tender document 22112012 - anna university · specified in the tender data sheet or any other date...
TRANSCRIPT
1
TENDER DOCUMENT FOR SUPPLY and INSTALLATION of
1. NETWORKING CORE SWITCH
2. SERVERS
3. SAN STORAGE 4. HPC GRID CLUSTER
Ramanujan Computing Centre
Anna University, Chennai – 600 025
2
A. TENDER NOTICE
Invitation to Bid for Supply and installation of Networking Core Switch, Servers, SAN Storage and HPC Grid Cluster
1. Tender Inviting Authority Designation
and Address
The Registrar,
Anna University, Chennai ‐600 025.
Email: [email protected]
URL : www.annauniv.edu/tender
A) Name of the Work Purchase and installation of Networking Core Switch, Servers, SAN Storage and HPC Grid Cluster
B) Tender reference AU/ CPC‐ RCC/Switch/Server/Storage/ HPC 2012‐13
2.
C) Place of execution Main and MIT Campuses, Anna University, Chennai.
3. Tender Documents available place On all working days between 10.00 A. M to 4.30 P.M @
Ramanujan Computing Centre, Anna University,
Chennai – 600 025.
Alternatively, Tender documents can be downloaded at free
of cost from www.annauniv.edu/tender and
http://tender.tn.gov.in
4. Earnest Money Deposit (EMD) Rs. 60,000/‐ (Rupees Sixty Thousand only)
Demand Draft or Banker’s cheque.
5. Due Date, Time and place of
submission of tender
Upto 07.12.2012 at 1.00 P.M
Computer Purchase Committee, Ramanujan Computing
Centre, Anna University, Chennai ‐600 025.
6. Date, Time and Place of Tender
Opening of the Technical Bids
On 07.12.2012 at 3.00 P.M at Ramanujan Computing Centre,
Anna University, Chennai‐600 025.
7. Date, Time and Place for opening of
the Price Bids
Will be intimated to the Technically Qualified Bidders only.
8. 1. Eligibility Criteria: Please refer to the Tender Document.
2. Two Bid System (i.e.) Stage‐1 Technical bid; Stage‐2 Price Bid opening.
3. Tenders received after due Date and Time will be summarily rejected.
4. Contact Phone Nos.: 044 – 22358033, 22358003.
E‐Mail: [email protected] ; URL: www.annauniv.edu/tender
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Checklist for Enclosures
(Bidder should fill up YES or NO without fail)
Sl. No: Bid Enclosures YES or NO
1. Whether Technical Bid (Envelope‐A) and Price Bid (Envelope‐B) prepared and
signed and stamped in all pages by the Authorized Signatory?
2. Whether EMD is put in the Technical Bid (Envelope – A)?
3. Whether the Tender is submitted in Two covers namely Technical Bid
(Envelope‐A) and Price Bid (Envelope‐B)?
4. Whether Two covers are put into an outer cover duly closed with VAX sealed
properly?
5. Whether Technical Bid (Envelope‐A) contains the following
5.1 Bidder’s covering letter in the Letter Head signed and stamped by the
Authorized Signatory.
5.2 Whether Document proof for Annual Turn Over Enclosed?
5.3 Whether list of Technical Staff Details Enclosed?
5.4 Proof regarding the firm is involved in the supply and installation of
Networking Switches, Servers, SAN Storage and HPC Grid Cluster (copies of
Purchase Orders) Enclosed?
5.5 Whether proof that the firm has atleast one service centre in Chennai
Enclosed?
5.6 Whether Document relating to TIN and Sales Tax Enclosed?
5.7 Whether OEM Certification is Enclosed?
5.8 Whether related Technical Data Sheets for Networking Core Switch, Servers,
SAN Storage and HPC Grid Cluster are enclosed?
6. Whether Price Bid (Envelope‐B) contains the following
6.1 Dully filled Price Bid which is signed and stamped by the Authorized Signatory
put inside the Envelope ‐ B?
