1H’09 Public Roadmap111
Intel® Public Roadmap
1H’ 2009
1H’09 Public Roadmap222
Public Roadmap Desktop Platform
1H’ 2009
Intel Confidential—NDA Platform Roadmap 1H’09 Public Roadmap
Extreme
Best
Better
Intel® Core™ i7 Processor Extreme EditionCodename: Tylersburg DT platform
Intel® X58 Express Chipset- 2x16 or 4x8 graphics
Intel® G45 & P45 Express Chipsets
Intel® Core™2 Duo Processor E8xxx & E7xxx seriesCodename: Boulder Creek platform
Intel® G45, G43, & P43 Express Chipsets
Intel® G31/P31 Express Chipsets
Intel® Core™2 Quad Proc. Q9xxx &Q8xxx seriesCodename: Boulder Creek platform
Intel® Pentium® & Celeron® Proc.
Intel® G41 Express Chipset
Q1’09 Q2’09
Desktop Processor: Roadmap
Intel® Core™ i7 ProcessorCodename: Tylersburg DT platform
Intel® X58 Express Chipset- 2x16 or 4x8 graphics
Consumer Platforms 1H’09
Good
Intel Confidential—NDA Platform Roadmap 1H’09 Public Roadmap44
Best
Intel® Core™2 Quad & Duo proc. Q9000,E8000 series2
Intel® Q45 Express Chipset w/ICH10DO, Intel® TPM
Business Security:Microsoft NAP, Access Monitor
Proactive IT Care:Intel® Standard Manageability plus: Fast Call for Help, Remote Schedule Maintenance, Remote Alerts, DASH
Intel® vPro Tech. for 2009
Q1’09 Q2’09
Better
Good Intel® G31 Express Chipset
Intel® G41 Express Chipset
Intel® Pentium® processor1
* Qualification window begins at platform launch and continues for 3 months.** Deployment begins at the end of the Qualification window and continues for 12 months.1 Intel® Pentium® dual-core proc not SIPP eligible. 2. Check the feature set reference table for vPro and SIPP CPU details.3. Intel Std. Manageability and Intel AMT support WS-MAN and DASH
Intel® SIPP Deploy 2008/2009 Platform**
Intel® Core™2 Duo Proc. E8000 seriesIntel® Q43 Express Chipset w/ICH10D, Intel® TPMIntel® Standard ManageabilityIntel® SIPP
- Manageability Upgrade Available
UpgradeableIntel® B43 Express Chipset w/ICH10D
Desktop Platform: Roadmap Business Platforms 1H’09
555
Public Roadmap Intel® Mobile Platform
1H’08-1H’09
666
Consumer Mobile Platforms: Roadmap1H’08-1H’09
Extreme
Performance
Entry
Intel® Core™2 ExtremeX9000
Intel® Centrino® processor technologyFeaturing Intel® Core™2 Duo
T9500, T9300, T8300, T8100
Intel® Celeron® processors570, 560, 550, 540, 530
Mobile Intel® GM965, GL960 Express chipsets with ICH8M
Mobile Intel® GM965, PM965 Express chipsets with ICH8M or ICH8M-Enhanced
Intel® Wireless WiFi Link 4965AGN or AG, or 3945ABG
Intel® Core™2 Extreme
QX9300, X9100
Intel® Centrino® 2 processor technologyFeaturing Intel® Core™2 Quad Q9100, Q9000
Featuring Intel® Core™2 Duo T9800, T9600, T9550,
T9400, P9600, P9500, P8700, P8600, P8400
Intel® Core™2 Duo processors: Low-Voltage and Ultra Low-VoltageL7700, L7500
U7700, U7600
‘Santa Rosa Refresh’ ‘Montevina’
1H’08 2H’08-1H’09
Intel® Core™2 Duo Small Form Factor processors:
Power-Optimized, Low Voltage, and Ultra Low-VoltageSP9400, SP9300
SL9400, SL9300
SU9400, SU9300, SU3300*
