Intel.com
– for Fab & Nanotechnologiesfor Fab & Nanotechnologies [email protected]@Intel.com
–For InvestmentsFor Investments [email protected]@Intel.com
Thanks