f59l1g81ma 2y operation temperature condition -40~85°c...title microsoft word -...

ESMT F59L1G81MA (2Y) Operation Temperature Condition -40°C~85°C

Elite Semiconductor Memory Technology Inc. Publication Date: Jul. 2014 Revision: 1.1 1/44

Flash 1 Gbit (128M x 8) 3.3V NAND Flash Memory

FEATURES

Voltage Supply: 3.3V (2.7V~3.6V) Organization

- Memory Cell Array: (128M + 4M) x 8bit - Data Register: (2K + 64) x 8bit

Automatic Program and Erase - Page Program: (2K + 64) Byte - Block Erase: (128K + 4K) Byte

Page Read Operation - Page Size: (2K + 64) Byte - Random Read: 25us (Max.) - Serial Access: 25ns (Min.) (3.3V)

Memory Cell: 1bit/Memory Cell Fast Write Cycle Time

- Program time: 350us - typical - Block Erase time: 3.5ms - typical

Command/Address/Data Multiplexed I/O Port Hardware Data Protection

- Program/Erase Lockout During Power Transitions

Reliable CMOS Floating Gate Technology - ECC Requirement: - 4bit/512Byte, - Endurance: 100K Program/Erase cycles - Data Retention: 10 years

Command Register Operation Automatic Page 0 Read at Power-Up Option

- Boot from NAND support - Automatic Memory Download

NOP: 4 cycles Cache Program Operation for High Performance Program Cache Read Operation Copy-Back Operation EDO mode OTP Operation Bad-Block-Protect

ORDERING INFORMATION

Product ID Speed Package Comments

F59L1G81MA -25TIG2Y 25 ns 48 pin TSOPI Pb-free

F59L1G81MA -25BIG2Y 25 ns 63 ball BGA Pb-free

F59L1G81MA -25BCIG2Y 25 ns 67 ball BGA Pb-free

GENERAL DESCRIPTION The device is a 128Mx8bit with spare 4Mx8bit capacity. The device is offered in 3.3V Vcc Power Supply. Its NAND cell provides the most cost-effective solution for the solid state mass storage market. The memory is divided into blocks that can be erased independently so it is possible to preserve valid data while old data is erased. The device contains 1024 blocks, composed by 64 pages consisting in two NAND structures of 32 series connected Flash cells. A program operation allows to write the 2,112-Byte page in typical 350us and an erase operation can be performed in typical 3.5ms on a 128K-Byte for X8 device block.

Data in the page mode can be read out at 25ns cycle time per

Byte. The I/O pins serve as the ports for address and command inputs as well as data input/output. The copy back function allows the optimization of defective blocks management: when a page program operation fails the data can be directly programmed in another page inside the same array section without the time consuming serial data insertion phase. The cache program feature allows the data insertion in the cache register while the data register is copied into the Flash array. This pipelined program operation improves the program throughput when long files are written inside the memory. A cache read feature is also implemented. This feature allows to dramatically improving the read throughput when consecutive pages have to be streamed out. This device includes extra feature: Automatic Read at Power Up.



PIN CONFIGURATION (TOP VIEW)

(TSOPI 48L, 12mm X 20mm Body, 0.5mm Pin Pitch)

123456789101112131415161718192021222324

NCNCNCNCNCNC

R/BRECENCNC

VCCVSSNCNC

CLEALEWEWPNCNCNCNCNC

484746454443424140393837363534333231302928272625

NCNCNCNCI/O7I/O6I/O5I/O4NCNCNCVCCVSSNCNCNCI/O3I/O2I/O1I/O0NCNCNCNC

BALL CONFIGURATION (TOP VIEW) (BGA 63 BALL , 9mm X 11mm Body , 0.8 Ball Pitch)

A

B

C

D

E

F

G

H

J

K

L

M

1 2 3 4 5 6 7 8 9 10

WEWP CE

RE

ALE R / BVSS

VSSVSS

VCC

VCC

I/O0

I/O1

I/O2 I/O3 I/O4 I/O6

I/O5 I/O7

NC NC

NC NC

NC NC

NC

NC NC

NC NC

NC NC

NC NC

NC NC

NC NC

NC NC

NC NC

NC NC

NC NC

NC NC

NC NC

NC NC

NC NC

NC NC

NCNC

NC

NC NC

NC

CLE



BALL CONFIGURATION (TOP VIEW)

(BGA 67 Ball, 6.5mmx8mmx1.0mm Body, 0.8mm Ball Pitch)

A

B

C

D

E

F

G

H

J

K

1 2 3 4 5 6 7 8

WEWP CE

RE

ALE R / BVSS

VSSVSS

VCC

VCC

I/O0

I/O1

I/O2 I/O3 I/O4 I/O6

I/O5 I/O7

NC NC

NC

NC

NC

NC

NC

NC

NC

NC

NC

NC

NC

NC

NC

NC NC

NC NC

NC NC

NC NC

NC NC

NC NC

NC NC

NC NC

NC NC

NC NC

NC NC

NCNC

NC

NC NC

NC

CLE

NC

NC

NC NC



Pin Description

Symbol Pin Name Functions

I/O0~I/O7 Data Inputs / Outputs The I/O pins are used to input command, address and data, and to output data during read operations. The I/O pins float to high-z when the chip is deselected or when the outputs are disabled.