‘Santa Rosa/ Santa Rosa Refresh’ ‘Montevina’
Mobile Intel® GM45, PM45 Express chipsets with ICH9M or ICH9M-Enhanced
Intel® Wireless WiFi Link 5000 Series
Intel® Celeron® processors
T1700, T1600, 585, 575, 723
Mobile Intel® GM45, GL40 Express chipsets with ICH9M
‘Santa Rosa’ ‘Montevina’
*Intel*Intel®® Core CoreTMTM 2 Solo processors are eligible for Centrino 2 Solo processors are eligible for Centrino®® branding only branding only
777
Best
Better
‘Santa Rosa Refresh’ ‘Montevina’
Mobile Intel® GM965, PM965 Express Chipsets with ICH8M or ICH8M-Enhanced
Intel® Wireless WiFi Link 4965AGN or AG, or 3945ABG
Extreme
Business Mobile Platforms: Roadmap1H’08-1H’09
Q2’08 2H’08-1H’09
Mobile Intel® GM965 & PM965 Express Chipsets with ICH8M–Enhanced
Intel® Wireless WiFi Link 4965AGN or AG
Intel® 82566MM Gigabit Network Connection
Intel-optimized adv. management & security solutions with Intel® AMT v2.5 & VT
1H’08
Intel® Core™2 ExtremeX9000
Intel® Centrino® with vProTM technologyFeaturing Intel® Core™2 Duo
T9500, T9300, T8300, T8100
Intel® Centrino® 2 with vProTM technologyFeaturing Intel® Core™2 Duo T9800, T9600, T9550, T9400, P9600, P9500, P8700, P8600, P8400
Intel® Core™2 Duo processors: Low-Voltage and Ultra Low-VoltageL7700, L7500
U7700, U7600
Intel® SIPP
Intel® Centrino® processor technologyFeaturing Intel® Core™2 Duo processors
Intel® Centrino®2 processor technologyFeaturing Intel® Core™2 Duo processors
Deploy 2007 Platforms Deploy 2008 platforms
Intel® Core™2 ExtremeQX9300, X9100
Intel® Core™2 Duo Small Form Factor processors: Power-Optimized, Low Voltage, and Ultra Low-VoltageSP9400, SP9300
SL9400, SL9300
SU9400, SU9300
Mobile Intel® GM45 and PM45 Express Chipsets with ICH9M Enhanced
Mobile Intel® GS45 Express Chipsets with ICH9M-SFF-Enhanced
Intel® 82567LM Gigabit Network Connection
Intel® Wireless WiFi Link 5000 Series
Intel® AMT 4.0, Intel® Anti-Theft Technology, Intel® Virtualization Technology (VT-x, VT-d), Intel® Trusted Execution Technology
Mobile Intel® GM45, PM45 Express Chipsets with ICH9M or ICH9M-Enhanced
Intel® Wireless WiFi Link 5000 series
888
Public RoadmapIntel® Server Platform Group (SPG)
2009
99* Other names and brands may be claimed as the property of others. Copyright © 2008, Intel Corporation.
Legal Disclaimer• INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED ,BY
ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS , INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO FITNESS FOR A PARTICULAR PURPOSE , MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR.
• ALL PRODUCTS, COMPUTER SYSTEMS, DATES, AND FIGURES SPECIFIED ARE PRELIMINARY BASED ON CURRENT EXPECTATIONS , AND ARE SUBJECT TO CHANGE WITHOUT NOTICE.
• THIS INFORMATION IS PROVIDED “AS IS” WITH NO WARRANTIES WHATSOEVER, INCLUDING ANY WARRANTY OF MERCHANTABILITY, NON-INFRINGEMENT, FITNESS FOR ANY PARTICULAR PURPOSE, OR ANY WARRANTY OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE.