4
1. ELIGIBILITY CRITERIA
The Bidders should meet the following Eligibility Criteria to participate in the Tender and should
enclose supporting documents for fulfilling the Eligibility in the Technical Bid. It is the responsibility of the company
to satisfy the Anna University norms regarding genuineness and validity of the document furnished. Bids
accompanied by the documents not fulfilling the requirements outlined in this section will be subject to rejection.
Sl.
No:
Minimum Eligibility Criteria Supporting documents to be submitted for
fulfilling the Eligibility Criteria
Yes or No
1.1 Bidder should be a Registered company in India and existing for the past Five years in India
Registration Certificate should be submitted.
Bidder shall be providing the following facilities at least for the last three years
1.2
1.2.1 Networking
1.2.2 Servers
1.2.3 SAN Storage
1.2.4 HPC Grid Cluster System
i. Copy of the Single Purchase Order to the value of Rs.25 lakhs or above during the last three years (for each item). ii. Copy of the purchase orders totalling to the value of Rs.75 lakhs or above during the last three years put together (for each item).
1.3 Bidder should have an average Annual Turnover of at least Rs.2 Crores in the previous three audited years
Annual Report including Balance Sheet and Profit & Loss accounts for the last three audited years shall be submitted.
1.4
The company or tenderer should have Good Strength of Service Engineers in the relevant field of Quoted item. However the firm should have atlest one service centre at Chennai. At the Chennai centre the firm quoting for all the items or partially the firm should have 5 certified Engineers, out of which atleast 1 certified Engineer in the relevant of the facilities above (1.2).
List of technical staffs shall be submitted (Name, Designation, Salary Details and Date of joining the Firm, certification obtained in).
1.5 Bidder should have valid sales tax/TIN/Service Registration Number.
Valid Documents for TIN/Service Registration Number shall be submitted.
1.6 The vendor can quote part ia l ly or for al l the i tems mentioned in the given Bill of Material and separate purchase order will be issued for each item – Subject to conditions 1.2, 1.3 and 1.4.
1.7 OEM (Original Equipment Manufacturer) Certification and product support.
Copy of the OEM’s Certification authorizing the Vendor as local partner/representative in India for the supply and installation of items indicated in the Tender Documents. Further the OEM should give undertaking for atleast five years product support directly or through their authorized dealers/vendor.
5
BID PREPARATION AND SUBMISSION
The Bid should be submitted in two parts viz Technical Bid (Envelope‐A) and Price Bid (Envelope‐B) as
explained below.
Each bid will be treated and evaluated separately.
TECHNICAL BID (ENVELOPE – A)
The Technical Bid format as given in the Tender shall be filled, signed and stamped on all pages. Errors if
any shall be attested by the Bidder. The Bid will be summarily rejected, if there is any indication of price in
the Technical Bid. Any alterations, deletions or overwriting shall be attested with full signature of the
authorised signatory.
Any alterations, deletions or overwriting shall be attested with full signature of the authorised signatory.
The Technical Bid with supporting documents and the EMD covers should then be put in a separate cover
and sealed appropriately. The Technical Bid cover should be superscribed as “Technical Bid (Envelope‐A)
for supply and installation of Networking Core Switch, Servers, SAN Storage and HPC Grid Cluster –
Tender No._____________________________due _____________. The “FROM address” and “TO”
Address” should be clearly written in the cover otherwise the Bid is liable for rejection.
PRICE BID (ENVELOPE – B)
All the Price items(quoted in Indian Ruppee) as asked in the Tender should be filled in the Price Bid
format as given in the Tender.
The Bid is liable for rejection if Price Bid contains conditional offers / partial offers.
The Price Bid shall be typed, signed and stamped in all pages by the authorised signatory of the Bidder.
Any alterations, deletions or overwriting shall be attested with full signature of the authorised signatory.
The Price Bid shall be put in a separate cover (Envelope‐B) and sealed appropriately. The Price Bid
cover(Evvelope – B) shall be superscribed as “Tender supply and installation of Networking Core Switch,
Servers, SAN Storage and HPC Grid Cluster –Tender
No.________________________________________________due on_____________”. The “FROM
address” and “TO” Address” shall be written without fail, otherwise the Price Bid is liable for rejection.
