glenn g. daves - src · 2012. 3. 29. · tm freescale, the freescale logo, altivec, c-5, codetest,...

TM

Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, t

he Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore and Symphony

are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack,

ColdFire+, CoreNet, Flexis, Kinetis, MXC, Platform in a Package, Processor Expert, QorIQ

Qonverge, Qorivva, QUICC Engine, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks

of Freescale Semiconductor, Inc. All other product or service names are the property

of their respective owners. © 2012 Freescale Semiconductor, Inc.

Glenn G. Daves

Director, Packaging Solutions Development

Freescale Semiconductor, Inc.

TM

Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, the Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore

and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MXC, Platform in a

Package, Processor Expert, QorIQ Qonverge, Qorivva, QUICC Engine, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks of Freescale Semiconductor, Inc.

All other product or service names are the property of their respective owners. © 2012 Freescale Semiconductor, Inc.

2

Piezo-resistive

effect of Si-Ge

discovered

Resonant Gate

Transistor patented Term “MEMS”

first used

1950’s 1960’s 1970’s 1980’s 1990’s 2000’s 2010’s

SOURCE: Southwest Center for Microsystems Education (SCME), History of MEMS Learning Module, 2001

Si-Ge Strain Gage

Pressure Sensors

Inkjet Heads

IR Sensors

Accelerometers

Digital Light Processors

Gyroscopes

Tire Pressure Monitors

iPod

Bio Sensors

Wii

iPhone

TM





3

• Increasing Accuracy − Increasing precision is desired/demanded over time − Isolation: stable packages that isolate sensor from extraneous stresses

• Increasing Integration − More functions, more chips in a single sense unit − Integration: expanding SiP, PiP, PoP complexity

• Miniaturization − Handheld device space constraints

fix maximum volumetric envelope − Miniaturization:

• Increasing Diversity − Expanding applications and markets − Customization: Each package customized for the application, market, and

environment. Pressure, inertial, optical / consumer, automotive, medical. . . − Design: accuracy required to do all the above well.

• Cost, Cost, Cost − Leverage existing capabilities (test & pkg) and integration, standardization.

Freescale Pressure Sensor Portfolio

TM





4

• Design Accuracy

• Isolation Improvement

• Cost

• Applications

TM





5

• MEMS designs sometimes experience many revisions. − Inherent functionality

− Fabrication process variation

− Assembly and board mounting stresses

− Environmental conditions

• Current analytic and finite element modeling

approaches are insufficient to achieve

“first time right” design objectives.

• Research Needs − Automation / Simplification To enable modeling of statistical variation and complex systems without added labor.

− Definition of model boundary conditions To improve design accuracy and better predict actual performance

TM





6

• Conventional wisdom: ceramic as a stable foundation for the system. − But, it is unaffordable and not scalable to miniaturization needs.

• Conventional microelectronics packaging materials (lead frames,

substrates, mold compounds, etc.) have attractive pricing but create and transmit more extraneous stresses to the sensor. − Increasing sensitivity requirements are revealing the limitations of applying

these packages to MEMS.

• Research Needs

− Materials Create a cost-effective ceramic-like base

suitable for many form factors.

− Physical Isolation Design robust sensors that are immune to

extraneous stress fields.

− Compensation / Trimming Develop more sophisticated methodologies

that cancel-out extraneous stresses.

TM





7

• Cost Hierarchy: − Conventional microelectronics paradigm: chip > package > test

− Emerging MEMS paradigm: test > package > chip

• Despite the changing cost paradigm, the

overwhelming majority of R&D attention, effort,

and dollars are directed towards improving the

chips to deliver more sensitivity, integration, etc.

• Research Needs − MEMS Design-for-test / Self-test methodologies To eliminate the need for custom actuation-based testers & handlers and leverage

existing digital tester/handler infrastructure.

− Isolation Improvement To enable leverage of existing digital packaging technologies & cost structures.

− Standardization & Integration One product / one process / one package. Multi-function products = fewer pkgs.

Court

esy o

f S

PE

A

TM





8

• Micro-fluidics − Medical and implantable devices, drug delivery,

lab-on-chip, etc.

− Cooling 3D chip stacks

• 2-D and 3-D Packaging Integration − Sensing “node” concepts for aerospace and military

− Volumetric shrinks

− More function in constant volume

• Wafer-level Packaging − ASIC-as-cap-wafer, TSV chip/wafer stacks

− Optical packaging: dispensed lenses, etc.

Court

esy o

f 3D

Plu

s

glenn g. daves - src · 2012. 3. 29. · tm freescale, the freescale logo, altivec, c-5, codetest,...

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