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From Technologies to Market

Report

From Technologies to Market

© 2016

Thermal Management in LEDs and Power Electronics 2016

2

REPORT OBJECTIVES

The objectives of the report are to:

• Provide power electronic and LED module market analysis and forecasts

• Cover a large variety of different materials and technology solutions used in modules

• Provide insight into different technologies currently used, technology trends, and newest innovations for modules.

• Provide an overview of key suppliers for module materials

• Demonstrate the strong synergies between applications that are driven by power density and efficiency

©2016 | www.yole.fr | Thermal Management Technology and Market Perspectives in Power Electronics and LEDs 2017 | Sample

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REPORT METHODOLOGY

Market segmentation methodology

Market forecast methodology


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REPORT METHODOLOGY

Technology analysis methodology Information collection


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TABLE OF CONTENTS

Part 1/1

• What is in this report? 4

• Companies cited in the report 5

• List of abbreviations used in this report 6

• Executive summary 7

• Introduction to power electronics and LEDs 43

• Power electronics landscape and market 44

Power electronics and 21st century challenges

Power electronics history, use and trends

Focus on China

Global power electronics market – IGBT Module

market

• LED landscape and market 62

Packaged LED industry and market trends

Packaged LED industry, technology and market

trends

• Context of thermal management 73

• Context of thermal management in power

packaging74

Challenges and business opportunities

• Context of thermal management in LED

modules82

LED module integration into lighting systems

Thermal management in LED modules

• Synergies between LED and power electronics

for thermal management89

• Focus on die attach 95

• Focus on ceramic substrates 128

• Focus on encapsulant 165

• Focus on Thermal Interfaces Materials (TIM) 199

• Focus on baseplates/PCBs 247

• Business model and supply chain analysis 249

• Conclusions 256


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Biography & contact

ABOUT THE AUTHORS

Pierrick Boulay, Market and Technology Analyst in LED, OLED and Lighting Systems

Dr Pierric Gueguen, Business Unit Manager for Power Electronics and Compound Semiconductors

Dr Pierric Gueguen is Business Unit Manager for Power Electronics and Compound Semiconductor activities at Yole Développement. He has a PhD in

Micro and Nano Electronics and an master degree in Micro and Nanotechnologies for Integrated Circuits. He worked as PhD student at CEA-Leti in the

field of 3D Integration for Integrated Circuits and Advanced Packaging. He then joined Renault SAS, and worked for 4 years as technical project manager

in R&D division. During this time, he oversaw power electronic converters and integration of Wide Band Gap devices in Electric Vehicles. He is author and

co-author of more than 20 technical papers and 15 patents.


Pierrick Boulay works as Market and Technology Analyst in the fields of LED, OLED and Lighting Systems to carry out technical, economic and marketing

analysis at Yole Développement, the "More than Moore" market research and strategy consulting company. He has experience in both LED lighting

(general lighting, automotive lighting…) and OLED lighting. In the past, he has mostly worked in R&D department for LED lighting applications. Pierrick

holds a master degree in Electronics (ESEO - France).

Coralie Le Bret, Market and Technology Analyst in Power Electronics and Compound Semiconductors

Coralie Le Bret has been an analyst in power electronics and compound semiconductor technologies since 2014, at Yole Développement, the "More than

Moore" market research and strategy consulting company. She gratuated from INSA Lyon with an engineering degree in material sciences, specializing in

semiconductors and microelectronics. At Yole Développement she is in charge of electro-mobility, and she uses her expertise on materials and

semiconductors to follow power devices and power packaging evolution.

Pars Mukish, Business Unit Manager for LED, OLED and Sapphire

Pars Mukish holds a master degree in Materials Science & Polymers (ITECH - France) and a master degree in Innovation & Technology Management (EM

Lyon - France). Since 2015, Pars Mukish has taken on responsibility for developing LED, OLED and Sapphire activities as Business Unit Manager at Yole

Développement. Previously, he has worked as Marketing Analyst and Techno-Economic Analyst for several years at the CEA (French Research Center).