OUTER COVER
The Technical Bid cover including EMD Cover (Envelope‐A) and Price Bid cover (Envelope‐B) shall then be
put in a single outer cover and sealed appropriately by use of sealant. The outer cover shall be
superscribed as “Tender supply and installation of Networking Core Switch, Servers, SAN Storage and
HPC Grid Cluster – Tender No: ___________________________________________ due on
___________”. The “FROM” address and “TO” address shall be written without fail otherwise the
Technical Bid is liable for rejection.
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MODE OF SUBMISSION OF BIDS
(a) The Bid should be submitted strictly as specified in the Tender document. The Bids should
be submitted in the Office of the Ramanujan Computing Centre, Anna University,
Chennai‐600 025 on or before the due date and time.
(b) If the Bidder prefers to submit the Bid by post, the Bidder should ensure that the Bid
reaches The Convener, Computer Purchase Committee, Ramanujan Computing Centre,
Anna University, Chennai‐600 025 on or before the due date and time. Anna University will
not be liable or responsible for any postal delay or any other delay whatsoever.
(c) If any Bid is received after due date and time or unsealed or disorderly submitted or
received by Facsimiles (FAX), the Bid will be treated as non responsive.
MODIFICATION AND WITHDRAWAL OF BIDS
The Bids once submitted cannot be modified or amended or withdrawn. No documents would be
supplemented after submission of Bids.
TECHNICAL BID OPENING
The Tender outer cover and Technical Bid cover including EMD cover will be opened at
the office of Ramanujan Computing Centre, Anna University, Chennai on the date and time as
specified in the Tender Data sheet or any other date published in the Anna University website. The
Tender will be opened in the presence of the Bidders who choose to be present. The representative of
the Bidder who prefers to attend Tender opening shall bring an Authorization letter from the Bidder.
EMD:
(a)The EMD amount(Rs.60,000/‐) as specified in the Tender Data Sheet should be paid along with
Technical Bid by way of Demand Draft or Banker’s cheque drawn from any Nationalized Bank or
Scheduled Bank in India and in favour of “The Registrar, Anna University, Chennai‐25” payable at
Chennai. No Bid shall be entertained without EMD.
(b) The EMD amount of the unsuccessful Bidders will be refunded after finalization of the Tender within a
reasonable time. The EMD amount held by Anna University till it is refunded to the unsuccessful Bidders
will not earn any interest thereon.
7
SCRUTINY DURING TENDER OPENING
a) The scrutiny during the Tender opening will be held for the following.
i) Whether Tender is submitted in two cover system viz. Technical Bid Cover
(Envelope – A) and Price Bid cover (Envelope – B)
ii) Whether required EMD amount is furnished and submitted along with
Envelope ‐ A.
b) All Bids fulfilling the above conditions alone will be considered for further evaluation
otherwise, the Bids will be treated as rejected. The decision of Anna University will be final
in this regard.
TECHNICAL BID EVALUATION
a) The Technical Evaluation will be held on the compliance of the Bid with respect to the
Tender conditions.
b) The Bids will be held non‐responsive and rejected if the Bids do not comply with the
Tender conditions, if the Bids do not conform to the Technical Specifications and if the
Bids do not establish the eligibility, capability and experience of the Bidders.
c) The Bidders who have duly fulfilled with the Technical requirements in the Technical Bid
evaluation as above will be considered as Technically Qualified Bidders and they only will
be eligible to participate in the opening of Price Bid.
d) The Bids of the Bidders who have failed to meet the Technical requirements in the
Technical Bid evaluation as indicated above will be rejected.
PRICE BID EVALUATION
1) The Price Bids (Envelope‐B) of the Technically Qualified Bidders in Technical Bid
(Envelope‐A) alone will be opened and evaluated. The Price Bids will be opened in the
presence of the Bidders at Anna University. The Bidders or their authorized
representatives will be allowed to take part in the Price Bid opening.
2) The Price Bid evaluation will be conducted as stipulated in the Tamil Nadu Transparency in
Tenders Act 1998 and Tamil Nadu Transparency in Tenders Rules 2000
a) The quoted price shall be corrected for arithmetical errors;
b) In cases of discrepancy between the prices quoted in words and in figures, lower
of the two shall be considered.
