power electronics for ev/hev 2018 - us 3ds outscale€¦ · mattin grao txapartegi is a technology...

Power Electronics for EV/HEV 2018 | Sample | www.yole.fr | ©2018

From Technologies to Market

Power Electronics for EV/HEV 2018

SampleApril 2018

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Biography & contact

ABOUT THE AUTHORS

Mattin GraoTxapartegi, Market & Technology Analyst, Power Electronics

Mattin Grao Txapartegi is a Technology & Market Analyst | Power Electronics at Yole Développement (Yole). He is engaged in many custom studies and reports dedicated

to the evolution of inverters architecture, power packaging and passive components. Get a deep understanding of the technology evolution, the market trends and the

strategies of each player are part of his mission at Yole. Indeed Mattin is daily driving technology and market scouting, roadmap definition, disruptive technologies and

market opportunities identification and competitive landscape analysis. Previously he acquired a comprehensive expertise in the design of power converters for EV at

Renault. As an engineer, Mattin is graduated from Grenoble INP (FR) with specialization in embedded systems for transportation. He has also an advanced master in

aeronautics from the Arts & Métiers ParisTech (FR).

Contact: [email protected]

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http://www.yole.fr/

mailto:[email protected]


COMPANIES CITED IN THE REPORT

BAIC, Beiqi, BMW, Bosch, BYD, Chery, Continental, CRRC/Dynex, Daimler, Delphi, Denso, Dongfeng,

DAW, Fiat, Ford, Fuji Electric, Geely, General Motors, Hitachi, Honda, Huanghai, Hyundai, Infineon/

International Rectifier, JAC, Kandi, Kia, Macmic, Mitsubishi Electric, Mitsubishi Motors, Nissan,

Oak Ridge National Laboratory, Porsche, Renault, SAIC, Schaeffler, Semikron, Siemens, Starpower,

STMicroelectronics, Tesla Motors, Tianjin Qingyuan Electric Vehicles, Toshiba, Toyota, Valeo,

Volkswagen, Volvo, Wanxiang Electric Vehicles, Zotye, and more.

http://www.yole.fr/

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OBJECTIVES OF THIS REPORT

• Provide updated market metrics and forecasts for electrified vehicles

• Analyze the differences between geographical areas, as well as the incentives and deterrents for market growth

• Present the main technological trends and ongoing developments for power electronics that target automotive at inverter, power module and power device levels

• Provide updated market metrics and forecasts for power electronics, broken down by electrified vehicle type

• Discuss battery pack evolution and its impact on power electronics

• Analyze business model evolution and supply-chain moves

http://www.yole.fr/

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Power Electronics for EV/HEV 2018 | Sample | www.yole.fr | ©2018 5Power Electronics for EV/HEV 2018 | Sample | www.yole.fr | ©2018

TABLE OF CONTENTS

• What we saw, what we missed 4

• Executive summary 9

• Electric and Hybrid Vehicles: current and

future market overview41

• EV/HEV market forecasts up to 2023 50

• Geographical split of PHEV & BEV 51

• Ranking of companies 54

• Market growth drivers & barriers 56

• Power electronics in EV/HEV 62

• Power electronics market for EV/HEV 65

• System level trends 76

• The 48-Volt system 90

• Battery pack evolution on EV/HEV 97

• Power module packaging trends 115

• Wide Band Gap devices 136

• Supply-chain & business models 157

• Supply-chain from die to OEM 159

• Business models in the automotive industry 167

• New business opportunities 171

• OEMs’ future strategies 176

• Chinese EV/HEV market evolution and local

players185

• Chinese market up to 2030 189

• Chines player landscape: local vs. foreigners 194

• Ranking of local OEMs 200

• Chinese EV/HEV business models 208

• Conclusions 223

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YOLE METHODOLOGY

• Yole Développement uses mainly three different sources to conduct its research:

• Internal knowledge: Yole has been working in the power electronics industry for years now and we have acquired a deep understanding of the market and its trends and evolutions. We have created a rich internal data-base of figures and key contacts in the industry.

• Interviews: we carry on an important number of interviews during the survey with key players of the industry (competitors, clients, system manufacturers).

• WSTS: World Semiconductor Trade Statistics.

Yole uses many information sources to achieve market estimations

Internal

knowledgeInterviews WSTS

PE industry

figures

MULTI-SOURCING

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http://www.yole.fr/


YOLE METHODOLOGY: TOP-DOWN AND BOTTOM-UP APPROACHES

Yole’smethodology and market knowledge enable us to cover all power electronics levels

• To achieve market estimations,Yole uses two approaches:top down and bottom up

Systems

Inverters

Power module/

Discrete components

Devices

Device

marketRaw data

Yole’s analysis

Top-down Bottom-up

From systems to device market From raw data to device market

Power electronics applications have been

followed by Yole for years using both top-down

and bottom-up approaches

Device

market

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ELECTRIC AND HYBRID VEHICLES: CURRENT AND FUTURE MARKET OVERVIEW

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http://www.yole.fr/


POWER ELECTRONICS IN EV/HEV

System level trends, battery pack evolution on EV/HEV, power module packaging trends

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http://www.yole.fr/



Focus on 48-volt systems

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BUSINESS OPPORTUNITIES FOR MATERIAL SUPPLIERS

As power module packaging designs and materials are evolving fast, the material suppliers will need to adapt to the new industry needs.

