radar technologies for automotive 2018 report by yole développement
TRANSCRIPT
From Technologies to Markets
Sample
November 2017
Radar Technologies
for Automotive
Courtesy of Audi
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TABLE OF CONTENTS
Part 1/1
Scope of the report 05
Introduction, definition & methodology 15
Executive summary 30
History and Overview 45
o History of Radar
o Frequency regulation
o Automotive use cases
o Benchmark with Camera, Lidar and Ultrasonic
Market forecast 65
o Market drivers
o Radar modules ($M, units)
o Radar chips ($M, units)
o Market share
Supply chain & ecosystem 80
o Ecosystem
o Module maker
o Chip maker
o Start up landscape
Technology overview 90
o Radar architecture
o Modulation techniques
o Antenna technologies
o Digital and analog beam forming
o Introduction to software
Radar evolution trend 110
o From dedicated to multimode
o Resolution, 3D and imaging
o Antenna and beam management
o Chip integration, node shrinking
Other radio based technology introduction 125
o Introduction to WiFi, BT, NFC
o Introduction to GNSS
o Vehicle communication technology,V2X
Conclusion & Perspectives 135
Yole’s presentation
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SCOPE OF THE REPORT
Full radar sensor review
Radar for automotive at module & chip level
Radar technologies overview (SiGe BiCMOS, Si RFCMOS)
Signal processing and analysis technologies
Introduction to connected vehicle & infrastructure
Data management & infotainment
Not included in the report
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WHO SHOULD BE INTERESTED IN THIS REPORT?
• Radar device manufacturers
Evaluate market potential of future technologies and products
Understand the differentiated value of your products and technologies in this market
Build a roadmap for modules: which type of modules? When?
Identify new business opportunities
Identify potential strategic partners or technology providers
Monitor and benchmark your competitor’s advancements
• Material and equipment suppliers, packaging houses
Understand what are the applications that will drive the volumes in 2020
Identify new business opportunities and prospects
• Specialists of microcontrollers, baseband/ transceiver, application processor…
Spot new opportunities and define diversification strategies linked to sensor / data fusion
• Automotive OEMs
Evaluate market potential of future technologies and products to differentiate your products
Evaluate the benefits of using these new technologies in your end system, design architectures for the next generation of systems
• R&D centers
Evaluate market potential of future technologies and products for new applicative markets
Identify the best candidates for technology transfer
• Financial & strategic investors
Understand the structure and value chain of the cellular handset andmedia tablet industry
Estimate the potential of new devices such as proximity sensing orimaging radar
Get the list of the main key players and emerging start-ups of thisindustry worldwide
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Biographies & contacts
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ABOUT THE AUTHORS
Cédric Malaquin
As a Technology & Market Analyst, specializing in RF devices & technologies at Yole Développement (Yole), Cédric Malaquin is involved in the
development of technology & market reports as well as the production of custom consulting projects. Prior to working with Yole, Cédric was
employed at Soitec as a Process Integration Engineer for nine years, and then as an Electrical Characterization Engineer during six years. Cédric has
contributed heavily to FDSOI and RFSOI product characterization and has authored or co-authored three patents and five international publications
in the semiconductor field. Cédric graduated from Polytech Lille in France with an engineering degree in Microelectronics and Material Sciences.
Claire Troadec
Since 2013, Claire Troadec has lead the RF activity at Yole Développement. After graduating from INSA Rennes in France with an engineering degree inMicroelectronics and Material Sciences, she joined NXP Semiconductors, and worked for seven years as a CMOS Process Integration Engineer at theIMEC R&D facility. During this time, she oversaw the isolation and performance boost of CMOS technology node devices from 90 nm down to 45 nm.Claire has authored or co-authored seven US patents and nine international publications in the semiconductor field, and she managed her owndistribution company before joiningYole Développement.
6©2017 | www.yole.fr | Radar Technologies for Automotive | Sample
INTRODUCTION
Report Scope
Best of Yole’sautomotive radar industry knowledge
This Yole Développement report is an entirely new analysis of the currentRADAR trends for automotive. It covers technology and application trends,and provides all of the data and insights required this dynamic market
Applications are presented to provide rapid access to key information such as functions,
specifications, technical solutions, geography, trends, market evolution, with graphical representations
of the industrial chain.
This report combines the best of Yole’s automotive radar industry knowledge. Yole regularlyparticipates in industry conferences and tradeshows worldwide, and has close relationswith market leaders. This report presents our analysts’ synthesis of the knowledgeprovided to them by various market leader regarding the status of the sensor industry forautomotive, and also explore future trends
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INTRODUCTION
Automotive sensing : mature but still highly dynamic market
A 40 years old market, still highly dynamic
Despite its age and its maturity, automotive has known many unexpected development forthe past two years. And as it has always been the case, it is the safety which keeps drivingthis market. Most of the players (OEMs and Suppliers) are now investing in technologiesto develop the autonomous vehicles. Automation will accelerate the development ofRADAR complementary with LiDAR and camera module…
In this report we’ll discuss the different RADAR module involved in standards and autonomous systems. The roadmaps and forecasts shown withinrepresent the diffusion of the different RADAR, optional or not, that we’ll find in high-end and middle-end cars.
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REPORT OBJECTIVES
This report’s objectives are as follows:
To provide radar for automotive
Unit shipments and revenue at module level and chipset level
Average selling price analysis, and expected evolution
To provide an application focus on key existing markets and the most promising emerging ones
Functions used, critical specification requirements, level of assembly and technology choices
What are the major drivers? What will the market look like in 2020? in 2030?
To provide an analysis of the major technology trends:
Expected evolution for current technologies’ performance level, price, and more
To provide a deep understanding of radars for automotive industry’s value chain, infrastructure, and
players:
Extensive list of radar manufacturers worldwide and their technology offer
List of key integrators worldwide
Provide a deep understanding of radar for automotive industry
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METHODOLOGIES & DEFINITIONS
Yole’s market forecast model is based on the following elementary structured blocks:
Yole’s analysisframework
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REPORT METHODOLOGY
Market segmentation methodology
Market forecast methodology
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REPORT METHODOLOGY
Technology analysis methodology Information collection
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COMPANY CITED IN THIS REPORT
Acura, Airgain, Alfa Romeo, Analog Device, Anatel, Arbe Robotics, Argo AI, ARTSys360, Autoliv, Autoroad, Automotive DistanceSystem Control, Audi, Bentley, BMW, Bosch, Broadcom, Bugatti, Buick, Chevrolet, Chrysler, Codha Wireless, Commsignia,Continental, Cruise, Cypress, Daihatsu, Denso-Ten, Delphi, Echodyne, Fiat, Fomoco, Ford, Furuno, Geely, Gemalto, General Motor,GlobalFoundry, GMC, Hamaton, Harada, Harman, Hella, Honda, Hyundai, IMST, InnoSent, Infineon, Infinity, Jaguar, Jeep, Kia, Laird,Lesswire, Lexus, Lincoln, LM technologies, Mando, Marvell, Maxim Integrated, Mercedes, Metawave, Melexis, Mini, Mitsubishi,Murata, Nanoradar, Neteera, Nissan, Novatel, NuTonomy, NXP, Oculii, Omniradar, Ottomatika, Oryx, OriginGPS, Panasonic,Peugeot, Porsche, Redpine signals, Renault, Qorvo, Qualcomm, Range Rover, Samsung, SAIC, SEAT, Semtech, Sierra Wireless,Skyworks, Skoda, ST Microelectronic, Subaru, Telit, Tesla, Texas Instrument, Tata,Toshiba,Toyota,TowerJazz,TpsCo,Trimble, Ublox,Uhnder, United Monolithic Semiconductors,Valeo,Vayyar,Volkswagen,Volvo,Wieson, ZF-TRW and more.