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Converter Level

• Harsh

Environment

• Reliability

• Form factor

• Etc…

Application level Device Level Module Level

• Power Density

• Efficiency

• Etc…

• Smaller Devices

• Brittle Materials

• Higher Junction

Temperature

• Lead free die

assembly

• Low Thermal

Resistance

• Etc…

CHALLENGES AND BUSINESS OPPORTUNITIES

One trend, many technical challengesDesign Process

Energy Management Thermal Management

SiCGaN

…

Sintering

Encapsulant

Ch

allen

ges

Em

erg

ing

So

luti

on

s

Etc…

HT Capacitors

InterconnectionEtc…


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GLOBAL POWER ELECTRONICS MARKET

Evolution of power device market between 2010 and 2021

In 2015 the power electronics market contracted, while most indicators pointed to continued market growth.


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• Packaged LED volume are driven by low and middle power LEDs but packaged LED revenue are driven also by high power LEDs (due to higher ASP).

• Such trend can be explained by the fact that low and middle power LEDs are subject to higher price pressure compared to high power LEDs. These markets (i.e.: low and middle power LEDs) can no more be considered as flourishing market as offering low margins to manufacturers.

• As a result, most of the recent investment made by LED manufacturers are done toward high power LEDs:

• 2015 / 2016 Osram high power LED packaging facility in Malaysia.

• 2014 CREE high power LED packaging facility in China.

• (…)

Packaged LED Market Volume and Revenue - Split by Package Type

PACKAGED LED INDUSTRY, TECHNOLOGY AND MARKET TRENDS


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PACKAGING

Synergies and differences in power packaging and LED packaging

Power module LED module

Heatsink

Thermal Interface Material (TIM)

Substrate

IG

BT

Baseplate

External connection

Plastic case

Die attachInterconnection

Encapsulation

Substrate attach

LED die

Substrate

PCB

Interface Material

#1 (Die Attach)

Encapsulation/

Optic/Phosphor

Heat

Sink

EncapsulationEpoxy

Methyl Silicone

Baseplate / PCB

Die AttachSoldering - SAC

Sintering

SubstrateDBC

DPC

No common

technologies

Common

technologies

with easy

modifications

Technologies

needed to be

adapted


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More than 30% of the thermal management market is common to LED and Power Electronics.

Thermal Management Market for LEDs and Power Electronics Materials

SYNERGIES AND DIFFERENCES IN LEDS AND POWER ELECTRONICS


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SYNERGIES AND DIFFERENCES BETWEEN LED AND POWER MODULES


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FOCUS ON DIE ATTACH

Summary of different die attach materials and their use

For Si-based devices (values may change for WBG devices).

Low Medium High

200°C

Power electronics Xxx Xxx

Power density

Die attach material

fusion temperature

(°C)

Xxx°C Xxx°C

Application

Die attach material

- Mainstream

SAC soldering Xxx

Xxx

Xxx

2 X X (W/mm²)

Low power LED

Xxx


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Material supplier (non exhaustive)

FOCUS ON DIE ATTACH

Europe:

• Xxx

• Henkel (DE)

• Xxx

• Xxx

• Xxx

• Xxx

Japan:

• Xxx

• Namics Corporation

• Xx

• Xxx

• Xxx

China:

• Xxx

USA:

• Xxx

• Xxx

• Xxx

• Dow Corning

• Xxx

• Xxx

• Xxx

• Xxx

• Xxx

• Xxx

• Xxx


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SUBSTRATES FOR POWER ELECTRONICS

Substrate material market share in 2015 and 2021

In 2015 AlNled the substrate market. New products should progressively take an increasing market share by 2021.