Die

Die attach

Substrate

Baseplate

Encapsulant

Heatsink

Substrate

attach

TIM

• Epoxy resin material

• High thermal cycling

• >175°C temperature handling• Sintering

• Pressure-less silver

powder

• Micro particle silver

powder

• Soldering

• Thermal Interface Material

• Higher thermal conductivity

• Higher thermal cycling TIM

• Long-time material stability

• Substrates

• Si3N4 AMB ceramic substrate

• Epoxy resin insulating foil for IMS/IMB

• Ceramic substrate with integrated pin-fin

Key success parameters

for material &

component suppliers

• Semiconductors

• SiC MOSFETs

• GaN HEMTs

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Wide Band Gap devices in EV/HEV

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SUPPLY-CHAIN & BUSINESS MODELS

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CHINESE EV/HEV MARKET EVOLUTION AND LOCAL PLAYERS

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POWER ELECTRONICS FOR EV/HEV 2018

• Related Reports

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http://www.yole.fr/

https://www.i-micronews.com/category-listing/product/status-of-the-power-electronics-industry-2017.html?utm_source=Yole&utm_medium=relatedreports_Sample&utm_campaign=r_PE_EV_HEV_April2018

https://www.i-micronews.com/category-listing/product/status-of-the-power-electronics-industry-2017.html?utm_source=Yole&utm_medium=relatedreports_Sample&utm_campaign=r_PE_EV_HEV_April2018

https://www.i-micronews.com/category-listing/product/li-ion-battery-packs-for-automotive-and-stationary-storage-applications.html?utm_source=Yole&utm_medium=relatedreports_Sample&utm_campaign=r_PE_EV_HEV_April2018

https://www.i-micronews.com/category-listing/product/li-ion-battery-packs-for-automotive-and-stationary-storage-applications.html?utm_source=Yole&utm_medium=relatedreports_Sample&utm_campaign=r_PE_EV_HEV_April2018

https://www.i-micronews.com/category-listing/product/power-sic-2017-materials-devices-modules-and-applications.html?utm_source=Yole&utm_medium=relatedreports_Sample&utm_campaign=r_PE_EV_HEV_April2018

https://www.i-micronews.com/category-listing/product/power-sic-2017-materials-devices-modules-and-applications.html?utm_source=Yole&utm_medium=relatedreports_Sample&utm_campaign=r_PE_EV_HEV_April2018

https://www.i-micronews.com/category-listing/product/power-module-packaging-material-market-and-technology-trends-2017.html?utm_source=Yole&utm_medium=relatedreports_Sample&utm_campaign=r_PE_EV_HEV_April2018

https://www.i-micronews.com/category-listing/product/power-module-packaging-material-market-and-technology-trends-2017.html?utm_source=Yole&utm_medium=relatedreports_Sample&utm_campaign=r_PE_EV_HEV_April2018

https://www.i-micronews.com/category-listing/product/infineon-ff400r07a01e3-double-side-cooled-igbt-module.html?utm_source=Yole&utm_medium=relatedreports_Sample&utm_campaign=r_PE_EV_HEV_April2018

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https://www.i-micronews.com/category-listing/product/infineon-fs820r08a6p2b-hybridpack-drive-igbt-module.html?utm_source=Yole&utm_medium=relatedreports_Sample&utm_campaign=r_PE_EV_HEV_April2018

https://www.i-micronews.com/category-listing/product/infineon-fs820r08a6p2b-hybridpack-drive-igbt-module.html?utm_source=Yole&utm_medium=relatedreports_Sample&utm_campaign=r_PE_EV_HEV_April2018

Electric and Hybrid Electric Vehicle (EV/HEV) sales continue to surge. In 2017, people bought 1.2 million battery electric vehicle (BEV) and plug-in hybrid vehicles (PHEV), a 52% increase compared to 2016. Full and mild HEV sales accounted for 2.8 million units last year, a 22% year-to-year increase. Several European car manufacturers also launched their 48V mild hybrid models in 2017. This cost-effective solution, which electrifies vehicle auxiliary systems and at the same time reduces CO2 emissions, will proliferate in 2018-2019 among all European carmakers, followed by the Chinese ones. Yole Développement believes that the 48V system will rapidly boost the market. We forecast a Compound Annual Growth Rate (CAGR) for 2017-2023 of 50% for mild hybrids, because these low cost electrified vehicle models are attractive. Their approach can be easily implemented in any car, from city cars to higher-end luxury models.

In terms of the geographical split for the potential of the EV/HEV market, in the report we disclose the divergence and evolution of the main markets. For instance, China today is very focused on the BEV

and PHEV segments, and last year China accounted for 50% of global sales in these categories. And, looking at the evolution of the giant Asian country, it seems that this predominance will continue in the future. Countries like Japan or the USA are more focused on full HEV than these full EV models. It’s also interesting to highlight that even if China represents a huge market for EV/HEV, local companies are involved in car manufacturing, but much less at tier-1 component or power module supplier level. At these stages European, American and Japanese companies are predominant, even in the Chinese supply chain.