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GLOSSARY
ALC Active Lane Control
AP Automated Pilot
AHD Automated Highway Driving
AEB Automatic Emergency Braking
AEB VRU Automatic Emergency Braking Vulnerable Road User
ACC Adaptive Cruise Control
AVP Automated Valet Parking
BSD Blind Spot Detection
CC Cruise Control
CP Child Protection
CTA Cross Traffic Alert
CDO Car Door Opener
CM Collision Mitigation
C-V2X Cellular Vehicle to Everything
DM Driver monitoring
DSRC Dedicated Short Range Communication
FCW Forward Crash Warning
FOV Field Of View
GNSS Global Navigation Satellite System
KP Knee Pedestrian
LCA Lane Change Assist
LDW Lane Departure Warning
LiDAR Light Detection And Ranging
LKA Lane Keep Assist
LRR Long Range Radar
MESA Metamaterial electronically scanning array
MOSARIM More Safety for All by Radar Interference Mitigation
mmW Millimeter Wave
MRR Mid Range Radar
OD Occupancy Detection
PA Parking Assistance
PCW Pre Crash Warning
PLL Phase Locked Loop
PS Proximity Sensing
RaDAR Radio Detection And Ranging
RCTA Rear Cross Traffic Alert
RCW Rear Crash Warning
RPCW Rear Pre Crash Warning
SFPA Series Fed Patch Antenna
SGR Simple Gesture Recognition
SBR Seat Belt reminder
SRR Short Range Radar
TSR Traffic Sign Recognition
TJA Traffic Jam Assist
UP Urban Pilot
VEA Vehicle Exit Assist
VCO Voltage Control Oscillator
VP Valet Parking
V2V Vehicle to Vehicle
V2I Vehicle to Infrastructure
V2N Vehicle to Network
V2X Vehicle to Everything
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AUTOMOTIVE MARKET TRENDS
Heading towards 100M vehicles per year
2009 2010 2011 2012 2013 2014 2015 2016 2017e 2018e 2019e 2020e 2021e 2022e CAGR
Africa 1,2 1,3 1,5 1,6 1,7 1,7 1,8 1,8 1,9 1,9 2,0 2,1 2,2 2,3 4%
Asia 28,3 35,2 35,4 38,2 40,6 42,6 44,2 46,0 47,8 49,6 51,6 53,6 55,7 57,8 4%
America 17,5 19,7 21,6 23,7 25,0 25,5 26,0 26,5 27,0 27,6 28,1 28,7 29,3 29,9 2%
Europe 18,6 18,8 19,7 18,7 18,3 18,5 18,9 19,2 19,6 20,0 20,4 20,8 21,2 21,7 2%
TOTAL 65,6 75,0 78,2 82,2 85,6 88,2 90,9 93,5 96,3 99,1 102,1 105,2 108,4 111,6 3,0%
YoY (%) 14% 4% 5% 4% 3% 3% 3% 3% 3% 3% 3% 3% 3%
0
20
40
60
80
100
120
2009 - 2022 light vehicle market forecast (in M units)The automotive market’s recovery is mainly due to high growth in China, and Asia in general
50% of the market is now located in Asia
We are heading towards 100M units shipped annually by 2019. The global light-vehicle market is growing in volume at a 3% CAGR.
Yole Développement © June 2017
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SENSOR IN AUTOMOTIVE NAVIGATION
Radar sensor complement imaging & ultrasonic device
LRRACC, FCW, AEB
SRR/MRR
CTA, ALC
mmW
radar
Blind-spot, side-view (mirrorless cars),
accident recorder, rear park assist
Stereo cameras: direction & distance for
LDWS & traffic sign recognition
LIDAR
Night vision cameraPedestrian / animal detection
3D cameras
Gesture recognitions
presence detection,
driver monitoring
Visible cameras
3D mapping of surroundings
SRR/MRR
BSD, LCA
RCTA, AVP
Light detection
and ranging
Imaging
Ultrasonic
SRRVEA
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SENSOR BENCHMARK
Ideal sensormust combine good behavior on range, velocity, angular resolution. It should operate under every condition.
IR
US
Good for short range.
Wide FOV. Low cost.
Affected by rain & dust.
Not good for velocity.
Not good for angular resolution.
Affected by noise & wind.
Limited to short range
Low cost.
LaserHighly directional.
Excellent for range.Limited FOV.
Affected by rain, fog.
CameraGood FOV.
Acceptable range up to 100m.
Object classification.
Not good for velocity measurement.
Do not operate under night condition.
Radar
Lidar
Excellent for range up to 250m.
Ideal solution for velocity.
Good angular resolution.
Robust in every weather condition.
Good cost roadmap.
No object classification yet
Best range, velocity and angular
resolution.
Very wide FOV.
High cost.
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AUTOMOTIVE RADAR USE CASES
Radar enable numerous use cases from short to long range.
LCARCTA
FCW
ACC Stop & Go
Range
AEB
BSD ACC
AVP
LongMediumShort
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FREQUENCY REGULATION
24 GHz tend to be replaced by 77 GHz then usedfor both short& long range
24 GHz UWB (21.65-26.65)
24GHz NB (24.05 to 24.25)
77 GHz (76-77)
79 GHz (76-81)
Range ShortResolution HighInteroperability BadApplication BSDProhibited
in Europe
after 2022
Range Medium to longResolution MediumInteroperability GoodApplication ACC, AEB
Worldwide
agreement
MOSARIM project
79GHz projet
FCC agreement
07/17Range Short to mediumResolution HighInteroperability GoodApplication AEB pedestrian, PA
Range ShortResolution PoorInteroperability GoodApplication BSD
ISM band
limitation
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FOCUS ON EUROPE AND USA INCENTIVE SAFETY POLICY
European and US safety bodies incent OEM for high level safety system.
20 OEM commitment
for AEB system as a
standard equipment
2022202020182016
1st to announce
AEB system for 80% of its cars
2014
- AEB
Interurban
City
- LDW
Safety rating
program
- AEB VRU
pedestrian
- LKA
- AEB VRU
cyclist
- Road departure
- Road intersection
- Night & obscure lighting
AEB target for 2018
- AEB
Head on
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AUTOMOTIVE SAFETY/CONVENIENCE APPLICATIONS EVOLUTION
70% of safety applications require RaDARtechnology. 2000 2010 2016
Basic Safety application
+ Antilock brake system
Convenience applications
+ Cruise control
Advanced safety applications
+ Electronic Stability Control
+ Blind Spot Detection
+ Forward Collision Warning
+ Rear Collision Warning
+ Lane Departure Warning
+ Vehicle Exit Assistant
ADAS applications
+ Adaptive Cruise Control
+ Automatic Emergency Braking
+ Pedestrian AEB
+ Cyclist AEB
+ Rear Cross Traffic Alert
+ Lane Change Assist
2025
Partially Automated Safety
+ Avoidance of Lateral Collision
+ Lane Keep Assist
+ Traffic Jam Assist
+ Traffic Continuous Indication
Advanced Convenience application
+ Remote Park Assist
+ Valet Parking
2030
Fully Automated Safety
+ Traffic Jam Pilot
+ Highway Pilot
+ Urban Pilot
Short Range
Long Range
Short/Mid/Long Range
Multi-Mode
High resolution
Short/Mid Range
High resolution
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NEXT GENERATION RADAR
Promising Radar developmentcould enable all these requirement.
