statement of work...11. inspection of connector mating on solar panels and shunt packages outside...
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Doc. No.QAG-QAED-EIQCS-SOW-0-01
Revision – 0
STATEMENT OF WORK FOR
SUBSYSTEM PACKAGE INSPECTION AND SPACECRAFT HARNESS
INSPECTION ACTIVITIES
ISRO SATELLITE CENTRE
INDIAN SPACE RESEARCH ORGANISATION
BANGALORE
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1 Introduction
Electrical Inspection & Quality Control section of Quality Assurance
Electrical Division of QAG is responsible for carrying out Quality Assurance
activities of subsystem packages and spacecraft electrical harness realization for
spacecrafts assembled, integrated and tested at ISAC. Since the management is
persuading realization of 12 spacecrafts per year it is required to outsource
various inspection, Quality control and documentation activities to a service
provider who has qualified and skilled manpower to realize onboard subsystem
packages and space craft electrical harness.
2 Scope
The different stages of electronic package fabrication and assembly and
harness fabrication are shown in flow chart-1, flow chart-2. Following
inspection stages are to be out sourced to external contract agency:
1. Card level fabrication audit 2. Package level fabrication audit 3. Package Clearance for vibration 4. Package Clearance for Assembly Integration and Testing Group 5. Harness fabrication audit at harness labs 6. Harness fabrication inspection activities at clean rooms
3 EIQCS responsibility for outsourcing QC inspection / audit work
1. Provide subsystem package / spacecraft harness for inspection. 2. Provide necessary inspection aids, equipments and tools. 3. Provide Checklists, inspection formats, work procedures and
fabrication documents. 4. Supervise & monitor the inspection and quality control activity. 5. Certification for work completion and payment on monthly basis.
4 Vendors responsibility
1. The contract agency shall recruit and sustain the technicians for the period of contract.
2. The contract agency shall Recruit Minimum Diploma (Electronics) qualified personnel.
3. All personnel shall have “Space Quality Electronics Fabrication Course” certificate conducted by PMPG, ISAC (Contractor shall produce proof regarding the qualification(s)). These personnel shall be deployed while initiating the work. For fresh candidates training & certification from PMPG ISAC is mandatory.
4. The fabrication inspection work mentioned in paragraph 5 is to be carried out under the overall supervision and guidance of EIQCS,
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QAED, QAG. In the event of unsatisfactory work performance from the contractor, the contract shall be terminated.
5. PERIOD OF CONTRACT: The contract will be initially for two years and may be extended for one more year on reviewing the performance. There should be continuity in work without break during the contract period.
6. PLACE OF WORK AND DURATION: The inspection work has to be carried out as and when the activity completes at CEFS / Clean rooms at ISAC & ISITE. The normal working hours on week days i.e Monday to Saturday is from 8.30 A.M. to 5.00 P.M (~26 Days a Month). However, during peak work load / panel closing activity in clean rooms, work has to be carried out beyond 5.00 P.M. on week days and also on holidays in shift pattern / extended working hours.
7. All security restrictions shall be strictly complied by the contract personnel.
8. The persons deputed to labs at ISAC shall not pass any data / information / test results to any outside party at any time during their contract period or thereafter.
9. The personnel shall use all equipment and tools with utmost care to ensure that there is no damage to the same.
10. The contract personnel shall inspect / audit The subsystem package / harness as per the wiring details / audit formats and checklists provided, which contains the specifications and parameters to be checked.
11. After completing the Inspection /audit, the contract personnel have to prepare inspection reports, fill audit formats and check lists.
