The halogen free polyamide for demanding applications

InnovationThe 3C industry – computer, consumerand communication electronics – is anenormous and growing sector based onconstant innovation, short design cycles,and a trend of decreasing size whileincreasing functionality. At the same time, regulatory requirements are becoming more demanding.

Stanyl® ForTii™ is a high temperature Polyamide 4T, available in halogen-free and red phosphorous free UL94-V0flame retardant grades, that delivers exceptional high temperature performance, high stiffness and low moisture absorption.

It helps our customers to comply with theEU’s Restriction of Hazardous Substances(RoHS) and the Waste Electrical andElectronic Equipment (WEEE) regulations,and also supports lead-free reflowsoldering.

Halogen free substancesStanyl ForTii entirely eliminates the use ofhalogens, and is one of the products inDSM’s portfolio of Brighter Living solutions.In addition to an extensive halogen-free portfolio, the DSM portfolio includes recycle-based materials, bio-based high-performance polymers, hazardous-substance-free materials, as well as materials that extend a product’s serviceable lifetime, provide signicant reductions in weight or friction, and help to deliver a low or neutral carbon footprint.

PartnershipWe developed Stanyl ForTii in close cooperation with the leading electronics Original Equipment Manufacturers (OEMs) and Tier 1 connector and socket manufacturers. This industry has a strong need for high-quality engineering plastics that can withstand the increased heat and mechanical requirements placed on them due to the integration and thinnovation trends driving the industry. DSM is uniquely positioned to support these customers. In addition to creating sophisticated engineering plastics that provide them with greater design freedom, we also support our customers with complete application development support.

Flame retardant plastics areessential in today’s electrical and electronics applications, but how can they be made moresustainable?

Stanyl ForTii delivers UL94-VOflame retardance down to 0.2 mm in combination with exceptional high temperature performance, high stiffness, low moisture absorption for good dimensional stability. Additionally it meets the Glow Wire Ignitability Temperature (GWIT) specifications, and also supports lead-free soldering.

Our mission at DSM is to create brighter lives for people today and for generations to come. In the consumer electronics industry, the market requires elimination of hazardous substances, as well as strong consumer demand for materials and processes that are more environmentally responsible. A key focus area is the elimination of halogenated flame retardants.

Halogen-freeflame retardants for abrighter future

High PerformanceStanyl ForTii is a high-performancepolyamide ideal for use in injection-moldedconsumer electronics parts. Applicationswhere the material has already proven itsreliability include connectors and socketsfor e.g. DDR DIMM and SODIMM, card connectors, SATA or backplane, i/o and FPC, desktop and server SMT DDR3 or LED packaging.

Industry trendsIt supports the industry trends of miniaturization and thinnovation with outstanding reflow capability, and can withstand even the most demanding warpage requirements to surface mount technology (SMT) applications.

Stanyl ForTii offers a unique balance ofhigh melt temperature (325°), high glasstransition temperature (125°), high stiffnessand very low moisture absorption. It combines exceptional toughness andstiffness with high strength before andaer reflow, providing higher applicationreliability values than PPS and liquid crystalpolymers (LCP).

PropertiesStanyl For Tii’s exceptional materialproperties outperform the traditionalplastic materials used in electrical andelectronics applications. Its flexuralstrength and toughness solve themechanical issues associated with LCPs,while its high strength at weld linesresolves issues associated with cracking.

Stanyl ForTii: a provenhalogen-free perfomanceplastic for demandingapplications.

Beyond electronicsStanyl ForTii’s balanced profileenhances design and performance of key applications in the automotive, white goods, lighting and medical segments, as wellas in electrical & electronics.

Consumer electronics- Excellent dimensional

stability, stiffness and toughness

- Supports most demanding SMT applications

- High flow for thin-wall molding

- Rapid crystallization for increased cycle times

Automotive- Weight reduction- High thermal and mechanical performance- Low moisture absorption- Chemical resistance- Best in class CTE matching

aluminum and steel.

Medical devices- Low moisture absorption- Excellent temperature, mechanical and electrical performance

White Goods- High dimensional stability- Supports high temperatures

in SMT- No cracking at weld lines- Easy and robust processing- Glow wire performance

Lighting- Excellent heat aging- High initial reflectivity- Strong UV and light resistance

Stanyl ForTii withstandseven the most demandingSMT applications.

Stanyl ForTii entirely eliminates the use of halogens, and is one of the products in DSM’s portfolio of Brighter Living solutions.

CTI

Flow

Stress at Break (Weldline)

Elongation at Break (Weldline)

Co-planarity

Solderability

HDT

Halfree feasibility

Stanyl ForTii

Stanyl

LCP

PPA

Low warpageAt reflow temperatures, its stiffness and low warpage outperform PPA, PPS, LCP as well as LCP/PPS blends. Stanyl ForTii also provides excellent electrical performance, including a comparative tracking index (CTI) of 600V (performance level category 0), a low and stable dielectric constant, and no ionic migration at DC currents

Warpage outperform LCP

Warpage outperform PA4T

Graph above shows the warpage and in specific how this differs between PAs and LCPs. Especially when going from halogenated PCBs to halogen free PCBs this warpage at reflow temperatures of 260˚C becomes crucial. The CTE delta a & a’ of PA4T to PCBs is lowest.

High stiffness, low moisture absorptionStanyl ForTii is well-suited to the requirements of electronics. Its high stiffness and low moisture absorption classies it in the second best moisture level for any application according to IPC/JEDEC J-STD 020D. Several customer products in moisture level one have also past this test.

Contact us today to learn how DSM can help improve the carbon footprint of your designs:

Electronics manufacturers face increasing regulatory requirements for environmentally responsible materials and processes

High stiffness,lower moisture absorption

Partnering for a brighter futureAt DSM, we actively seek to partner withcustomers to improve the environmentalimpact of their applications in a cost-competitive way.

Our portfolio includes a wide offer ofgrades with best-in-class performance atextreme operating temperatures, whileconsiderably extending service lifetimes.We back all of our material sales withextensive research and development, aswell as a collaborative partnership wherewe support you through grade selection,design and testing.

With manufacturing facilities on threecontinents, we offer a security of stock thatbuys our customers peace of mind,comfortable in the knowledge that supplywill never be an issue with DSM.

PA4THalogen free PCBHalogenated PCB

LCP

CTE at Tg

Transition from halogenated tohalogen free PCBs

a

b b’

a’

Average warpage after Reflow around 0.5 mm(Flip in warpage direction)

Average warpage after Reflow around 0.03 mm(Identical warpage direction)

DSM Engineering PlasticsFor further information, please see:www.dsm.com, www.stanylfortii.com or contact:

EuropeTel +31 46 47 73796Info-Europe.DEP@dsm.com

AmericasTel +1 800 333 4237Info-Americas.DEP@dsm.com

Asia PacificTel +86 21 6141 8188Info-Asia.DEP@dsm.com

©DSM 2012

All information, advice and/or samples (“information”) are provided by or on behalf of DSM Engineering Plastic on an “as is” basis, without any further warrantiesas to the accuracy, usefulness, correctness or completeness thereof. Use or disclosure of or reliance on such information shall be for your own sole risk, accountand responsibility and you will indemnify and hold DSM Engineering Plastics and its affiliates harmless from and against any and all damages or claims from thirdparties in respect of your receipt, use or disclosure of or reliance on the information.

The disclosure of information shall not be construed as granting you a license or any other intellectual property rights relating to such information. The obtaining ofsuch license or rights shall be subject to seperate negotiations.

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