Having assessed how each type of electrified vehicle market will evolve, Yole Développement expects double-digit CAGR for 2018-2023. This means some 10 million EV/HEVs will be sold by around 2020, and up to 18 million by 2023, across all categories. This report shows how different power electronics markets, such as power converters and power modules, relate to the EV/HEV application.

POWER ELECTRONICS FOR EV/HEV 2018Market & Technology report - April 2018

EV/HEV SALES WILL ACHIEVE A 28% CAGR FROM 2017-2023 – BY 2023 THE IGBT POWER MODULE MARKET WILL REACH $2.3B

Who will benefit from the EV/HEV market’s explosive growth?

WHAT’S NEW • Insight into new 48V systems• Total system-level power

electronic costs by type of EV/HEV• Deep discussion about the position

of different players involved with SiC for automotive

• Chinese EV/HEV market evolution up to 2030

KEY FEATURES OF THE REPORT Get the sample of the report on www.i-Micronews.com• 2015-2023 EV/HEV sales by type

of vehicle including BEV, PHEV, full HEV and mild HEV

• Regional breakdown of BEV and PHEV sales and top five company ranking

• System-level evolution looking at factors like cost, and the 48V transition

• Detailed analysis of EV/HEV battery pack evolution

• Deep insight into power packaging evolution with several case studies and technology roadmaps

• Deep discussion about how SiC MOSFETs will enter the EV/HEV industry

• 2016-2023 market metrics and forecasts for each type of electrified vehicle from vehicle sales, via the power converter market, to power devices

• Supply chain analysis, evolutionary trends and new business opportunities

• A whole chapter about the Chinese EV/HEV ecosystem and its evolution

(Yole Développement, April 2018)

Power module market by EV/HEV type

2017 2018 2019 2020 2021 2022 2023 BEV PHEV Full HEV Mild HEV

-

0,5

1

1,5

2

2,5

In $

B U

SD

CAGR2017-2023: 43,4%

CAGR2017-2023: 22%

All market segments are analysed in this report (CAGR...)BEV: Battery electric vehicle - HEV: Hybrid electric vehicle - PHEV: Plug-in hybrid vehicle

COST-EFFECTIVE TECHNOLOGY INNOVATIONS ARE AT THE CENTER OF THE EV/HEV INDUSTRY

This new Yole Développement report describes battery pack technologies and the challenges they face in powering electric vehicles. Production

cost is one of the main barriers today, but the possibility to use higher voltage batteries is one of the development directions for several carmakers.

POWER ELECTRONICS FOR EV/HEV 2018

HOW WILL THE DYNAMIC EV/HEV INDUSTRY EVOLVE? WHAT ARE THE NEW BUSINESS OPPORTUNITIES?

This report explores EV/HEV market and technology evolution and dynamics, including Yole Développement’s analyst view of supply-chain changes and new business opportunities. As mentioned before, China is the biggest market today for electric cars. However, the majority of IGBT power modules used in Chinese cars are manufactured outside China. This is not a sustainable solution for the Chinese industry and particularly for the Chinese government. The model as it is today is based on several joint ventures between local and foreign companies at the carmaker level, and to a lesser extent between

tier-1 companies. This is mainly due to government restrictions to foreign companies. In coming years, we should see the Chinese government taking action in order to get power devices manufactured in China to supply the local market.

Otherwise, in coming years we will see a lot of cost reduction, to make technologies more affordable and help the financial situation of companies’ EV/HEV divisions. Several manufacturers say that electric cars are not profitable due to their high cost. The battery is mostly responsible for that, but cost reductions will likely come from tier-1 supplier efforts to find better

Porsche is one of the most active companies doing this, and afterwards the Volkswagen group will likely take advantage of the technology. One clear advantage of using higher system voltages is the possibility of using fast charging technologies.

At the insulated-gate bipolar transistor (IGBT) power module level, a shift in design has happened in recent years. Modules have changed from classical packaging technologies, with a plastic casing, silicone gel encapsulation and a ceramic substrate. Now they are more compact, transfer-molded epoxy modules with organic isolation, although this has been a big step for traction inverter IGBT modules. These compact and flexible designs help integrate power converters better. As part of this, double-sided cooling modules have spread throughout the EV/HEV industry. The first double-sided cooling modules were in Lexus cars, but now we have the well-known fourth generation Toyota Prius PowerCards and the latest Bosch, Infineon or Dynex modules. This has built a pathway towards power electronics and cooling system integration and optimized thermal management systems.

Another important aspect is the arrival of organic insulator foils that avoid expensive and rigid ceramic substrates. Surprisingly, the isolation layer itself shows lower thermal conductivity of up to 10 W/

mK, compared to 24 W/mK for alumina and up to 90 W/mK for silicon nitride. However, it offers design flexibility, with thicker insulated-metal substrate (IMS)-type structures with copper layers on top and bottom, which can optimize the thermal paths for each custom design. This new business will obviously threaten the ceramic substrate suppliers, who therefore need to counterattack with new, better-adapted ceramic propositions. Integrated ceramic and baseplate substrate solutions, which can be found in Mitsubishi Electric modules, go in that direction.

