Solid-State LiDAR ToF Image Sensor

Nanjing visionICs microelectronic technology Co.,Ltd

Scope

§Address cost, reliability and high-volume production issues inthe existing 3D-Camera and LiDAR Systems

– Leading ToF IC solution provider– Low cost, low-power and high-performance LiDAR receiver SoC– Leading solutions for the chip level optical detection and processing

§Our offerings– ToF receiver sensor & laser driver

– Solid-state LiDAR module

– Single photon detector (400-940nm, 1100-1550nm)

§Oct 2016 founded，Headquarter locates at Jiangbei, Nanjing§ Pre-A: ￥50M, closed at Jun 2018， post-valuation: ￥210M

2visionICs Confidential

ToF for Mobile

• ToF for face ID, challenges?• Depth resolution down to 1mm• Pixel Resolution: 480x320• Against strong sunlight

interference

• Back ToF camera• Sub-cm depth resolution• 10m range• VGA resolution @30fps• Against strong sunlight interference

• Huaiwei P30 Pro and Vivo NEX2 at 2019• Use cases for Mobile, waiting for market proven!

• Augment gaming?

Structured Light approach has been chosen as a starting point for the 3D by Apple. The front 3D module could evolve toward ToF technology in the future.

Low cost, more reliability in direct sunlight and lower computation

Potentiality ofAugmented Reality Complicated

Sensor Design!!!

4

Existing ToF application at Mobile (SPAD ToF )

5

Major suppliers：ST Microelectronics，Till July 2017,300M shipments, used over 80 different smartphonesof 15 different brands

Brands：AppleHuaweiLGSonyLenovoASUS

HTCOne PlusMEIZUOPPO

[AMS]

visionICs2019/9/29 8

3D Imaging

Triangular Structured Light Time-of-Flight (ToF) FMCW

Direct ToFIndirect ToF

Light Source

APD SPADPIN

CMOS\CCD

APD

PassiveStereos Camera

3D Techniques [AMS]

Direct ToFIndirect ToF

Time-of-Flight

Direct ToF Indirect ToF

Laser Modulation Narrow pulse Continuous or wide pulseMeasurement Round trip time Phase shiftCircuits blocks PIN/APD/SPAD+TDC+MCU PIN/APD/CMOS+TAC+ADC+MCU

Cost Similar SimilarDetection Range Longer @ same optical power Shorter @ same optical power

Multi. Obj. Det. Yes NoDepth Resolution <1cm <1cm

Power Low High

ToF advantagesn Compact constructionn Ease of usen Long detection range

n Accuracy of <1cmn High frame raten Low computation

complexityn work outdoor

9

Sensing Area

visionICs ToF Ranging/Imaging SoCs and Modules

ToF Ranging Sensor(S4)：2mm×1.8mmSensing Area ：264μm × 264μm ，18 × TDCCMOS 130nm

ToF Imaging Sensor (A4)：6.3mm×5.5mmPixel Size ： 64×32 (Macro) /256×64(Micro)180mW power @ CMOS 130nm

ToF Ranging Sensor(S3):1.5mm×1.3mmSensing Area：80μm× 40μm, 1 × TDCCMOS 180nm

ToF Imaging Sensor (A3)：4.8mm×3.4mmMarco Pixel Size：32×32/64×32100mW power @ CMOS 180nm

3rd Generation 4th Generation

3.5×3.3×2 cm3

ToF Ranging Prototype

ToF Imaging Prototype

10

Ranging

Imaging

Single Photon Sensing Area

Single Photon Sensing Array Single Photon

Sensing Array

Single Photon Sensing Area

VI4300

VI4302VI3801

11

Vacuum Robots:1.Avoidance2.SLAM

Modules Typical Value（Ranging）Distance Measurement: 0.1m - 250mMeasurement Accuracy: ＜2m:±2cm, ＞2m:±1%Frame Rate: 1Hz - 5KHzAmbient Light: Up to 100KLuxPower: 30mW

SoCs Typical Value（Ranging)Sensor Size: 2mm x 1.8mmSensing Area: 264um x 264um, 18 x TDC(50ps)CMOS 130nm

AGV：1.Avoidance2.SLAM

Mobile:Camera laser focus

UVA:1.Avoidance2.Altimeter

ADAS: 1.Avoidance2.SLAM

Applications: ToF Range SoCs and Modules

ST ships out over 100M pcs a year

12

Modules Typical Value（3D Imaging）Distance Measurement: 0.1m ~ 30mMeasurement Accuracy: ＜1%@40% ReflectivityFOV: 120° x 60°Frame Rate: Up to 30-FPSAmbient Light: Up to 100KLuxPower: ＜ 200mW

SoCs Typical Value（3D Imaging)Sensor Size: 6.3mm×5.5mmPixel Size: 64×32 (Macro) /256×64(Micro)CMOS 130nm

AGV、Robots：1.SLAM replacing rotation method2.Avoidance

Mobile:1.ToF Camera2.Face ID

ADAS: 1.Gesture recognition2.L3 / L43.Avoidance & SLAM

Others

Applications: ToF Imaging SoCs and Modules

Company Overview

19

• Santa Clara Site, CA, USA– 2,000 sqft office

– 5 employees

– Leading technology R & D

– Developing ToF sensor IC for LiDAR system

• Nanjing, Jiangbei New Area, China– 18,000 sqft office

– 46 employees, 2019

– LiDAR IC & system design

– Optical system collaborated with the leading

optics manufacturer at China

visionICs2019/9/29

Founder & CEO

visionICs2019/9/29 20

Cheng Li （BS: Southeast University；Ph.D：Texas A&M University)

• Former Principal Scientist, HP Labs, Palo Alto, US: led and participated several USgovernment research projects, accumulated funding of $60M;

• Research topics include: high-speed CMOS SerDes, LiDAR, high-speed & low-power siliconphotonics design and manufacturing;

• Former Senior Scientist, NEC Lab, Princeton, New Jersey: worked on NEC’s long-hauloptical communication projects

• Alcatel-Lucent Shanghai, 3 years of R&D + 3 years of marketing ;• 20+ USA/International patents, 100+ acdamic papers, 1 published book, 800+ citations;• 3 ISSCC and 4 JSSC publications (Top IC design conference and Journal worldwide), 1 TCAD

publication on computer architecture；• 2015-2016: Committee of AIM Photonics (American Institute for Manufacturing, Integrated

Photonic);• Committee of IEEE International Conferences (BCTM, CSICS, MWSCAS);• Invited lecture EE382C (High-speed interconnects section) at Stanford University，2016.

Nanjing visionICs microelectronic technology Co.,Ltd