• THE HARDWARE VENDOR REMAINS SOLELY RESPONSIBLE FOR THE DESIGN, SALE AND FUNCTIONALITY OF IT’S PRODUCT, INCLUDING ANY LIABILITY ARISING FROM PRODUCT INFRINGEMENT OR PRODUCT WARRANTY.
• INTEL, INTEL XEON, INTEL CORE 2 DUO, INTEL CORE 2 QUAD, INTEL CORE 2 EXTREME, THE INTEL LOGO, INTEL CORE MICROARCHITECTURE ARE TRADEMARKS OR REGISTERED TRADEMARKS OF INTEL CORPORATION OR ITS SUBSIDIARIES IN THE UNITED STATES AND OTHER COUNTRIES.
• Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. See www.intel.com/products/processor_number for details.
• Intel® Virtualization Technology requires a computer system with a processor, chipset, BIOS, virtual machine monitor (VMM) and applications enabled for virtualization technology. Functionality, performance or other virtualization technology benefits will vary depending on hardware and software configurations. Virtualization technology-enabled BIOS and VMM applications are currently in development.
• “Intel® Turbo Boost Technology requires a PC with a processor with Intel Turbo Boost Technology capability. Intel® Turbo Boost Technology performance varies depending on hardware, software and overall system configuration. Check with your PC manufacturer on whether your system delivers Intel Turbo Boost Technology. For more information, see http://www.intel.com/technology/turboboost.”
• Intel® Hyper-Threading Technology requires a computer system with a processor supporting HT Technology and an HT Technology-enabled chipset, BIOS and operating system. Performance will vary depending on the specific hardware and software you use. For more information including details on which processors support HT Technology, see here
• Lead-free: 45nm product is manufactured on a lead-free process. Lead is below 1000 PPM per EU RoHS directive (2002/95/EC, Annex A). Some EU RoHS exemptions for lead may apply to other components used in the product package.
• Halogen-free: Applies only to halogenated flame retardants and PVC in components. Halogens are below 900 PPM bromine and 900 PPM chlorine.
This slide MUST be used with any slides removed from this presentation
Risk Factors
10
Intel’s Roadmap Update presentations may contain forward-looking statements.
All statements made that are not historical facts are subject to a number of risks and uncertainties, and actual results may differ materially.
Please refer to our recent Earnings Release and Form 10-Q for more information on the risk factors that could cause actual results to differ.
2
Intel® Itanium® Platform Boxboro-MC Platform (Mid ‘09)
Server Platform Roadmap Mission Critical (MC) Platform 2009
MissionCritical
Intel® Itanium® processor 9100 series
Intel®E8870 chipset — 400FSB, Intel®82801DB (ICH4), 82546GB
Technologies
FSB 667, DDR2-667, Dual-Core, Hyper-Threading Technology,Intel® Virtualization Technology, Intel® Cache Safe Technology. IA-64, Demand Based switching, Core Level Lockstep
Tukwila-MC processor
Boxboro-MC Chipset
Technologies
Quad-Core, Intel® QuickPath Interconnect, Dual Integrated Memory Controllers
All products, computer systems, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice.
Q1 ’09 Q2 ’09 Q3 ’09 Q4 ’09Q2 ’09Q1 ’09 Q3 ’09 Q4 ’09
12
Tylersburg-EP Platform
Server Platform Roadmap Efficient Performance(EP) Platform 2009
Efficient Performance
Two Socket
All products, computer systems, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice.
1. Lead and Halogen free kit includes Intel® Xeon® family CPU, Intel® Chipsets, and Intel® LAN components. Note:45nm product is manufactured on a Lead Free process. Lead-free per EU RoHS directive July, 2006. Some E.U. RoHS exemptions may apply to
other components used in the product package.
Nehalem-EP Processor
Tylersburg -36D , -24D Chipset
Technologies
Quad-Core / Dual Core
DDR3 1333/1066/800 memory
Intel® Turbo Boost Technology, Intel® VT
Intel® QuickPath Interconnect (QPI)
Intel® Hyper-Threading Technology
Lead and halogen free platform kit1
Q1 ’09 Q3 ’09 Q4 ’09Q2 ’09
13
Caneland Platform
Server Platform Roadmap Expandable Platform (EX) 2009
Expandable
All products, computer systems, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice.