Courtesy of NXP
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TODAY RADAR MODULE SPLIT AMONG AVAILABLE REFERENCES
xx% of available radar references are devoted to short range application.
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RADAR STARTUP LANDSCAPE
More than xx startup in radar technology
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RADAR MODULE TEARDOWN
Multiple complex architecture.
Delphi RaCam
Bosch LRR4
Beam forming / elevation beam
Continental ARS4-A
Digital beam forming
Autoliv MRRV1
Multimodal FM sweep (adress different range)
Bosch MRR1 Plus
Rx Tx PA
RxTx
Rx Rx
RxRx
VCOTx Tx
Rx Tx
TxRx Rx Rx
Freq synthé from ADI
MCU from Renesas
Device Supplier Location
MCU NXP MCU board
Wave form géné NXP In MCU ?
Device Supplier Location
MCU TI MCU board
Wave form géné InfineonRF board
back side
Device Supplier Location
MCU NXP MCU board
Wave form géné ST ASIC ? MCU board
Device Supplier Location
MCU NXP MCU board
Wave form géné ST ASIC ? MCU board
Release 2012Release 2014
Release 2014
Release 2016
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79 GHZ ADVANTAGE
Technical advantages of higher frequency and bandwidth makes 79 GHz a convenient platform for Radar.
Better target separation
Better location determination
24 GHz NB 79 GHz (76-81)
Antenna size reduction
HF circuits size reduction
More compact module
24 GHz NB
24 GHz NB
77 GHz LRR
24GHz SRR
76 77 81 GHz
24 77 GHz
Polarization 2
Polarization 1
LRRLRR
MRR MRR
MRRMRRSRR
SRR
24GHz SRR
24GHz SRR
24GHz SRR
Heterogenic approach
High interference risk
Unified platform
Low interference risk
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RADAR MODULE MARKET FORECAST 2016-2022
Radar market CAGR 25%.24 GHz productstart to declinein 2021, being replaced by 79 GHz product.
Forecast 2016-2022
Module in Munit
Forecast 2016-2022
Module in M$
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RADAR CHIPSET MARKET FORECAST 2016-2022
Radar chip market CAGR of 22%. Chip volume tends to stabilize due to integration trend.
Forecast 2016-2022
Chip in Munit
Forecast 2016-2022
Chip in M$
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RELATED REPORTS
©2017 | www.yole.fr | Radar Technologies for Automotive | Sample
Automatic emergency braking, adaptive cruise control, and lane-change assist are some examples of these new applications. Spurred by the New Car Assessment Program, OEMs are designing cars with numerous sensors that enable applications like these. And since most of these new applications are safety-related, the sensors must be highly accurate. This means very tight specifications for object detection and classification, as well as being ultra-reliable: operable in every weather condition, in poor lighting, near or far, and with a wide field of view. Radar technology is well-suited to fulfill most of these requirements. We say “most” because
object classification is not currently possible with radar, but certain companies are moving quickly to unlock this capability in imaging radar.
Radar has an impressive technology roadmap allowing for huge resolution improvement as well as device miniaturization and cost reduction. Despite small growth (~3%) in global car sales until 2022, Yole Développement expects an average growth rate of 25% for radar module sales, and an average growth rate of 22% for radar chip sales over the next five years - with autonomous driving being the next long-term driver for radar technology growth.
RADAR TECHNOLOGIES FOR AUTOMOTIVE 2018Market & Technology report - November 2017
AUTOMOTIVE IS EXPERIENCING AN EXPLOSION OF NEW HIGH-TECH APPLICATIONS
How will radar sensor technology shape the cars of the future?Prepare for the automotive sensor industry’s golden age, in which radar will be increasingly viewed as a key technology for autonomous vehicles.
KEY FEATURES OF THE REPORT Get the sample of the report on www.i-Micronews.com• Automotive radar module market
forecast (Mu & $M) through 2022• Automotive radar chip market
forecast (Mu & $M) through 2022• Automotive radar landscape/
ecosystem mapping• Technology overview• Technology trends: integration,
performance improvement
OBJECTIVES OF THE REPORTEcosystem identification and analysis• Defining the application range• Technical market segmentation• Market trends and forecasts• Key players, by market and analysis
Analysis and description of markets and technologies involved:• Detailed applications per market
segment• Major actors, worldwide• Technology trends • Main technical challenges
Explosion of automotive applications
(Yole Développement, November 2017)
Active
Safety
Passive
Control PA
ACC
ACC Stop&Go AEB
LCA
FCW/RCW
AEB VRU
BSD
VEA
AVP
AP
ALC
PCW RPCW
Mitigation Control
Assistance Warning
(R)CTA
• AEB: Automatic emergency braking• AEB VRU: Automatic emergency braking vulnerable road user• ACC: Adaptive cruise control• ALC: Active lane control• AP: Automated pilot• AVP: Automated valet parking• BSD: Blind spot detection• FCW/RCW: Forward/ Rear crash warning• LCA: Lane change assist• PA: Parking assistance• PCW: Pre crash warning• (R)CTA: Rear cross traffic alert• RPCW: Rear pre crash warning• VEA: Vehicle exit assist
Vehicle automation process
(Yole Développement, November 2017)
ThinkECU
Sensor fusion
ActBrakeSteer
Accelerate
SenseCamera
UltrasonicRadarLidar
LocalizeGPS/GNNS
CloudSensor data
SuperviseDriver or
Automation
CommunicateV2VV2IV2N
Cloud computing
V2V: Vehicle to vehicleV2I: Vehicle to infrastructureV2N: Vehicle to network
RADAR TECHNOLOGIES FOR AUTOMOTIVE 2018
A WELL-ESTABLISHED SUPPLY CHAIN IS FACING UNPRECEDENTED COMPETITION
Innovative startups like Metawave and Uhnder, which are proposing disruptive technologies for very high-resolution electronic steerable antennas and imaging radar, are competing head-to-head with well-established
77 GHz radar in W band development is overtaking the current mainstream 24 GHz offer in the unlicensed ISM (industrial, scientific, medical) band. 77 GHz radar combines better range coverage (thanks to its “full power” mode) and larger available bandwidth, thus improving range resolution and accuracy by a factor of 20x. Other benefits include its 3x smaller form factor and improved velocity resolution.
Radar architectures have reached a new level of complexity, requiring innovation in antenna design, complex modulation techniques, and target resolution algorithms. Multi-beam, multi-range
requirements have led to complex antenna arrays that are multiplying transmit-and-receive paths and adding 3D detection capability. Chipmakers have developed new chips to support these stringent requirements, increasing the number of channels that a single chip can handle.
Integration is another big area for exploration. A battle is underway between the well-established SiGe technology and the more recent RFCMOS platform, which is quickly becoming a reality thanks to players like Texas Instruments - which has spent the last decade developing RFCMOS technology.