3) The lowest evaluated price as per the Bill of material above evaluation
will be adjudged as L1 price.
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SPECIAL TERMS AND CONDITIONS
1. Delivery Period: The delivery should be made within 4‐5 weeks from the date of receipt of
purchase order.
2. Warranty: The entire item supplied by the vendor shall be guaranteed against any defects and the vendor should provide time‐to‐time operational maintenance support (On Site comprehensive Warranty). The said warranty should cover all the Hardware & Software Products. The warranty and service shall be provided directly from the manufacturer. The vendor shall be liable to rectify any defects that may be found in the equipment supplied at free of cost.
3. Installation: The installation should be done at the Anna University, Chennai at no extra cost.
4. Response Time: The response time of the vendor to attend to any complaint upon receipt of the complaint/information from the user should not be more than 24 hours.
6. The vendor must submit their tender document in the given format. Deviations from this format
will automatically disqualify the tender process.
7. Anna University reserves the right to increase or reduce the quantity or even withdraw the tender without assigning any reasons thereof.
8. Anna University reserves the right to cancel the contract under repeated violations of the
specified and mutually agreed QoS parameters. 9. Anna University is not responsible for any delay in delivery of equipment. 10. The items must be delivered and installed at the required locations at your own risk and cost.
11. Any Proposal or Bid received after Bid submission date and time will not be entertained/ considered.
12. The Successful vendor has to provide training for installation and configuration for the items
supplied by them to the staff involved in the project.
9
SCHEDULE OF REQUIREMENTS
Sl. No
Item Description Quantity in Nos.
A Networking Core Switch 01
B Servers 08
C 20 TB SAN Storage 01
C1 8 Port SAN Switch 01
C 1.1 Optional Items
‐ 10 Meters Fiber Patch Cords (LC – LC) Cables ‐ Compatible for connecting SAN storage and HBA
Cards on the server
D HPC Grid Cluster
D1 Computer Node 04
D2 Master Node 01
D3 Interconnect Network
D4 Cluster Administration Network
D5 Rack 01
D6 Software Component
D7 Storage Sub System 01
10
TECHNICAL SPECIFICATION FOR NETWORKING CORE SWITCH
Sl. No
Description Compliance with Remarks (Yes/No)
Make: Model:
1 Minimum 8 port 10Gigabit Ethernet Module (XFP / SFP+) loaded with 4*LR optics
2 Minimum 16 Port 1000 Base‐x Module
3 48 port 10/100/1000 Module (RJ45)
4 Minimum 2 or higher slots (Full slot) has to be free for future expansion
5 Redundant Power Supply
6 Redundant Supervisor Engine with hitless failover
7 All Ports should be wire‐speed and non‐blocking
8 VLAN support ‐ 802.1Q (Minimum 4000 Active VLANs)
9 Should support IPv6 Routing, OSPF, BGP, BGP4, OSPF IS‐IS routing for IP v4 & IP v6 – Day One (All Necessary Core Licenses should be provided Day One)
10 Switch should have distributed switching – Day One
12 Switch should seamlessly interoperate with existing core switch at Anna University
13 Support for SNMP, RMON, Web based management
14 Minimum 256 K or more MAC address wide from day 1
15 160Gbps (Full Duplex) Per Slot Bandwidth or more
16 Total Switching fabric of minimum 1.6 Tbps or more
17 Throughput of minimum 1200 Mpps or more
18 Should be scalable to support minimum of 6*40Gbe (QSFP+) ports without any replacement in Management Module / Supervisor Engine
19 19” Rack mountable
20 Warranty: 3 Years Comprehensive Onsite warranty with all hardware & software covered
11
TECHNICAL SPECIFICATION FOR SERVERS
Sl. No
Technical Specification Compliance (Yes/No)
Remarks for any deviation
Make: Model:
1 Processors 2x Intel 6 Core Xeon E5‐4610 or higher processor, 2.40GHz, 16MB L3 Cache, upgradable to four processor
2 FSB Up to 7.2 GT/s Quick Path Interconnect (QPI) links
3 Chipset Intel C600 or higher
4 Memory 64GB Memory DDR3 RAM, 1066/1333 Mhz
5 HDD Storage 6 x 600 GB 10K RPM 2.5" SAS Hot Plug HDD
6 RAID RAID5 Controller Card with 512MB Battery Cache
7 Network Interface Cards 1Gbps Network Interface Card
8 Ports Minimum 4 nos. USB and 1 Serial Port
9 Form Factor 2U or 4U Rack Mountable
10 Power Supplies Dual Hot Plug Power Supply
11 Monitor: 18.5” Backlight LED (43.2 cm) TCO‐03 Certified
12 Keyboard and Optical Mouse
13 OS support and Certification All Linux and Windows Operating System Support and Windows Server Certification(2008) & ULCertification
14 ISO 9000‐14001, ISO 9001‐2008, Greenpeace International, should be in the list of top 5 brands asper IDC report published in India during the year 2011‐12.
