1H’09 Public Roadmap111

Intel® Public Roadmap

1H’ 2009

1H’09 Public Roadmap222

Public Roadmap Desktop Platform

1H’ 2009

Intel Confidential—NDA Platform Roadmap 1H’09 Public Roadmap

Extreme

Best

Better

Intel® Core™ i7 Processor Extreme EditionCodename: Tylersburg DT platform

Intel® X58 Express Chipset- 2x16 or 4x8 graphics

Intel® G45 & P45 Express Chipsets

Intel® Core™2 Duo Processor E8xxx & E7xxx seriesCodename: Boulder Creek platform

Intel® G45, G43, & P43 Express Chipsets

Intel® G31/P31 Express Chipsets

Intel® Core™2 Quad Proc. Q9xxx &Q8xxx seriesCodename: Boulder Creek platform

Intel® Pentium® & Celeron® Proc.

Intel® G41 Express Chipset

Q1’09 Q2’09

Desktop Processor: Roadmap

Intel® Core™ i7 ProcessorCodename: Tylersburg DT platform

Intel® X58 Express Chipset- 2x16 or 4x8 graphics

Consumer Platforms 1H’09

Good

Intel Confidential—NDA Platform Roadmap 1H’09 Public Roadmap44

Best

Intel® Core™2 Quad & Duo proc. Q9000,E8000 series2

Intel® Q45 Express Chipset w/ICH10DO, Intel® TPM

Business Security:Microsoft NAP, Access Monitor

Proactive IT Care:Intel® Standard Manageability plus: Fast Call for Help, Remote Schedule Maintenance, Remote Alerts, DASH

Intel® vPro Tech. for 2009

Q1’09 Q2’09

Better

Good Intel® G31 Express Chipset

Intel® G41 Express Chipset

Intel® Pentium® processor1

* Qualification window begins at platform launch and continues for 3 months.** Deployment begins at the end of the Qualification window and continues for 12 months.1 Intel® Pentium® dual-core proc not SIPP eligible. 2. Check the feature set reference table for vPro and SIPP CPU details.3. Intel Std. Manageability and Intel AMT support WS-MAN and DASH

Intel® SIPP Deploy 2008/2009 Platform**

Intel® Core™2 Duo Proc. E8000 seriesIntel® Q43 Express Chipset w/ICH10D, Intel® TPMIntel® Standard ManageabilityIntel® SIPP

- Manageability Upgrade Available

UpgradeableIntel® B43 Express Chipset w/ICH10D

Desktop Platform: Roadmap Business Platforms 1H’09

555

Public Roadmap Intel® Mobile Platform

1H’08-1H’09

666

Consumer Mobile Platforms: Roadmap1H’08-1H’09

Extreme

Performance

Entry

Intel® Core™2 ExtremeX9000

Intel® Centrino® processor technologyFeaturing Intel® Core™2 Duo

T9500, T9300, T8300, T8100

Intel® Celeron® processors570, 560, 550, 540, 530

Mobile Intel® GM965, GL960 Express chipsets with ICH8M

Mobile Intel® GM965, PM965 Express chipsets with ICH8M or ICH8M-Enhanced

Intel® Wireless WiFi Link 4965AGN or AG, or 3945ABG

Intel® Core™2 Extreme

QX9300, X9100

Intel® Centrino® 2 processor technologyFeaturing Intel® Core™2 Quad Q9100, Q9000

Featuring Intel® Core™2 Duo T9800, T9600, T9550,

T9400, P9600, P9500, P8700, P8600, P8400

Intel® Core™2 Duo processors: Low-Voltage and Ultra Low-VoltageL7700, L7500

U7700, U7600

‘Santa Rosa Refresh’ ‘Montevina’

1H’08 2H’08-1H’09

Intel® Core™2 Duo Small Form Factor processors:

Power-Optimized, Low Voltage, and Ultra Low-VoltageSP9400, SP9300

SL9400, SL9300

SU9400, SU9300, SU3300*

‘Santa Rosa/ Santa Rosa Refresh’ ‘Montevina’