Lastly, the report discusses the penetration of SiC metal-oxide-semiconductor field-effect transistors (MOSFETs) in electric and hybrid vehicle converters extensively. Some early adopters have already started using SiC, such as Chinese carmaker BYD in its on-board chargers, or US EV icon Tesla for its Model 3 inverter. Nevertheless, SiC is still used in only small volumes, requiring a back-up solution with silicon IGBTs. Other carmakers are even more conservative and do not see enough system-level benefits to adopt SiC MOSFETs. Yole Développement gives its vision of the industry and its evolution related to SiC penetration into the automotive supply-chain. The company also analyzes the potential of GaN power devices, but they’re not yet mature enough to be implemented in electric cars in the short term.

EV/HEV playground: Business opportunities for material suppliers


Die Die attach

Substrate

Baseplate

Encapsulant

Heatsink

Substrate attach

TIM

• Epoxy resin material • High thermal cycling • >175°C temperature handling

• Soldering • Transient-Liquid-Phase Soldering

• Sintering • Pressure-less silver powder • Micro particle silver powder

• Thermal Interface Material • Higher thermal conductivity • Higher thermal cycling TIM • Long-time material stability

• Substrates • Si3N4 AMB ceramic substrate • Epoxy resin insulating foil for IMS/IMB • Ceramic substrate with integrated pin-fin

Key success parameters for

material & component suppliers

• Semiconductors • SiC MOSFETs • GaN HEMTs

Find more details about

this report here:

MARKET & TECHNOLOGY REPORT

COMPANIES CITED IN THE REPORT (non exhaustive list)BAIC, Beiqi, BMW, Bosch, BYD, Chery, Continental, CRRC/Dynex, Daimler, Delphi, Denso, Dongfeng, DAW, Fiat, Ford, Fuji Electric, Geely, General Motors, Hitachi, Honda, Huanghai, Hyundai, Infineon/International Rectifier, JAC, Kandi, Kia, Macmic, Mitsubishi Electric, Mitsubishi Motors, Nissan, Oak Ridge National Laboratory, Porsche, Renault, SAIC, Schaeffler, Semikron, Siemens, Starpower, STMicroelectronics, Tesla Motors, Tianjin Qingyuan Electric Vehicles, Toshiba, Toyota, Valeo, Volkswagen, Volvo, Wanxiang Electric Vehicles, Zotye, etc.

AUTHORMattin Grao Txapartegi is a Technology & Market Analyst | Power Electronics at Yole Développement (Yole). He is engaged in many custom studies and reports dedicated to the evolution of inverters architecture and passive components, from capacitors to protection devices. Today, he investigates power packaging solutions to analyze the latest technical challenges, market growth and competitive landscape. Getting a deep understanding of the technology evolution, the market trends and the strategies of each player are part of his mission at Yole. Indeed Mattin is daily driving technology and market scouting, roadmap definition, disruptive technologies and market opportunities identification and competitive landscape analysis.Previously he acquired a comprehensive expertise in the design of power converters for EV at Renault.As an engineer, Mattin is graduated from Grenoble INP (FR) with specialization in embedded systems for transportation. He has also an advanced master in aeronautics from the Arts & Métiers ParisTech (FR).

What we saw, what we missed 4

Executive summary 9

Electric and Hybrid Vehicles: current and future market overview 41

> EV/HEV market forecasts up to 2023 > Geographical breakdown of PHEV and BEV > Ranking of companies> Market growth drivers and barriers

Power electronics in EV/HEV 62> Power electronics market for EV/HEV> System level trends> The 48V system> Battery pack evolution on EV/HEV

> Power module packaging trends> Wide Band Gap devices

Supply-chain and business models 157> Supply-chain from die to OEM> Business models in the automotive industry> New business opportunities> OEMs’ future strategies

Chinese EV/HEV market evolution and local players 185

> Chinese market up to 2030> Chinese player landscape: local vs. foreigners> Ranking of local OEMs> Chinese EV/HEV business models

Conclusion 223

TABLE OF CONTENTS (complete content on i-Micronews.com)

EV/HEV: Threats to traditional power electronics players*


OBJECTIVES OF THE REPORT• Provide updated market metrics and forecasts for electrified vehicles• Analyze the differences between geographical areas, as well as the incentives and deterrents for

market growth• Present the main technological trends and ongoing developments for power electronics that

target automotive at inverter, power module and power device levels• Provide updated market metrics and forecasts for power electronics, broken down by electrified

vehicle type• Discuss battery pack evolution and its impact on power electronics• Analyze business model evolution and supply-chain moves

RELATED REPORTBenef i t f rom our Bundle & Annual Subscription offers and access our analyses at the best available price and with great advantages

• Power Module Packaging: Material Market and Technology Trends 2017

• Power SiC 2017: Materials, Devices, Modules, and Applications

• Li-ion Battery Packs for Automotive and Stationary Storage Applications

• Infineon FF400R07A01E3 Double Side Cooled IGBT Module

• Infineon FS820R08A6P2B HybridPACK Drive IGBT Module

Find all our reports on www.i-micronews.com

$1B in 2017

$2.3B in 2023

*OSAT: Outsourced Semiconductor Assembly and Test

3

• Competition through innovation. • Accelerated implementation of new

technologies. • New players may choose different

suppliers.