14 Warranty 3 years warranty with onsite service support
12
TECHNICAL SPECIFICATION FOR 20 TB SAN STORAGE
Sl. No
Technical Specification Compliance (Yes/No)
Remarks for any Deviation
Make: Model:
1 Rack Mount SAN Array must be rack mountable
2 Controller SAN Array should be configured with Dual Controller. (HA and Failover)
3 Front End Connectivity Each controller should be configured with atleast 2x8Gbps FC Ports.
4 Cache SAN Array should be configured with Minimum of 4GB cache per controller with scalability features.
5 Disk Support SAN Array should be configured with minimum of 2 TB HDD.(Nearline SAS HDD)
6 Disk Space SAN Array should be configured with minimum of 20TB RAW Capacity. (Nearline SAS HDD)
7 RAID SAN Array should support RAID Levels: 0, 1, 5
8 Hot Spare Atleast 1 hotspare to be configured per disk array.
9 Redundancy Disk Drives should be hot swappable. Controllers, Fans & Power Supplies should be Redundant
10 Cache Data Backup Cache should be battery backed up for cache memory de‐staging in case of power failure
11 Management Software SAN Management software should be array based and provide GUI / web based management with complete reporting features like LUN Usage, Empty Space etc. It should also support performance monitoring.
13
12 PIT / Snapshot / Clone Software SAN Array should be supplied with Snapshot or Point‐In‐Time copy functionality for snapshot and full copy of theproduction LUN’s / volumes. Software to takeminimum 60 or higher snapshots per volume. Writablesnapshots.
13 Additional Snapshot Features Snapshot software should be integrated with Vshpere 5 using storage API's. With this integration, storage should be recovered at asingle VM level. Storage array should also integrated with VSS provider of Win server 2003/2008 OS toenable to take consistent snap shots of MS‐SQL server / NTFS file system.
14 Disaster Recovery Support Should support SAN array based data replication in synchronous or asynchronous mode.
15 Warranty 3 years warranty with onsite service support
TECHNICAL SPECIFICATION FOR SAN SWITCH
Sl. No
Technical Specification Compliance (Yes/No)
Remarks for any Deviation
Make: Model:
24 port 8 Gbps SAN Switch
1 ‐ 8 Ports licensing ‐ Scalability up to 16 ports ‐ with all necessary software and accessories
2 Warranty: Three Years warranty with onsite service support.
3 Optional Items ‐ 10 Meters Fiber Patch Cords (LC – LC) Cables ‐ Compatible for connecting SAN storage and HBA Cards on the server
14
TECHNICAL SPECIFICATION FOR HBC Grid Cluster
Sl. No
Item Description Compliance (Yes/No)
Remarks for any Deviation
Make: Model: 1.1 General Specification
1 HPC Cluster solution must have servers, housed in its suitable chassis
2 The server must capability to house compute nodes within standard 19” Rack’s footprint.
3 The server must be configured to match the power, cooling thresholds of the datacenter design proposed by the vendor. The HPC Cluster configuration and all other related project requirements must be contained within the datacenter space mentioned along with terms & conditions.