Radar technology evolution
(Yole Développement, November 2017)
2010 2030
Technology x Market Development
2020 2000 1990
SRR 24 GHz (BSD, LCA)
CMOS All integrated
LRR 76-77 GHz (ACC, AEB)
Gunn GaAs MMIC
SiGe MMIC 2Tx/4Rx
SiGe MMIC 3Tx/4Rx
SiGe MMIC 3Tx/4Rx 1Tx elevation
GaAs discrete
SiGe MMIC 1Tx/1Rx
MultiMode 76-81 GHz (ACC,AEB,BSD,LCA,VPA,…)
Antenna on chip
CMOS Imaging radar
SiGe MMIC 3Tx/4Rx 1Tx elevation
CMOS x Tx/y Rx MIMO
Antenna in package
SiGe MMIC 2Tx/2Rx
Automotive radar megatrend - Integration - Cost reduction - High resolution - 3D capability - Imaging capability
Radar’s long-term evolution
(Yole Développement, November 2017)
LEVEL1
LEVEL2
LEVEL3
Feature SRR BSD, LCA
Features SRR BSD, RCW, LCA LRR ACC, AEB
Device #
SRR 2
Device #
SRR 2
LRR 1
Device #
SRR 4
LRR 1
Features
RCTA LRR ACC, AEB
Device #
SRR to MRR 4
LRR 1
Features SRR mode BSD, RCTA MRR mode AEB pedestrian LRR mode ACC, AEB
Features USR mode AVP, PA SRR mode BSD, RCTA MRR mode AEB pedestrian LRR mode ACC, AEB
LEVEL5
Object detection
High resolution target separation
360° Object recognition
LEVEL4
> 2014
> 2016
> 2018
> 2020
> 2030
Object detection
3D detection
Device #
USRR to MRR 6
LRR 2
SRR BSD, FCW, RCW,
IN THIS HIGHLY DYNAMIC MARKET, MILLIMETER WAVE TECHNOLOGY IS AT THE EPICENTER
Find more details about
this report here:
MARKET & TECHNOLOGY REPORT
COMPANIES CITED IN THE REPORT (non exhaustive list)Acura, Airgain, Alfa Romeo, Analog Device, Anatel, Arbe Robotics, Argo AI, ARTSys360, Autoliv, Autoroad, Automotive Distance System Control, Audi, Bentley, BMW, Bosch, Broadcom, Bugatti, Buick, Chevrolet, Chrysler, Codha Wireless, Commsignia, Continental, Cruise, Cypress, Daihatsu, Denso-Ten, Delphi, Echodyne, Fiat, Fomoco, Ford, Furuno, Geely, Gemalto, General Motor, GlobalFoundry, GMC, Hamaton, Harada, Harman, Hella, Honda, Hyundai, IMST, InnoSent, Infineon, Infinity, Jaguar, Jeep, Kia, Laird, Lesswire, Lexus, Lincoln, LM technologies, Mando, Marvell, Maxim Integrated, Mercedes, Metawave, Melexis, Mini, Mitsubishi, Murata, Nanoradar, Neteera, Nissan, Novatel, NuTonomy, NXP, Oculii, Omniradar, Ottomatika, Oryx, OriginGPS, Panasonic, Peugeot, Porsche, Redpine signals, Renault, Qorvo, Qualcomm, Range Rover, Samsung, SAIC, SEAT, Semtech, Sierra Wireless, Skyworks, Skoda, ST Microelectronic, Subaru, Telit, Tesla, Texas Instruments, Tata, Toshiba, Toyota, TowerJazz, TpsCo, Trimble, Ublox, Uhnder, United Monolithic Semiconductors, Valeo, Vayyar, Volkswagen, Volvo, Wieson, ZF-TRW and more.
AUTHORS
Since 2013, Claire Troadec has led RF activity at Yole Développement. After graduating from INSA Rennes in France with an engineering degree in Microelectronics and Material Sciences, she joined NXP Semiconductors, where she worked for seven years as a CMOS Process Integration Engineer at the IMEC R&D facility. During this time she oversaw the isolation and performance boost of CMOS technology node devices from 90nm down to 45nm. Claire has authored or co-authored seven U.S. patents and nine international publications in the semiconductor field, and she managed her own distribution company before joining Yole Développement.
Scope of the report 5
Introduction, definition & methodology 15
Executive summary 30
History and overview 45> History of radar> Frequency regulation> Automotive use cases> Benchmark with camera, lidar and ultrasonicMarket forecast 65> Market drivers> Radar modules ($M, units)> Radar chips ($M, units)> Market share
Supply chain & ecosystem 80> Ecosystem> Module maker> Chip maker> Start up landscape
Technology overview 90> Radar architecture> Modulation techniques> Antenna technologies> Digital and analog beam forming> Introduction to software
Radar evolution trend 110> From dedicated to multimode> Resolution, 3D and imaging> Antenna and beam management> Chip integration, node shrinking
Other radio based technology introduction 125> WiFi, BT, NFC> GNSS> Vehicle communication technology, V2X
Conclusions & perspectives 135
Yole Développement presentation 140
TABLE OF CONTENTS (complete content on i-Micronews.com)
As a Technology & Market Analys t specializing in RF devices & technologies at Yole Développement (Yole), Cédric Malaquin is involved in the development of technology and market repor ts as well as the production of custom consulting projects. Prior to working with Yole, Cédric was employed at Soitec as a Process Integration Engineer for nine years , and then as an Electr ical Characterization Engineer for six years. Cédric has contributed heavily to FDSOI and RFSOI product characterization and has authored or co-authored three patents and five international publications in the semiconductor field.Cédric graduated from Polytech Lille in France with an engineering degree in Microelectronics and Material Sciences.
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• Imaging Technologies for Automotive 2016
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RELATED REPORT
module makers like Continental and Bosch. Regarding automotive 77 GHz radar chips based on a 130nm SiGe platform, NXP and Infineon are the top suppliers, with other big semiconductor companies like Texas Instruments and ADI offering products based on advanced CMOS nodes (down to 28nm).
Foundries are also positioning themselves in this ecosystem. For example, GLOBALFOUNDRIES and its 22FDX platform, TOWERJAZZ and its 180nm SiGe platform, and UMS too. It is exciting to see such a wide diversity of technology
offerings, a clear confirmation of the automotive radar market’s traction. However, penetrating the automotive market with new technologies is no easy task. On the contrary, entering and maintaining a position in the automotive supply chain is a long, trust-based process.
We are certainly entering a new “radar age”, with many developments, disruptive technologies, and new entrants positioning this technology as the primary sensor - along with imaging (cameras) for ADAS and autonomous vehicles.
ORDER FORMRadar Technologies for Automotive 2018
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(1) Our Terms and Conditions of Sale are available at www.yole.fr/Terms_and_Conditions_of_Sale.aspx The present document is valid 24 months after its publishing date: November 28, 2017
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Founded in 1998, Yole Développement has grown to become a group of companies providing marketing, technology and strategy consulting, media and corporate finance services, reverse engineering and reverse costing services and well as IP and patent analysis. With a strong focus on emerging applications using silicon and/or micro manufacturing, the Yole group of companies has expanded to include more than 80 collaborators worldwide covering MEMS and image sensors, Compound Semiconductors, RF Electronics, Solid-state lighting, Displays, software, Optoelectronics, Microfluidics & Medical, Advanced Packaging, Manufacturing, Nanomaterials, Power Electronics and Batteries & Energy Management.The “More than Moore” market research, technology and strategy consulting company Yole Développement, along with its partners System Plus Consulting, PISEO and KnowMade, support industrial companies, investors and R&D organizations worldwide to help them understand markets and follow technology trends to grow their business.