Power module marketfor EV/HEV

Chinese powermodule makers

OSATs

Automotive tier1 players

*Non-exhaustive list of players

technology at power module and converter level. Penetration of SiC MOSFETs in EV/HEVs will also depend on how tier-1 suppliers enable system level price reductions when using SiC. For these reasons, we still expect plenty of advances in the EV/HEV industry that will open new business

opportunities for a wide variety of companies, including material suppliers, integrated device manufacturers, Chinese semiconductor companies, outsourced semiconductor assembly and test companies, and tier-1 suppliers. Yole Développement’s 2018 report explains this complex ecosystem.

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Founded in 1998, Yole Développement has grown to become a group of companies providing marketing, technology and strategy consulting, media and corporate finance services, reverse engineering and reverse costing services and well as IP and patent analysis. With a strong focus on emerging applications using silicon and/or micro manufacturing, the Yole group of companies has expanded to include more than 80 collaborators worldwide covering MEMS and image sensors, Compound Semiconductors, RF Electronics, Solid-state lighting, Displays, software, Optoelectronics, Microfluidics & Medical, Advanced Packaging, Manufacturing, Nanomaterials, Power Electronics and Batteries & Energy Management.The “More than Moore” market research, technology and strategy consulting company Yole Développement, along with its partners System Plus Consulting, PISEO and KnowMade, support industrial companies, investors and R&D organizations worldwide to help them understand markets and follow technology trends to grow their business.

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https://www.i-micronews.com/reports.html

https://www.i-micronews.com/media-kit.html

https://www.i-micronews.com/media-kit.html


6 COMPANIES TO SERVE YOUR BUSINESS

Due diligence

www.yole.fr

Manufacturing costs analysis

Teardown and reverse engineering

Cost simulation tools

www.systemplus.fr

Market, technology and strategy

consulting

www.yole.fr

IP analysis

Patent assessment

www.knowmade.fr

Innovation and business maker

www.bmorpho.com

Design and characterization of

innovative optical systems

www.piseo.fr

Yole Group of Companies

http://www.yole.fr/

http://www.yole.fr/


OUR GLOBAL ACTIVITY

30%of our business

40%of our business 30%

of our business

Greater

China office

Yole Japan

HQ in Lyon

Nantes

Paris

Nice

Vénissieux

Europe office

Frankfurt

Hsinchu

Tokyo

Yole Inc.

Phoenix

Yole Korea

Seoul

Palo Alto

http://www.yole.fr/

http://www.yole.fr/


ANALYSIS SERVICES - CONTENT COMPARISON

Technology

and Market

Report

Leadership

Meeting

Q&A

Service

Depth of the analysis

Bre

adth

of th

e a

nal

ysis

Meet the

Analyst

Custom

Analysis

High

High

Low

http://www.yole.fr/

http://www.yole.fr/


SERVING THE ENTIRE SUPPLY CHAIN

Our analysts provide market analysis,

technology evaluation,

and business plans along the entire

supply chain

Integrators, end-

users and software

developpers

Device manufacturers

Suppliers: material, equipment,

OSAT, foundries…

Financial investors, R&D centers

http://www.yole.fr/

http://www.yole.fr/


SERVING MULTIPLE INDUSTRIAL FIELDS

We workacross

multiples industries to understand

the impact of More-than-

Moore technologies from deviceto system

From A to Z…

Transportation

makers

Mobile phone

and

consumer

electronics

Automotive

Medical

systems

Industrial

and defense

Energy

management

http://www.yole.fr/

http://www.yole.fr/


o Yole Développement, System Plus Consulting, KnowMade and PISEO, all part of Yole Group of Companies, keep on increasing their collaboration to offer, in 2018, a

collection of 150+ reports. Combining respective expertise and methodologies from the 4 companies, the reports aim to provide market & technology analysis, patent

investigation and patent infringement risk analysis, teardowns & reverse costing analysis.They cover:

o You are looking for:

• An analysis of your product market

• A review of your competitors evolution

• An understanding of your manufacturing and production costs

• An understanding of your industry technology roadmap and related IPs

• A clear view on the evolution of the supply chain…

Our reports are for you!

The combined team of 60+ experts (PhDs, MBAs, industry veterans…) from Yole Développement, System Plus Consulting, KnowMade and PISEO, collect information,identify the trends, the challenges, the emerging markets, the competitive environments and turn it into results to give you a complete picture of your industrylandscape.

In the past 20 years, we worked on more than 1 700 projects, interacting with technology professionals and high level opinion makers from the main players of theindustry.

o In 2018, Yole Group of Companies plan to publish +150 reports. Gain full benefit from our Annual Subscription offers and receive at least a 36% discount.

REPORTS COLLECTION

www.i-Micronews.com

• MEMS & Sensors

• RF devices & technologies

• Imaging

• Medical technologies (MedTech)

• Photonics

• Advanced packaging

• Manufacturing

• Advanced substrates

• Power electronics

• Batteries and energy management

• Compound semiconductors

• Solid state lighting

• Displays

• Software

• Memory

http://www.yole.fr/

http://www.yole.fr/

http://www.i-micronews.com/


OUR 2018 REPORTS COLLECTION (1/3)

