11.03.2009, T. Tischler, CBM Collaboration Meeting, GSI

Status MVD demonstrator:mechanics & integration

T.Tischler, S. Amar-Youcef, M. Deveaux, D. Doering, J. Heuser,

I. Fröhlich, J. Michel, C. Müntz, C.Schrader, S. Seddiki, J. Stroth, C. Trageser

and B. Wiedemann

11.03.2009, T. Tischler, CBM Collaboration Meeting, GSI

Status MVD demonstrator:mechanics & integration

Outline:

MVD demonstrator

- Global design- Sensors- Mechanical support- FPC- Integration procedure- Demo-Aux board- Thermal simulations- Mechanical and thermal stress tests

Cryogenic system and vacuum system

Summary and Outlook

11.03.2009, T. Tischler, CBM Collaboration Meeting, GSI

MVD demonstrator:Global design

2x MIMOSA-20 Sensors

ZIF connectorFlex-rigid R/O

Demo-Aux board

Liquid cooledCu heat sink

TPG/RVC/TPG sandwich

Flexprint Cable

11.03.2009, T. Tischler, CBM Collaboration Meeting, GSI

MVD demonstrator:Sensors

MIMOSA-20 - 320 x 640 pixels

- 30 μm pixel pitch

- ~ 2 ms time resolution

- ~ 2 cm² active surface

- 2 serial analogue outputs

- Differential output lines

MIMOSA-20

Successfully operated with demonstrator electronics(See talk of S. Amar-Youcef)

11.03.2009, T. Tischler, CBM Collaboration Meeting, GSI

Structure of the support:

MVD demonstrator:Mechanical support

TPG (Thermal Pyrolytic Graphite)ultra high heat conduction (1500 W/mK in two dimensions)

RVC (Reticulated Vitreous Carbon)ultra light and stiff material

Dummy chips (former CMS test structures)

Complete support is called „sandwich“.

Currently 0.455 % X0

plus sensors

Thickness [μm]

1x Splicing tape glue 35 ± 52x TPG (C) 300 ± 202x Liquid glue 100 ± 201x RVC (C foam) 5600 ± 200

Sum 6435 ± 205

2x

11.03.2009, T. Tischler, CBM Collaboration Meeting, GSI

MVD demonstrator:Flexprint cable

Currently 0,212 % X0

3 layers of 12 μm copper on Polyimide

- Minimized set of lines for 2 MIMOSA-20- One cable for two sensors for individual readout- 60 pads for chip bonding

Design and layout by electronics workshop @ IKF

52,5 mm

32 m

m

Can be reduced by replacing Cu with Al.Contact to ALICE Silicon Trackergroup established.

Flexprint cable demonstrator

11.03.2009, T. Tischler, CBM Collaboration Meeting, GSI

MVD demonstrator:Flexprint cable

FPC-balcony structurecomes with pad-layout

advantage: easier bonding

First bonding exercises with FPC glued on Dummy Chip succeeded

11.03.2009, T. Tischler, CBM Collaboration Meeting, GSI

MVD demonstrator: Integration procedure

SiliconTPG

RVC

AdhesiveFPC

Bonds

Components:

Handling -Support

1-side (DemoV1):

Double-side (DemoV2):

Handling

-Support

Open questions:

- Order of mounting

- High precison positioning

- Risks of damages while mounting

- 1-sided / 2-sided mounting

11.03.2009, T. Tischler, CBM Collaboration Meeting, GSI

MVD demonstrator:Demo-Aux board

see talk of C. Schrader

Demo-Aux boardconnects Chip and FPCwith readout chain.

Mounted onheat sink for directcooling.

Heat sink modificationis work in progress.

Heat sink

11.03.2009, T. Tischler, CBM Collaboration Meeting, GSI

MVD demonstrator: Thermal simulations

10 mW

2 W

10 mW

1 W/cm²1 W/cm²

FPC 50Chip 150TPG 1500, 1500, 20RVC 0,04

1Block 400

W/mK

Glue

2 W

0°C

Thermal simulations:

MVD demonstratorcan handle theupcoming heat.

Dissipated by FPC

Dissipatedby Demo-Aux board

Dissipatedby Demo-Aux board

Dissipated by FPC

Dissipated by Chips

Simulations done bySamir Amar-Youcef

Hea

t co

nduc

tivity

11.03.2009, T. Tischler, CBM Collaboration Meeting, GSI

MVD demonstrator: Thermal simulations

0 5 10 15 20 25 30 35 40 45

0

5

10

15

20

25

30

35

ChipsTemperature characteristics

FPC: 20 mW

FPC: 20 mW

20mW / no RVC

Length / mm

Tem

pera

ture

/ °C

Temperature maximum 30.4 °C

Temperature minimum 0 °C

Temperature gradienton chip surfaceFirst chip 5°CSecond chip 8°C

to be confirmedexperimentally

11.03.2009, T. Tischler, CBM Collaboration Meeting, GSI

Study potential problems caused by different thermal expansion coefficients of the support materials.

Thermocycling with Liquid Nitrogen

MVD demonstrator:Mechanical and thermal stress tests

Testchips do notshow any changes,especially no cracks

First resultsare promising.

CTE [1/K]

Dummy chips (Si) 3,00 x 10-6

TPG (C) 1,00 x 10-6

RVC (C foam) 2,20 x 10-6

Static load test of one Sandwich by an accident. RVC was compressed but

test chips do not show any cracks

Further tests are needed.

11.03.2009, T. Tischler, CBM Collaboration Meeting, GSI

Cryo system and vacuum system

Demonstrator is designed and constructed for use in vacuum.

Vacuum system is ready and operational.

First material tests were madebut further studies are needed to make a qualitative statement.

Characteristics:

- vacuum operation down to 10-8 mbar

- electronic pressure readout via Labview

- 50 Pin- and several BNC-feedthroughs

available for electronic test under vacuum

- modular system inside the vacuum system

multifarious operations feasibletogether with B. Wiedemann

11.03.2009, T. Tischler, CBM Collaboration Meeting, GSI

Cryo system and vacuum system

A cryogenic system is placed inside the vacuum system to studyradiation hardness of MIMOSA-chips at temperatures downto Liquid Nitrogen temperature for the future MVD.

Affluxion of LN2 isregulated viatemperature sensorsmountedinside the system.

Additional cooling circuit forMIMOSA readout cards needed,can handle temperatures down to- 90°C. Readout cards mustprevented to be at LN2 temperature.

LN2 temperature insidecryogenic system

Temperature sensors

11.03.2009, T. Tischler, CBM Collaboration Meeting, GSI

Summary and Outlook

Outlook:

Combination of functionalities ( heat conductivity, mechanical stability and FPC) together with IPHC (Strasbourg) and IMEC (Belgium)

Summary:

Global design of the MVD demonstrator was updated and tested in simulations.

Mechanical support was build and tested.

FPC is available and first exercises in bonding started.

First mechanical stress tests were made with promising results.

Conclusion:

Main components of the demonstrator are available and also tested.

Experiments to confirm the simulation results must follow.