4 Should support remote console access to all the servers.
5 The Servers management/monitoring software must be from the OEM itself.
6 The management software should provide proactive notification of actual or impending component failure alerts.
7 Should be able to perform comprehensive system data collection and enable users to quickly produce detailed inventory reports for managed devices.
8 Should provide for a 3 years comprehensive warranty on Hardware and Software.
1.2 Compute Nodes. Quantity: 4 Nos.
1 Compute Server Configuration should be scalable in mounting standard 19” rack’s footprint.
2 The Server must be configured to match the power, cooling thresholds of the datacenter design.
15
3 Dual Intel Xeon Sandy bridge E5‐2670 or higher Processor Eight‐core 2.6 GHz or better.
4 4 GB per core Memory using 8GB DDR3 ECC Memory @ 1600 MHz speed min.
5 DVD Drive.
6 2×500 GB or more HDD
7 Infiniband QDR Connect X3 HCA single port connected on PCI‐ex gen2 slot.
8 Dual 1 GbE NIC embedded Ports
9 One management Port for in‐band management of servers.
10 Licensed Enterprise Linux OS, fully certified by OEM
11 Redundant power supply
12 Memory : (max) Up to 512 GB DDR3 via 16 or higher DIMM slots (UDIMM/RDIMM/LRDIMM)
13 Cache : 20 MB
14 RAID support Integrated 6 Gbps hardware RAID‐0,‐1, ‐10, optional RAID‐5,‐6,‐10,‐50,‐60 System management IMM v2 with dedicated management port
1.3 Master Node. Quantity: 1 No.
1 Compute Server configuration should be scalable in mounting standard 19” rack’s footprint
2 The server must be configured to match the power, cooling thresholds of the datacenter design.
3 Dual Socket Intel Xeon Sandybridge E5 – 2670 or higher Processor Eight‐core or higher @ minmum 2.6 GHz or better
4 4 GB per Core Memory using 8GB DDR3 ECC Memory @1600 MHz Speed min.
5 DVD Drive.
16
6 2 × 1 TB or more HDD with RAID 1
7 Infiniband QDR ConnectX 3 HCA single port connected on PCI‐ex gen2 slot.
8 Dual 1 GbE NIC embedded ports.
9 One Management port for in‐band and out‐band management of servers.
10 Web based GUI system health monitoring with remote power control.
11 Licensed Enterprise Linux OS. Fully certified by OEM.
12 Redundant power supply
1.4 Interconnect Network
1 Infiniband 4X QDR speed Interconnect Fabric, Fully 100% non‐blocking and standard fat‐tree topology based.
2 Compatible with the latest OFED drivers and OpenMPI libraries.
3 Should be connected to all the infiniband ports in all the proposed servers and storage.
4 The infiniband 4X fabric operating at QDR speeds to be proposed in a chassis switch based configuration
5 Infiniband QDR speed Optical/Copper cables to be proposed.
6 The switch must be populated with 4xQDR ports to meet the cluster requirements. Single core switch configuration required
7 Vendors must provide information on the size (rack form factor), power consumption, cooling needs and the cable wiring related drawings in detail
8 The IB switches scalability to be mentioned.
17
1.4 Cluster Administration Network
1 Modular Gigabit Switch based cluster administration network
2 Network should be based on core chassis based configuration with required number of ports
3 Gigabit Switches and suitable cables as required for the proposed HPC systems and storage must be provided.
1.5 Racks
1 25U Racks with adequate rack accessories and PDU.
2 Neatly structured cabling for all the power and networked connectivity.
1.6 Software Component
1 Master Node should have a suitable software suite to manage the entire cluster. Cluster monitoring like Ganglia are to be incorporated.
2 Job Scheduler with complete support and integration for job submission for the proposed cluster must be quoted.
3 All nodes should contain the GNU based compliers, Message passing Library (open MPI, MPICH2, Scientific & Engineering Computing Libaraies (LAPACK, BLAS, SCLAPACK, PBLAS, ATLAS)
4 Integrated Advanced scheduling features should include cross‐system scheduling peer to peer scheduling, with Advanced fair‐share & Hierarchical fair share scheduling, multi‐cluster scheduling.
