mmwave radio design for mobile handsets - 5g … radio design for mobile handsets alberto...

mmWave Radio Design for Mobile Handsets

Alberto Valdes-GarciaResearch Staff Member, ManagerMaster Inventor & Member IBM Academy of Technology

IBM ResearchT. J. Watson Research Center

©2015 IBM Corporation2

Toronto 5G Summit – November 2015

Enabling 5G: mmWave Silicon Integration and Packaging

https://ieeetv.ieee.org/ieeetv-specials/toronto-5g-summit-2015-bodhisatwa-sadhu-enabling-5g-mmwave-silicon-integration-and-packaging?

mmWave WLAN – IBM 16-Element 60-GHz phased array

mmWave Backhaul – IBM 64-Element 94-GHz phased array

mmWave handset radio – IBM 60-GHz low-power TRX

Overview of IBM Research’s 10+ years of

work on silicon-based mmWave radios,

phased arrays, and Gb/s link demonstrations


Toronto 5G Summit – November 2015

Enabling 5G: mmWave Silicon Integration and Packaging


mmWave WLAN – IBM 16-Element 60-GHz phased array

mmWave Backhaul – IBM 64-Element 94-GHz phased array

mmWave handset radio – IBM 60-GHz low-power TRX

Focus of this presentation


Gb/s mmWave Wireless Links:Applications across the infrastructure stack

mmWave-based 5G network concept:

Ericsson: E. Dahlman, et al., “5G Radio Access,” Ericsson Review, June, 2014

Samsung: W. Roh, et al., "Millimeter-wave beamforming as an enabling technology for 5G cellular communications:

theoretical feasibility and prototype results," in IEEE Communications Magazine, Feb, 2014


Potential 5G Scenarios Require mmWave Radio Integration into Handset Devices

mmWave Phased Array

Base Station to Handset Link

mmWave D2D Link


No mmWave Mass Adoption in Phones Yet!

Directivity Cost

Power budget

Portability

Main challenges


Outline

Four challenges of mmWave mobile

– Our approach to address these challenges

– TRX module: 60-GHz 32nm SOI CMOS IC

+ Antennas in Package

TRX demonstrations

– Communications link

– Pulse based radar

Summary and conclusions


Challenge 1: DirectivityMaking mmWave Omni-directional

Reasons for challenge

Integrated antennas higher

directivity

Large cable loss makes discrete

antennas unattractive



Phased arrays do not

solve the problem!



directivity


antennas unattractive





directivity


antennas unattractivePhased arrays do not

solve the problem!


Challenge 1: DirectivityApproach: Switched Beam

Our solution

Multiple antennas in package pointing in different directions

A.L. Amadjikpe, et al., TMTT 2013

X. Gu, et al., ECTC 2015


60GHz Switched Beam Antenna in Package

X. Gu, et al., ECTC 2015

D. Liu, et al., AP-S, 2015

RX2 (Yagi)

TX2 (Yagi)

11

mm

RFIC

(3.2x3.2mm2)

11mm

TX1 (Patch)

RX1 (Patch)

Parasitic patches

Parasitic patches

BGA balls

Patch antenna

Yagi

antenna

4-layer organic packageRF IC C4s

BGA ballsBoard

Power, ground

and signals


60GHz IC Block Diagram: Switched LNAs and PAs

• Antenna switching performed by switching LNAs & PAs

• Sliding IF architecture with on-chip PLL

B. Sadhu, et al., RFIC 2016


Measured Antenna Coverage

• Orthogonally pointed low directivity antennas

• Total coverage achieved = 254○



Challenge 2: CostIC + Packaging + Test

IC Design34%

Packaging33%

Test33%

Silicon-based (CMOS)

implementationMultilayer Organic

(MLO) Packaging

?


Challenge 2: CostApproach: On-chip mmWave Test

Reasons

Expensive equipment

Fragile probes & connectors

High signal path losses

Frequent calibration

Solution

On-chip mmWave test

IC Design34%

Packaging33%

Test33%


Indirect On-chip Test at mmWave

Temperature

sensor

LNA

Digital

controls

Input

@ 60GHz

Output

@ 60GHz

DC voltage

sensor

Noise

figure

(predicted)

Micro-

controller

DUT

Traditional testing Indirect sensing

Indirect sensing: Estimate the performance metric of interest by using other

performance metrics that are straightforward to measure

Monte Carlo sim across P, Vsup,

T

Choose variables (I, T, V)

3 3 3 2 2 2

300 030 003 200 020 002

110 101 011 100 010 001 000

NF a I a T a V a I a T a V

a IT a VI a VT a I a T a V a

Fit NF(I, T, V) using

multivariate polynomial

rms error = 0.36 dB

J.-O. Plouchart, et al.,

RFIC, 2015

In collaboration with CMU


Self-test Enables Self-optimization

• Critical blocks include self-test and optimization knobs

• 20 on-chip sensors, 300+ optimization knobs

÷2IF

VGA

×2

÷2IF

VGA

22.8–26.4

GH

z

Self-Healing PLL

11.4–13.2GHz

45.6–52.8GHz

I

Q 11.4–13.2GHz

LPF/VGA

LPF/VGA

TX Ant.