CLE Command Latch Enable

The CLE input controls the activating path for commands sent to the internal command registers. Commands are latched into the command register through the I/O ports on the rising edge of the WE signal with CLE high.

ALE Address Latch Enable The ALE input controls the activating path for addresses sent to the internal address registers. Addresses are latched into the address register through the I/O ports on the rising edge of WE with ALE high.

CE Chip Enable

The CE input is the device selection control. When the device is in the Busy

state, CE high is ignored, and the device does not return to standby mode in

program or erase operation. Regarding CE control during read operation, refer to ’Page read’ section of Device operation.

RE Read Enable The RE input is the serial data-out control, and when it is active low, it drives the data onto the I/O bus. Data is valid tREA after the falling edge of RE which also increments the internal column address counter by one.

WE Write Enable The WE input controls writes to the I/O ports. Commands, address and data are latched on the rising edge of the WE pulse.

WP Write Protect The WP pin provides inadvertent write/erase protection during power transitions. The internal high voltage generator is reset when the WP pin is active low.

R / B Ready / Busy Output

The R/ B output indicates the status of the device operation. When low, it indicates that a program, erase or random read operation is in progress and returns to high state upon completion. It is an open drain output and does not float to high-z condition when the chip is deselected or when outputs are disabled.

VCC Power VCC is the power supply for device. VSS Ground NC No Connection Lead is not internally connected.

Note: Connect all VCC and VSS pins of each device to common power supply outputs. Do not leave VCC or VSS disconnected.



BLOCK DIAGRAM

ARRAY ORGANIZATION

Array Address

I/O0 I/O1 I/O2 I/O3 I/O4 I/O5 I/O6 I/O7 Address 1st cycle A0 A1 A2 A3 A4 A5 A6 A7 Column Address 2nd cycle A8 A9 A10 A11 L* L* L* L* Column Address 3rd cycle A12 A13 A14 A15 A16 A17 A18 A19 Row Address 4th cycle A20 A21 A22 A23 A24 A25 A26 A27 Row Address

Note: 1. Column Address: Starting Address of the Register. 2. *L must be set to “Low”. 3. The device ignores any additional input of address cycles than required.



Product Introduction

The device is a 1Gbit memory organized as 128K rows (pages) by 2,112x8 columns. Spare 64x8 columns are located from column address of 2,048~2,111. A 2,112-byte data register is connected to memory cell arrays accommodating data transfer between the I/O buffers and memory during page read and page program operations. The program and read operations are executed on a page basis, while the erase operation is executed on a block basis. The memory array consists of 1,024 separately erasable 128K-byte blocks. It indicates that the bit-by-bit erase operation is prohibited on the device.

The device has addresses multiplexed into 8 I/Os. This scheme dramatically reduces pin counts and allows system upgrades to future densities by maintaining consistency in system board design. Command, address and data are all written through I/O's by bringing WE to low while CE is low. Those are latched on the rising edge of WE . Command Latch Enable (CLE) and Address Latch Enable (ALE) are used to multiplex command and address respectively, via the I/O pins. Some commands require one bus cycle. For example, Reset Command, Status Read Command, etc require just one cycle bus. Some other commands, like page read and block erase and page program, require two cycles: one cycle for setup and the other cycle for execution.

In addition to the enhanced architecture and interface, the device incorporates copy-back program feature from one page to another page without need for transporting the data to and from the external buffer memory.

Command Set

Function 1st Cycle 2nd Cycle Acceptable Command during Busy

Read 00h 30h Read for Copy Back 00h 35h Read ID 90h - Reset FFh - O Page Program 80h 10h Copy-Back Program 85h 10h Block Erase 60h D0h Random Data Input(1) 85h - Random Data Output(1) 05h E0h Read Status 70h - O Cache Program 80h 15h Cache Read 31h - Read Start For Last Page Cache Read

3Fh -

Note: Random Data Input / Output can be executed in a page.