MEMS & SENSORS

o MARKET AND TECHNOLOGY REPORT – by Yole Développement

− Status of the MEMS Industry 2018 - Update

− Silicon Photonics 2018 - Update

− Consumer Biometrics: Sensors & Software 2018 - Update

− MEMS Pressure Sensors 2018

− Air Quality Sensors 2018

o REVERSE ENGINEERING & COSTING REVIEW – by System Plus Consulting

− Gas & Particles Sensors

− MEMS Pressure Sensors

− Piezo MEMS 2018 *

o PATENT ANALYSES – by KnowMade

− MEMS Microphone – Patent Landscape Analysis

RF DEVICES AND TECHNOLOGIES


− 5G impact on RF Front End Modules and Connectivity for Cellphones 2018 – Update

− Radar Technologies for Automotive 2018 - Update

− RF GaN Market: Applications, Players, Technology, and Substrates 2018-2023 –

Update

− Advanced RF System-in-Package for Cellphones 2018 – Update *

− Wireless technologies (Radar, V2X) for Automotive 2018

− RF Standards and Technologies for Connected Objects 2018

− RF & Photonic Components & Technologies for 5G Infrastructure 2018


− RF Front-End Modules in Smartphones

− RF GaN*


− RF Front End Module – Patent Landscape Analysis

− RF GaN – Patent Landscape Analysis

IMAGING & OPTOELECTRONICS


− Status of the CMOS Image Sensor Industry 2018 – Update

− Status of the Compact Camera Module and Wafer Level Optics Industry 2018 -

Update

− 3D Imaging and Sensing 2018 - Update

− Machine Vision for Industry and Automation 2018

− Sensors for Robotic Vehicles 2018

− Imagers and Detectors for Security and Smart Buildings 2018

− LiDARs 2018

o QUARTERLY UPDATE – by Yole Développement

− CMOS Image Sensors 2018 *


− CMOS Image Sensors

− Compact Camera Modules


− LiDAR – Patent Landscape Analysis

SOFTWARE


− Consumer Biometrics: Sensors & Software 2018 - Update

− Processing Hardware and Software for AI 2018 – Vol. 1 & 2

Update : 2017 version still available / *To be confirmed

http://www.yole.fr/

http://www.yole.fr/


OUR 2018 REPORTS COLLECTION (2/3)ADVANCED PACKAGING


− Status of Advanced Packaging Industry 2018 - Update

− Status of Advanced Substrates 2018: Embedded Die and Interconnects, Substrate Like

PCB Trends

− Fan-Out Packaging 2018 – Update*

− 3D TSV and Monolithic Business Update 2018 – Update

− Advanced RF System-in-Package for Cellphones 2018 – Update*

− Power Modules Packaging 2018 – Update

− Discrete Power Packaging 2018 – Update*

− Memory Packaging Market and Technology Report 2018 – Update*

− Status of Panel Level Packaging 2018

− Trends in Automotive for Advanced Packaging 2018

− Processing Hardware and Software for AI 2018 – Vol. 1 & 2

− Integrated Passive Devices (IPD) 2018


− RF Front-End SiP

− Fan-Out Packaging *


− Hybrid Bonding for 3D Stack – Patent Landscape Analysis

MANUFACTURING


− Wafer Starts for More Than Moore Applications

− Equipment for More than Moore: Technology & Market Trends for Lithography &

Bonding/Debonding 2018

− Equipment for More than Moore: Technology & Market Trends for Thin Film

Deposition & Etching 2018


− Wafer Bonding Technology Overview 2018

MEMORY


− Emerging Non Volatile Memory 2018 – Update

− Memory Packaging Market and Technology Report 2018 – Update*

o QUARTERLY UPDATE – by Yole Développement**

− Memory Market 2018 (NAND & DRAM)

o MONTHLY UPDATE – by Yole Développement**

− Memory Pricing 2018 (NAND & DRAM)


− DRAM Technology & Cost Review 2018

− NAND Memory Technology & Cost Review 2018


− 3D Non-Volatile Memories – Patent Landscape Analysis

COMPOUND SEMICONDUCTORS

MARKET AND TECHNOLOGY REPORT – by Yole Développement

− Status of Compound Semiconductor Industry 2018*

− Power SiC 2018: Materials, Devices, and Applications - Update

− Power GaN 2018: Materials, Devices, and Applications – Update

− RF GaN Market: Applications, Players, Technology, and Substrates 2018-2023 –

Update

− GaAs Materials, Devices and Applications 2018

− InP Materials, Devices and Applications 2018


− Power SiC Devices

− Power GaN Devices


− Power SiC – Patent Landscape Analysis

− Status of the GaN IP – Patent Watch 2018 & Patent Activity 2017

Update : 2017 version still available / *To be confirmed / ** Can not be selected within an Annual Subscription offer

http://www.yole.fr/

http://www.yole.fr/


OUR 2018 REPORTS COLLECTION (3/3)