CONSULTING AND ANALYSIS• Market data & research, marketing analysis• Technology analysis• Strategy consulting• Reverse engineering & costing• Patent analysis• Design and characterization of innovative optical systems• Financial services (due diligence, M&A with our partner)More information on www.yole.fr
MEDIA & EVENTS• i-Micronews.com website & related @Micronews e-newsletter• Communication & webcast services• Events: TechDays, forums…More information on www.i-Micronews.com
REPORTS• Market & technology reports• Patent investigation and patent infringement risk analysis• Teardowns & reverse costing analysis• Cost simulation toolMore information on www.i-micronews.com/reports
CONTACTSFor more information about :• Consulting & Financial Services: Jean-Christophe Eloy ([email protected])• Reports: David Jourdan ([email protected]) Yole Group of Companies• Press Relations & Corporate Communication: Sandrine Leroy ([email protected])
Definitions: “Acceptance”: Action by which the Buyer accepts the terms and conditions of sale in their entirety. It is done by signing the purchase order which mentions “I hereby accept Yole’s Terms and Conditions of Sale”.
“Buyer”: Any business user (i.e. any person acting in the course of its business activities, for its business needs) entering into the following general conditions to the exclusion of consumers acting in their personal interests.
“Contracting Parties” or “Parties”: The Seller on the one hand and the Buyer on the other hand.
“Intellectual Property Rights” (“IPR”) means any rights held by the Seller in its Products, including any patents, trademarks, registered models, designs, copyrights, inventions, commercial secrets and know-how, technical information, company or trading names and any other intellectual property rights or similar in any part of the world, notwithstanding the fact that they have been registered or not and including any pending registration of one of the above mentioned rights.
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• Corporate license: purchased under “Annual Subscription” program, the report can be used by unlimited users within the company. Joint-Ventures are not included.
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“Seller”: Based in Lyon (France headquarters), Yole Développement is a market research and business development consultancy company, facilitating market access for advanced technology industrial projects. With more than 20 market analysts, Yole works worldwide with the key industrial companies, R&D institutes and investors to help them understand the markets and technology trends.
1. SCOPE 1.1 The Contracting Parties undertake to observe the following
general conditions when agreed by the Buyer and the Seller. ANY ADDITIONAL, DIFFERENT, OR CONFLICTING TERMS AND CONDITIONS IN ANY OTHER DOCUMENTS ISSUED BY THE BUYER AT ANY TIME ARE HEREBY OBJECTED TO BY THE SELLER, SHALL BE WHOLLY INAPPLICABLE TO ANY SALE MADE HEREUNDER AND SHALL NOT BE BINDING IN ANY WAY ON THE SELLER.
1.2 This agreement becomes valid and enforceable between the Contracting Parties after clear and non-equivocal consent by any duly authorized person representing the Buyer. For these purposes, the Buyer accepts these conditions of sales when signing the purchase order which mentions “I hereby accept Yole’s Terms and Conditions of Sale”. This results in acceptance by the Buyer.
1.3 Orders are deemed to be accepted only upon written acceptance and confirmation by the Seller, within [7 days] from the date of order, to be sent either by email or to the Buyer’s address. In the absence of any confirmation in writing, orders shall be deemed to have been accepted.
2. MAILING OF THE PRODUCTS 2.1 Products are sent by email to the Buyer:
• within [1] month from the order for Products already released; or • within a reasonable time for Products ordered prior to their effective release. In this case, the Seller shall use its best endeavours to inform the Buyer of an indicative release date and the evolution of the work in progress.
2.2 Some weeks prior to the release date the Seller can propose a pre-release discount to the Buyer The Seller shall by no means be responsible for any delay in respect of article 2.2 above, and including incases where a new event or access to new contradictory information would require for the analyst extra time to compute or compare the data in order to enable the Seller to deliver a high quality Products.
2.3 The mailing of the Product will occur only upon payment by the Buyer, in accordance with the conditions contained in article 3.
2.4. The mailing is operated through electronic means either by email via the sales department or automatically online via an email/password. If the Product’s electronic delivery format is defective, the Seller undertakes to replace it at no charge to the Buyer provided that it is informed of the defective formatting within 90 days from the date of the original download or receipt of the Product.
2.5 The person receiving the Products on behalf of the Buyer shall immediately verify the quality of the Products and their conformity to the order. Any claim for apparent defects or for non-conformity shall be sent in writing to the Seller within 8 days of receipt of the Products. For this purpose, the Buyer agrees to produce sufficient evidence of such defects. .
2.6 No return of Products shall be accepted without prior information to the Seller, even in case of delayed delivery. Any Product returned to the Seller without providing prior information to the Seller as required under article 2.5 shall remain at the Buyer’s risk.
3. PRICE, INVOICING AND PAYMENT 3.1 Prices are given in the orders corresponding to each Product
sold on a unit basis or corresponding to annual subscriptions. They are expressed to be inclusive of all taxes. The prices may be reevaluated from time to time. The effective price is deemed to be the one applicable at the time of the order.
3.2 Yole may offer a pre release discount for the companies willing to acquire in the future the specific report and agreeing on the fact that the report may be release later than the anticipated release date. In exchange to this uncertainty, the company will get a discount that can vary from 15% to 10%.
3.3 Payments due by the Buyer shall be sent by cheque payable to Yole Développement, credit card or by electronic transfer to the following account: HSBC, 1 place de la Bourse 69002 Lyon France Bank code: 30056 Branch code: 00170 Account n°: 0170 200 1565 87BIC or SWIFT code: CCFRFRPP IBAN: FR76 3005 6001 7001 7020 0156 587
To ensure the payments, the Seller reserves the right to request down payments from the Buyer. In this case, the need of down payments will be mentioned on the order. 3.4 Payment is due by the Buyer to the Seller within 30 days
from invoice date, except in the case of a particular written agreement. If the Buyer fails to pay within this time and fails to contact the Seller, the latter shall be entitled to invoice interest in arrears based on the annual rate Refi of the «BCE» + 7 points, in accordance with article L. 441-6 of the French Commercial Code. Our publications (report, database, tool...) are delivered only after reception of the payment.
3.5 In the event of termination of the contract, or of misconduct, during the contract, the Seller will have the right to invoice at the stage in progress, and to take legal action for damages.
4. LIABILITIES 4.1 The Buyer or any other individual or legal person acting on
its behalf, being a business user buying the Products for its business activities, shall be solely responsible for choosing the Products and for the use and interpretations he makes of the documents it purchases, of the results he obtains, and of the advice and acts it deduces thereof.
4.2 The Seller shall only be liable for (i) direct and (ii) foreseeable pecuniary loss, caused by the Products or arising from a material breach of this agreement
4.3 In no event shall the Seller be liable for: a) damages of any kind, including without limitation, incidental or consequential damages (including, but not limited to, damages for loss of profits, business interruption and loss of programs or information) arising out of the use of or inability to use the Seller’s website or the Products, or any information provided on the website, or in the Products; b) any claim attributable to errors, omissions or other inaccuracies in the Product or interpretations thereof.
