redesign of die internal structure dr. henry tan school of mechanical, aerospace and civil...
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Redesign of Die Internal Structure
Dr. Henry TanSchool of Mechanical, Aerospace and Civil Engineering
The University of Manchester
Finite Element Modeling
Commercial software: ANSYSABAQUS
Thermal, structural analysis
Mathematical details skipped
Model Cooling Process
Sequentially coupled thermal/structural analysis:
Input of structural analysis depends on the results from thermal analysis.
1st step:Geometry/Mesh Generation
3D Mesh Generation
Previous experience: 2D
3D Geometry description3D mesh generation
Same Mesh for Thermal/Structural Analysis
Same meshDifferent thermal/structural element
In sequentially coupled thermal/structural analysis:
Geometry description
2nd step:
Coupled Fields Analysis
Basics for Thermal Analysis
Solve the heat balance equation
Finite element solution gives:Nodal temperature
Transient Thermal Analysis
Time dependent cooling load50C/hour, to 500C
Initial temperature distribution (at all nodes)900C
Need to define:
Boundary condition
Initialcondition
Thermal Stress Analysis
Input: nodal temperatures that a transient thermal analysis calculates
Output: thermal stresses
Solve the force balance equation
Thermal Material Properties
Temperature dependence -> Nonlinear thermal analysis
Thermal conductivity, 10.5 W/Km @ 20 C 30 W/Km @ 1000 C
Structural Material Properties
Plasticity -> Nonlinear structural analysis
0.2% proof stress (as cast): 280 N/mm2@20C, 195 N/mm2@870C 110 N/mm2@900 C
80 N/mm2@1000 C, 45 N/mm2@1100 C
Ultimate Tensile Strength: 470 N/mm2@20C, 250 N/mm2@870C, 145 N/mm2@900C, 92 N/mm2@1000C, 53 N/mm2@1100C
Thermal expansion coefficient: 20-600C 17.8 x 10-6
20-800C 18.2 x 10-6
20-1000C 18.9 x 10-6
Results from Finite Element Modeling
• Temperature-time curves for selected locations (corners)• Stress-time curves for selected locations (corners)• distortion-time curves for selected locations (corners)
• Temperature field (picture) at selected cooling time• Stress field at selected cooling time• Deformation field at selected cooling time
• Animation for temperature evolution on the die surface• Animation for stress evolution on the die surface• Animation for deformation evolution on the die surface