Broadside

TX Ant.

Endfire

RX Ant.

Broadside

RX Ant.

EndfireOn-chip

Microcontroller

Sensor

Actuator

Temperature-sensor, ADCs, bandgap

BA BS

BA BS

BA BSLNA

LNA

PA

SW

PA

Pre-driver

SW

BA BS

BA BS

BA PD

BA PD

BA Bias Actuator

(DAC)

BS Bias Sensor

PD Power Detector

I

Q

Healing infrastructure


Challenge 3: Power ConsumptionApproach: Low Power Design & Optimization

Reasons

Low efficiency closer to

technology fMAX

Biased for worst case PVT

corner –wasteful

Solution

System level power budgeting

Low power designs

Dynamic power optimization

LNA

PLL + doubler

RX mixer and BB

PA PLL + doubler

TX BB TX mixer

RX mode

TX mode


Block Diagram: State of the art blocks

World class block level performance:

Class-E PA: 25% PAE @60GHz LNA: <3.3dB NF @60GHz

LiT VCO: -131dBc/Hz @10MHz from 22GHz

PA: O. Ogunnika, et al., RFIC, 2012; LNA: J.-O. Plouchart, et al., RFIC, 2015;VCO: B. Sadhu, et al., RFIC 2012, JSSC, 2013


Dynamic Power Optimization in LNA

J.-O. Plouchart, et al., RFIC, 2015

Self-healing

reduces power

by 25% while

achieving same

NF<5dB

Fix bias

with

NF<5dB

• Optimize power while meeting specification


Challenge 4: PortabilityApproach: Tight Integration and Co-design

Reasons

High PA power required

Low LNA noise figure required

Solution

Integrated CMOS circuits with

performance comparable to discrete

components

Integrate antennas close to LNA and

PA to minimize losses


Tightly Integrated IC, Package, Antenna

LNA 1

LNA 2

PA 2

PA 1

RX BB

I&Q

TX RF UP-

MIXER +

LO

BUFFER +

RF PRE-

DRIVER

PLL +

DOUBLER

+ LO

BUFFERTX IF UP-

MIXER +

IF VGA

RX RF DOWN-MIXER

+ LO BUFFER

INST. ADCs

+ BIAS

RX IN 2

RX IN 1

TX OUT 2

TX OUT 1

RX OUT I RX OUT Q

TX

IN

I

TX IN Q

DIG

ITA

L I/O

PLL REF

MIC

RO

-

CO

NT

RO

LL

ER

3.2mm

3.2

mm

IC area3.2mm x

3.2mm

Self-test area

overhead< 5%

Self-test power

overhead~ 0

Switched beam

area overhead< 16%

Tight co-integration with package

IC Implementation in 32nm CMOS SOI

parasitic patches PCB GND

and package

GND stop

here



BOARD LEVEL DEMONSTRATIONS


TX-RX Link Measurement Set-up

serial

ethernet

Zynq card

Packaged chip

Arbitrary waveform generator

Spectrum analyzer

TRx serial

TX baseband

60GHz mmWave

measurements

TCL session

Matlab session

• TCL session for manual commands

• Matlab for automated

Oscilloscope

TX RX


Demonstration of 60GHz TRX at IEEE RFIC Symp. 2016 Industry Showcase Session, San Francisco, CA

RX TX

802.11ad

MCS8

(2.3Gb/s)

Communication link between 2 TRX chips:

1. > 2Gbps QPSK over > 1m

2. Data link maintained over broad angular range

3. Evaluation of higher order modulations on-going


Radar Demonstration Set-up

Arbitrary waveform generator -- prbs data

TX baseband

60GHz mmWave

OscilloscopeTX

Zynq card

TRx serial

Object 2Object 1

Computer obtains AWG and scope data

Compares data to find real-time distance

RX

Multi-functionality (communications, radar, sensing) has been demonstrated with

current 2 – 5 GHz radios (e.g. WiFi, Bluetooth). mmWave can potentially take

such capabilities to a whole new level


Radar Demonstration Results

Radar setup using 2 TRX chips:

1. Demonstrated PRBS pulse based radar

2. Resolution of 3cm achieved over 2m range

3. Power < 250mW makes it attractive for proximity detection in UAVs

Object 1

Object 2

Object 1Object 2


Performance Summary – Board Level Measurements



Conclusions

Silicon based mmWave radio integration is ready

for 5G handsets

– Cellular, D2D

Antenna and packaging need special attention

– Co-design is critical

Testing is expensive

– Use on-chip test


‘Ultimately though, we should expect mmWave systems

to become as inexpensive and ubiquitous as 2.4- and 5-

GHz WLAN systems are today. Some of the early

companies developing products in the mmWave space

will succeed and become profitable, and some will fail.