Q1 ’09 Q3 ’09 Q4 ’09*Q2 ’09
Intel® Xeon® processor 7400 series 45 nm 6-core (Dunnington) (shipping)
Intel® Xeon® processor 7300 series Intel® Xeon® processor 7200 series
Intel® 7300 ChipsetEnabled chipsets -4P/8P+ platforms
Technologies
Quad-Core, Dual-Core, Intel® Core™ MicroArchitecture, FBD Memory, Intel® VT,Next Generation Intel® I/O AT, Snoop Filter
* Nehalem-EX processor on Boxboro-EX platform targeted for production in Q4 ‘09
14
Tylersburg-EN Platform
Server Platform Roadmap Entry Platform (EN) 2009
EntryTwo Socket
* Lynnfield processor based platform production targeted for 2H ’091 Halogen free kit includes Intel® Xeon® family CPU, Intel® Chipsets, and Intel® LAN components.Lead free kit includes Intel® Xeon® family CPU, Intel® Chipsets, and Intel® LAN components. Note:45nm product is manufactured on a Lead Free process. Lead-free per EU RoHS directive July, 2006. Some E.U. RoHS exemptions may apply to other components used in the product package.
All products, computer systems, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice.
Intel® Xeon® processor 5400 series Intel® Xeon® processor 5200 series Intel® 5000V Chipset (Blackford)
Nehalem-EN Processor
Tylersburg -24D Chipset
TechnologiesQuad-Core / Dual Core, DDR3 memory, Turbo Mode, Intel® VT, Intel® QuickPath interconnect, Intel® Hyper-Threading Technology (SMT), Lead and halogen free platform kit1
EntryOne Socket
Garlow Platform
Cranberry Lake Platform
Bensley-VS Platform
Intel® Xeon® processor 5400 series Intel® Xeon® processor 5200 series
Intel® 5100 Chipset (San Clemente);
Intel® Xeon® processor 3300 seriesIntel® Xeon® processor 3100 seriesIntel® Xeon® processor 3200 series Intel® Xeon® processor 3000 series
Intel® 3210/3200 Chipset
TechnologiesDual-Core/Quad-Core Intel® Core™ Microarchitecture,Lead and halogen free processors starting in 2H’08 (3300/3100 series)
Lynnfield Processor
Ibex Peak Chipset
2009 Platform*
1H ‘09 2H ‘09
15
Tylersburg-WS Platform
Tylersburg-WS Platform
Server Platform Roadmap Workstation Platforms (WS) 2009
WorkstationTwo Socket
1. Lead and Halogen free kit includes Intel® Xeon® family CPU, Intel® Chipsets, and Intel® LAN components. Note:45nm product is manufactured on a Lead Free process. Lead-free per EU RoHS directive July, 2006.
Some E.U. RoHS exemptions may apply to other components used in the product package.
All products, computer systems, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice.
Nehalem-EP Processor
Tylersburg -36D Chipset
Technologies
Quad-Core / Dual Core, DDR3 1333/1066/800 memory, Intel® Turbo Boost Technology, Intel® VT, Intel® QuickPath interconnect, Intel® Hyper-Threading Technology , Lead and halogen free platform kit1
Workstation One Socket
Nehalem –EP Processor
Tylersburg -36S Chipset
TechnologiesIntel® QuickPath interconnect Lead and halogen free platform kit1
Intel® Core™2 Extreme QX9650Intel® Core™2 Quad Q9000
Intel® Core™2 Duo E8400
Intel® X38 Chipset
TechnologiesQuad-Core, Dual-Core, 1333 FSB Intel® Core™ Microarchitecture;
Q2 ’09Q1 ’09 Q3 ’09 Q4 ’09
Garlow-WS Platform