ABSOLUTE MAXIMUM RATINGS

Parameter Symbol Rating Unit VCC -0.6 to +4.6 VIN -0.6 to +4.6 Voltage on any pin relative to VSS VI/O -0.6 to VCC + 0.3 (< 4.6)

V

Temperature Under Bias TBIAS -40 to +125 ℃ Storage Temperature TSTG -65 to +150 ℃ Short Circuit Current IOS 5 mA

Note: Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded. Functional operation should be restricted to the conditions as detailed in the operational sections of this data sheet. Exposure to absolute maximum rating conditions for extended periods may affect reliability. RECOMMENDED OPERATING CONDITIONS (Voltage reference to GND, TA = -40 to 85 )℃

Parameter Symbol Min. Typ. Max. Unit Supply Voltage VCC 2.7 3.3 3.6 V Supply Voltage VSS 0 0 0 V

DC AND OPERATION CHARACTERISTICS (Recommended operating conditions otherwise noted)

Parameter Symbol Test Conditions Min. Typ. Max. UnitPage Read with Serial Access ICC1 tRC=25ns, CE =VIL, IOUT=0mA - 15 30

Program ICC2 - - 15 30 Operating Current

Erase ICC3 - - 15 30

mA

Stand-by Current (TTL) ISB1 CE =VIH, WP =0V/VCC - - 1 mA

Stand-by Current (CMOS) ISB2 CE = VCC -0.2, WP =0V/ VCC - 10 50 uA

Input Leakage Current ILI VIN=0 to VCC (max) - - ±10 uAOutput Leakage Current ILO VOUT=0 to VCC (max) - - ±10 uAInput High Voltage VIH

(1) - 0.8 x VCC - VCC +0.3 V Input Low Voltage, All inputs VIL

(1) - -0.3 - 0.2 x VCC V Output High Voltage Level VOH IOH=-400uA 2.4 - - V Output Low Voltage Level VOL IOL=2.1mA - - 0.4 V

Output Low Current (R/ B ) IOL (R / B ) VOL=0.4V 8 10 - mA

Note: 1. VIL can undershoot to -0.4V and VIH can overshoot to VCC+0.4V for durations of 20ns or less. 2. Typical value are measured at VCC =3.3V, TA=25 . And not 100% tested.℃ VALID BLOCK

Symbol Min. Typ. Max. Unit NVB 1004 - 1024 Block

Note: 1. The device may include initial invalid blocks when first shipped. Additional invalid blocks may develop while being used. The

number of valid blocks is presented with both cases of invalid blocks considered. Invalid blocks are defined as blocks that contain one or more bad bits which cause status failure during program and erase operation. Do not erase or program factory-marked bad blocks. Refer to the attached technical notes for appropriate management of initial invalid blocks.

2. The 1st block, which is placed on 00h block address, is guaranteed to be a valid block at the time of shipment and is guaranteed to be a valid block up to 1K program/erase cycles with 4bit/512Byte ECC.



AC TEST CONDITION (TA= -40 to 85 , V℃ CC=2.7V~3.6V)

Parameter Condition Input Pulse Levels 0V to VCC Input Rise and Fall Times 5 ns Input and Output Timing Levels VCC /2 Output Load* 1 TTL Gate and CL=50pF

Note: Refer to Ready/ Busy , R/ B output’s Busy to Ready time is decided by the pull-up resistor (Rp) tied to the R/ B pin. CAPACITANCE (TA=25 , V℃ CC=3.3V, f=1.0MHz)

Item Symbol Test Condition Min. Max. UnitInput / Output Capacitance CI/O VIL = 0V - 8 pF Input Capacitance CIN VIN = 0V - 8 pF

Note: Capacitance is periodically sampled and not 100% tested. MODE SELECTION

CLE ALE CE WE RE WP Mode

H L L H X Command Input

L H L H X Read Mode

Address Input (4 clock)

H L L H H Command Input

L H L H H Write Mode

Address Input (4 clock)

L L L H H Data Input

L L L H X Data Output X X X X H X During Read (Busy) X X X X X H During Program (Busy) X X X X X H During Erase (Busy) X X(1) X X X L Write Protect X X H X X 0V/VCC

(2) Stand-by

Note: 1. X can be VIL or VIH. 2. WP should be biased to CMOS high or CMOS low for stand-by. Program / Erase Characteristics (TA= -40 to 85℃, VCC=2.7V~3.6V)

Parameter Symbol Min. Typ. Max. Unit Average Program Time tPROG - 350 750 us Dummy Busy Time for Cache Program tCBSY - 3 750 us Number of Partial Program Cycles in the Same Page NOP - - 4 Cycle

Block Erase Time tBERS - 3.5 10 ms

Note: 1. Typical program time is defined as the time within which more than 50% of the whole pages are programmed at 3.3V VCC and 25 ℃

temperature. 2. tPROG is the average program time of all pages. Users should be noted that the program time variation from page to

page is possible. 3. Max. time of tCBSY depends on timing between internal program completion and data in.