• In 2015,AlN was leading the substrate market, with Al2O3 second and Si3N4 third

• The type of used substrate depends on the application targeted, for instance whether it’s high-end or mid-range

• Xxx

© 2016Yole Développement© 2016

Yole Développement

TOTAL$XXXM

TOTAL$XXXM


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SUBSTRATES

Substrate market size evolution between 2015 and 2021, split by application (in Mcm²)

The substrate market will be driven by energy and electrified vehicles, like other power module parts.

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SUBSTRATES

Substrate market size evolution between 2015 and 2021, split by application (in M$)

In 2021 we expect the substrate market to be worth around half a billion dollars.

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Choosing the substrate type

HIGH POWER PACKAGED LEDS

Thermal

Conductivity

Thermo-

Mechanical

Match

Moldability Cost SizeLight

ReflectivityStatus & Trend

Xxx Fair Fair Fair Excellent Excellent Fair Xxx

AlN Ceramic Excellent Excellent Fair FairExcellent

Fair

Has increased fast in

the past - Should now

stabilize

Xxx Fair Poor Excellent Excellent Poor Fair Xxx

Xxx Excellent Excellent Excellent Fair Excellent Fair Xxxx

Xxx Excellent Fair Excellent ? Excellent Excellent Xxx


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Analysis of Different Thermal Interface Materials

THERMAL MANAGEMENT IN LED MODULES

Pro ConsThermal

ConductivityCost

Thermal

greasesXxx

• Xxx

• Good filling airgap

• Dusty

• XxxUp to 9 W/mK X

Xxx Xxx• Xxx

• Xxx• Xxx Xxx X

Xxx Xxx• Xxx

• Xxx

• Xxx

• XxxXxx X

Thermal

AdhesiveXxx • High thermal conductivity • Xxx Xxx X

Thermal

FilmsXxx • Easy to handle • Xxx Up to 4W/mK X


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Many players are involved in both Power Electronics and LED industries.

Material suppliers

BUSINESS MODEL AND SUPPLY CHAIN ANALYSIS

LED Material Suppliers

Power Electronics Material Suppliers


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Main materials to improve for thermal management depend on applications, but there are synergies between LED and power modules.

Focus on thermal management

SYNERGIES AND DIFFERENCES BETWEEN LED AND POWER MODULES

Baseplate PCBTIMSubstrate EncapsulantDie Attach

Common

LED + PE

PE Only

Possible

evolution

from LED

to PE

LED Only

Epoxy

Xxx

Xxx

Xxx

Xxx

Xxx

SAC

Xxx

Xxx

Xxx

Xxx

DBC

Xxx

Xxx

Xxx

Xxx

Xxx

Xxx

Xxx

Xxx

Xxx

Thermal Grease

Xxx

Xxx

Xxx

Xxx

PCT

Xxx Xxx

Possible

evolution

from PE

to LED

Legend:

Processes

Materials


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RELATED REPORTS


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http://www.i-micronews.com/category-listing/product/power-packaging-technology-trends-and-market-expectations.html


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© 2016

Yole Développement

FromTechnologies to Market

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FIELDS OF EXPERTISE

Yole Développement’s 30 analysts operate in the following areas

MEMS & Sensors

LED

Compound

Semi.

Imaging

Photonics

MedTech

Manufacturing

Advanced

Packaging

Batteries / Energy

Management

Power

Electronics

Displays

RF

Devices &

Techno.

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4 BUSINESS MODELS

o Consulting and Analysis

• Market data & research, marketing analysis

• Technology analysis

• Strategy consulting

• Reverse engineering & costing

• Patent analysis

www.yole.fr

o Reports

• Market & Technology reports

• Patent Investigation and patent infringement risk analysis

• Teardowns & Reverse Costing Analysis

• Cost Simulation Tool

www.i-Micronews.com/reports

o Financial services

• M&A (buying and selling)

