fvtx review homeworks

FVTX Review Nov 2007 1

FVTX Review Homeworks


When is Project Complete; how will it be determined?


Project Complete Deliverables

Active Strips, Noise hits/chip - Calibration system allows us to pulse each channel and make sure it is operational through to the PHENIX DAQ, calibration without pulse measures noise hits/chip

Detector resolution, efficiency - Cosmic rays can measure thisRadiation Length - Assured before final assembly, through engineering design controlsDAQ deliverables - Automatically delivered as long as we stick with our current DAQ plan

Minimum Acceptable Expected Performance Mini strips active >90% >95% hit efficiency >95% 99% Radiation length per wedge < 2.4 % 1.5% Detector hit resolution < 25 m ~15 m Noise hits/chip <1% <<1% (thresh:noise=5) LVL1 latency 4 s LVL1 Multi-Event buffer depth

4 events

Read-out time < 40 s Read-out rate > 10 kHz


Project Complete Deliverables - Timeline

Active Strips, Noise hits/chip - All of this can be tested initially prior to installation into PHENIX hall (summer 2010). Must be re-tested after installation (summer/fall 2010, depending on accessibility; part of commissioning plan)

Detector resolution, efficiency - Can also test outside of PHENIX if we are so inclined (if, for instance, we cannot install when detector is ready). Would definitely re-test after installation, once noise issues have been addressed. Expect by late fall 2010 we can have these completed.

Radiation Length - Assured before final assembly, through engineering design controls. Early in project

DAQ deliverables - Automatically delivered as long as we stick with our current DAQ plan. Early in project.


More Detail on Slow Controls Monitoring and Diagnostics


Slow Controls, Monitoring and Diagnostics

Global detector monitoring of temperature, water, etc. - Use (mature) PHENIX standard Adam monitoring system. Eric Mannel integrates our needs with PHENIX monitoring people (Paul Giannotti and co.)

Detector environment monitoring, cooling system - Walter Sonheim/HYTEC in charge

On-board monitoring of I/V/T - on-board chips identified which can monitor board status of I/V/T. ROC board specified to be able to send slow controls data either down the dedicated slow-controls fiber or integrate the data into the data-stream fiber.


Cooling System:

Monitor temperature of coolant

Monitor the flow rate of coolant – by each coolant loop

Dry Gas; Flow rate, humidity monitor, temperature

Electrical:

The commercial voltage systems for low and bias voltage have built in monitoring of voltage and current – standard industrial communication link.

PHENIX system has standard monitoring interface – Adams system is currently fully implemented with in PHENIX.

There is an on-going study to develop a fault analysis matrix to decide what the minimum number of channels needed to meet physics measurement requirement.

Radiation level monitor – diode, remember the VTX/FVTX has the benefit of being shielded by the Central Magnet. Monitoring the bias current on the sensor (diode measurement).

The FVTX subsystem group will develop a list of operational parameters to monitor during run periods, in conjunction with PHENIX on-line group.

Slow Control Monitoring - Draft


Workforce Breakdown


BNL CU UNM NMSU LANLFY08 0.25 3.1 1.2 2.16 2.65FY09 0.5 2.8 1.2 1.96 4.4FY10 0.5 3.3 1.2 1.56 4.5

0

2

4

6

8

10

12

FTE

FY08 FY09 FY10

Fiscal Year

OFF project Manpower by Year

LANL

NMSU

UNM

CU

BNL

Workforce by Institution


WBS # Institution FY08 FY09 FY10

WBS 1.4 CU 3.1 2.8 3.3

LANL 1.0

UNM 1.2 1.2 .6

WBS 1.5 LANL 2.65 2.65 2.75

WBS 1.7 NMSU 2.16 1.96 1.56

LANL .75 1.75

BNL .25 .5 .5

UNM .6

Workforce by WBS


Pre-Production Q&A Details


QA on sensors

• Visual inspection is first (under hi-magnification)

• many defects are obvious

• pits in the metallization

• defects in the passivation

• scratches or discoloration

• misalignment of metal to implant

• bond pad integrity

• polysilicon meander pattern


QA on SensorsDepletion Voltage/Breakdown Voltage

• I/V test on sensor

• Total I/V measured on the guard ring

• Spy pads allow one to probe the dc characteristics of the individual implanted strips

• Full depletion voltage and breakdown voltage for each sensor

• Testing every strip for integrity depends on vendor selection

•C/V tests

•Curve of 1/C2 has a characteristic shape, knee indicates depletion voltage

• Coupling capacitor value

QA on test structures

• Measure polysilicon test structures

• Measure oxide breakdown voltage (typically > 50V)


QA using external charge sources

Response and charge-sharing characteristics1064 nm laser diode scanRadioactive check sources, penetrating Beta, shallow, Alpha

More extensive testing (requires a readout chip FSSR or FPHX)

Coincidence cosmic ray telescope


Equipment

– Keithley 237 High Voltage Source Measure Unit

– Keithley 617 ElectrometerKeithley 617 Electrometer

– HP4284A LCR MeterHP4284A LCR Meter

– Probestation: Alessi/Cascade REL-6100 semiautomaticProbestation: Alessi/Cascade REL-6100 semiautomatic

– Software: UNM Custom on LabviewSoftware: UNM Custom on Labview

– Laser: EG&G 1064nmLaser: EG&G 1064nm

– Picoprobe35 High Bandwidth High Impedance ProbePicoprobe35 High Bandwidth High Impedance Probe

– Tektronix 7254B 2.5GHz Tektronix 7254B 2.5GHz

– Eichhorn Hausmann MX203-6-33 Contactless Wafer GaugeEichhorn Hausmann MX203-6-33 Contactless Wafer Gauge

Test Instruments


• FNAL engineers have a simulator package that checks for design rules exceptions

• Input data patterns will be simulated through the design layout

• Design review incorporating FVTX personnel plus external reviewer (compatibility with PHENIX DAQ)

Before submission to MOSIS FPHX


• Probe station QA

• Measure reference voltages and currents

• Noise

• Threshold

• Gain

• Pedestals

• Bench tests

• Performance under load

• Setup parameter sensitivity

• Stability and robustness at system level

• Controls interface and readout performance

QA FPHX readout chip

WBS 1.4.2


FPHX QA tests with mini-DAQ1. Test download of all registers, write into each download register

and read it back (check for stuck bit)2. Check resets and BCO counters for the chip (substantial

amplitude pulse) If the sequence is properly timed, should get a specific BCO counter every time

3. Check “hit reject” and “send hit” registers can be set4. Write the specific pattern into mask register and read a single

pulse response. Checks the ability to mask the channels.5. Run full calibration sequence on the chip. Be sure that every

channel responses. Checks the correct strip number association. Verifies the noise level and threshold distribution of every channel.

6. Run calibration chain with ADC information. Checks correct ADC assignment

FVTX Review Nov 2007 19Jon S Kapustinsky, FVTX Review Nov 2007 24

QA HDI

• Visual inspection

• look for shorts and opens (some rework is possible)

• inspect bond pad quality

• alignment fiducial metrology

• Electronic tests• continuity• crosstalk measurements made with external test signals• assemble prototype silicon HDI and FSSR chip (laser, source, calinput)• assemble prototype sensor HDI and FVTX chip (laser source, cal input)

WBS 1.4.3

• Run spice simulation on the HDI

Before pre-production submission

• Parameters measured on prototypes

• Signal integrity

• Crosstalk

fvtx review homeworks

Documents

phenix system

monitoring of voltage

phenix daq

slow controls data

phenix online group

phenix hall summer

humidity monitor

dedicated slowcontrols