By : SlingX Corp. / David Peng

Date : March 17th, 2017

POC to Product8 Aspect Thinking In Designing Product

Brief of David Peng

• David Peng

• Title : SlingX Corp. / CEO

• Education : Bachelor of Electrical Engineer Dept. of National Central Univ.

• Experience :

• 1 year at HiTech Energy Inc as director in charge of BMS project management

• 2 years at Jabil Corp. as director in charge of STB project management at Jabil Circuit Taiwan branch STB Div.

• 6 Years at LiteOn Group as senior manager in charge of Wireless Dept. , DQA dept. & Product Marketing at NABU & IABU

• 6 Years at Foxconn as senior manager in charge of R&D dept. & project management at CNSBG & CMMSG

• Major at : RF Circuit & Embedded system Design 　　　 Product technology analysis, development and integration

Product Management

Product marketing plan and promotion

ASSUMPTIONS

1. Conceptual Idea has been approved and feasibility study has been done

2. Out-side-In design processes

PLM PROCESS

Test It Unique Idea Proof Concept Ship ItProduce It

CONCEPT & PROOF OF CONCEPT DESIGN, ENGINEERING, MANUFACTURING & PRODUCTION

Design It

EVTPOCConcept DVT PVT MP

1. Tooling making2. Reliability & Stress Test3. Certification Test4. Design MFG flow and test station5. Draft test plan and Test MFG test code6. Setup test station and smooth the test

procedure

1. UI / ME Design 2. Housing/PCBA interference check3. Thermal simulation / solution4. Mock-up Making5. E/E design 6. Board Function Test 7. EMI/EMC/ESD pre-test8. FW design 9. APP design 10. Server construction

1,800 Tesla Model x

US$ 240 M

8 Aspect Thinking In Designing Product

1. System Block Diagram

2. Usage Environment ( Environment / Reliability Test )

3. Certification

4. Manufacturing Test Requirement

5. Considerations in Mechanical Design

6. Layout Strategy

7. Status Transition Diagram

8. APP & Cloud

System Block Diagram“A block diagram is a diagram of a system in which the principal parts or functions are represented by blocks connected by lines that show the relationships of the blocks”

-------------- “ Wiki”

What do you read from it ?

System Block Diagram1. Function :

1. Power, Memory, Display, Sensor, I/O……

2. Chip part number

2. Interface :

1. Signal between blocks : I2C, SPI, UART, HDMI, MII, LVDS, GPIO…..

2. I/O to User : USB, SD, Touch panel, Audio Jack, RJ-45, LED, Power Jack, AC Plug……

Also relate to ID & Mechanical design

3. Voltage : Color of each block indicates what voltage of chip uses

4. Power Budget :

1. List the input voltage and maximum current of each block

2. Accumulate power budget of each block to get system power consumption

5. Cost : For an experienced designer can estimate 70% ~ 80% BOM cost

System Block DiagramPower Budget

System Block DiagramPower Budget

15V AC/0.8AAdapter

BridgeRectifier

Regulator7812

110V AC

19V DC

5 V Line Driver

DC-DCConverter

340632.5 V

3.3 V BCM6348, BCM5325E, SDRAM, Flash, WLANBCM6348

2SB1188 (PNP)controlled by 6348

DC-DCConverter

340631.2 V

1.8 V BCM5325E

BCM63482SB1188 (PNP)

controlled by 6348

Regulator7805 100 mA

707 mA

286 mA

670 mA15.84V AC

900 mA

910 mA193 mA

624 mA

Usage Environment ( Environment / Accelerated Life Test ) Product marketing has to list the possible user scenario, especially for some extreme conditions to designer. And these scenarios should make designer to take some reliability tests into consideration. Those tests can be categorized into two parts:

1. Environment Test

1. Temperature & Humidity Test ( Aging Test )

Purpose : to ensure that the DUT works as intended during and after long time exposure to high temperature and humidity including condensation. The intention of the test is to reveal failure modes that depend on ageing of materials and components.