• Due diligence

• Fundraising

• Maturation of companies

• IP portfolio management & optimization

www.yolefinance.com

www.bmorpho.com

o Media

• i-Micronews.com website

• @Micronews e-newsletter

• Communication & webcast services

• Events

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A GROUP OF COMPANIES

Market,

technology and

strategy

consulting

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M&A operations

Due diligences

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Innovation and business maker

www.bmorpho.com

Manufacturing costs analysis

Teardown and reverse engineering

Cost simulation tools

www.systemplus.fr

IP analysis

Patent assessment

www.knowmade.fr


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OUR 2016 REPORTS PLANNING (1/2)

MARKET AND TECHNOLOGY REPORTS

by Yole Développement

o MEMS & SENSORS

− Gas Sensor Technology and Market 2016

− Status of the MEMS Industry 2016

− Sensors for Cellphones and Tablets 2016

− Inkjet Printhead Market & Technology Trends 2016

− Sensors for Biometry and Recognition 2016

− Finger Print Sensors Market and Technologies 2016

− Silicon Photonics 2016

− Emerging Non Volatile Memories 2016

o IMAGING & OPTOELECTRONICS

− Status of the CMOS Image Sensor Industry 2016

− Uncooled Infrared Imaging Technology & Market Trends 2016

− Imaging Technologies for Automotive 2016

− Sensors for Drones & Robots: Market Opportunities and Technology

Evolution 2016

− Silicon Photonics 2016

o MEDTECH

− BioMEMS: Microsystems for Healthcare Applications 2016

− Point of Need Testing 2016: Application of Microfluidic Technologies

o ADVANCED PACKAGING

− Fan-Out WLP: Technology Trends and Business Update 2016

− Embedded Die Packaging: Technologies and Markets Trends 2016

− 2.5D & 3D IC Business Update 2016

− Status and Prospects for the Advanced Packaging Industry in China 2016

− Fan-in Wafer Level Packaging: Market and Technology Trends 2016

o MANUFACTURING

− Thinning & Dicing Equipment for Advanced Packaging, MEMS, Photovoltaics,

LED, CMOS 2016


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OUR 2016 REPORTS PLANNING (2/2)

o COMPOUND SEMICONDUCTORS

− Power SiC 2016: Materials, Devices, Modules, and Applications

− GaN Modules, Devices and Substrates for Power Electronics 2016

− Sapphire Applications & Market 2016: from LED to Consumer Electronics

− GaN RF Devices Market: Applications, Players, Technology, and Substrates

2016 – 2022

− RF components and modules for cellphones 2016**

o LED

− Sapphire Applications and Market 2016: From LED to Consumer Electronics

− Thermal Management for LED and Power 2016

− LED Packaging 2016

− Microdisplays and MicroLEDs 2016**

− UV LEDs - Technology, Manufacturing and Application Trends

− OLED for Lighting - Technology, Industry and Market Trends 2016

− Automotive Lighting: Technologies, Industry and Market Trends 2016

o POWER ELECTRONICS

− Power Electronics for EV/HEV 2016: Market, Innovations and Trends

− Status of Power Electronics Industry 2016

− Passive Components Technologies and Market Trends for Power Electronics

2016

− Power SiC 2016: Materials, Devices, Modules, and Applications

− GaN Modules, Devices and Substrates for Power Electronics 2016

− Inverter Technologies Trends & Market Expectations 2016

− Opportunities for Power Electronics in Renewable Electricity Generation

2016

− Thermal Management for LED and Power 2016

− GaN RF Devices Market: Applications, Players, Technology, and Substrates

2016 - 2022

o BATTERY

− Stationary Storage and Automotive Li-ion Battery Packs

− Beyond Li-ion Batteries: Present and Future Li-ion Technology Challengers

PATENT ANALYSIS by Knowmadeo Patent Infringement (crossed analysis based on Knowmade and System Plus

Analysis expertise)

o Patent Investigation (crossed analysis based on Knowmade & Yole Développement

expertise)

o Patent Landscape

TEARDOWN & REVERSE COSTING by System Plus

ConsultingMore than 30 teardowns and reverse costing analysis and cost simulation tools to be

published in 2016.


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OUR 2015 PUBLISHED REPORTS LIST

o MEMS & SENSORS

− Sensors and Data Management for Autonomous Vehicles

− Sensors for Wearable Electronics And Mobile Healthcare

− Status of the MEMS Industry

− Uncooled Infrared Imaging Technology & Market Trends

− Infrared Detector Technology & Market Trends

− High-End Gyroscopes, Accelerometers and IMUs for Defense, Aerospace &

Industrial

− Emerging Non Volatile Memory (NVM) Technology & Market Trends

o IMAGING & OPTOELECTRONICS

− Camera Module Industry

− Uncooled Infrared Imaging Technology & Market Trends

− Status of the CMOS Image Sensors

− Infrared Detector Technology & Market Trends

o MEDTECH

− Sample Preparation Automation Through Emerging Microfluidic Technologies

− 2015 Microfluidic Applications in the Pharmaceutical, Life Sciences, In-Vitro

Diagnostic, and Medical Device Markets

− Sensors for Wearable Electronics And Mobile Healthcare

o COMPOUND SEMICONDUCTORS


− SiC, GaN, and other Wide Band Gap (WBG) materials for power electronics

applications

− GaN and SiC Devices for Power Electronics Applications

o LED

− LED Lighting Module Technology, Industry and Market Trends 2015

− UV LED - Technology, Manufacturing and Application Trends

− Phosphors & Quantum Dots 2015: LED Downconverters for Lighting & Displays


o POWER ELECTRONICS

− Power Packaging Technology Trends and Market Expectations

− Energy Management for Smart Grid, Cities and Buildings: Opportunities for Battery

Electricity Storage Solutions

− Status of Chinese Power Electronics Industry

− New Technologies and Architectures for Efficient Data Center

− IGBT Market and Technology Trends

− Status of Power Electronics Industry

− SiC, GaN, and other Wide Band Gap (WBG) materials for power electronics

applications

− GaN and SiC Devices for Power Electronics Applications

o ADVANCED PACKAGING

− Status of the Advanced Packaging Industry

− Supply Chain Readiness for Panel Manufacturing in Packaging

− Fan-in Wafer Level Packaging: Market and Technology Trends

− Flip Chip: Technologies and Markets Trends

− Fan-Out and Embedded Die: Technologies & Market Trends

o MANUFACTURING

− Photolithography Equipment and Materials for Advanced Packaging, MEMS and

LED Applications

− Emerging Non Volatile Memory (NVM) Technology & Market Trends


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CONTACT INFORMATION

Follow us on

• Consulting and Specific Analysis

• North America: Steve LaFerriere, Director of Northern America Business DevelopmentEmail: [email protected]

• Japan & Asia: Takashi Onozawa, Representative Director, Yole KKEmail: [email protected]

• RoW: Jean-Christophe Eloy, CEO & President, Yole DéveloppementEmail [email protected]

• Report business

• North America: Steve LaFerriere, Director of Northern America Business DevelopmentEmail: [email protected]

• Europe: Lizzie Levenez, EMEA Business Development ManagerEmail: [email protected]

• Japan & Asia: Takashi Onozawa, Representative Director, Yole KK.Email: [email protected]

• Greater China: Mavis Wang, Business Development DirectorEmail: [email protected]

• Financial services

• Jean-Christophe Eloy, CEO & PresidentEmail: [email protected]

• General

• Email: [email protected]


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Power electronics and LEDs are different industries that today face similar challenges. Needs for green energy with lower CO2 emissions have led these industries to develop more efficient and smaller solutions. At the device level, cost pressure and the need for better performance is pushing designers towards smaller and thinner chips, also leading to increased power density. Such power density targets in both power electronics and LEDs bring a convergence of thermal management requirements, supporting the development of new materials.

Among materials used for thermal management, Yole Développement specifically investigated the market and technology evolution of die attach, substrates, baseplates/PCBs and encapsulants. Overall, the market for these materials was worth $1.98B in 2015 and will grow to $3.16B by 2021 at a compound annual growth rate (CAGR) of 6%. Their value proposition has the potential to bring business to their suppliers and key differentiating

factors to device manufacturers. In 2021, the value of the market for thermal management materials will be almost 14% of the total value of the power electronics and LED module market. Automotive applications claim a large share of the thermal management material market, reaching almost 45% in 2021. Approximately 30% of the overall market comprises technologies common to LEDs and power electronics.

Power electronic modules represent a healthy market, worth about $2.9B in 2015 and set to reach $4.5B in 2021, growing at 9% CAGR. The LED packaging market reached $15B in 2015, after years of strong growth led by LED TV and general lighting. However, price pressure will moderate growth in coming years, with a 3.4% CAGR leading to a market worth $18.5B in 2021.

From perspectives ranging from manufacturers and material suppliers through to end users, market dynamics, drivers and challenges are presented in this report, for both power electronics and LEDs.

THERMAL MANAGEMENT TECHNOLOGY AND MARKETPERSPECTIVES IN POWER ELECTRONICS AND LEDs 2017 Market & Technology report - December 2016

SOME TECHNICAL DEVELOPMENTS IN LEDS AND POWER ELECTRONICS ARE CONVERGING TO HANDLE MODULE-LEVEL THERMAL MANAGEMENT

Emerging technologies support the convergence of thermal management needs in the power electronics and LED businesses.

KEY FEATURES OF THE REPORT Get the sample of the report on www.i-Micronews.com• Overall view of business evolution

for power electronics and LEDs• Drivers and challenges that are

facing power electronics and LED designers

• Insight into synergies between power electronics and LEDs for thermal management

• 2015-2021 market volume and value in $M for die attach, substrates, encapsulants, baseplates/PCBs in power electronics and LED applications

• Technology status and technical roadmap analysis

• Analysis of convergence and differences between technical developments in LEDs and power electronics to support thermal management

• Business model and supply chain analysis across various materials used for thermal management

OBJECTIVES OF THE REPORT• Provide power electronic and

LED module market analysis and forecasts

• Cover a large variety of different materials and technology solutions used in modules

• Provide insight into different technologies currently used, technology trends, and newest innovations for modules.

• Provide an overview of key suppliers for module materials

• Demonstrate the strong synergies between applications that are driven by power density and efficiency

(Yole Développement, December 2016)

Thermal management market for LED and power electronics materials

2015 2016 2017 2018 2019 2020 2021

Exclusive power electronics Common LED and power electronics Exclusive LED

0

500

1 000

1 500

2 000

2 500

3 000

3 500

Mar

ket

reve

nue

($M

)

A MARKET DYNAMIC THAT CREATES SYNERGIES ACROSS THE TWO INDUSTRIES TO BENEFIT MATERIAL SUPPLIERS

Power electronics and LEDs need the right materials to handle thermal management challenges. As those applications are driven by similar technical requirements, one technical solution can be adopted and developed for one industry before being used by another industry.

The 30% of the overall thermal management material market that is common to both LED and power electronics represents $660M in 2015 and will reach $1014M in 2021. Another 30% can be reached by adapting existing technologies used in LED or power for the other application.

THERMAL MANAGEMENT TECHNOLOGY AND MARKET PERSPECTIVES IN POWER ELECTRONICS AND LEDs 2017

With such a strong thermal management market expansion, many solutions are being tested and validated to support new requirements and demand. Packages have to be smaller, with less thermal resistance and better reliability.

Depending on market segments and power levels, the technical solutions may be completely different between LED and power electronics. LEDs need to emit light efficiently and effectively. Optical properties of the silicone gel are therefore a key priority. Power electronics, by contrast, doesn’t consider this parameter. Also, for low power LEDs having a baseplate is definitely not an option. When it comes to higher power levels, synergies are more important and convergence in terms of requirements enables one technology to handle both power electronics and LEDs.

In addition to architectural changes, such as the removal of some layers and interfaces, materials providers have to innovate. These changes can be driven by common markets like automotive, where silver sintering die attach is gaining interest in power electronics for electric vehicles and hybrid electric vehicles (EV/HEV). This silver sintering approach is now starting to be implemented in production for LED lighting. Encapsulant materials will also be impacted by emergence of high temperature epoxy compounds and high temperature stable silicone gels. Silicon nitride substrates, Parylene coatings, ceramic heatsinks and eutectic or ball bonding die attach technologies are some other technologies that could emerge in the mid- to long- term.

As every single material will have to adapt in coming years, in this report Yole Développement highlights their technology status and the related trends and roadmaps. The report analyses similarities and differences to address both LEDs and power electronics.

TECHNOLOGY EVOLUTION AND ROADMAPS: SIMILARITIES AND DIFFERENCES BETWEEN LEDS AND POWER ELECTRONICS


Material supplier synergies (Non-exhaustive list)

LED material suppliers

Power electronics material suppliers

Technology platforms are being used to bring companies the flexibility they need to adapt their existing products.

Within the industry, leading companies like Curamik and Dow Corning have already adapted their product portfolio to target both power electronics and LEDs. This trend and market positioning is being followed by many other companies as they are looking for new business.

Based on core competencies, companies supplying one type of material are adding others to offer their customers a “one stop shop”. This is particularly the case for Kyocera, Mitsubishi Materials and Heraeus. A company like Henkel today has the capability to supply PCBs, thermal interfaces and die attach.

With this report, Yole Développement provides insights into synergies and supply chain evolution in the field of materials for power electronics and LED thermal management.


Synergies and differences between LED and power modules

Power module LED module

Heatsink Thermal Interface Material (TIM)

Substrate IGBT

Baseplate

External connection

Plastic case

Die attach

Interconnection

Encapsulation

Substrate attach

LED die

Substrate

PCB

Interface material #1 (Die attach)

Encapsulation/ optic/ phosphor

Heat sink

Encapsulation Epoxy

Methyl Silicone

Baseplate / PCB

Die attach Soldering - SAC

Sintering

Substrate DBC

DPC

No common technologies

Common technologies

with easy modifications

Technologies needed to be

adapted

Find more details about

this report here:

MARKET & TECHNOLOGY REPORT

What is in this report? 4

Companies cited in the report 5

List of abbreviations used in this report 6

Executive summary 7

Introduction to power electronics and LEDs 43

> Power electronics landscape and market- Power electronics and 21st century

challenges- Power electronics history, use and trends- Focus on China- Global power electronics market – IGBT

Module market> LED landscape and market

- Packaged LED industry and market trends- Packaged LED industry, technology and

market trends

Context of thermal management 73> Context of thermal management in power

packaging> Challenges and business opportunities> Context of thermal management in LED

modules- LED module integration into lighting

systems- Thermal management in LED modules

Synergies between LED and power electronics for thermal management 89

> Focus on die attach> Focus on ceramic substrates> Focus on encapsulant> Focus on Thermal Interfaces Materials (TIM)> Focus on baseplates/PCBs

Business model and supply chain analysis 249

Conclusions 256

TABLE OF CONTENTS (complete content on i-Micronews.com)

• LED Packaging 2016: Market, Technology and Industry Landscape

• LED Lighting Module Technology, Industry and Market Trends 2015

• Toyota Prius 4 PCU Power Modules• Infineon CooliR²Die™ Power Module• Power Electronics for EV/HEV 2016: Market,

Innovations and Trends• Automotive Lighting: Technology, Industry, and

Market Trends

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Pierrick Boulay works as Market and Technology Analyst in the fields of LED, OLED and Lighting Systems to carry out technical, economic and marketing analysis at Yole Développement, the “More than Moore” market research and s trategy consulting company. He has experience in both LED lighting (general lighting, automotive lighting…) and OLED lighting. In the past, he has mostly worked in R&D department for LED lighting applications. Pier r ick holds a mas ter degree in Electronics (ESEO - France).