POWER ELECTRONICS

MARKET AND TECHNOLOGY REPORT – by Yole Développement

− Status of Power Electronics Industry 2018 - Update

− Power Modules Packaging 2018 - Update

− Discrete Power Packaging 2018 – Update*

− Power Electronics for EV/HEV 2018 - Update

− Wireless Charging Market Expectations and Technology Trends 2018

− Integrated Passive Devices (IPD) 2018


− Power ICs Market 2018 – Update


− Power ICs Market 2018*

− Power Modules*

BATTERY AND ENERGY MANAGEMENT


− Solid State Electrolyte Battery 2018

− Li-ion Battery Packs for Automotive and Stationary Storage Applications 2018 -

Update


− Solid-State Batteries – Patent Landscape Analysis

− Status of the Battery IP – Patent Watch 2018 & Patent Activity 2017

SOLID STATE LIGHTING


− IR LEDs and Lasers 2018 - Update

− Automotive Lighting 2018 – Update

− UV LEDs 2018 - Update

− VCSELs 2018

− LiFi 2018


− VCSELs 2018

− UV LEDs 2018 *

DISPLAYS


− MicroLED Displays 2018 – Update

− Quantum Dots and Wide Color Gamut Display Technologies 2018 - Update

− Displays and Optical Vision Systems for AR / VR / MR 2018


− MicroLED Display – Patent Landscape Analysis

MEDTECH


− BioMEMS & Non Invasive Emerging Biosensors: Microsystems for Medial

Applications 2018 - Update

− Point-of-Need Testing: Application of Microfluidic Technologies - Update

− Neurotechnologies and Brain Computer Interface 2018

− CRISPR-Cas9 Technology: From Lab to Industries 2018

− Portable Medical Imaging 2018

− Inkjet Functional and Additive Manufacturing for Electronics 2018

− Liquid Biopsy 2018: From Isolation to Downstream Applications

− Chinese Microfluidics Industry 2018

− Scientific Cameras for the Life Sciences & Analytical Instrumentation Laboratory

Markets 2018*


− Microfluidic IC Cooling – Patent Landscape Analysis

− Circulating Tumor Cell Isolation – Patent Landscape Analysis

− Organ-on-a-Chip – Patent Landscape Analysis

− OCT Medical Imaging – Patent Landscape Analysis

Update : 2017 version still available / *To be confirmed

http://www.yole.fr/

http://www.yole.fr/


OUR 2017 PUBLISHED REPORTS (1/3)MEMS & SENSORS


− Status of the MEMS Industry 2017

− High End Inertial Systems Market and Technology 2017

− Magnetic Sensors Market and Technologies 2017

− MEMS and Sensors for Automotive - Market and Technology Trends 2017

− Acoustic MEMS and Audio Solutions 2017

− Sensors and Sensing Modules for Smart Homes and Buildings 2017

− Fingerprint Sensor Applications and Technologies – Consumer Market Focus 2017

o REVERSE COSTING REPORT – by System Plus Consulting

− Continental SRL1: State-of-the-art LiDAR for Advanced Driver Assistance Systems –

Reverse Costing Report

− Bosch Mobility Ultrasonic Sensor – Reverse Costing Report

− MEMS Packaging 2017 - Reverse Costing Review

− Bosch BMP380 Pressure Sensor – Reverse Costing Report

IMAGING & PHOTONICS


− Status of the CMOS Image Sensor Industry 2017

− 3D Imaging and Sensing 2017

− Uncooled Infrared Imaging Technology & Market Trends 2017

− Camera Module Industry Market and Technology Trends 2017


− FLIR Boson – a small, innovative, low power, smart thermal camera core – Reverse

Costing Report

− Camera Module Physical Analyses Overview 2017

RF DEVICES AND TECHNOLOGIES


− RF Front End Modules and Components for Cellphones 2017

− Advanced RF System-in-Package for Cell Phones 2017

− 5G Impact on RF Front-End Industry 2017

ADVANCED PACKAGING


− Status of the Advanced Packaging Industry 2017

− Embedded Die Packaging: Technology and Market Trends 2017

− Fan-Out: Technologies and Market trends 2017

− Advanced Substrates Overview: From IC Package to Board 2017

− 3D TSV and 2.5D Business Update - Market and Technology Trends 2017

− Advanced RF System-in-Package for Cellphones 2017

− Memory Packaging Market and Technology Report 2017

− MEMS Packaging 2017

− Emerging Non-Volatile Memory 2017


− NVIDIA Tesla P100 - Reverse Costing Report

− MEMS Packaging - Reverse Technology Review

− Advanced RF SiP for Cellphones 2017 - Reverse Costing Review

SOFTWARE


− Embedded Software in Vision Systems

MEDTECH


− Status of the Microfluidics Industry 2017

− Solid-State Medical Imaging 2017

− Organs-On-Chips 2017

− Connected Medical Devices Market and Business Models 2017

− Artificial Organ Technology and Market analysis 2017

− Medical Robotics Technology & Market Analysis 2017

http://www.yole.fr/

http://www.yole.fr/


OUR 2017 PUBLISHED REPORTS (2/3)