Reference Standard :

Test method :

Temperature: Temp 1: 65 ± 3°C Temp 2: 40 ± 3°C

Humidity: Humidity 1: 70 ± 3% RH Humidity 2: 95 ± 3% RH

Hold time 1: 400 minutes

Hold time 2: 60 minutes

Transition times: 10 minutes

Duration: 126 cycles at 8 hours each. In total 42 days

Usage Environment ( Environment / Accelerated Life Test )

The temperature range of product category :

1. Commerce Grade : 0~70 ℃2. Industry Grade : -40~+85℃3. Car Grade : -40~+125℃4. Military Grade : -55~+150℃

Usage Environment ( Environment / Accelerated Life Test ) 2. Salt Spray Test :

Purpose : Salt spray testing is an accelerated corrosion test that produces a corrosive attack to coated samples in order to evaluate (mostly comparatively) the suitability of the coating for use as a protective finish

Standard : ISO 9227.

3. Waterpoof & dustproof :

Purpose : To classify and rate the degree of protection provided against intrusion (body parts such as hands and fingers), dust, accidental contact, and water by mechanical casings and electrical enclosures.

Standard : IEC 60529.

IP rating : IPXY X : Degree of solid object protection, ranks from 0 ~ 6

Y : Degree of water protection, ranks from 0 ~ 8

Usage Environment ( Environment / Accelerated Life Test )

Usage Environment ( Environment / Reliability Test ) 5. Drop Test

Purpose: This test is carried out to confirm that the DUT can withstand the end user dropping it accidentally during intended use or during transport, respectively.

Reference standard: IEC 60068-2-32 Test Ed

Test method : Drop DUT from 1.5 M height to ground for 6 faces and 8 corners

6. Vibration Test

Purpose: To determine whether the packaging and the product will resist the vibration it may be exposed to during transport. Normally we use vibration test to check if components solder well on PCB, especially for DIP components.

Reference Standard :

Usage Environment ( Environment / Reliability Test ) 2. HALT/HASS Test

Highly Accelerated Life Testing (HALT) is a kind of stress test to find out the weak links of a new product. These discovery tests rapidly find weaknesses using accelerated stress conditions. The goal of HALT is to proactively find weaknesses and fix them thereby increasing product reliability.

HALT test major focuses on those test items:

• vibration,

• high/ low temperature,

• rapid temperature cycling,

• combined stress,

• on/ off cycling,

• voltage limits and frequency limits.

CertificationTerminology : 1. FCC : Federal Communications Commission

Audit authority which is in charge of management of computers, peripheral and communications products sold in the United States

Any digital technology of electronic devices or systems, devices or systems generate pulse frequency of more than 10KHz of equipment shall get FCC certification before they can be sold in the US market

2. UL : UL is an accredited standards developer in the US and Canada. In extending its global public safety mission, UL Standards partners with national standards bodies in countries around the world to build a safer, more sustainable world.

3. CE : Derived from the European Community abbreviation

Audit authority which is in charge of the basic safety requirements set by the European Union for the protection of people's safety and health and environmental protection benefits.

Certification

CE = EMC + Safety ( LVD) ( FCC ) ( UL )

EMC = EMI + EMS

Certification – EMI & EMC1. EMI

Electromagnetic interference (EMI) is radio frequency energy that interferes with the operation of an electronic device. This radio frequency energy can be produced by the device itself or by other devices nearby.

Certification – EMI & EMC1. EMC

Electromagnetic compatibility (EMC) is the ability of an electronic product to operate without causing EMI that would interfere with other equipment and without being affected by EMI from other equipment or the environment. The goal is to reduce EMI to meet the requirements requested by governments of the whole world.

• CE EN55011/13/32/24

• ETSI EN 301489-1/-3/-7/-17/-24

• Australia AS/NZS CISPR11/13/22/32/24

• FCC Part15B/18

• ISED ICES-003

• BSMI CNS13438/CNS13439/CNS13803

• Japan VCCI-3

• Korea KN32/35

966 Chamber

10m Chamber

Certification – Safety1. Safety Scope

1. Electrical shock damage

1. To prevent the current flows through the human body. As long as there are several milli-ampere that will cause health effects on the human body, of course, more larger current will produce

2. To test device immunity capability to high voltage shock

2. Energy damage

High-current supply or high-capacitance lines between the adjacent two terminals, short circuit case, may produce arc discharge or burning in the combustion of molten metal, even low voltage lines, may also cause energy hazard

3. Fire

In the event of overload, parts failure, insulation collapse, high impedance or loose connector, resulting in abnormal temperature, there may be a fire hazard. Therefore; safety test requests once fire in the equipment, it can not distribute to the adjacent areas of the fire or the danger outside the equipment area

