neep 541 – graphite damage fall 2002 jake blanchard
TRANSCRIPT
NEEP 541 – Graphite Damage
Fall 2002Jake Blanchard
Outline Radiation Damage in Graphite
Graphite structure Swelling Thermomechanical properties sputtering
Graphite Crystal Structure Crystal is hexagonal Planes of atoms are strongly
bonded (covalent) within the plane, but the plane-to-plane bonding is relatively weak (van der Waals) [lubrication]
Crystal cleaves easily parallel to the basal planes
Physical properties are highly anisotropic
Different Views of Structure
Phase Diagram
Types of Graphite Pyrolitic – highly oriented Polycrystalline graphites with
randomly oriented grains POCO graphite is fine-grained, giving
it high strength and high failure strains
Graphnol is similar to POCO, but with smaller thermal expansion coefficient
Irradiation of Graphite Neutron irradiation produces point defects Interstitials form loops (immobile) or
small, mobile clusters Vacancies form loops or collapse lattice
within layer planes Growth occurs perpendicular to layer
planes due to interstitials and shrinkage occurs parallel to planes due to relaxation of lattice around vacancies or lines of vacancies
Swelling of Graphite Graphite usually shrinks initially due
to pore closure Graphite is porous due to cooling
from the graphitizing temperature After initial shrinkage, growth occurs When volume returns to initial value,
structural properties are poor
Polycrystalline Graphite35 dpa – 600-690 C
Pyrolitic Graphite
Pyrolytic Graphite
Isotropic Graphite
Thermomechanical Properties Modulus and thermal conductivity
increase as density increases, then decrease
Polycrystalline Graphite
Thermal conductivity
Thermal expansion coefficient
Elastic modulus
Pyrolitic GraphiteParallel to Planes
Pyrolitic GraphitePerpendicular to Planes
Sputtering Both physical and chemical
sputtering occur in graphite
Pyrolitic Carbon Sputtering
He
D
H
Chemical Sputtering Molecules are formed on surface due
to chemical reaction between incident ion and carbon atoms with binding energy low enough to desorb
Molecule then is not bound to surface A third process (radiation enhanced
sublimation) allows target atoms to be thermally released from surface
Chemical Sputtering With incident hydrogen, sputtering
yield peaks around 800-900 K Peak yield is 0.1 ions/ion
Chemical Sputtering1 keVProtons
Methane Production - Protons
Methane Yield – 2 keV protons