3d mems accelerometers for building applications mikaël colin – memscap s.a. 1st memscon event...

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3D MEMS Accelerometers for Building Applications Mikaël Colin – MEMScAP S.A. 1st MEMSCON Event – Bucharest October 7th, 2010 1 st MEMSCON Event 07/10/10, Bucharest Company

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Page 1: 3D MEMS Accelerometers for Building Applications Mikaël Colin – MEMScAP S.A. 1st MEMSCON Event – Bucharest October 7th, 2010 1 st MEMSCON Event 07/10/10,

3D MEMS Accelerometers for Building Applications

Mikaël Colin – MEMScAP S.A.

1st MEMSCON Event – Bucharest

October 7th, 2010

1st MEMSCON Event07/10/10, Bucharest Company

Page 2: 3D MEMS Accelerometers for Building Applications Mikaël Colin – MEMScAP S.A. 1st MEMSCON Event – Bucharest October 7th, 2010 1 st MEMSCON Event 07/10/10,

Acceleration RF ID tag

MEMScAP, France1st MEMSCON Event - 07 October 10, Bucharest

Accelerometer end-user specifications

Parameter Value Unit

Acceleration 0.01-2 g

Frequency 0.1-10 Hz

Duration 15 s

Size constraint - mm3

Operating temperature -20 to +50 °C

Operating Humidity 0 to 100 %RH

Vibrations (15g) 1000 Hz

Shocks 2000 g

Battery lifetime 2 years

3D MEMS accelerometer

MEMS = Micro ElectroMechanical System

Page 3: 3D MEMS Accelerometers for Building Applications Mikaël Colin – MEMScAP S.A. 1st MEMSCON Event – Bucharest October 7th, 2010 1 st MEMSCON Event 07/10/10,

Accelerometers transduction mechanisms

Vibration Beam Accelerometer (VBA) Resonance frequency is dependent on the applied force Driven oscillator at resonance frequency (closed loop) High end applications

Company1st MEMSCON Event07/10/10, Bucharest

Spring Mass System Acceleration force causes a proof

mass displacement Displacement measurement system Direct or indirect measurement Indirect measurement methods:

Piezoelectric effect Piezoresistive effect Capacitive sensing

Page 4: 3D MEMS Accelerometers for Building Applications Mikaël Colin – MEMScAP S.A. 1st MEMSCON Event – Bucharest October 7th, 2010 1 st MEMSCON Event 07/10/10,

Transduction principles

MEMScAP, France1st MEMSCON Event - 07 October 10, Bucharest

Piezoelectric effect Piezoresistive effect

Capacitive sensing

Page 5: 3D MEMS Accelerometers for Building Applications Mikaël Colin – MEMScAP S.A. 1st MEMSCON Event – Bucharest October 7th, 2010 1 st MEMSCON Event 07/10/10,

MEMS Technologies

MEMScAP, France1st MEMSCON Event - 07 October 10, Bucharest

Bulk micromachining

Surface micromachining

Hybrid integration

Page 6: 3D MEMS Accelerometers for Building Applications Mikaël Colin – MEMScAP S.A. 1st MEMSCON Event – Bucharest October 7th, 2010 1 st MEMSCON Event 07/10/10,

Concept of 3D accelerometer

Mounting of 3 1D accelerometers

MEMScAP, France1st MEMSCON Event - 07 October 10, Bucharest

3-axis sensitive mechanical structure

3 independent structures on the same die

Page 7: 3D MEMS Accelerometers for Building Applications Mikaël Colin – MEMScAP S.A. 1st MEMSCON Event – Bucharest October 7th, 2010 1 st MEMSCON Event 07/10/10,

Selected concept

MEMScAP, France1st MEMSCON Event - 07 October 10, Bucharest

3 independent capacitive micromachined sensors on a single die

~ 4mm

~ 11mmOut of the wafer plane sensitivity In plane sensitivity

Page 8: 3D MEMS Accelerometers for Building Applications Mikaël Colin – MEMScAP S.A. 1st MEMSCON Event – Bucharest October 7th, 2010 1 st MEMSCON Event 07/10/10,

Fabrication

Wafer level packaging concept

MEMScAP, France1st MEMSCON Event - 07 October 10, Bucharest

Page 9: 3D MEMS Accelerometers for Building Applications Mikaël Colin – MEMScAP S.A. 1st MEMSCON Event – Bucharest October 7th, 2010 1 st MEMSCON Event 07/10/10,

ASIC+MEMS Assembly

Hybrid integration in a ceramic carrier

MEMScAP, France1st MEMSCON Event - 07 October 10, Bucharest

MEMSASIC Read-out

Page 10: 3D MEMS Accelerometers for Building Applications Mikaël Colin – MEMScAP S.A. 1st MEMSCON Event – Bucharest October 7th, 2010 1 st MEMSCON Event 07/10/10,

Thank you for your attention

MEMScAP, France1st MEMSCON Event - 07 October 10, Bucharest