4. Mechanical and thermal damage

5. Radiation damage

6. Chemical damage

Certification – Safety2. Safety Test Standard

• UL 60950-1/EN 60950-1/IEC 60950-1, Information Technology Equipment

• UL 62368-1/EN 62368-1/IEC 62368-1, Audio/Video, Information and communication technology equipment

• UL 60065 / EN 60065 / IEC 60065, Standard for Audio, Video and Similar Electronic Apparatus - Safety Requirements

• UL 60335-1 / EN 60335-1 / IEC 60335-1, Safety of Household and Similar Appliances, Part 1: General Requirements

• BSMI –CNS14336

Certification – RF Test1. RF Test

RF Test is in response to meet domestic and international electronic the wireless communications industry product certification services such as 80.11ac, 802.11ad, BLE and LTE, etc). This tests majorly at “Frequency deviation”, “Power” and “Timing”, etc.

BLE Hopping Chart ( Mid Freq)

Certification – RF Test2. RF Test Standard

FCC 15.247, 15.407, including DFS, FCC part 22/24/27…...

ISED Canada RSS-247,RSS-130, RSS-132

RSS-133,RSS-139,RSS-192,RSS-195…

ETSI EN 300 328, ETSI EN 301 893, including DFS, EN300 220,EN300 440…..

EN301 511, EN301 908-1….

Japan MIC Article 2, Para 1, Item 19

Korea RRA Notice 2012-12 Taiwan NCC LP0002

Australia / New Zealand AS/NZS 4268

15°

FCC CE IC ACA NCC India Japan

Limit 1.6w /kg- 1g

2.0w/kg- 10g

1.6w/kg- 1g

2.0w/kg- 10g

2.0w/kg- 10g

1.6w/kg- 1g

2.0w/kg- 10g

Mobil Phone

Head/ Body

Head/ Body

Head/ Body

Head/ Body

Head Head/ Body

Head

NB Body Body Body Body n/a n/a n/a

Tablet Body Body Body Body n/a n/a n/a

AP Body Body Body Body n/a n/a n/a

Certification – SAR Test1. SAR Test

SAR test is mainly to simulate the body to absorb the intensity of electromagnetic waves to protect the human body from radio frequency transmission beyond the value of wireless devices caused by human damage

Manufacturing Test Requirement1. Purpose :

1. Guarantee product quality

2. Less manufacturing cost

2. Items :

1. Manufacture Test Plan ( SOP )

2. Test points & Test Tooling Design

3. Manufacture Test Program

Manufacturing & Test Requirement1. SOP :

SOP plans the following items :

1. Board level functions to be tested

2. Test stations and test flow

3. Test Criteria ( Pass Or Fail)

Adobe Acrobat Document

Manufacturing & Test Requirement2. Test points & Test Tooling Design

3. Manufacture Test Program (Mfg program)

Extracted from shipping firmware to only test board hardware functions. After all hardware functions tested then mfg program will be erased and replaced by shipping image code.

Considerations in Mechanical Design1. 3D interference Checking

2. Thermal consideration

3. Mockup

4. Antenna placement criteria

5. Waterproof

Considerations in Mechanical Design1. 3D interference Checking

To check any interference between housing, electrical components and mechanical components

Max. OD = 16.0 mmMax. ID = 14.0 mmMin. OD = 10.0 mmMin. ID = 8.0 mm

Considerations in Mechanical Design2. Thermal consideration

Thermal shall impact on system once system does not have good heat dissipation system.

1. System Power Efficiency

2. Noise

1. Temperature noise According to Johnson-Nyquist noise formula, P/B = K BT, the noise temperature goes high, the more power system needs

2. S/N ratio decrease

System Temp. rises

System power efficiency decrease

Current increase to raise power

W=I2RGenerate more heat

Considerations in Mechanical Design2. Thermal consideration

Solution :

1. Conduction

Convention is the transfer of heat between two bodies. The rate at which energy is conducted as heat between two bodies is a function of the temperature difference (temperature gradient)

between the two bodies and the properties of the conductive medium through which the heat is transferred.

Heatsink is the most popular way to adopt to solve thermal issue.

2. Radiation

Radiation is electromagnetic radiation generated by the thermal motion of charged particles in matter. All matter with a temperature greater than absolute zero emits thermal radiation. In general, the radiation includes visible light and infrared light.