5 Complete cluster integration with comprehensive 3 years onsite support to be provided by OEM only for scheduler, integrated Portal framework for job submission and HPC Grid performance analysis
6 HPC Cluster Configuration software must have GUI as well as Web based UI access.
18
1.7 storage Sub‐Systems
1 Single Controller based Storage system with provision to add second controller to be connected to Master Node.
2 Dual Active and Hot Swappable controllers provisions for future.
3 Cache: 1 GB Cache per controller
4 Drive Interface: Two 6 GB SAS Drive Ports
5 Storage: 4 x 2 TB NL SAS 7.2K RPM HDD
6 RAID: 0,1 and 10 to be supported
7 Storage Partitions: Support for up to 128 storage partitions
8 Fans and power Supplies: Dual redundant – hot swappable fans power supply.
19
SL. NO.
ITEM DESCRIPTION QTY in Nos.
UNIT COST (`). TAX (`).
TOTAL AMOUNT (`).
A Networking Core Switch 01
B Servers 08
C 20 TB SAN Storage 01
C1 8 Port SAN Switch 01
C 1.1 Optional Items ‐ 10 Meters Fiber Patch Cords (LC – LC) Cables
‐ Compatible for connecting SAN storage and HBA Cards on the server
01 01
D HPC Grid Cluster
D1 Computer Node 04
D2 Master Node 01
D3 Rack 01
D4 Storage Sub System 01
D5 Interconnect Network
D6 Cluster Administration Network
D7 Software Component
Total Amount (Inclusive of all taxes)
Note: AMC cost for maintenance after the warranty period should be quoted separately, year wise (for 3 Years) .
COMMERCIAL BID
20
BIDDER DETAILS:
Company Name and Address
Contact Person
E‐Mail
Phone
Mobile
FAX
21
BID COVERING LETTER
To: The Registrar,
Anna University,
Chennai – 600 025,
Tamil Nadu, INDIA.
Dear Sir,
Supply and Installation of Networking Core Switch, Servers, SAN Storage and HPC Grid Cluster to the Anna University, Chennai – 600 025.
1. TERMS AND CONDITIONS
a. I/We, the undersigned Bidder(s), having read and examined in detail the specifications and all
bidding documents in respect of this tender do hereby propose to provide goods and services
as specified in the bidding document.
b. I/We, the undersigned Bidder(s), having submitted the qualifying data as required in this
tender, do hereby bind ourselves to the conditions of this tender. In case any further
information documentary proof in this regard before evaluation of our bid is required, I/We
agree to furnish the same on demand to your satisfaction.
2. RATE AND VALIDITY
a. All the rates mentioned in our proposal are in accordance with the terms as specified in bidding
documents. All the rates and other terms and conditions of this proposal are valid for a period of
90 Calendar days from the date of opening of the bid.
b. I/We do hereby confirm that our bid rates include all taxes including Income Tax & Professional
Tax.
c. I/We have studied the Clauses relating to Indian Income Tax Act and hereby declare that if any
Income Tax, surcharge on Income Tax and any other Corporate Tax is altered under the law,
shall pay the same. 3. DEVIATIONS
We declare that all the services shall be performed strictly in accordance with the Technical
specification, Time Schedule and other terms of the tender document except the deviation as
mentioned in the Technical Deviation Proforma. Further, I/We agree that additional conditions, if
any, found in the proposal documents, other than those stated in deviation proforma, shall not be
given effect to.
22
4. BID PRICING
I/We further declare that the rates stated in our proposal are in accordance with your terms and
conditions in the bidding document. 5. EARNEST MONEY
I/We have enclosed the earnest money as specified in the Tender Document. In case of default it is
liable to be forfeited in accordance with the provisions of the tender document. 6. BANK GUARANTEE
If I/We become the successful vendor I/We agree to furnish the amount to the tune of 10% of the total value of the project before releasing the purchase order towards Bank Guarantee. 7. I/We hereby declare that my/our proposal is made in good faith, without collusion or fraud and the
information contained in the proposal is true and correct to the best of my/our knowledge and belief
and nothing has been concealed there from.
Thanking you,
Yours faithfully,
Date: Place: (Signatory) Name: Designation: