optically-isolated multilink bdm interface for the s08/s12

Freescale SemiconductorApplication Note

AN3589Rev. 0, 02/2008

Contents

Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1Installing the Jumper on the Multilink BDM Board. . . . . . 1Opto-Isolated BDM Board . . . . . . . . . . . . . . . . . . . . . . . . 2Assembling the Multilink Board to the Opto-Isolated Board . . . . . . . . . . . . . . . . . . . . . . . 3Optocoupler Component U1, U2 in Schematic . . . . . . . . 6

Optically-Isolated Multilink BDM Interface for the S08/S12 Microcontrollersby Michael A. Steffen

1 IntroductionThis application note explains the modification of the HCS08/HCS12 Multilink background debug mode (BDM) Interface. The complete project consists of the Multilink BDM and an opto-isolated daughter board. The completed assembly, both printed circuit boards (PCBs), fit into the original Multilink BDM case.

2 Installing the Jumper on the Multilink BDM Board

The jumper provides the host side of the opto-isolated board with 5 V to power the optocouplers and provide signal. Open the Multilink case and remove the PCB. Unplug the ribbon cable attached to header J2. In Figure 1, solder a jumper wire to pins 3 and 16 on connector J3.

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© Freescale Semiconductor, Inc., 2008. All rights reserved.

Figure 1. Multilink Rev. C Board

3 Opto-Isolated BDM BoardThe opto-isolated board can be used with the Multilink Rev B (blue) and Rev C (maroon case) interface devices. This opto-isolated board plugs into the BDM multilink board upside down.

Multilink Rev. C board

Jumper Wire

J3 connector Pin 1

J2 Header

Optically Isolated Multilink BDM Interface for the S08/S12 Microcontrollers, Rev. 0

2 Freescale Semiconductor

Figure 2. Opto-Isolated BDM Board

4 Assembling the Multilink Board to the Opto-Isolated Board

Turn the opto-isolated board upside down and plug the connector J1 onto the multilink BDM board to header J2. Plug the ribbon cable onto connector J2 on the opto-isolated board. Make sure the red strip on the ribbon cable is on the same side as the white dot on the opto-isolated board J2 header. Re-assemble the case and test the multilink interface. When the interface is plugged into the USB port, the blue and the yellow LEDs illuminate. This is different than the unisolated multilink BDM because the yellow light only illuminates when target power is applied.

White dot for ribbon cable orientation

Host side-connector J1 plugs Target side-ribbon J1 plugsin the multilink BDM board onto J2 into connector J2 on this board


Freescale Semiconductor 3

Figure 3. Opto-Isolated BDM board Schematic



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Figure 4. Opto-Isolated BDM

5 Optocoupler Component U1, U2 in SchematicThe optocoupler used in the design was the Agilent Technologies HCPL-0630 device. It has a typical data transfer speed of 10 MBd and is intended for use in microprocessor systems. This optocoupler design provides maximum AC/DC circuit isolation while achieving TTL compatibility.

Figure 5. Top Copper Opto-Isolated BDM Board Layout Layer



Figure 6. Top Legend Opto-Isolated BDM Board Layout Layer

Figure 7. Bottom Copper Opto-Isolated BDM Board Layout Layer



Table 1. Opto-Isolated BDM Board Bill of Materials

Ref Des Quantity Description ManufacturerManufacturing Part

NumberDigikey Supplier Part

Number

C1, C2 2 CAP 0.1 μF 50 V Ceramic X7R 0805

Panisonic Ecg ECJ-2YB1H104K PCC1840CT-ND

J1 (6pos) 1 SIP Socket 50 POS Straight PCB

Millmax Manufacturing

801-93-050-10-001000 ED7150-ND

J2 (6pos) 1 CONN Header 80 POS .100 Vert Gold (BREAKAWAY)

Molex/Walden Electronics

10-89-1801 WM6880-ND or A26528-40-ND

Q1 – Q4 4 Transistor Switching PNP SOT-23

Infineon Technologies

MMBT3906LT1 MMBT3906LT1INCT-ND

R1, R2, R9, R10

4 RES 330 OHM 1/8W 5% 0805 SMD

Yageo America 9C08052A3300JLHFT 311-330ACT-ND

R3, R5, R7, R8

4 RES 51.1K OHM 1/8W 1% 0805 SMD

Yageo America RC0805FR-0751K1L 311-51.1KCRCT-ND

R4, R6, R11, R12

4 RES 2.0K OHM 1/8W 5% 0805 SMD

Yageo America RC0805JR-072KL 311-2.0KARCT-ND

U1, U2 2 Optocoupler 2CH LOG-OUT 10 MBd 8-DIP

Avago Technologies US Inc.

HCPL-2630 516-1086-5-ND



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Document Number: AN3589Rev. 002/2008

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optically-isolated multilink bdm interface for the s08/s12

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