AC Timing Characteristics for Command / Address / Data Input

Parameter Symbol Min. Max. Unit CLE Setup Time tCLS

(1) 12 - ns CLE Hold Time tCLH 5 - ns CE Setup Time tCS

(1) 20 - ns CE Hold Time tCH 5 - ns WE Pulse Width tWP 12 - ns ALE Setup Time tALS

(1) 12 - ns ALE Hold Time tALH 5 - ns Data Setup Time tDS

(1) 12 - ns Data Hold Time tDH 5 - ns Write Cycle Time tWC 25 - ns WE High Hold Time tWH 10 - ns Address to Data Loading Time tADL

(2) 100 - ns Note: 1. The transition of the corresponding control pins must occur only once while WE is held low. 2. tADL is the time from the WE rising edge of final address cycle to the WE rising edge of first data cycle.



AC Characteristics for Operation

Parameter Symbol Min. Max. Unit Data Transfer from Cell to Register tR - 25 us

ALE to RE Delay tAR 10 - ns CLE to RE Delay tCLR 10 - ns Ready to RE Low tRR 20 - ns RE Pulse Width tRP 12 - ns WE High to Busy tWB - 100 ns WP Low to WE Low (disable mode)

WP High to WE Low (enable mode) tWW 100 ns

Read Cycle Time tRC 25 - ns RE Access Time tREA - 20 ns CE Access Time tCEA - 25 ns RE High to Output Hi-Z tRHZ - 100 ns CE High to Output Hi-Z tCHZ - 30 ns CE High to ALE or CLE Don’t Care tCSD 0 - ns RE High to Output Hold tRHOH 15 - ns RE Low to Output Hold tRLOH 5 - ns CE High to Output Hold tCOH 15 - ns RE High Hold Time tREH 10 - ns Output Hi-Z to RE Low tIR 0 - ns RE High to WE Low tRHW 100 - ns WE High to RE Low tWHR 60 - ns

Read - 5 us Program - 10 us Erase - 500 us

Device Resetting Time during ...

Ready

tRST

- 5(1) us Cache Busy in Read Cache (following 31h and 3Fh) tDCBSYR - 30 us

Note: 1. If reset command (FFh) is written at Ready state, the device goes into Busy for maximum 5us.



NAND Flash Technical Notes Mask Out Initial Invalid Block(s)

Initial invalid blocks are defined as blocks that contain one or more initial invalid bits whose reliability is not guaranteed by ESMT. The information regarding the initial invalid block(s) is called the initial invalid block information. Devices with initial invalid block(s) have the same quality level as devices with all valid blocks and have the same AC and DC characteristics. An initial invalid block(s) does not affect the performance of valid block(s) because it is isolated from the bit line and the common source line by a select transistor. The system design must be able to mask out the initial invalid block(s) via address mapping.

The 1st block, which is placed on 00h block address, is guaranteed to be a valid block up to 1K program/erase cycles with 4bit/512Byte ECC. Identifying Initial Invalid Block(s) and Block Replacement Management

All device locations are erased (FFh) except locations where the initial invalid block(s) information is written prior to shipping. The initial invalid block(s) status is defined by the 1st byte in the spare area. ESMT makes sure that either the 1st or 2nd page of every initial invalid block has non-FFh data at the 1st byte column address in the spare area.

Do not erase or program factory-marked bad blocks. The host controller must be able to recognize the initial invalid block information and to create a corresponding table to manage block replacement upon erase or program error when additional invalid blocks develop with Flash memory usage.



Algorithm for Bad Block Scanning

Check “FFh” at the 1st Byte column address in the spare area of the 1st and 2nd page in the block.

For (i=0; i<Num_of_LUs; i++) {

For (j=0; j<Blocks_Per_LU; j++) {

Defect_Block_Found=False; Read_Page(lu=i, block=j, page=0); If (Data[coloumn=First_Byte_of_Spare_Area]!=FFh) Defect_Block_Found=True;

Read_Page(lu=i, block=j, page=1); If (Data[coloumn=First_Byte_of_Spare_Area]!=FFh) Defect_Block_Found=True;

If (Defect_Block_Found) Mark_Block_as_Defective(lu=i, block=j);

}

}



Error in Write or Read Operation

Within its lifetime, additional invalid blocks may develop with NAND Flash memory. Refer to the qualification report for the actual data. The following possible failure modes should be considered to implement a highly reliable system. In the case of status read failure after erase or program, block replacement should be done. Because program status fail during a page program does not affect the data of the other pages in the same block, block replacement can be executed with a page-sized buffer by finding an erased empty block and reprogramming the current target data and copying the rest of the replaced block. In case of Read, ECC must be employed. To improve the efficiency of memory space, it is recommended that the read or verification failure due to single bit error be reclaimed by ECC without any block replacement. The additional block failure rate does not include those reclaimed blocks.

Failure Mode Detection and Countermeasure sequence Erase Failure Read Status after Erase → Block Replacement

Write Program Failure Read Status after Program → Block Replacement

Read Up to 4 bits Failure Verify ECC → ECC Correction Note: Error Correcting Code → RS Code or BCH Code etc. Example: 4bit correction / 512 Byte Program Flow Chart



Erase Flow Chart



Read Flow Chart



Block Replacement

Addressing for program operation Within a block, the pages must be programmed consecutively from the LSB (Least Significant Bit) page of the block to MSB (Most Significant Bit) pages of the block. Random page address programming is prohibited. In this case, the definition of LSB page is the LSB among the pages to be programmed. Therefore, LSB page doesn’t need to be page 0.

