INTEGRATED CIRCUITSDr. Esam Yosry

Lec. #9

NPN

Tra

nsi

stor

Fab

rica

tion

Introduction

NPN Fabrication-Simple Flow

AMI Bipolar Transistor Process

Bipolar Fabrication –Masking Layers

Typical Bipolar Resistor Technology

Intr

od

uct

ion

(Chip

Fabri

cati

on C

ycl

e)

NPN Transistor (BJT) Fabrication Example

Emitter Base Collector

Bipolar Transistor

Bip

ola

r Tr

an

sist

or

Fab

rica

tion

– S

imp

le

AMI Bipolar Transistor Process

Oxide

P+substrate

P-Epi Layer

The beginning wafer is a P-epitaxial layerOn a P+ substrate that is oxidized.

AMI Bipolar Transistor Process

N-Tub Collector

Oxide

P-Epi Layer

N-Tub

Field Oxide

Collector

Field Oxide

Field Oxide

P-Epi Layer

N-Tub

Field Oxidation

AMI Bipolar Transistor Process

N-Tub

Field Oxide

P-base

Collector

Field Oxide

P-Epi Layer

P-Base Formation

P+

N-Tub

Field Oxide

P-base

Collector

Field Oxide

P-Epi Layer

P+ Contact Formation

AMI Bipolar Transistor Process

N+P+

N-Tub

Field Oxide

P-base

Collector

N+N+Field Oxide

P-Epi Layer

N+ Emitter and Collector Contact Formation

N+P+

N-Tub

Field Oxide

P-base

Collector

N+N+Field Oxide

P-Epi Layer

Oxide

Contact Apertures

Oxide

Bipolar Fabrication –Masking Layers

Mask No. Physical Layer AMI Name GDS Level No.

1 N-type Well N_WELL 1

2 Field Oxide ACTIVE 3

3 P-type Base PBASE 2

4 P+ S-D Ion Implant P_PLUS_SELECT 11

5 N+ S-D Ion Implant N_PLUS_SELECT 12

6 Contact Openings CONTACT 14

7 First Metal METAL 1 15

8 Vias between Metal VIA 16

9 Second Metal METAL 2 17

10 Bond Pad Openings GLASS 18

Typical Bipolar Resistor Technology

N-Tub

Field OxideP-base

Field Oxide

P-Epi Layer

P-Base Resistor Formation

N+P+ P+

Top view of The resistor

P+ N+

Thanks

Many thanks to Prof. Hany Fikry and Prof Wael Fikry for their useful materials that help me to prepare this presentation.