8. reinhart richter 100313dl

7/27/2019 8. Reinhart Richter 100313DL

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COST OF MEMS TESTMinimizing Cost of Calibration & Test for MEMS

devices


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Agenda


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Innovative solutions

Wafer Level Test

In-Process Test

Final Test

interface products

> DUT boards

> Vertical Probes (Quad Tech)

> Cantilever Springs (Blue Line)

test handlers

> Strip Test> Pick & Place

> Test in Carrier> Sensor Test

> Gravity Feed


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Who is Multitest

Santa Clara DallasBoston

Japan

Korea

Taiwan

Philippines

Singapore

Thailand

Malaysia

ShenzhenShanghai

Tianjin

Italy

Germany

The Netherlands

IsraelMoroccoPhoenix

St. PaulEl Dorado Hills

UKFrance

Pomona

Multitest experts are close to your sites for

> application support

> service including professional installations

> post-installation support


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Our markets

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Our markets

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Singulated Package Test Strip Test / Test in Carrier

Comprehensive MEMS Test Solution Set

handler platform Gravity Gravity P&P Instrip

tube

x4

tube

x4 / x8

tray

x4 / x8 / x16

strip

x42 / x72 / x144

Accelerometers

20g/ 50g /100g X, Y, Z, 45 Y, Z, X+Y on request

3 axis low g Z+X, Z+Y on request InFlip 3DOF; InFlipM 6DOF

GyroscopesYZ = 5DOF Z sinusoidal; XYZ =

6DOF

Z sinusoidal;

XYZ = 6DOF (9DOF on

request)

InGyro 6 DOF, InGyroM 9DOF

Pressure / Gasup to 20 bar absolute

Gas detection

Barometric abs.& rel(on request)

Gas detection

InPressure (20bar abs.+ gas d.)

InBaro absolute (on request)

MagnetometerZ = 1DOF, MRS XY =

2DOF,

XYZ = 5 (8) DOF

MRS XY = 2DOF,XYZ = 3DOF

MRS XY = 2DOF,XYZ = 3/6DOF (9DOF on

requ.)

InFlipM 6DOF, InGyroM 9DOF

Microphone InPhone

Humidity humidity MEMS InHumid (on request)

Optical Sensorsspecific solutions

available

specific solutions

availableInOptic (on request)

Oscillators temp. calibr. up to +/-0,2K

on request on request

application


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MEMS today in cars


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MEMS today in smart-phones


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MEMS tomorrow


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Addressing complexity of Cost of Calibration and Test

_________________________Lifetime

Yield Utilization Throughput* *

Capital Cost Variable Cost

CoCT =

Overhead

> uptime, MTBA, MTTA, MTTR

> package conversion time

> setup time

> socket cleaning & exchange

> training

> contacting accuracy

and repeatability

> open/short rate

> test yield / re-test rate

> DUT test time

> handler index time

> number of contact sites

> soak speed & capacity

> effective throughput

investment cost for

> handler base + change kit

> tester

> manipulator + docking

> depreciation period

> useful lifetime

> re-use for new

applications

> utilities (eg. power, CDA, LN2)

> labor, operations & engineering

> load boards, contactors

> maintenance & service

> spare parts

> management

> adminstration

> facilities


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Optimizing Cost of Test and Calibration for Sensors



> setup time

> contactors cleaning & exchange

> training


and repeatability

> open/short rate


> DUT test time





investment cost for


> MEMS module

> tester



> useful lifetime

> re-use for new

applications





> spare parts

> management

> adminstration

> facilities

_________________________Lifetime



CoCT =

Overhead


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4 Steps to best CoCT

1

23

4


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Step 1: Standardization

Standard Sensor Test Equipment replaces

cost-intensive custom designed solutions:

>ease of operation

>ease of maintenance

> leverage skills / little additional training

needs

>convertibility to other sensors

applications, exchangeable stimuli

>global support

>convenient spare supply

Example: Multitest MEMS Cart


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Step 2: Modularity

Sensor Test Equipment is combined with

Standard Handling Equipment

Example: Multitest Standard Pick & Place Test Handler with MEMS Cart

>ease of operation /

maintenance - similar to

standard process

> leverage skills / little

additional training needs

>sensor test module can be

fully optimized for dedicated

requirements>new sensor applications

require only changes in the

sensor test modules -> fast

time to market


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Step 3: Parallel Test

Sensor Test Equipment is combined with Standard Strip Test

Equipment

>up to 1200 signal lines>high throughput

>supporting small packages

Example: Multitest Standard Strip Test Handler with MEMS Box


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Step 3: Parallel Test for singulated packages