12. The contract personnel have to report to Head, QAED or his authorized nominee
5 Work Details
5.1 Details of inspection procedures / activities during audit
5.1.1 Visual Inspection during audit:
During audit Visual examination / inspection of onboard assemblies and sub-assemblies
is carried out on 100% basis for processes like inspection of turret swaging,
components mounting, component solder joints, assembly cleaning, lacing, conformal
coating, potting, radiation shielding, crimping etc. These inspections will be carried out
as per the inspection standards and applicable documents specified in
1. Workmanship Standards for the Fabrication of Electronic Packages
Doc.No. ISRO-PAX-300
2. Card level audit check list :: QAG-QAED-EIQC-ASY-CHL-001
3. Package Level audit check list :: QAG-QAED-EIQC-ASY-CHL-002
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4. Card/Package Audit Certificate format :: QAG-QAED-EIQC-ASY-RPT-
001
5. Pre-certificate format :: PRE-CERT/001
6. Checklist for discrete component addition in harness :: QAG-QAED-
EIQC-HRF-CHL-020
7. Harness Audit Checklist :: QAG-QAED-EIQC-HRF-CHL-021
8. Panel Closure Checklist :: QAG-QAED-EIQC-HRF-CHL-022
5.1.2 Audit activity involves
1. Inspection with unaided / aided eye.
2. Record observations with respect to specifications
3. Perform Accept / Reject function
4. Record deviations if any.
5. Preparation of Card level / Package level / Harness fabrication
audit reports
6. QC data entry, documentation, etc,. Maintenance of
Documentation and records
5.2 Card level fabrication audit
Card level audit comprises of visual inspection of hardware,
verification of approval of fabrication documents, verification of process
history sheet, verification of inspection records & checklist, verification
of implementation of Rework Data Cards (RDC), checking the records
of Non conformances and implementation of MRB dispositions, waivers
and deviations. The card level audit stage is depicted in flow chart-1.
The card level audit shall be conducted as per card level audit checklist.
Quantum of work is depicted in Table -1.
5.2.1 Major Processes involving card level fabrication
1. Turret swagging/soldering
2. Component Mounting
3. Component Soldering
4. Card Cleaning
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5.2.2 Card level Audit for External vendors
5.2.3 Card level workmanship audit shall be carried out, for every subsystem package being fabricated.
5.2.4 The audit shall be carried out after completion of final assembly approval by vendor.
5.2.5 One card per package and all card level documentation shall be audited. Component Values, voltage, tolerance & established reliability data etc are to be checked.
5.3 Package level fabrication audit
Package level audit comprises of visual inspection of hardware,
verification of approval of fabrication documents, verification of process history
sheet, verification of inspection records & checklist, verification of implementation
of Rework Data Cards (RDC), recording of Non conformances and
implementation of MRB dispositions, recording of waivers and deviations. The
package level audit stage is depicted in the flow chart-1. The audit shall be
conducted as per checklist for package level inspection activities. Quantum of
work is depicted in Table -1.
5.3.1 Major Processes involving Package level fabrication Audit :
1. Selectable components mounting
2. Package wiring
3. Package lacing
4. Package cleaning
5. Conformal coating
6. Potting
7. Radiation shielding
The audit shall be conducted as per checklist for package level inspection.
5.3.2 Package level Audit for external vendors.
5.3.3 All Cards from Digital, controls, Power system packages are audited for workmanship.100% package documentation (including RDC’s) is to be audited.
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5.3.4 Clearance to Vibration
This stage is shown in flow chart-1 and shall be done as per QC checklist for vibration clearance. Quantum of work is depicted in Table -1.
5.3.5 Clearance to AIT
This stage is shown in flow chart-1 and shall be done as per QC checklist for AIT clearance. Quantum of work is depicted in Table -1.
5.4 Processes involving Harness fabrication inspection activities
5.4.1 Harness fabrication audit at harness lab.
Harness fabrication audit comprises of visual inspection of harness,
verification of approval of fabrication documents, verification of work sheets for
inspection records & checklist, checking the records of Non conformances and
implementation of MRB dispositions, waivers and deviations. The harness audit
stage is depicted in the flow chart-2. The harness audit shall be conducted as per
harness audit checklist. Quantum of work is depicted in Table -2.
5.4.2 Harness fabrication inspection activities
1. Inspection of modifications in harness & reworks involving
crimping of contact, Sleeve shrinking and Contact retention.