4.4 All the information contained in the Products has been obtained from sources believed to be reliable. The Seller does not warrant the accuracy, completeness adequacy or reliability of such information, which cannot be guaranteed to be free from errors.
4.5 All the Products that the Seller sells may, upon prior notice to the Buyer from time to time be modified by or substituted with similar Products meeting the needs of the Buyer. This modification shall not lead to the liability of the Seller, provided that the Seller ensures the substituted Product is similar to the Product initially ordered.
4.6 In the case where, after inspection, it is acknowledged that the Products contain defects, the Seller undertakes to replace the defective products as far as the supplies allow and without indemnities or compensation of any kind for labor costs, delays, loss caused or any other reason. The replacement is guaranteed for a maximum of two months starting from the delivery date. Any replacement is excluded for any event as set out in article 5 below.
4.7 The deadlines that the Seller is asked to state for the mailing of the Products are given for information only and are not guaranteed. If such deadlines are not met, it shall not lead to any damages or cancellation of the orders, except for non acceptable delays exceeding [4] months from the stated deadline, without information from the Seller. In such case only, the Buyer shall be entitled to ask for a reimbursement of its first down payment to the exclusion of any further damages.
4.8 The Seller does not make any warranties, express or implied, including, without limitation, those of sale ability and fitness for a particular purpose, with respect to the Products. Although the Seller shall take reasonable steps to screen Products for infection of viruses, worms, Trojan horses or other codes containing contaminating or destructive properties before making the Products available, the Seller cannot guarantee that any Product will be free from infection.
5. FORCE MAJEURE The Seller shall not be liable for any delay in performance directly or indirectly caused by or resulting from acts of nature, fire, flood, accident, riot, war, government intervention, embargoes, strikes, labor difficulties, equipment failure, late deliveries by suppliers or other difficulties which are beyond the control, and not the fault of the Seller.
6. PROTECTION OF THE SELLER’S IPR 6.1 All the IPR attached to the Products are and remain the
property of the Seller and are protected under French and international copyright law and conventions.
6.2 The Buyer agreed not to disclose, copy, reproduce, redistribute, resell or publish the Product, or any part of it to any other party other than employees of its company. The Buyer shall have the right to use the Products solely for its own internal information purposes. In particular, the Buyer shall therefore not use the Product for purposes such as: • Information storage and retrieval systems; • Recordings and re-transmittals over any network (including
any local area network); • Use in any timesharing, service bureau, bulletin board or
similar arrangement or public display; • Posting any Product to any other online service (including
bulletin boards or the Internet);• Licensing, leasing, selling, offering for sale or assigning the
Product. 6.3 The Buyer shall be solely responsible towards the Seller of
all infringements of this obligation, whether this infringement comes from its employees or any person to whom the Buyer has sent the Products and shall personally take care of any related proceedings, and the Buyer shall bear related financial consequences in their entirety.
6.4 The Buyer shall define within its company point of contact for the needs of the contract. This person will be the recipient of each new report in PDF format. This person shall also be responsible for respect of the copyrights and will guaranty that the Products are not disseminated out of the company.
6.5 In the context of annual subscriptions, the person of contact shall decide who within the Buyer, shall be entitled to access on line the reports on I-micronews.com. In this respect, the Seller will give the Buyer a maximum of 10 password, unless the multiple sites organization of the Buyer requires more passwords. The Seller reserves the right to check from time to time the correct use of this password.
6.6 In the case of a multisite, multi license, only the employee of the buyer can access the report or the employee of the companies in which the buyer have 100% shares. As a matter of fact the investor of a company, the joint venture done with a third party etc..cannot access the report and should pay a full license price.
7. TERMINATION 7.1 If the Buyer cancels the order in whole or in part or postpones
the date of mailing, the Buyer shall indemnify the Seller for the entire costs that have been incurred as at the date of notification by the Buyer of such delay or cancellation. This may also apply for any other direct or indirect consequential loss that may be borne by the Seller, following this decision.
7.2 In the event of breach by one Party under these conditions or the order, the non-breaching Party may send a notification to the other by recorded delivery letter upon which, after a period of thirty (30) days without solving the problem, the non-breaching Party shall be entitled to terminate all the pending orders, without being liable for any compensation.
8. MISCELLANEOUS All the provisions of these Terms and Conditions are for the benefit of the Seller itself, but also for its licensors, employees and agents. Each of them is entitled to assert and enforce those provisions against the Buyer. Any notices under these Terms and Conditions shall be given in writing. They shall be effective upon receipt by the other Party. The Seller may, from time to time, update these Terms and Conditions and the Buyer, is deemed to have accepted the latest version of these terms and conditions, provided they have been communicated to him in due time.
9. GOVERNING LAW AND JURISDICTION 9.1 Any dispute arising out or linked to these Terms and
Conditions or to any contract (orders) entered into in application of these Terms and Conditions shall be settled by the French Commercial Courts of Lyon, which shall have exclusive jurisdiction upon such issues.
9.2 French law shall govern the relation between the Buyer and the Seller, in accordance with these Terms and Conditions.
TERMS AND CONDITIONS OF SALES
© 2017
Yole Développement
FromTechnologies to Market
Source: Wikimedia Commons
30©2017 | www.yole.fr | About Yole Développement
FIELDS OF EXPERTISE COVERED BY OUR 35+ ANALYSTS
MEMS & Sensors
Solid State Lighting(LED, OLED, …)
Compound Semi.
Imaging
Photonics
MedTech
Manufacturing
Advanced
Packaging
Batteries / Energy Management
Power Electronics
Displays
RF
Devices &
Techno.
Advanced
Substrates
Software
31©2017 | www.yole.fr | About Yole Développement
3 BUSINESS MODELS
o Consulting and Analysis
• Market data & research,
marketing analysis
• Technology analysis
• Strategy consulting
• Reverse engineering & costing
• Patent analysis
• Design and characterization of
innovative optical systems
• Financial services (due diligence,
M&A with our partner)
www.yole.fr
o Reports
• Market & technology reports
• Patent investigation and patent
infringement risk analysis
• Teardowns & reverse costing
analysis
• Cost simulation tool
www.i-Micronews.com/reports
o Media
• i-Micronews.com website
• @Micronews e-newsletter
• Communication & webcast
services
• Events: TechDays, forums,…
www.i-Micronews.com
32©2017 | www.yole.fr | About Yole Développement
A GROUP OF COMPANIES
Market, technology
and strategy
consulting
www.yole.fr
Due diligence
www.yole.fr
Manufacturing costs analysis
Teardown and reverse engineering
Cost simulation tools
www.systemplus.fr
IP analysis
Patent assessment
www.knowmade.fr
Innovation and business maker
www.bmorpho.com
Design and characterization of
innovative optical systems
www.piseo.fr
33©2017 | www.yole.fr | About Yole Développement
OUR GLOBAL ACTIVITY
30%of our business
40%of our business 30%
of our business
Greater
China office
Yole Japan
HQ in Lyon
Nantes
Paris
Nice
Vénissieux
Europe office
Frankfurt
Hsinchu
Tokyo
Yole Inc.