Sensor Test Equipment is combined with Strip-LikeTest Equipment

and Carrier Loading / Unloading

> leverages advantages of striptest for singulated packages

>high throughput

>supporting small packages

> full device traceability

Example: Multitest InCarrier


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Step 4: Multi-DoF Test @ 1 Insertion

Sensor Test Equipment to fully support multi-axis / combo sensors

Example: Multitest 9 DOF Test Setup

>multiple actuations in ONEinsertion

>modular architecture for

reduced complexity


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Example: 9 DOF Inertial & Magnetometer Test

6 Axis Inertial MEMS Test = 3 Axis Gyroscope + 3 Axis low g Accelerometer

with non magnetic contact environment for passive 3 DOF Magnetometer test

1 Test Insertion for

3D Accelerometer

+

3D Gyroscope

+

3D Magnetometera b

g


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_________________________Lifetime



CoCT =

Overhead

Optimizing Cost of Test and Calibration for Sensors



> setup time

> socket cleaning & exchange

> training


and repeatability

> open/short rate


> DUT test time





investment cost for


> MEMS module

> tester



> useful lifetime

> re-use for new

applications





> spare parts

> management

> adminstration

> facilities


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MEMS Test and Calibration Equipment for best CoTC

Best Cost of Test and Calibration is ensured by

Convertibility to changing packages

Exchangeable stimuli

Modular concept that combines best package handlingperformance with state-of-the art MEMS test solutions

MEMS test modules for high parallel test handlingsolutions (strip test, test in carriers)

Multi-DOF solutions with only ONE insertion


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Thank you!

For more information please visit:

www.multitest.com/sensor

This presentation will be available at

www.multitest.com/SemiconTaiwan
http://www.multitest.com/sensorhttp://www.multitest.com/SemiconTaiwanhttp://www.multitest.com/SemiconTaiwanhttp://www.multitest.com/sensor


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MEMS Test Example Singulated MEMS

Standard

Gravity or Pick & Placetest handlerMT9320 (tube), MT9928 (tube),

NEW: MT9510 (tray)

> singulated

device handling

tube to tube, bowl to

bulk, tray to tray

> NEW: up to 8/16 contact sites

> temperature conditioning

(-55C to +155C

at +/- 3C accuracy)

>fast package conversion

(at MT9928, MT9510)

Standard

MEMS test module> MEMS stimulus

during test

> configurable for multiple

MEMS applications

Accelerometer high g

Accelerometer 3 axis Yaw-Rate (Gyro)

Pressure

..

> fast package conversion


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MEMS Test Example InStrip or InCarrier

Standard

platform InStrip

(strip test handler)

>temperature

conditioning

(-40C to +125C)

>fast package

conversion

Standard

InMEMS test module

>MEMS stimulus during

test for whole strip

>High parallel test

(600 to 1200 signal lines)

>Configurable for multiple

MEMS applications InFlip = Accelerometer 3 axis

InPressure = Pressure test

InGyro = 6 DOF motion

InMagnet + InGyro

InPhone

>fast package conversion

The worlds first and only

sing le insert ion 144x //9DOF sensor test and

cal ibration hand ler !!!


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Singulated IC Test InStrip IC Test

InCarrierTM IC Test

What is InCarrier?

Patented

Combined advantages of Singulated Test and InStrip Test

I C i E l


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InCarrier Examples

SO Device in InCarrierBGA 64 in InCarrier

InCarrier in standardslotted strip

cassette (cassette isshown open; different

shutter types available)


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InCarrier Process

Loader

wafer ring

tray tube

Burn-In using

MT InCarrier sockets

Sort-un-

loader

Selective

Laser Product-Marking

contact Create

map

file

InMEMS =

Strip Handler +

MEMS Test Module

tube

tray

T & R

bowl

8. reinhart richter 100313dl

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