(64)

(32)

(3)(2)(1)

:

:

Page 63

Page 31

Page 2

Page 1

Page 0

Data register

From the LSB page to MSB page

DATA IN: Data (1) Data (64)

(64)

(1)

(3)(32)(2)

:

:

Page 63

Page 31

Page 2

Page 1

Page 0

Data register

Ex.) Random page program (Prohibition)

DATA IN: Data (1) Data (64)



System Interface Using CE don’t-care

For an easier system interface, CE may be inactive during the data-loading or serial access as shown below. The internal 2,112byte data registers are utilized as separate buffers for this operation and the system design gets more flexible. In addition, for voice or audio applications that use slow cycle time on the order of μ-seconds, de-activating CE during the data-loading and serial access would provide significant savings in power consumption. Program/Read Operation with “ CE not-care”



Address Information

I/O DATA ADDRESS I/Ox Data In / Out Col. Add1 Col. Add2 Row Add1 Row Add2

I/O0 ~ I/O7 2,112 Byte A0 ~ A7 A8 ~ A11 A12 ~ A19 A20 ~ A27 Command Latch Cycle

Address Latch Cycle



Input Data Latch Cycle

Serial access Cycle after Read (CLE = L, ALE = L, WE = H)

Note: 1. Dout transition is measured at ±200mV from steady state voltage at I/O with load. 2. tRHOH starts to be valid when frequency is lower than 33MHz.



Serial access Cycle after Read (EDO Type CLE = L, ALE = L, WE = H)

Note: 1. Transition is measured at +/-200mV from steady state voltage with load.

This parameter is sample and not 100% tested. (tCHZ, tRHZ) 2. tRLOH is valid when frequency is higher than 33MHZ.

tRHOH starts to be valid when frequency is lower than 33MHZ. Status Read Cycle



Read Operation (Read One Page)

Read Operation (Intercepted by CE )



Random Data Output In a Page



Page Program Operation

Page Program Operation with Random Data Input

Note: tADL is the time from WE rising edge of final address cycle to the WE rising edge of first data cycle.

1

1



Copy-Back Operation with Random Data Input

Cache Program Operation



Cache Read Operation



Block Erase Operation

Read ID Operation

ID Definition Table ID Access command = 90h

Maker Code Device Code 3rd Cycle 4th Cycle 5th Cycle C8h D1h 80h 95h 40h

Description 1st Byte Maker Code 2nd Byte Device Code 3rd Byte Internal Chip Number, Cell Type, etc 4th Byte Page Size, Block Size, etc 5th Byte Plane Number, Plane Size



3rd ID Data

Description I/O7 I/O6 I/O5 I/O4 I/O3 I/O2 I/O1 I/O0 1 0 0 2 0 1 4 1 0

Internal Chip Number

8 1 1 2 Level Cell 0 0 4 Level Cell 0 1 8 Level Cell 1 0 Cell Type

16 Level Cell 1 1 1 0 0 2 0 1 4 1 0

Number of Simultaneously Programmed Pages

8 1 1 Not Support 0 Interleave Program

Between Multiple Chips Support 1 Not Support 0 Cache Program Support 1

4th ID Data

Description I/O7 I/O6 I/O5 I/O4 I/O3 I/O2 I/O1 I/O0 1KB 0 0 2KB 0 1 4KB 1 0

Page Size (w/o redundant area)

8KB 1 1 64KB 0 0 128KB 0 1 256KB 1 0

Block Size (w/o redundant area)

512KB 1 1 8 0 Redundant Area Size

(Byte/512Byte) 16 1 x8 0 Organization x16 1 45ns 0 0 Reserved 0 1 25ns 1 0 Serial Access Time

Reserved 1 1



5th ID Data

Description I/O7 I/O6 I/O5 I/O4 I/O3 I/O2 I/O1 I/O0 4bit/512B 0 0 2bit/512B 0 1 1bit/512B 1 0

ECC Level

Reserved 1 1 1 0 0 2 0 1 4 1 0 Plane Number

8 1 1 64Mb 0 0 0 128Mb 0 0 1 256Mb 0 1 0 512Mb 0 1 1 1Gb 1 0 0 2Gb 1 0 1 4Gb 1 1 0

Plane Size (w/o redundant area)

8Gb 1 1 1 Reserved Reserved 0



DEVICE OPERATION Page Read

Upon initial device power up, the device defaults to Read mode. This operation is also initiated by writing 00h command, four-cycle address, and 30h command. After initial power up, the 00h command can be skipped because it has been latched in the command register. The 2,112Byte of data on a page are transferred to cache registers via data registers within 25us (tR). Host controller can detect the completion of this data transfer by checking the R/ B output. Once data in the selected page have been loaded into cache registers, each Byte can be read out in 25ns cycle time by continuously pulsing RE . The repetitive high-to-low transitions of RE clock signal make the device output data starting from the designated column address to the last column address.

