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1 ELECTRICAL REQUIREMENTS TO MEET EMERGING INTERCONNECT STANDARDS Tom Gregorich Director, IC Package Engineering 2013 Semiconductor Roadmap Symposium September 24, 2013

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1

ELECTRICAL REQUIREMENTS TO MEET EMERGING INTERCONNECT STANDARDS

Tom Gregorich Director, IC Package Engineering

2013 Semiconductor Roadmap Symposium

September 24, 2013

2

WHILE TECHNOLOGY INNOVATION MARCHES ON…

HP Shakes Up Desktop Work

Station: 24-core Xeon chips,

Thunderbolt 2 and Faster RAM Max Smolaks, September 10, 2013

Sony Smart Watch vs. Samsung

Galaxy Gear: The First Big Battle

in the Wearable Tech War Brian Bennett, September 6, 2013

Multicore Smartphone Application

Processor Market Penetration Hits

Two-Thirds in 1H 2013 Sravan Kundojjala, September 10, 2013

3

…THERE ARE DARK CLOUDS ON THE HORIZON

Intel’s Former Chief Architect

Robert Colwell: Moore’s Law Will

Be Dead Within a Decade Joel Hruska, August 30, 2013

4

CONUNDRUM: A CONFUSING AND DIFFICULT PROBLEM

Intel’s Former Chief Architect

Robert Colwell: Moore’s Law Will

Be Dead Within a Decade Joel Hruska, August 30, 2013

HP Shakes Up Desktop Work

Station: 24-core Xeon chips,

Thunderbolt 2 and Faster RAM Max Smolaks, September 10, 2013

Sony Smart Watch vs. Samsung

Galaxy Gear: The First Big Battle

in the Wearable Tech War Brian Bennett, September 6, 2013

Multicore Smartphone Application

Processor Market Penetration Hits

Two-Thirds in 1H 2013 Sravan Kundojjala, September 10, 2013

5

KEY QUESTIONS

What portion of the semiconductor industry’s

technological success has been a result of

Moore’s Law?

Are there alternative technologies which

could be used to supplement the benefits

currently provided by Moore’s Law?

How much of the technology gap resulting

from the slowing of Moore’s Law can be filled

by these alternative technologies?

What technological, organizational and

systemic changes will be needed to enable

use of these alternative technologies?

6

OPINIONS AND SUGGESTIONS

There are probably no singular replacements for Moore’s Law and

probably no silver bullets

Successful 3D TSV products must be preceded by successful 3D

products using other 3D technologies

Winning strategies will rely on relentless study and optimization of

partitioning, architecture and customization to enhance value at

the system-level

As software evolves it needs to contribute to system efficiency

rather than consume it

Study 2nd tier and mixed-signal suppliers to understand how to

survive without depending primarily on Moore’s Law

Remember “Jonas’ Law” (swim fast, eat everything around you or

be eaten!)

7

OPINIONS AND SUGGESTIONS

Thank You!