MANUFACTURING


− Laser Technologies for Semiconductor Manufacturing 2017

− Equipment and Materials for 3D TSV Applications 2017

− Equipment and Materials for Fan-Out Packaging 2017

− Glass Substrate Manufacturing in the Semiconductor Field 2017

BATTERIES & ENERGY MANAGEMENT


− Status of the Rechargeable Li-ion Battery Industry

− Market Opportunities for Thermal Management Components in Smartphones

DISPLAYS


− MicroLED Displays

− Quantum Dots and Wide Color Gamut Display Technologies

− Phosphors & Quantum Dots 2017 - LED Downconverters for Lighting & Displays

SOLID STATE LIGHTING


− LED Packaging 2017: Market, Technology and Industry Landscape

− CSP LED Lighting Modules

− IR LEDS and VCSELs - Technology, Applications and Industry Trends

− LED Lighting Module Technology, Industry and Market Trends 2017

− Automotive Lighting: Technology, Industry and Market Trends 2017

− Horticultural LED Lighting: Market, Industry, and Technology Trends

POWER ELECTRONICS


− Status of the Power Electronics Industry 2017

− Thermal Management Technology and Market Perspectives in Power Electronics and

LEDs 2017

− Gate Driver Market and Technology Trends 2017

− Power MOSFET 2017: Market and Technology Trends

− Power Module Packaging: Material Market and Technology Trends 2017

− IGBT Market and Technology Trends 2017


− Power Management ICs Market 2017


− EPC2045 100V GaN-on-Silicon Transistor – Reverse Costing Report

− Silicon Capacitor - Technology and Cost Review

− Industrial 100V MOSFET - Technology and Cost Review

− InvenSense ICM-20789: High Performance 6-Axis Motion Sensor and Pressure Sensor

Combo – Reverse Costing Report

COMPOUND SEMICONDUCTORS


− Bulk GaN Substrate Market 2017

− RF Power Market and Technologies 2017: GaN, GaAs and LDMOS

− Power SiC 2017: Materials, Devices, Modules, and Applications

− Power GaN 2017: Epitaxy, Devices, Applications, and Technology Trends

http://www.yole.fr/

http://www.yole.fr/


OUR 2017 PUBLISHED REPORTS LIST (3/3)

OUR PARTNERS’ REPORTS

PATENT ANALYSES – by KnowMade

− Wireless Charging Patent Landscape Analysis

− RF Acoustic Wave Filters Patent Landscape Analysis

− NMC Lithium-Ion Batteries Patent Landscape Analysis

− Pumps for Microfluidic Devices Patent Landscape

− III-N Patent Watch

− FLUIDIGM Patent Portfolio Analysis

− Knowles MEMS Microphones in Apple iPhone 7 Plus Patent-to-Product Mapping 2017

− Consumer Physics SCiO Molecular Sensor Patent-to-Product Mapping

− Patent Licensing Companies in the Semiconductor Market - Patent Litigation Risk and Potential Targets

− Microfluidic Technologies for Diagnostic Applications Patent Landscape

TEARDOWN & REVERSE COSTING – by System Plus Consulting

More than 60 teardowns and reverse costing analysis and cost simulation tools published in 2017

MORE INFORMATION

o All the published reports from theYole Group of Companies are available on our website www.i-Micronews.com.

o Ask for our Annual Subscription offers: With our bundle offer, you choose the number of reports you are interested in and select the related offer. You then have up

to 12 months to select the required reports from the Yole Développement, System Plus Consulting and KnowMade offering. Pay once and receive the reports

automatically (multi-user format). Contact your sales team according to your location (see the last slide).

http://www.yole.fr/

http://www.yole.fr/

http://www.i-micronews.com/


MICRONEWS MEDIA

o About Micronews Media

To meet the growing demand for market,

technological and business information,

Micronews Media integrates several tools able

to reach each individual contact within its

network.We will ensure you benefit from this.

ONLINE ONSITE INPERSON

@Micronews e-newsletter

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Events Webcasts

Unique, cost-effective ways

to reach global audiences.

Online display advertising

campaigns are great strategies

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product/brand visibility. They

are also an efficient way to

adapt with the demands of the

times and to evolve an effective

marketing plan and strategy.

Brand visibility, networking

opportunities

Today's technology makes it

easy for us to communicate

regularly, quickly, and

inexpensively – but when

understanding each other is

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increasing your brand/product

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Targeted audience

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Webcasts are a smart,

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Benefit from the i-Micronews.com

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Gain new leads for your business

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registrants per webcast

Contact: Camille Veyrier ([email protected]), Marketing & Communication Project Manager

http://www.yole.fr/

http://www.yole.fr/



CONTACT INFORMATION

o CONSULTING AND SPECIFIC ANALYSIS, REPORT

BUSINESS

• North America:

• Steve LaFerriere, Senior Sales Director for Western US &

Canada

Email: [email protected] – + 1 310 600-8267

• Troy Blanchette, Senior Sales Director for Eastern US &

Canada

Email: [email protected] – +1 704 859-0453

• Japan & Rest of Asia:

• Takashi Onozawa, General Manager, Asia Business

Development (Korea, Singapore, India & ROA)

Email: [email protected] - +81 34405-9204

• Miho Othake, Account Manager (Japan)

Email: [email protected] - +81 3 4405 9204

• Itsuyo Oshiba, Account Manager (Japan)

Email: [email protected] - +81-80-3577-3042

• Greater China: Mavis Wang, Director of Greater China Business

Development


• Europe: Lizzie Levenez, EMEA Business Development Manager

Email: [email protected] - +49 15 123 544 182

• RoW: Jean-Christophe Eloy, CEO & President, Yole Développement

Email [email protected] - +33 4 72 83 01 80

o FINANCIAL SERVICES (in partnership withWoodside

Capital Partners)

• Jean-Christophe Eloy, CEO & President

Email: [email protected] - +33 4 72 83 01 80

• Ivan Donaldson, VP of Financial Market Development


o GENERAL

• Public Relations: [email protected] - +33 4 72 83 01 89

• Email: [email protected] - +33 4 72 83 01 80

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