Mobile Intel® GM45, PM45 Express chipsets with ICH9M or ICH9M-Enhanced

Intel® Wireless WiFi Link 5000 Series

Intel® Celeron® processors

T1700, T1600, 585, 575, 723

Mobile Intel® GM45, GL40 Express chipsets with ICH9M

‘Santa Rosa’ ‘Montevina’

*Intel*Intel®® Core CoreTMTM 2 Solo processors are eligible for Centrino 2 Solo processors are eligible for Centrino®® branding only branding only

777

Best

Better

‘Santa Rosa Refresh’ ‘Montevina’

Mobile Intel® GM965, PM965 Express Chipsets with ICH8M or ICH8M-Enhanced

Intel® Wireless WiFi Link 4965AGN or AG, or 3945ABG

Extreme

Business Mobile Platforms: Roadmap1H’08-1H’09

Q2’08 2H’08-1H’09

Mobile Intel® GM965 & PM965 Express Chipsets with ICH8M–Enhanced

Intel® Wireless WiFi Link 4965AGN or AG

Intel® 82566MM Gigabit Network Connection

Intel-optimized adv. management & security solutions with Intel® AMT v2.5 & VT

1H’08

Intel® Core™2 ExtremeX9000

Intel® Centrino® with vProTM technologyFeaturing Intel® Core™2 Duo

T9500, T9300, T8300, T8100

Intel® Centrino® 2 with vProTM technologyFeaturing Intel® Core™2 Duo T9800, T9600, T9550, T9400, P9600, P9500, P8700, P8600, P8400

Intel® Core™2 Duo processors: Low-Voltage and Ultra Low-VoltageL7700, L7500

U7700, U7600

Intel® SIPP

Intel® Centrino® processor technologyFeaturing Intel® Core™2 Duo processors

Intel® Centrino®2 processor technologyFeaturing Intel® Core™2 Duo processors

Deploy 2007 Platforms Deploy 2008 platforms

Intel® Core™2 ExtremeQX9300, X9100

Intel® Core™2 Duo Small Form Factor processors: Power-Optimized, Low Voltage, and Ultra Low-VoltageSP9400, SP9300

SL9400, SL9300

SU9400, SU9300

Mobile Intel® GM45 and PM45 Express Chipsets with ICH9M Enhanced

Mobile Intel® GS45 Express Chipsets with ICH9M-SFF-Enhanced

Intel® 82567LM Gigabit Network Connection

Intel® Wireless WiFi Link 5000 Series

Intel® AMT 4.0, Intel® Anti-Theft Technology, Intel® Virtualization Technology (VT-x, VT-d), Intel® Trusted Execution Technology

Mobile Intel® GM45, PM45 Express Chipsets with ICH9M or ICH9M-Enhanced

Intel® Wireless WiFi Link 5000 series

888

Public RoadmapIntel® Server Platform Group (SPG)

2009

99* Other names and brands may be claimed as the property of others.    Copyright © 2008, Intel Corporation.

Legal Disclaimer• INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED ,BY

ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS , INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO FITNESS FOR A PARTICULAR PURPOSE , MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR.

• ALL PRODUCTS, COMPUTER SYSTEMS, DATES, AND FIGURES SPECIFIED ARE PRELIMINARY BASED ON CURRENT EXPECTATIONS , AND ARE SUBJECT TO CHANGE WITHOUT NOTICE.

• THIS INFORMATION IS PROVIDED “AS IS” WITH NO WARRANTIES WHATSOEVER, INCLUDING ANY WARRANTY OF MERCHANTABILITY, NON-INFRINGEMENT, FITNESS FOR ANY PARTICULAR PURPOSE, OR ANY WARRANTY OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE.

