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ELECTRONICS ARIZONA STATE UNIVERSITY ELECTRICAL ENGINEERING DEPARTMENT Integrated Circuits and Systems Dr. John Brunhaver

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ELECTRONICSARIZONA STATE UNIVERSITYELECTRICAL ENGINEERING DEPARTMENT

Integrated Circuits and Systems

Dr. John Brunhaver

OUTLINE

What are the focus areas in the circuitsspecialization and who are the faculty?

What are the applications for circuits and the research that we do at ASU?

How do you engage as an undergraduate in research at ASU?

Where do “circuits” designers find jobs?

AREAS

Analog Circuit Design Digital & VLSI Circuits MicroElectroMechanical System (MEMS) Emerging Devices and Circuits RF and Microwave IC’s

FACULTY

VSLI & Digital: John Brunhaver, Kevin Cao, Larry Clark, Umit Ogras, Jae-Sun Seo

Analog: Bertan Bakkaloglu, Sayfe Kiaei, Sule Ozev

Emerging Devices and Circuits: David Allee, Hugh Barnaby, Shimeng Yu

MEMS & BioEngineering: Junseok Chae, Jennifer Blain Christen

RF & Microwave ICs: Sayfe Kiaei, Jennifer Kitchen, Georgios Trichopoulos

NEW FACULTY – PAST 2 YEARS

Shimeng Yu John Brunhaver Georgios Trichopoulos

APPLICATIONS

Bio-Technologies

Wireless

Security

Aerospace & Automotive

Si-CMOS front-end

MEMS

Integrated Power Management ICs

COURSESEEE 333 – VHDLEEE 334 – Circuits IEE E335 Circuits II

EEE 425Digital Circuits

EEE 523Analog CMOS

EEE 525VLSI

EEE 433Analog Circuits

EEE 598Switch Cap

Digital CoursesAnalog Courses

EEE 598Σ∆

Converters

EEE 625 Adv. VLSI

CSE/EEE 518

Synthesis

EEE 598 Modeling

EEE 524 RFIC

EEE 527 A/D

EEE 526 VLSI

Architecture

EEE 538 MEMS

EEE 598 Adv. MEMS

EEE 598Bioelectronics

These are your core classes for circuits.

Design Flow:

Thin Film Transistor Characterization- Semiconductor Parameter Analyzer- Automatic and Manual Probing

Flexible Display Center at ASUhttp://flexdisplay.asu.edu

Thin Film Transistor Model Parameter Extraction- Transistor Model Parameters Extracted

from Device Data

Improved Thin Film Transistor Models- Better Modeling of Parasitics- Incorporation of Threshold

Voltage Shift- Advanced Models Enable AccuratePrediction of Circuit Performance Before Fabrication

Circuit Design & Simulation- Professional CAD Suite- Tanner Tools

Circuit Layout & Verification- FDC Developing Design Rules forHigh Manufacturing Yield

Fabrication & Test

0.0 5.0 10.0 15.0 20.0Drain-source voltage [V]

0.0

0.5

1.0

1.5

2.0

2.5

Dra

in c

urre

nt [

uA]

Measured Modeled

Modeled data Measurement data

0.0 5.0 10.0 15.0 20.0Drain-source voltage [V]

0.0

0.5

1.0

1.5

2.0

2.5

Dra

in c

urre

nt [

uA]

Measured Modeled

Modeled data Measurement data

'v(10)''v(4)''v(8)'

0.0m 10.0m 20.0m 30.0mtime [sec]

-10.0

0.0

10.0

20.0

30.0

40.0

Y A

xis

Title

[V

]

Designs in Collaboration withUDC, Honeywell, Kent Displays,and E ink.

RADIATION - RESEARCH

Space Electronics and Radiation Effects Space Electronics Testbed

Reliability and Radiation Effects Modeling Radiation Sensors

Extreme Environment Effects in Devices and ICs Combined Temperature and Radiation for Moon/Mars Low Dose Rate Effects

NASA Carrier

RadHARD PCB

Design

U1

OPAMP_3T_VIRTUAL

D1

1N4371AR110M

V1

5 V R21.0M

R3100k

R4200k

U2

COMPARATOR_VIRTUAL

Q1

2N2222A0

R6

620

9

3

U4A

74LS08J

U5A74LS04D

U6

COMPARATOR_VIRTUAL

R7100k

R8100k

R9100k

R10

1.2R17110k

0

11

VCC5VVCC

R11

1.0k

C1

1.0uF

CRS2

3612

8

1721

S1

10

7

14

51

35

0

0

0

15

2 Q22N2222A

0 6

R31620

16

U9A

74LS04D

18

4

0

0

EMERGING DEVICES AND CIRCUITS:

Research Highlights:

3D Memory Array Artificial Synapse

• Resistive Random Access Memory (RRAM) Technology• 3D integration of RRAM, RRAM array and architecture design,

radiation effects on RRAM, etc • Brain-inspired Neuromorphic Computing with Synaptic Devices• Hardware Security with Physical Unclonable Functions

VLSIRESEARCH

Radiation hardened VLSI circuits Low power/high performance

microprocessor circuits and architectures

Ultra low power and harsh environment VLSI systems

High Security Digital Systems Research Opportunities:

Radiation hardened, high performance, low power, microprocessor design

Security circuits (smart cards, ultra-secure ICs)

Low power cache, MMU design Multicore microprocessor circuits and

programming

Students hired by: AMD, Intel, Qualcomm, Microchip, FreeScale, MRDC, TI

Self-Learning Adaptive Circuits & Systems

Custom ASIC chip achieving real-timedata collection, learning, and recognition

Brain-inspired machine learning algorithms to manage device fluctuations, and to realize efficient on-line feature extraction (training)

Hardware demonstration with >5000X speedup in information processing compared to CPU/GPU

Original Image

Image Patch X

Dictionary D

RRAM/SRAM as synaptic devices

Ij

Vi

Rij

Extracted Feature Z

Real-time Sparse Coding

On-chip voltage conversion / regulationis necessary to support multiple on-chip voltages with fast response

On-chip voltage regulators based on switched-capacitor converters, low dropout regulators

Achieve high-efficiency, high current density and minimal droop/noise

On-chip Voltage Regulation

Corei

Core1

CoreN

Corei+1

voltage regulators

voltage regulators

voltage regulators

voltage regulators

on-chip links

ENERGY EFFICIENT ARCHITECTURE – PRODUCTIVE VLSI DESIGN

Architecture Generation

Simulator Hardware Generator

DesignConstraints

BenchmarkApplications

Custom Compiler

Hardware Optimizer

Quality of Result Physical Design

BIOENGINEERING – RESEARCH

WasteIncubatorCulture Flask

Life Sciences

CellularMolecular

Physiological

Engineering

MEMSControl Systems

Circuits

Sensor and Sensor Systems

Micro system on soft substrate (Parylene, PDMS, Polyimide):

Flexible, stretchable and networked 3D surface manufacture

Biomedical and geology applications

Fluidic parameters measurement: Sensors: thermal anemometer, electrodes Functions: shear stress, temperature,

conductivity, dissolved oxygen….. Networked sensor meshes Geochemistry and astrobiology

applications

Miniature seismometers for harsh environments• Goal: provide light and robust seismometer for space exploration. Testing current devices for harsh environments: high/low temperature, temperature cycles, vacuum and radiation (NASA).• Based on Molecular Electric Transducer with liquid electrolyte, using microfabrication improve size and performance.• Applications: space exploration, gas or oil detection

UNDERGRADUATE RESEARCH ENGAGEMENT

Fulton Undergraduate Research Initiative (FURI)http://more.engineering.asu.edu/furi/program-requirements/

NASA Undergraduate Space Grantshttp://nasa.asu.edu/

Senior Design Projectshttp://ecee.engineering.asu.edu/programs/undergraduate/

WHERE DO WE FIND JOBS? (1/2)

17

Intel Corp. 7 11,000 Semiconductors

Raytheon Co. 14 9600 Missiles

Honeywell International Inc. 15 9500 Aerospace

General Dynamics Corp. 32 4500 Defense, communications

Boeing 34 4300 Aircraft

IBM Corp. 85 1800 Technology services

Freescale Semiconductor Ltd. 87 1720 Semiconductors

Microchip Technology Inc. 87 1720 Semiconductors

Orbital Sciences Corp. 91 1650 Aerospace

Arizona Republic 2015 – top [largest employer] 100 companies in AZ.

COMPANY RANKING EMPLOYEES CATEGORY

WHERE DO WE FIND JOBS? (2/2)

Top 50 companies to work for: [Fortune Magazine 2014]

- Google- Intel- Microsoft- Qualcomm - Burns & McDonnell- National Instruments (no longer NI)

18

WHERE HAVE OUR UNDERGRADUATES GONE?

• Intel • Qualcomm• Broadcom• Microchip• FreeScale• On Semiconductor• MRDC• AMD• Texas Instruments• RFMD/TriQuint now Qorvo• Medtronic• Google• Apple• Government Labs• Startup Companies

WHAT ARE OUR UNDERGRADUATES DOING?

• Applications Engineer – In field technical customer support of electronics

• Verification and Test Engineer – performance testing on electronics, volume production testing, testing of product prototypes

• Electronic Design Engineer – integrated circuit (IC) designers, board-level circuits designers, circuit/board layout

• Marketing – marketing, company representation, customer support• Talent (Employee) Recruiting – college recruiting, recruit employees at

career fairs and through outreach• Other – graduate school, teaching, community service, HR…

QUESTIONS???