Phoenix
Yole Korea
Seoul
Palo Alto
34©2017 | www.yole.fr | About Yole Développement
ANALYSIS SERVICES - CONTENT COMPARISON
Multi-
Customers
Action
Technology
and Market
Report
Leadership
Meeting
Q&A
Service
Depth of the analysis
Bre
adth
of th
e a
nal
ysis
Meet the
Analyst
Custom
Analysis
High
High
Low
35©2017 | www.yole.fr | About Yole Développement
SERVING THE ENTIRE SUPPLY CHAIN
Our analysts provide market analysis,
technology evaluation,
and business plans along the entire
supply chain
Integrators and
end-users
Device manufacturers
Suppliers: material, equipment,
OSAT, foundries…
Financial investors,
R&D centers
36©2017 | www.yole.fr | About Yole Développement
SERVING MULTIPLE INDUSTRIAL FIELDS
We workacross
multiples industries to understand
the impact of More-than-
Moore technologies from deviceto system
From A to Z…
Transportation
makers
Mobile phone
and
consumer
electronics
Automotive
Medical
systems
Industrial
and defense
Energy
management
37©2017 | www.yole.fr | About Yole Développement
o Yole Développement publishes a comprehensive collection of market & technology reports and patent analysis in:
• MEMS & Sensors
• RF devices & technologies
• Imaging
• Medical technologies (MedTech)
• Photonics
• Advanced packaging
• Manufacturing
• Advanced substrates
• Power electronics
• Batteries and energy management
• Compound semiconductors
• Solid state lighting
• Displays
o You are looking for:
• An analysis of your product market
• A review of your competitors evolution
• An understanding of your manufacturing and production costs
• An understanding of your industry technology roadmap and related IPs
• A clear view on the evolution of the supply chain
The combined team of 60+ experts (PhDs, MBAs, industry veterans…) from Yole Développement, System Plus Consulting and KnowMade, collect information, identifythe trends, the challenges, the emerging markets, the competitive environments and turn it into results to give you a complete picture of your industry landscape.
In the past 19 years, we worked on more than 2 000 projects, interacting with technology professionals and high level opinion makers from the main players of theindustry.
o Every year, Yole Développement, System Plus Consulting and Knowmade publish +120 reports. Gain full benefit from our Bundle and Annual Subscription offers.
REPORTS COLLECTION
www.i-Micronews.com
38©2017 | www.yole.fr | About Yole Développement
OUR 2017 REPORTS PLANNING (1/2)
MARKET AND TECHNOLOGY REPORTS by Yole Développement
o MEMS & SENSORS
− Acoustic MEMS and Audio Solutions 2017
− Integrated Passive Devices Market Status 2017
− 3D Imaging & Sensing 2017
− Status of the MEMS Industry 2017
− Silicon Photonics 2017*
− MEMS & Sensors for Automotive 2017
− High End Inertial Sensors for Defense and Industrial Applications 2017*
− Magnetic Sensors Market and Technologies 2017
− Sensors and Sensing Modules for Smart Homes and Buildings 2017
− Sensing and Display for AR/VR/MR 2017**
− MEMS Packaging 2017
− Fingerprint Sensor Applications and Technologies - Consumer Market Focus 2017
o RF DEVICES AND TECHNOLOGIES
− RF Front End Modules and Components for Cellphones 2017
− Advanced RF SiP for Cellphones 2017
− 5G Impact on RF Industry: From Wireless Infrastructure to Cellphone Terminals
2017
− RF Technologies for Automotive Applications 2017
− GaN and Si LDMOS Market and Technology Trends for RF Power 2017
o MANUFACTURING
− Glass Substrate Manufacturing 2017
− Equipment & Materials for Fan Out Technology 2017
− Equipment and Materials for 3D TSV Applications 2017
− Emerging Non Volatile Memories 2017*
o MEDTECH
− Status of the Microfluidics Industry 2017
− Solid State Medical Imaging 2017
− Connected Medical Devices: the Internet of Medical Things 2017
− Sensors for Medical Robotics 2017
− Artificial Organs: Market & Technology Analysis 2017
− Organs-on-a Chip 2017
o ADVANCED PACKAGING
− Advanced Substrates Overview 2017
− Integrated Passive Devices Market Status 2017
− Status of the Advanced Packaging Industry 2017
− Fan Out Packaging: Market & Technology Trends 2017*
− 3D TSV and 2.5D Business Update - Market and Technology Trends 2017
− Advanced QFN: Market & Technology Trends 2017**
− MEMS Packaging 2017
− Advanced Packaging for Memories 2017
− Advanced RF SiP for Cellphones 2017
− Power Packaging Market and Technology Trends 2017
− Embedded Die Packaging: Technologies and Markets Trends 2017
o IMAGING & OPTOELECTRONICS
− 3D Imaging & Sensing 2017
− Status of the CMOS Image Sensor Industry 2017*
− Camera Module for Consumer and Automotive Applications 2017*
− Uncooled Infrared Imaging Technology & Market Trends 2017*
− Solid State Medical Imaging 2017
− Embedded Software for Machine Vision Systems 2017**
o BATTERY AND ENERGY MANAGEMENT
− Status of the Rechargeable Li-ion Battery Industry*2016 version still available / **To be confirmed
39©2017 | www.yole.fr | About Yole Développement
OUR 2017 REPORTS PLANNING (2/2)o POWER ELECTRONICS
− Status of Power Electronics Industry 2017
− Power MOSFET 2017: Market and Technology Trends
− IGBT Market and Technology Trends 2017
− Power Module Packaging: Material Market and Technology Trends 2017
− Power SiC 2017: Materials, Devices, and Applications
− Power GaN 2017: Materials, Devices, and Applications*
− Materials Market Opportunities for Cellphone Thermal Management (Battery
Cooling, Fast Charging, Data Processing, etc.) 2017
− Gate Driver Market and Technology Trends 2017
− Power Management ICs Market Quarterly Update 2017
− Integrated Passive Devices Market Status 2017
− Thermal Management for LED and Power 2017
o COMPOUND SEMICONDUCTORS
− Power SiC 2017: Materials, Devices, and Applications
− Power GaN 2017: Materials, Devices, and Applications*
− GaN and Si LDMOS Market and Technology Trends for RF Power 2017
− 5G Impact on RF Industry: From Wireless Infrastructure to Cellphone Terminals
2017
− Bulk GaN Substrate Market 2017
o DISPLAYS
− MicroLED Displays 2017
− MicroLED IP 2017
− Quantum Dots for Display Applications 2017
− Phosphors & Quantum Dots 2017 - LED Downconverters for Lighting & Displays
o SOLID STATE LIGHTING
− UV LEDs 2017 - Technology, Manufacturing and Application Trends*
− Horticultural Lighting 2017 - Technology, Industry and Market Trends
− Automotive Lighting 2017 - Technology, Industry and Market Trends*
− Active Imaging and Lidar 2017 - IR Lighting**
− LED Lighting Module 2017 - Technology, Industry and Market Trends
− IR LEDs and VCSELs - Technology Applications and Industry Trends 2017
− Phosphors & Quantum Dots 2017 - LED Downconverters for Lighting & Displays
− MicroLED Displays 2017
− CSP LED Lighting Module 2017
− LED Packaging 2017
− Thermal Management Technology and Market Perspectives in Power Electronics
and LEDs 2017
PATENT ANALYSIS by Knowmade
− Consumer Physics SCiO Molecular Sensor Patent-to-Product Mapping 2017
− Patent Licensing Companies in the Semiconductor Market - Patent Litigation Risk
and Potential Targets 2017
− MEMS Microphone: Patent Landscape Analysis 2017
− Knowles MEMS Microphones in Apple iPhone 7 Plus Patent-to-Product Mapping
− Microbolometer: Patents Used in Products 2017
− Microfluidic Technologies for Diagnostic Applications Patent Landscape 2017
− Pumps for Microfluidic Devices Patent Landscape
− III-N Patent Watch
− MicroLEDs: Patent Landscape Analysis 2017
− Uncooled Infrared Imaging: Patent Landscape Analysis 2017
− 3D Monolithic Memory: Patent Landscape Analysis 2017
− NMC Lithium-Ion Batteries Patent Landscape Analysis
− FLUIDIGM Patent Portfolio Analysis
TEARDOWN & REVERSE COSTING by System Plus Consulting More than 60 teardowns and reverse costing analysis and cost simulation tools to be
published in 2017.