The device can output data at a random column address instead of sequential column address by using the Random Data Output command. Random Data Output command can be executed multiple times in a page.

After power up, device is in read mode so 00h command cycle is not necessary to start a read operation.

A page read sequence is illustrated in Figure below, where column address, page address are placed in between commands 00h and 30h. After tR read time, the R/ B de-asserts to ready state. Read Status command (70h) can be issued right after 30h. Host controller can toggle RE to access data starting with the designated column address and their successive bytes. Read Operation



Random Data Output In a Page



Page Program

The device is programmed based on the unit of a page. Addressing of page program operations within a block should be in sequential order. A complete page program cycle consists of a serial data input cycle in which up to 2,112byte of data can be loaded into data register via cache register, followed by a programming period during which the loaded data are programmed into the designated memory cells.

The serial data input cycle begins with the Serial Data Input command (80h), followed by a four-cycle address input and then serial data loading. The bytes not to be programmed on the page do not need to be loaded. The column address for the next data can be changed to the address follows Random Data Input command (85h). Random Data Input command may be repeated multiple times in a page. The Page Program Confirm command (10h) starts the programming process. Writing 10h alone without entering data will not initiate the programming process. The internal write engine automatically executes the corresponding algorithm and controls timing for programming and verification, thereby freeing the host controller for other tasks. Once the program process starts, the host controller can detect the completion of a program cycle by monitoring the R/ B output or reading the Status bit (I/O6) using the Read Status command. Only Read Status and Reset commands are valid during programming. When the Page Program operation is completed, the host controller can check the Status bit (I/O0) to see if the Page Program operation is successfully done. The command register remains the Read Status mode unless another valid command is written to it.

A page program sequence is illustrated in Figure below, where column address, page address, and data input are placed in between 80h and 10h. After tPROG program time, the R/ B de-asserts to ready state. Read Status command (70h) can be issued right after 10h. Program & Read Status Operation

Random Data Input In a page



Cache Program

Cache Program is an extension of Page Program, which is executed with 2,112 byte data registers, and is available only within a block. Since the device has 1 page of cache memory, serial data input may be executed while data stored in data register are programmed into memory cell.

After writing the first set of data up to 2,112 bytes into the selected cache registers, Cache Program command (15h) instead of actual Page Program (10h) is inputted to make cache registers free and to start internal program operation. To transfer data from cache registers to data registers, the device remains in Busy state for a short period of time (tCBSY) and has its cache registers ready for the next data-input while the internal programming gets started with the data loaded into data registers. Read Status command (70h) may be issued to find out when cache registers become ready by polling the Cache-Busy status bit (I/O6). Pass/fail status of only the previous page is available upon the return to Ready state. When the next set of data is inputted with the Cache Program command, tCBSY is affected by the progress of pending internal programming. The programming of the cache registers is initiated only when the pending program cycle is finished and the data registers are available for the transfer of data from cache registers. The status bit (I/O5) for internal Ready/Busy may be polled to identity the completion of internal programming. If the system monitors the progress of programming only with R/ B , the last page of the target programming sequence must be programmed with actual Page Program command (10h). Cache Program (available only within a block)

Note: 1. Since programming the last page does not employ caching, the program time has to be that of Page Program. However, if the

previous program cycle with the cache data has not finished, the actual program cycle of the last page is initiated only after completion of the previous cycle, which can be expressed as the following formula.

2. tPROG = Program time for the last page + Program time for the (last-1)th page – (Program command cycle time + Last page data loading time)



Copy-Back Program

Copy-Back Program is designed to efficiently copy data stored in memory cells without time-consuming data reloading when there is no bit error detected in the stored data. The benefit is particularly obvious when a portion of a block is updated and the rest of the block needs to be copied to a newly assigned empty block. Copy-Back operation is a sequential execution of Read for Copy-Back and of Copy-Back Program with Destination address. A Read for Copy-Back operation with “35h” command and the Source address moves the whole 2,112byte data into the internal buffer. The host controller can detect bit errors by sequentially reading the data output. Copy-Back Program is initiated by issuing Page-Copy Data-Input command (85h) with Destination address. If data modification is necessary to correct bit errors and to avoid error propagation, data can be reloaded after the Destination address. Data modification can be repeated multiple times as shown in Figure below. Actual programming operation begins when Program Confirm command (10h) is issued. Once the program process starts, the Read Status command (70h) may be entered to read the status register. The host controller can detect the completion of a program cycle by monitoring the R/ B output, or the Status bit (I/O6) of the Status Register. When the Copy-Back Program is complete, the Status Bit (I/O0) may be checked. The command register remains Read Status mode until another valid command is written to it. Page Copy-Back Program Operation

Page Copy-Back Program Operation with Random Data Input



Block Erase

The block-based Erase operation is initiated by an Erase Setup command (60h), followed by a two-cycle row address, in which only Plane address and Block address are valid while Page address is ignored. The Erase Confirm command (D0h) following the row address starts the internal erasing process. The two-step command sequence is designed to prevent memory content from being inadvertently changed by external noise.