• THE HARDWARE VENDOR REMAINS SOLELY RESPONSIBLE FOR THE DESIGN, SALE AND FUNCTIONALITY OF IT’S PRODUCT, INCLUDING ANY LIABILITY ARISING FROM PRODUCT INFRINGEMENT OR PRODUCT WARRANTY.

• INTEL, INTEL XEON, INTEL CORE 2 DUO, INTEL CORE 2 QUAD, INTEL CORE 2 EXTREME, THE INTEL LOGO, INTEL CORE MICROARCHITECTURE ARE TRADEMARKS OR REGISTERED TRADEMARKS OF INTEL CORPORATION OR ITS SUBSIDIARIES IN THE UNITED STATES AND OTHER COUNTRIES.

• Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. See www.intel.com/products/processor_number for details.

• Intel® Virtualization Technology requires a computer system with a processor, chipset, BIOS, virtual machine monitor (VMM) and applications enabled for virtualization technology. Functionality, performance or other virtualization technology benefits will vary depending on hardware and software configurations. Virtualization technology-enabled BIOS and VMM applications are currently in development.

• “Intel® Turbo Boost Technology requires a PC with a processor with Intel Turbo Boost Technology capability.   Intel® Turbo Boost Technology performance varies depending on hardware, software and overall system configuration.  Check with your PC manufacturer on whether your system delivers Intel Turbo Boost Technology.  For more information, see http://www.intel.com/technology/turboboost.”  

• Intel® Hyper-Threading Technology requires a computer system with a processor supporting HT Technology and an HT Technology-enabled chipset, BIOS and operating system. Performance will vary depending on the specific hardware and software you use. For more information including details on which processors support HT Technology, see here 

• Lead-free: 45nm product is manufactured on a lead-free process.  Lead is below 1000 PPM per EU RoHS directive (2002/95/EC, Annex A).  Some EU RoHS exemptions for lead may apply to other components used in the product package.

• Halogen-free: Applies only to halogenated flame retardants and PVC in components.  Halogens are below 900 PPM bromine and 900 PPM chlorine.

This slide MUST be used with any slides removed from this presentation

Risk Factors

10

Intel’s Roadmap Update presentations may contain forward-looking statements.

All statements made that are not historical facts are subject to a number of risks and uncertainties, and actual results may differ materially.

Please refer to our recent Earnings Release and Form 10-Q for more information on the risk factors that could cause actual results to differ.

2

Intel® Itanium® Platform Boxboro-MC Platform (Mid ‘09)

Server Platform Roadmap Mission Critical (MC) Platform 2009

MissionCritical

Intel® Itanium® processor 9100 series

Intel®E8870 chipset — 400FSB, Intel®82801DB (ICH4), 82546GB

Technologies

FSB 667, DDR2-667, Dual-Core, Hyper-Threading Technology,Intel® Virtualization Technology, Intel® Cache Safe Technology. IA-64, Demand Based switching, Core Level Lockstep

Tukwila-MC processor

Boxboro-MC Chipset

Technologies

Quad-Core, Intel® QuickPath Interconnect, Dual Integrated Memory Controllers

All products, computer systems, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice.

Q1 ’09 Q2 ’09 Q3 ’09 Q4 ’09Q2 ’09Q1 ’09 Q3 ’09 Q4 ’09

12

Tylersburg-EP Platform

Server Platform Roadmap Efficient Performance(EP) Platform 2009

Efficient Performance

Two Socket

All products, computer systems, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice.

1. Lead and Halogen free kit includes Intel® Xeon® family CPU, Intel® Chipsets, and Intel® LAN components. Note:45nm product is manufactured on a Lead Free process. Lead-free per EU RoHS directive July, 2006. Some E.U. RoHS exemptions may apply to

other components used in the product package. 

Nehalem-EP Processor

Tylersburg -36D , -24D Chipset

Technologies

Quad-Core / Dual Core

DDR3 1333/1066/800 memory

Intel® Turbo Boost Technology, Intel® VT

Intel® QuickPath Interconnect (QPI)

Intel® Hyper-Threading Technology

Lead and halogen free platform kit1

Q1 ’09 Q3 ’09 Q4 ’09Q2 ’09

13

Caneland Platform

Server Platform Roadmap Expandable Platform (EX) 2009

Expandable

All products, computer systems, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice.