But the end result will be “millimeter-waves

for the masses.”’ - Advanced Millimeter Wave

Technologies: Antenna, Packaging and Circuits, Wiley

Press, 2009


Acknowledgment

This work was supported by the DARPA HEALICS (Self-Healing Mixed-Signal Integrated

Circuits) program under Air Force Research Laboratory (AFRL) contract FA8650-09-C-

7924.

The views, opinions, and/or findings contained in this presentation are those of the

author/presenter and should not be interpreted as representing the official views or

policies, either expressed or implied, of the Defense Advanced Research Projects Agency

or the Department of Defense.

J.-O. Plouchart Xiaoxiong Gu Sakshi Dhawan Herschel Ainspan

Bodhisatwa Sadhu Duixian Liu Mark Ferriss Christian Baks

Michael Beakes Mark Yeck Daniel Friedman Roger Moussalli

Yahya Tousi


To Learn More…

► IBM Presentation at IEEE 5G Summit November 2015.

“Enabling 5G: mmWave Silicon Integration and Packaging”

► Slides: http://www.5gsummit.org/docs/slides/Bodhisatwa-Sadhu-5GSummit-Toronto-11142015.pdf

► Video:

https://ieeetv.ieee.org/ieeetv-specials/toronto-5g-summit-2015-bodhisatwa-sadhu-enabling-5g-mmwave-silicon-integration-and-

packaging?

► IBM Research Blog: The future of mobile experience:

https://www.ibm.com/blogs/research/2016/05/future-mobile-experience-millimeter-wave-5g-wireless

► IBM-Ericsson announcement on 5G collaboration:

https://www.ericsson.com/news/1873727



https://www.ibm.com/blogs/research/2016/05/future-mobile-experience-millimeter-wave-5g-wireless/



References

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VCO Based 25GHz PLL with Autonomic Biasing”, IEEE Journal of Solid-State Circuits, May 2013.

[2] S. Sun, F. Wang, S. Yaldiz, X. Li, L. Pileggi, A. Natarajan, M. Ferriss, J.-O. Plouchart, B. Sadhu, B. Parker, A.

Valdes Garcia, M. A. T. Sanduleanu, J. Tierno, and D. Friedman, “Indirect Performance Sensing for On-Chip Self-

Healing of Analog and RF Circuits,” IEEE Transactions on Circuits and Systems – I, Vol. 61, no. 8, pp. 2243-2252,

August 2014

[3] J.-O. Plouchart, F. Wang, X. Li, B. Parker, M. Sanduleanu, A. Balteanu, B. Sadhu, A. Valdes-Garcia, and D.

Friedman, “Adaptive Circuit Design Methodology and Test Applied to Millimeter-Wave Circuits”, IEEE Design &

Test, December, 2014

[4] X. Gu, D. Liu, C. Baks, B. Sadhu, and A. Valdes-Garcia, “A Multilayer Organic Package with Four Integrated

60GHz Antennas Enabling Broadside and End-Fire Radiation for Portable Communication Devices”, IEEE

Electronic Components and Technology Conference, May 2015

[5] J.O. Plouchart, F. Wang, A. Balteanu, B. Parker, M. Sanduleanu, M. Yeck, V. Chen, W. Woods, B. Sadhu, A.

Valdes-Garcia, X. Li, D. Friedman, “A 18mW, 3.3dB NF, 60GHz LNA in 32nm SOI CMOS Technology with

Autonomic NF Calibration”, IEEE Radio Frequency Integrated Circuits Symposium, May 2015

[6] B. Sadhu, A. Valdes-Garcia, J.-O. Plouchart, H. Ainspan, A. K. Gupta, M. Ferriss, M. Yeck, M. Sanduleanu, X.

Gu, C. Baks, D. Liu, and D. Friedman “A 60GHz Packaged Switched Beam 32nm CMOS TRX with Broad Spatial

Coverage, 17.1dBm Peak EIRP, 6.1dB NF at < 250mW”, IEEE Radio Frequency Integrated Circuits Symposium,

May 2016

mmwave radio design for mobile handsets - 5g … radio design for mobile handsets alberto...

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