COMPANIES CITED IN THE REPORT (non exhaustive list)3M, Aavid Thermalloy, ABB, ACC, Alpha, AI Technology, AM2T, Amkor, Amocera, APE, aPSI3D , AT&S, BlueStar, Besi, Bergquist, Bosch, BYD, CeramTec, CETC, Comelec, Continental, Coorstek, CPS, Creative Materials, CSR, Curamik, Danfoss, Deca Technologies, Delphi, Denka, Denso, Dow Chemical Dow Corning, Dowa, DuPont, Dynex, Emerson, Fairchild, Ferrotec, Fraunhofer, Freescale, Fuji Electric, GaN System, General Electric, Grace Semiconductor, GRISET, Hala, Henkel, Heraeus, Hitachi, Honda, Infineon, Intel, International Rectifier, Ixxys, J Devices, KCC, Kyocera, LS, Lumileds, Macmic, MagnaChip, Meidensha, MERSEN, Microcool, Microsemi, Mitsubishi Electric, Mitsubishi Materials, Momentive, Namium, Namics, Nepes, Novapack, NuSil, ON Semiconductor, Osram, Plansee, Powerex, Powerstax, Ravelin Materials, RHP Technology, Schneider Electric, Semikron, Shanghai Hua Hong NEC, Shin Etsu, Siemens, Starpower, StatsChiPAC, STMicroelectronics, Texas Instrument, Tong Hsing, Toshiba, Toyota, TSMC, Valeo, Vincotech, Vishay, Wackler, Yincae, Zevac, ZZX...

Coralie Le Bret has been an analyst in power electronics and compound semiconductor technologies since 2014, at Yole Développement, the “More than Moore” market research and strategy consulting company. She gratuated from INSA Lyon with an engineering degree in material sciences, specializing in semiconductors and microelectronics. At Yole Développement she is in charge of electro-mobility, and she uses her exper tise on materials and semiconductors to follow power devices and power packaging evolution.

Pars Mukish holds a master degree in Materials Science & Polymers (ITECH - France) and a master degree in Innovation & Technology Management (EM Lyon - France). Since 2015, Pars Mukish has taken on responsibility for developing LED, OLED and Sapphire activities as Business Unit Manager at Yole Développement. Previously, he has worked as Marketing Analyst and Techno-Economic Analyst for several years at the CEA (French Research Center).

AUTHORSDr Pierric Gueguen is Business Unit Manager for Power Electronics and Compound Semiconductor activities at Yole Développement, the “More than Moore” market research and strategy consulting company. He has a PhD in Micro and Nano Electronics and an master degree in Micro and Nanotechnologies for Integrated Circuits. He worked as PhD student at CEA-Leti in the field of 3D Integration for Integrated Circuits and Advanced Packaging. He then joined Renault SAS, and worked for 4 years as technical project manager in R&D division. During this time, he oversaw power electronic converters and integration of Wide Band Gap devices in Electric Vehicles. He is author and co-author of more than 20 technical papers and 15 patents.

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Founded in 1998, Yole Développement has grown to become a group of companies providing marketing, technology and strategy consulting, media in addition to corporate finance services. With a strong focus on emerging applications using silicon and/or micro manufacturing (technology or process), Yole Développement group has expanded to include more than 50 associates worldwide covering MEMS, Compound Semiconductors, LED, Image Sensors, Optoelectronics, Microfluidics & Medical, Photovoltaics, Advanced Packaging, Manufacturing, Nanomaterials and Power Electronics. The group supports industrial companies, investors and R&D organizations worldwide to help them understand markets and follow technology trends to develop their business.

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