2. Inspection of heaters wiring with butt splice contact crimping /
soldering, sleeve shrinking.
3. Inspection of thrusters wiring.
4. Participation in wet probe test.
5. Harness routing inspection.
6. Inspection of clearance between packages and harness running
around the packages.
7. Inter panel wire harness inspection.
8. Wire routing inspection of heater wires, temperature sensors,
RCS, semi rigid cables, antenna, sensors heads, etc.
9. Routing of electrical ground wires from the shield splice formed on
the wire harness.
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10. Inspection of connector identification and mating to the
concerned packages.
11. Inspection of connector mating on solar panels and shunt
packages outside spacecraft.
12. Inspection of Harness Lacing, EMI taping, Teflon tapeing of the
wire harness.
13. Inspection of ESD grounding for harness.
14. Inspection and clearance of all panels before closure.
15. Online inspection of patch connector mating between panels and
spacecraft deck.
16. Inspection of MLI (Multi Layer Insulation over plumb lines,
battery, satellite, etc.) ground soldering.
17. Inspection of satellite ground reference plane (SGRP) grounding
(Wire routing, soldering, lacing, conformal coating).
18. Inspection of sun sensors wiring on solar panels.
19. D' Sub Connector and feed through potting inspection.
20. Potting of connectors that are fabricated after the closure of the
spacecraft panels.
21. Inspection of Eccobond of mechanical fasteners.
23. Others (as specified by the project).
Due care shall also be exercised during such inspection to avoid ESD
damage to electronic packages. All inspections shall be performed as per QC
checklist for harness fabrication. Quantum of work is depicted in Table -2.
6 Skill and educational qualification
Sl.No. Inspection Activity Qualification No. of personnel
1. Inspection / Audit of subsystem Package fabrication
Diploma in electronics
3
2. Spacecraft Harness fabrication Inspection/ Audit
Diploma in electronics
4
Total 7
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All personnel planed to be deployed shall have space quality electronic
fabrication training certificate issued by SRG, ISAC. Fresh candidates shall
undergo training program conducted by PMPG, RQA and can be deployed for
the activities only after successful completion of training and certification.
Mandatory educational qualifications / skills / Experience required.
1. Name of the person who will be deployed. If personnel are already deployed in other contractual work, No Objection Letter (to relieving them from current activity) from that contract manager should be attached along with the quote.
2. At least three personnel to be deployed should have already passed Space Quality Electronic Fabrication (SQEF) training course conducted by PMPG, ISAC. These names shall be submitted along with the offer which be verified using the internal records.
3. Educational Qualifications ( Minimum Diploma in Electronics Engineering). Proof which will be verified during selection of candidates.
4. Vendor shall have minimum of one year experience in execution of satellite electronic assembly fabrication / inspection activities. Proof of which should be submitted along with the offer.
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Table-1 Quantum of work for Subsystem Package Fabrication Inspection Activities
Sl.
no
Inspection activity Approx. work
quantity per annum
Number of
units per
annum
1. Card Level audit Activities
Verification of hardware (sample basis)
Verification of documents / reports for the following processes 100% o PCB cleaning / PCB baking o Turret Swagging & soldering o PTH filling o Component Mounting o Component soldering o Card cleaning o Clearance for F/T o Approval for final Assembly
360 cards
1800 Documents
2160
7200
2. Package Level audit Activities
100% Verification of hardware
100% Verification of documents / reports for the following processes o Selectable & on-box component
mounting o Selectable & on-box component
soldering o Package wiring o Package cleaning o Lacing o Conformal coating o Potting, doubler bonding, staking o Radiation shielding o Rework
360 Packages
360 Documents
1800
1800
3. Clearance for Vibration test
100% Verification of hardware for o Package number o Package connectors
100% Verification of documents / Package history for o RDC implementation o MRB recommendation
implementation o Clearance from RAED, RAMD &
Vendor
360 Packages
360 Documents
360
360
4. Clearance for AIT
100% Verification of hardware for o Package number identification
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Sl.
