design considerations in clbs for deep sub-micron technologies

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Design Considerations in CLBs for Deep Sub-Micron Technologies Louis Alarcón Octavian Florescu

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Design Considerations in CLBs for Deep Sub-Micron Technologies. Louis Alarc ó n Octavian Florescu. Motivation. As technology scales… The effects due to process variations will become more pronounced. Regular structures are needed to mitigate these effects. - PowerPoint PPT Presentation

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Page 1: Design Considerations in CLBs for Deep Sub-Micron Technologies

Design Considerations in CLBs for Deep Sub-Micron

Technologies

Louis AlarcónOctavian Florescu

Page 2: Design Considerations in CLBs for Deep Sub-Micron Technologies

Motivation

As technology scales…

– The effects due to process variations will become more pronounced.

• Regular structures are needed to mitigate these effects.

– Leakage will increase as the VTH are scaled.• Low leakage architectures will be needed to

control stand-by power.

Page 3: Design Considerations in CLBs for Deep Sub-Micron Technologies

Configurable Logic Block• Stack

– Regular– Low Leakage– Slow due to RC

delay

• Current Sensing– Recover

performance loss through smaller voltage swings.

DataInputs

S S

OUT

OUTCLK

ProgramBits

PassTransistor

Stack

Current Sense

Page 4: Design Considerations in CLBs for Deep Sub-Micron Technologies

RootInput

A

B S

S

P0

Programming(P0, P1, P2, P3)

Logic

to senseampA

B

B

B

The Stack

• Inverted multiplexer tree

• “pseudo-differential” currents at the outputs

• Data inputs: 4• Program bits: 16

Page 5: Design Considerations in CLBs for Deep Sub-Micron Technologies

ION

IOFF 0V1

V2

IBIAS

I1

V = V1 - V2 > 0

V1V2

ION IOFF

CLB

V1 V2

ION IOFF

DCVSL-basedSense Amplifier

(DCVSL-SA)

Clamped Bit-LineSense

Amplifier(CBL)

ConditionalPrecharge

Sense Amplifier

(CP)

Sense Amplifier Topologies

Page 6: Design Considerations in CLBs for Deep Sub-Micron Technologies

ION

IOFF 0V1

V2

IBIAS

I1

V = V1 - V2 > 0

V1V2

ION IOFF

CLB

V1 V2

ION IOFF

DCVSL-basedSense Amplifier

(DCVSL-SA)

Clamped Bit-LineSense

Amplifier(CBL)

ConditionalPrecharge

Sense Amplifier

(CP)

Sense Amplifier Topologies

Page 7: Design Considerations in CLBs for Deep Sub-Micron Technologies

ION

IOFF 0V1

V2

IBIAS

I1

V = V1 - V2 > 0

V1V2

ION IOFF

CLB

V1 V2

ION IOFF

DCVSL-basedSense Amplifier

(DCVSL-SA)

Clamped Bit-LineSense

Amplifier(CBL)

ConditionalPrecharge

Sense Amplifier

(CP)

Sense Amplifier Topologies

Page 8: Design Considerations in CLBs for Deep Sub-Micron Technologies

ION

IOFF 0V1

V2

IBIAS

I1

V = V1 - V2 > 0

V1V2

ION IOFF

CLB

V1 V2

ION IOFF

DCVSL-basedSense Amplifier

(DCVSL-SA)

Clamped Bit-LineSense

Amplifier(CBL)

ConditionalPrecharge

Sense Amplifier

(CP)

Sense Amplifier Topologies

Page 9: Design Considerations in CLBs for Deep Sub-Micron Technologies

EDP and Leakage

CMOS

TG

CBL

CP

DCVSL-SA

Looks too good to be true? It probably is…

EDP

CMOS

TG

CBL

CP

DCVSL-SA

Leakage Current

Page 10: Design Considerations in CLBs for Deep Sub-Micron Technologies

CLB(Stack)

CPSA

ION

IOFF

VSA

RootInput

ION VSA

Process Variation and MismatchV should be > 0 for proper sensing

ION,min neededby the senseamplifier

upsize

Page 11: Design Considerations in CLBs for Deep Sub-Micron Technologies

Sizing for Yield

CBL CP

DCVSL-SA

CBL

CP

DCVSL-SA

EDP Leakage Current

Yield Target: 99% (Monte Carlo process and mismatch simulations)• needs to be verified in silicon

Page 12: Design Considerations in CLBs for Deep Sub-Micron Technologies

Constant Yield Lines

• Solid line has a 99% yield over all process corners.– Overkill?

• The yield increases as VDD increases

CP (Upsized)CLB: 10xCP Sense Amp: 2x

CP

EDP CP

PerformanceLoss

Page 13: Design Considerations in CLBs for Deep Sub-Micron Technologies

Constant Yield Lines

• Dash-dotted line represents a constant Yield Line.

• Size of CLB tailored to desired Yield and VDD.

99% yield line

A

B

CP (Upsized)CLB: 10xCP Sense Amp: 2x

CP

YieldB = YieldA

EDP CP

Page 14: Design Considerations in CLBs for Deep Sub-Micron Technologies

Constant Yield Lines

99% yield line

CP (Upsized)CLB: 10xCP Sense Amp: 2x

CP

EDP CP

CMOS

TG

CP

Upsized EDP

YieldB = YieldA

A

B

Page 15: Design Considerations in CLBs for Deep Sub-Micron Technologies

Constant Yield Lines

CBL 99% line

A

B

CBL (Upsized)

CBL

YieldB = YieldA

EDP CBL

CMOS

TG

CBL

CP

Upsized EDP

Page 16: Design Considerations in CLBs for Deep Sub-Micron Technologies

Constant Yield Lines

DCVSL-SA 99% line

A

B

DCVSL-SA (Upsized)

DCVSL-SA

YieldB = YieldA

EDP

CMOS

TG

CBL

CP

DCVSL-SA

Upsized EDP

Page 17: Design Considerations in CLBs for Deep Sub-Micron Technologies

EDP and Yield

CMOSTG

CBLCP

DCVSL-SA

EDP(w/o sizing for yield)

CMOS

TG

CBL

CP

DCVSL-SA

EDP (constant yield)

Page 18: Design Considerations in CLBs for Deep Sub-Micron Technologies

EDP and Yield

CMOSTG

CBLCP

DCVSL-SA

EDP(w/o sizing for yield)

CMOS

TG

CBL

CP

DCVSL-SA

EDP (constant yield)

High Voltage Space

Page 19: Design Considerations in CLBs for Deep Sub-Micron Technologies

• DCVSL-SA best performing SA, and competitive with current TG and CMOS implementations.

However…• More difficult to design

– Analog-like design process• Less versatile

– Mandatory latch at the output– DVS

• Higher design risk– 6 unacceptable

Summary of Results

CMOS

TG

CBL

CP

DCVSL-SA

EDP (constant yield) CMOS

TG

CBL

CP

DCVSL-SA

Leakage Current

Page 20: Design Considerations in CLBs for Deep Sub-Micron Technologies

Summary of Results• DCVSL-SA best performing SA, and competitive

with current TG and CMOS implementations.However…• More difficult to design

– Analog-like design process• Less versatile

– Mandatory latch at the output– DVS

• Higher design risk– 6 unacceptable

Page 21: Design Considerations in CLBs for Deep Sub-Micron Technologies

Sense Amplifiers in Future Technologies

• Design of Sense Amplifiers in the future will become more challenging.– Impact of process variations will become more

pronounced– VDD will continue to scale

VSA/VDD increases VTH/VDD increases

• The useful design space will be limited.– Low leakage environments– High voltage, low energy space

Page 22: Design Considerations in CLBs for Deep Sub-Micron Technologies

Thank you

Page 23: Design Considerations in CLBs for Deep Sub-Micron Technologies

Design Considerations in CLBs for Deep Sub-Micron

Technologies

Louis AlarconOctavian Florescu

Page 24: Design Considerations in CLBs for Deep Sub-Micron Technologies

Energy – Delay

CMOS

TG

CBL

CP

DCVSL-SA

CBL

CP

DCVSL-SA

Page 25: Design Considerations in CLBs for Deep Sub-Micron Technologies

Low Threshold Voltage

CMOS

TG

CBL

CP

DCVSL-SA