The more surface for thermal dissipation, the more thermal radiation. ( Fins )

3. Convention

Convention is the transfer of heat from one place to another by the movement of fluids. The fluid can be air, water or any liquid.

Considerations in Mechanical Design3. Thermal consideration

4. Thermal simulation

FinsFin integrates the 3 solutions with Conduction, radiation and convention

Fins increase the surface area to have more heat can be dissipated by radiation and convention with air.

In general, we like to do thermal simulation to have more system thermal information then apply the solution.

Air flow trackT ambient =40 ℃

Considerations in Mechanical Design3. Mockup

1. Verify the interference of solid bodies

2. Verify the color plan , real visual effect and feeling

3. Verify if any issue occurs in real operations

4. Tips

If you want to have more than 2 mockup samples then please adopt soft-tooling to make mockup samples to lower your cost.

4. Antenna placement criteria

5. Waterproof

Layout Strategy1. Power & Ground

Power and Ground is the most important item that designer must take into consideration when you engage in PCB layout. Good management of power & ground enables PCB with good performance, less noise and less EMI. Some principles

1. A complete ground preferred, no scattered ground

2. Analog, RF and Digital ground separated to avoid noise coupled

3. Every ground plane must have its own path to the common ground to reduce noise

4. The impedance of return path

All the return current will take the shortest return path to common ground based on the impedance of the return path. With DC, the return current takes the way back with the lowest resistance (Figure a). With a higher frequency, the return current flows along the lowest impedance (Figure b).

Figure a Figure b

Layout Strategy1. Safety Requirement

To have good space between power, signal and ground to meet the safety requirement.

2. Placement 1. Place components based on function blocks. Create a diagram with the functional groups of the system – e.g.,

transmitter path, receiver path, analog signals, digital signals, etc.

2. To have layout path as short as possible unless any requirement s listed in the layout guide ( for example, the address and data signals of DRAM or Flash)

3. List the critical signals that may have higher radiation.

Status Transition Diagram

• Talk to you about where things should go, what colors to use.

• UI is responsible for the creative and visual pieces .

• UX focuses on the interactive side.• UX handles the architecture of the content and the site

map.

USER INTERFACE USER EXPERIENCE

Usability

Functionality

InformationArchitecture

Validation

Requirements

Design

APP & CLOUD

Validation

Requirements

Design

Usability

Functionality

InformationArchitecture

Communication MQTT, WebSockets, HTTP

Platform Android, iOS, Windows Phone.

Platform Local server, AWS, Google cloud. AzureKey Features Communication server Web API Database Push Notification server

Key Features Home/daily-life devices Business and Public

infrastructure Health-care

Key Features Data Transmission and Management IoT device connect and control Integrations with other web services

Mobile

Internet of ThingsBackend Server

Mobile Application Development

APP & CLOUD

Mobile Application DevelopmentTypes of Mobile App Dev

Native Mobile Apps Web-based Mobile Apps Hybrid Mobile Apps

Native mobile apps are developed in a programming language native to the device and operating system

Native apps typically run and “feel” better.

Suited for any type of Apps. More expensive to develop

on multiple OS platforms.

Typically built with the combination of languages, including CSS 3, HTML and JavaScript.

Hybrid apps don’t need separate efforts for each mobile platform.

Developed once and can be made available in all major platforms.

Saving a lot of development time.

Not Suited for complex Apps. The operation is not smooth.

Performance and development time are between Native and Web-based Apps.

Not suited for complex Apps. High cost of maintenance

and updates.

APP & CLOUD

Mobile Application Development

Apps Front-end development

UI UX design

Cross-device accommodations

Apps Back-end development

User authentication-authorization

Data services

Reusable business logic

Apps Deployment

App Store Google Play

In-house (ipa / apk)

APP & CLOUD

Special Thanks To Gary Hus : CEO, 京艷設計有限公司

Mobile: +886 988-079-803

E-mail: garyhsu240465@gmail.com

Simon Chen: Senior Manager, Bay Area Compliance Laboratories Corp.

Mobile : +886 935-166-791

E-mail : simon.chen@baclcorp.com

Angus Cheng: General Manager, Foxcat Inc.

Mobile : +886 983-267-700

E-mail : angus@foxcat.co

SlingX Corp. / David Peng

Tel : +886 2 2541-3113

Mobile : +886 939-266-600

E-mail : ap626421@gmail.com

THANK YOU