no
Inspection activity Approx. work
quantity per annum
Number of
units per
annum
o Connector identification o Package damages due to
handling
100% Verification of documents / for Package history clearance
o Clearance from RAED o Clearance from RAMD o Clearance from VENDOR
360 packages
360 Documents
1800
1800
5. Others (Miscellaneous) Pre-certificate preparation
- 720
Total Units 18,000
Total assembly area work units for two years = 36,000
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Table -2 Quantum of work for Harness Fabrication Inspection Activity
Sl.no. Inspection activity Approximate Quantity
of work per annum
Number of units
Per annum
1. Inspection of Contact Crimping, Contact Sleeve Shrinking & Contact Retention Test
24,000 Contacts 8000
2. Inspection of Ground Lug Shield Soldering & Sleeve Shrinking/ Hook soldering & sleeve shrinking/ SGRP / ESD / MLI ground / ground links soldering
1700 Joints 1700
3. Inspection of Rework / modifications inspection
3000 joints 1500
4. Ecco bonding & Potting(Selective)
600 connectors 600
5. Inspection of lacing, anchoring, tying, sleeving, protection of harness
2500 branches 5000
6. Butt splice, heaters, Temperature sensors wiring , extension of lines etc.
2500 Joints 2500
7. Semirigid cable inspection 1600 joints 1600
8. Audit of worksheets & hardware
200 cables 200
9. Panel clearance/ DOR verification
2000 sheets 2000
10. Others (miscellaneous) Quality Appraisal report
32 panels 900
11. Total Units 24000
Total harness area work units for two years = 48,000
Total work units for two years: 36,000 + 48,000 = 84,000
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Flow chart-1 :: Electronic assembly audit / inspection work flow
Electronic assembly wiring by External vendor and online QC inspection by the vendor
Card level Audit by EIQCS & Clearance
Package wiring by the vendor and online QC inspection by vendor
Package level audit by EIQCS
Vibration preparation by the vendor ; OLQC Vendor Inspn.
Vibration clearance by EIQCS
AIT clearance preparation by vendor ; OLQC Vendor Inspn.
AIT clearance and precertificate by EIQCS
Electronic assembly wiring by CEFS, ISAC or ISITE Online Inspection by OLQC, CEFS
Card level audit by EIQCS on selected hardware
Semirigid cable assembly wiring at CMG
Inspection & clearance by
EIQCS
Note : Grey colour boxes are EIQCS activities
Necessary checklists and work instructions will be provided by EIQCS staff.
Draft audit report shall be prepared by the inspector
Audit report is reviewed by the engineer in-charge (EIQCS staff) prior to release
Audit certificate & Pre-certificate shall be prepared by EIQCS staff only.
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Flow chart-2 :: Spacecraft harness inspection / Clean room support work flow
First end Harness wiring at CEFS / Harness lab by CEFS /Vendor, Online inspection by OLQC CEFS / Vendor QC
Wet probe test and witness by OLQC
Second end Harness wiring at CEFS / Harness lab by CEFS /Vendor, Online inspection by OLQC CEFS / Vendor QC
Wet probe test of panel harness and witness by EIQCS , followed by baking
Harness audit by EIQCS Work sheet verification & Harness inspection clearance by EIQCS
Harness final wiring in clean room by CEFS / Vendor
Online inspection and clearance by EIQCS
Thermal and propulsion elements related wiring , Micro switch, PRT wiring at clean room
Online inspection and clearance by EIQCS
Copper taping , potting,
eccobonding etc,
Online inspection and clearance by EIQCS
Panel closure preparation by Integration / CEFS
DOR /Connector worksheet verification & Committee mode panel closure clearance by EIQCS
Note : Grey colour boxes are EIQCS activities
Necessary checklists and work instructions will be provided by EIQCSstaff.
Draft audit report shall be prepared by the inspector
Audit report is reviewed by the engineer in-charge (EIQCS staff) prior to release
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