At the rising edge of WE after the Erase Confirm command input, the internal control logic handles erase and erase-verify. When the erase operation is completed, the host controller can check Status bit (I/O0) to see if the erase operation is successfully done. Figure below illustrates a block erase sequence, and the address input (the first page address of the selected block) is placed in between commands 60h and D0h. After tBERS erase time, the R/ B de-asserts to ready state. Read Status command (70h) can be issued right after D0h to check the execution status of erase operation. Block Erase Operation

Read Status

A status register on the device is used to check whether program or erase operation is completed and whether the operation is completed successfully. After writing 70h command to the command register, a read cycle outputs the content of the status register to I/O pins on the falling edge of CE or RE , whichever occurs last. These two commands allow the system to poll the progress of each

device in multiple memory connections even when R/ B pins are common-wired. RE or CE does not need to toggle for status change.

The command register remains in Read Status mode unless other commands are issued to it. Therefore, if the status register is read during a random read cycle, a read command (00h) is needed to start read cycles. Status Register Definition for 70h Command

I/O Page Program Block Erase Cache Program Read Cache Read Definition

I/O0 Pass / Fail Pass / Fail Pass / Fail(N) NA NA Pass: ”0” Fail: ”1” I/O1 NA NA Pass / Fail(N-1) NA NA Don’t cared

I/O2 NA (Pass / Fail, OTP) NA NA NA NA Don’t cared

I/O3 NA NA NA NA NA Don’t cared I/O4 NA NA NA NA NA Don’t cared

I/O5 NA NA True Ready / Busy NA True

Ready / Busy Busy: ”0” Ready: ”1”

I/O6 Ready / Busy Ready / Busy Ready / Busy Ready / Busy Ready / Busy Busy: ”0” Ready: ”1”

I/O7 Write Protect Write Protect Write Protect Write Protect Write Protect Protected: ”0” Not Protected: ”1”

Note: 1. I/Os defined NA are recommended to be masked out when Read Status is being executed. 2. N: current page, N-1: previous page.



Read ID The device contains a product identification mode, initiated by writing 90h to the command register, followed by an address input of 00h. Four read cycles sequentially output the manufacturer code (C8h), and the device code and 3rd, 4th and 5th cycle ID respectively. The command register remains in Read ID mode until further commands are issued to it. Read ID Operation

ID Definition Table ID Access command = 90h

Maker Code Device Code 3rd Cycle 4th Cycle 5th Cycle C8h D1h 80h 95h 40h

Reset The device offers a reset feature, executed by writing FFh to the command register. When the device is in busy state during random read, program or erase mode, the reset operation will abort these operations. The contents of memory cells being altered are no longer valid, as the data will be partially programmed or erased. The command register is cleared to wait for the next command, and the Status Register is cleared to value C0h when WP is high. If the device is already in reset state a new reset command will be accepted by the command register. The R/ B pin changes to low for tRST after the Reset command is written. Refer to Figure below.

Device Status

After Power-up After Reset Operation mode 00h Command is latched Waiting for next command



Cache Read

Cache Read is an extension of Page Read, and is available only within a block. The normal Page Read command (00h-30h) is always issued before invoking Cache Read. After issuing the Cache Read command (31h), read data of the designated page (page N) are transferred from data registers to cache registers in a short time period of tDCBSYR, and then data of the next page (page N+1) is transferred to data registers while the data in the cache registers are being read out. Host controller can retrieve continuous data and achieve fast read performance by iterating Cache Read operation. The Read Start for Last Page Cache Read command (3Fh) is used to complete data transfer from memory cells to data registers. Read Operation with Cache Read



READY/BUSY The device has a R/ B output that provides a hardware method of indicating the completion of a page program, erase and random read completion. The R/ B pin is normally high but transition to low after program or erase command is written to the command register or random read is started after address loading. It returns to high when the internal controller has finished the operation. The pin is an open-drain driver thereby allowing two or more R/ B outputs to be Or-tied. Because pull-up resistor value is related to tr (R/ B ) and current drain during busy (ibusy), an appropriate value can be obtained with the following reference chart. Its value can be determined by the following guidance.

RP vs tRHOH vs CL

where IL is the sum of the input currents of all devices tied to the R/ B pin. RP (max) is determined by maximum permissible limit of tr



Data Protection & Power-up sequence

The timing sequence shown in the figure below is necessary for the power-on/off sequence.

The device internal initialization starts after the power supply reaches an appropriate level in the power on sequence. During the initialization the device R/ B signal indicates the Busy state as shown in the figure below. In this time period, the acceptable commands are 70h.

The WP signal is useful for protecting against data corruption at power on/off. AC Waveforms for Power Transition

Write Protect Operation Enable WP during erase and program busy is prohibited. The erase and program operations are enabled and disable as follows. Enable Programming:

Note: WP keeps “High” until programming finish. Disable Programming:



Enable Eraseing:

Note: WP keeps “High” until erasing finish. Disable Erasing:



PACKING DIMENSION 48-LEAD TSOP(I) ( 12x20 mm )

Dimension in mm Dimension in inch Dimension in mm Dimension in inch Symbol Min Norm Max Min Norm Max

SymbolMin Norm Max Min Norm Max

A ------- ------- 1.20 ------- ------- 0.047 D 20.00 BSC 0.787 BSC A 1 0.05 ------- 0.15 0.006 ------- 0.002 D 1 18.40 BSC 0.724 BSC A 2 0.95 1.00 1.05 0.037 0.039 0.041 E 12.00 BSC 0.472 BSC b 0.17 0.22 0.27 0.007 0.009 0.011 e 0.50 BSC 0.020 BSC

b1 0.17 0.20 0.23 0.007 0.008 0.009 L 0.50 0.60 0.70 0.020 0.024 0.028c 0.10 ------- 0.21 0.004 ------- 0.008 θ 0O ------- 8O 0O ------- 8O c1 0.10 ------- 0.16 0.004 ------- 0.006



PACKING DIMENSIONS 63-BALL 1G NAND Flash ( 9x11 mm )

A2

A1

A

Seating plane C ccc

C

Solder ball

b

Pin #1

Pin #1Index

Detail B

Detail A

Detail A

Detail B

e

ee

e

D1

E1

D

E

Dimension in mm Dimension in inch

Symbol Min Norm Max Min Norm Max A 1.00 0.039 A1 0.25 0.35 0.010 0.014 A2 0.60 BSC 0.024 BSC

Φb 0.40 0.50 0.016 0.020 D 10.90 11.00 11.10 0.429 0.433 0.437 E 8.90 9.00 9.10 0.350 0.354 0.358 D1 8.80 BSC 0.346 BSC

E1 7.20 BSC 0.283 BSC

e 0.8 BSC 0.031 BSC

ccc 0.10 0.004

Controlling dimension : Millimeter.



PACKING DIMENSIONS 67-BALL Flash ( 6.5x8 mm )

"A"

Detail "A"

Φb

Pin# 1 index

D

E

eD1

eE

1

Pin# 1 index

"B"

Seating plane

Detail "B"

A2

A1

A

Symbol Dimension in mm Dimension in inch Min Norm Max Min Norm Max

A 1.00 0.039 A1 0.22 0.27 0.32 0.009 0.011 0.013 A2 0.61 0.66 0.71 0.024 0.026 0.028 Φb 0.30 0.35 0.40 0.012 0.014 0.016 D 6.40 6.50 6.60 0.252 0.256 0.260 E 7.90 8.00 8.10 0.311 0.315 0.319 D1 5.60 BSC 0.220 BSC

E1 7.20 BSC 0.283 BSC

e 0.80 BSC 0.031 BSC

Controlling dimension : Millimeter. (Revision date : Jun 29 2014)



Revision History

Revision Date Description

0.1 2014.03.19 Original

1.0 2014.05.27 1. Delete "Preliminary" 2. Modify the description of Identifying Initial Invalid

Block(s) and Block Replacement Management

1.1 2014.07.03

1. Modify Product ID 2. Add 67 ball BGA package 3. Correct the figure of Program/Read Operation with "/CE

not-care"



Important Notice All rights reserved. No part of this document may be reproduced or duplicated in any form or by any means without the prior permission of ESMT. The contents contained in this document are believed to be accurate at the time of publication. ESMT assumes no responsibility for any error in this document, and reserves the right to change the products or specification in this document without notice. The information contained herein is presented only as a guide or examples for the application of our products. No responsibility is assumed by ESMT for any infringement of patents, copyrights, or other intellectual property rights of third parties which may result from its use. No license, either express , implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of ESMT or others. Any semiconductor devices may have inherently a certain rate of failure. To minimize risks associated with customer's application, adequate design and operating safeguards against injury, damage, or loss from such failure, should be provided by the customer when making application designs. ESMT's products are not authorized for use in critical applications such as, but not limited to, life support devices or system, where failure or abnormal operation may directly affect human lives or cause physical injury or property damage. If products described here are to be used for such kinds of application, purchaser must do its own quality assurance testing appropriate to such applications.

f59l1g81ma 2y operation temperature condition -40~85°c...title microsoft word -...

Documents