Q1 ’09 Q3 ’09 Q4 ’09*Q2 ’09

Intel® Xeon® processor 7400 series 45 nm 6-core (Dunnington) (shipping)

Intel® Xeon® processor 7300 series Intel® Xeon® processor 7200 series

Intel® 7300 ChipsetEnabled chipsets -4P/8P+ platforms

Technologies

Quad-Core, Dual-Core, Intel® Core™ MicroArchitecture, FBD Memory, Intel® VT,Next Generation Intel® I/O AT, Snoop Filter

* Nehalem-EX processor on Boxboro-EX platform targeted for production in Q4 ‘09

14

Tylersburg-EN Platform

Server Platform Roadmap Entry Platform (EN) 2009

EntryTwo Socket

* Lynnfield processor based platform production targeted for 2H ’091 Halogen free kit includes Intel® Xeon® family CPU, Intel® Chipsets, and Intel® LAN components.Lead free kit includes Intel® Xeon® family CPU, Intel® Chipsets, and Intel® LAN components. Note:45nm product is manufactured on a Lead Free process. Lead-free per EU RoHS directive July, 2006. Some E.U. RoHS exemptions may apply to other components used in the product package. 

All products, computer systems, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice.

Intel® Xeon® processor 5400 series Intel® Xeon® processor 5200 series Intel® 5000V Chipset (Blackford)

Nehalem-EN Processor

Tylersburg -24D Chipset

TechnologiesQuad-Core / Dual Core, DDR3 memory, Turbo Mode, Intel® VT, Intel® QuickPath interconnect, Intel® Hyper-Threading Technology (SMT), Lead and halogen free platform kit1

EntryOne Socket

Garlow Platform

Cranberry Lake Platform

Bensley-VS Platform

Intel® Xeon® processor 5400 series Intel® Xeon® processor 5200 series

Intel® 5100 Chipset (San Clemente);

Intel® Xeon® processor 3300 seriesIntel® Xeon® processor 3100 seriesIntel® Xeon® processor 3200 series Intel® Xeon® processor 3000 series

Intel® 3210/3200 Chipset

TechnologiesDual-Core/Quad-Core Intel® Core™ Microarchitecture,Lead and halogen free processors starting in 2H’08 (3300/3100 series)

Lynnfield Processor

Ibex Peak Chipset

2009 Platform*

1H ‘09 2H ‘09

15

Tylersburg-WS Platform

Tylersburg-WS Platform

Server Platform Roadmap Workstation Platforms (WS) 2009

WorkstationTwo Socket

1. Lead and Halogen free kit includes Intel® Xeon® family CPU, Intel® Chipsets, and Intel® LAN components. Note:45nm product is manufactured on a Lead Free process. Lead-free per EU RoHS directive July, 2006.

Some E.U. RoHS exemptions may apply to other components used in the product package. 

All products, computer systems, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice.

Nehalem-EP Processor

Tylersburg -36D Chipset

Technologies

Quad-Core / Dual Core, DDR3 1333/1066/800 memory, Intel® Turbo Boost Technology, Intel® VT, Intel® QuickPath interconnect, Intel® Hyper-Threading Technology , Lead and halogen free platform kit1

Workstation One Socket

Nehalem –EP Processor

Tylersburg -36S Chipset

TechnologiesIntel® QuickPath interconnect Lead and halogen free platform kit1

Intel® Core™2 Extreme QX9650Intel® Core™2 Quad Q9000

Intel® Core™2 Duo E8400

Intel® X38 Chipset

TechnologiesQuad-Core, Dual-Core, 1333 FSB Intel® Core™ Microarchitecture;

Q2 ’09Q1 ’09 Q3 ’09 Q4 ’09

Garlow-WS Platform