*2016 version still available / **To be confirmed
40©2017 | www.yole.fr | About Yole Développement
OUR 2016 PUBLISHED REPORTS LIST (1/2)
MARKET AND TECHNOLOGY REPORTS by Yole Développement
o MEMS & SENSORS
− Gas Sensors Technology and Market 2016
− Status of the MEMs Industry 2016
− Sensors for Cellphones and Tablets 2016
− Market and Technology Trends of Inkjet Printheads 2016
− Sensors for Biometry and Recognition 2016
− Silicon Photonics 2016
o IMAGING & OPTOELECTRONICS
− Status of the CMOS Image Sensor Industry 2016
− Uncooled Infrared Imaging Technology & Market Trends 2016
− Imaging Technologies for Automotive 2016
− Sensors for Drones & Robots: Market Opportunities and Technology Evolution 2016
o MEDTECH
− BioMEMS 2016
− Point of Care Testing 2016: Application of Microfluidic Technologies
o ADVANCED PACKAGING
− Embedded Die Packaging: Technology and Market Trends 2017
− 2.5D & 3D IC TSV Interconnect for Advanced Packaging: Business Update 2016
− Fan-Out: Technologies and Market Trends 2016
− Fan-In Packaging: Business update 2016
− Status and Prospects for the Advanced Packaging Industry in China 2016
o MANUFACTURING
− Thin Wafer Processing and Dicing Equipment Market 2016
− Emerging Non Volatile Memories 2016
o COMPOUND SEMICONDUCTORS
− Power GaN 2016: Epitaxy and Devices, Applications and Technology Trends
− GaN RF Devices Market: Applications, Players, Technology and substrates 2016
− Sapphire Applications & Market 2016: from LED to Consumer Electronics
− Power SiC 2016: Materials, Devices, Modules, and Applications
o LED
− UV LED Technology, Manufacturing and Applications Trends 2016
− OLED for Lighting 2016 – Technology, Industry and Market Trends
− Automotive Lighting: Technology, Industry and Market Trends 2016
− Organic Thin Film Transistor 2016: Flexible Displays and Other Applications
− Sapphire Applications & Market 2016: from LED to Consumer Electronics
o POWER ELECTRONICS
− Power Electronics for EV/HEV 2016: Market, Innovations and Trends
− Status of Power Electronics Industry 2016
− Passive Components Technologies and Market Trends for Power Electronics 2016
− Power SiC 2016: Materials, Devices, Modules, and Applications
− Power GaN 2016: Epitaxy and Devices, Applications, and Technology Trends
− Inverter Technologies Trends & Market Expectations 2016
− Opportunities for Power Electronics in Renewable Electricity Generation 2016
− Thermal Management Technology and Market Perspectives in Power Electronics and
LEDs 2017
− GaN RF Devices Market: Applications, Players, Technology and substrates 2016
o BATTERY AND ENERGY MANAGEMENT
− Beyond Li-ion Batteries: Present and Future Li-ion Technology Challengers 2016
− Stationary Storage and Automotive Li-ion Battery Packs 2016
− Opportunities for Power Electronics in Renewable Electricity Generation 2016
41©2017 | www.yole.fr | About Yole Développement
OUR 2016 PUBLISHED REPORTS LIST (2/2)
PATENT ANALYSIS by Knowmade
− Microbattery Patent Landscape Analysis
− Miniaturized Gas Sensors Patent Landscape Analysis
− 3D Cell Culture Technologies Patent Landscape
− Phosphors and QDs for LED Applications Patent Landscape
− TSV Stacked Memory Patent Landscape
− Fan-Out Wafer Level Packaging Patent Landscape Analysis
TEARDOWN & REVERSE COSTING by System Plus Consulting More than 45 teardowns and reverse costing analysis and cost simulation tools published
in 2016.
MORE INFORMATION
o All the published reports from the Yole Group of Companies are available on our website
www.i-Micronews.com.
o Ask for our Bundle and Annual Subscription offers: With our bundle offer, you choose the
number of reports you are interested in and select the related offer. You then have up to 12
months to select the required reports from the Yole Développement, System Plus Consulting
and KnowMade offering. Pay once and receive the reports automatically (multi-user format).
Contact your sales team according to your location (see the last slide).
42©2017 | www.yole.fr | About Yole Développement
MICRONEWS MEDIA
o About Micronews Media
To meet the growing demand for market,
technological and business information,
Micronews Media integrates several tools able
to reach each individual contact within its
network.We will ensure you benefit from this.
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Events Webcasts
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to reach global audiences.
Online display advertising
campaigns are great strategies
for improving your
product/brand visibility. They
are also an efficient way to
adapt with the demands of the
times and to evolve an effective
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Brand visibility, networking
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Today's technology makes it
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Targeted audience
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Webcasts are a smart,
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Benefit from the i-Micronews.com
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43©2017 | www.yole.fr | About Yole Développement
CONTACT INFORMATION
o CONSULTING AND SPECIFIC ANALYSIS
• North America: Steve LaFerriere, Director of Northern America Business DevelopmentEmail: [email protected] – +1 31 06 008 267
• Japan & Rest of Asia: Takashi Onozawa, General Manager, Asia Business DevelopmentEmail: [email protected] - +81 3 4405 9204
• Greater China: Mavis Wang, Director of Greater China Business DevelopmentEmail: [email protected] - +886 979 336 809
• RoW: Jean-Christophe Eloy, CEO & President, Yole DéveloppementEmail [email protected] - +33 4 72 83 01 80
o REPORT BUSINESS
• North America: Steve LaFerriere, Director of Northern America Business DevelopmentEmail: [email protected] – +1 31 06 008 267
• Europe: Lizzie Levenez, EMEA Business Development ManagerEmail: [email protected] - +49 15 123 544 182
• Rest of Asia: Takashi Onozawa, General Manager, Asia Business DevelopmentEmail: [email protected] - +81 3 4405 9204
• Japan & Asia: Miho Othake, Account ManagerEmail: [email protected] - +81 3 4405 9204
• Greater China: Mavis Wang, Director of Greater China Business DevelopmentEmail: [email protected] - +886 979 336 809
o FINANCIAL SERVICES (in partnership with Woodside Capital Partners)
• Jean-Christophe Eloy, CEO & PresidentEmail: [email protected] - +33 4 72 83 01 80
o GENERAL
• Public Relations: [email protected] - +33 4 72 83 01 89
• Email: [email protected] - +33 4 72 83 01 80
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