cuetp - alloy sheet

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Rendering date: 2022-01-15 04:09:13http://conductivity-app.org

CuETPUNS:C11000EN:CW004A

Manufactures list:Aurubis (http://www.aurubis.com/en/) - Cu-ETP, Cu-ETP1Cupori Oy (http://www.cupori.com) - Cupori 110 PremiumDaechang Co., Ltd. (http://www.brasone.com/) - ETPFreeport McMoRan Copper & Gold (http://www.fcx.com/) - C110 - ETP CopperKGHM Polska Miedź S.A. (http://www.kghm.pl/) - Cu-ETP-8-CLKM Europa Metal AG (http://www.kme.com/) - KME100La Farga (http://www.lfl.es) - Cu-ETP, Cu-ETP1Luvata (http://www.luvata.com/) - CuETPMontanwerke Brixlegg AG (http://www.montanwerke-brixlegg.com) - MB-ETP, MB-ETP1Mueller Industries (www.muellerindustries.com/) - ASTM B152 Alloy C11000Nexans (http://www.nexans.us/) - ETP copper, Cu-a1Palabora (http://www.palabora.com/) - Cu-ETP 1Pan Pacific Copper (http://www.ppcu.co.jp/eng/) - Tough Pitch Copper (ETP)Pegler Yorkshire Group LTD. (http://www.pegleryorkshire.co.uk) - ETPRevere Copper Products, Inc. (http://reverecopper.com/) - C11000Sociedad Contractual Minera el Abra (http://www.fcx.com/) - C110Sociedad Minera Cerro Verde S.A.A. (http://www.fcx.com/) - C110Sofia Med S.A. (http://www.sofiamed.bg) - Cu-ETPTenke Fungurume (http://www.fcx.com/) - C110

CuETP is the most common copper. It is universal for electrical applications. CuETP has aminimum conductivity rating of 100% IACS and is required to be 99.9% pure. It has0.02% to 0.04% oxygen content (typical). Most ETP sold today will meet or exceed the101% IACS specification. As with OF copper, silver (Ag) content is counted as copper(Cu) for purity purposes. C11000C (Electrolytic Tough Pitch Copper) is an electrolyticrefined copper widely used for electrical and electronic applications. CuETP has theproperties required in all applications with a hydrogen-free atmosphere. In the presenceof H2 and heat all oxygen-bearing coppers suffer from so-called hydrogen embrittlement.This is a chemical reduction of copper oxide by diffusing hydrogen leading to formation ofH2O within the microstructure, resulting in embrittlement of the grain boundaries. Thephosphorus of our copper content is very low, so that electrical conductivity iscomparable to the best performing materials. C1100 is an oxygen containing copperwhich has a very high electrical and thermal conductivity. It has excellent formingproperties. Due to its oxygen content soldering and welding properties are limited. Thealloy is registered US EPA antimicrobial. Due to its high copper content of about 99% Cu-ETP provides the full antimicrobial properties of copper to inhibit the growth of bacteria,viruses and fungi which are in contact for a short period of time on copper containingsurfaces. Traditionally used ETP grade copper for electric applications, characterized by

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its content of hard copper oxides (Cu2O) with sizes of 5÷10 µm, which, for very smallwire diameters, significantly decrease their ductility. Electrolytic Tough Pitch Copper isnot suitable for case hardening. This material can be bent, soldered, drilled, riveted, andformed to almost any configuration. ETP Copper is available in round bar, squares, flatrectangular (bus bar), and certain profile shapes.Literature [Ref: 316, 409, 410, 411, 412, 413, 414, 325, 411, 254, 342, 340, 415, 268,347, 343, 345, 344, 143, 341, 346]

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Basic properties

Basic properties Value Comments

Density [g/cm3]8,89-8,988,327,93

Solid state,temperature:

20°CSolid state,temperature:1083°C

Liquid state,temperature:1083°C

Specific heat capacity[J/(kg*K)] 385-386

Temperature coefficient ofelectrical resistance (0...100°C)

[10-3/K]3,7-4,0

Electrical conductivity [T=20°C,(% IACS)] 93,15-100 min, ASTM

Thermal conductivity[W/(m*K)] 388

For highconductivitycopper, a

values of 387is an adjusted

valuecorrespondingto an electricalconductivity of101% IACS

Thermal expansion coefficient20...300°C [10-6/K] 17,7

[Ref: 316, 409, 413, 254, 342, 340, 415, 268, 347, 343, 346,417, 418, 419, 420, 421, 422, 423, 375, 385, 386, 387, 396,438, 442, 590, 602, 603]

Electrical conductivity is strongly influenced by chemical composition. A high level of colddeformation and small grain size decrease the electrical conductivity moderately.Minimum conductivity level can be specified [Ref: 316, 409, 410, 254, 340, 268, 344,143]

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Variation of density with amount of cold reduction by rolling for CuETP (C11000) andsimilar coppers (CuETP1). A - vacuum annealed 12 h at 880 °C and cold drawn; B -vacuum annealed 12 h at 970 °C and flat rolled; C - vacuum annealed 12 h at 995 °Cand cold drawn; D - hot rolled, vacuum annealed 4 h at 600 °C and drawn [Ref: 254]

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Theoretical and measured density of ETP copper (density was calculated theoretically andthen measured by Archimedes method) [Ref: 603]

Influence of impurity content on density ETP copper annealed at 700°C, 30min. [Ref: 415]

Remarks: Changes in the density of copper were very small for all considered impurities(from 8,76 to 8,98 g/cm3)

Content [%] Density [g/cm3]0,016 O2 8,910,04 8,900,06 8,900,09 8,880,27 8,840,36 8,76

0,016 O2 0,053 As 8,910,005 0,093 8,890,003 0,036 8,920,009 0,06 8,850,013 0,86 8,860,006 1,04 8,910,008 O2 0,0035 Sb 8,910,013 0,021 8,91

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0,005 0,046 8,900,015 0,042 8,920,016 0,22 8,920,014 0,47 8,900,015 O2 0,002 Bi 8,900,016 0,006 8,920,015 0,015 8,980,014 O2 0,06 Fe 8,900,003 0,20 8,920,004 0,40 8,920,008 0,73 8,910,005 0,96 8,910,004 1,32 8,910,007 1,80 8,91

Effect of temperature on the density of ETP copper [Ref: 415, 596, 599]

Temperature [°C] Density [g/cm3] Reference Calculated density* [g/cm3]

-173 9,01720 8,962 [Ref: 610]100 8,925200 8,88500 8,732600 8,70 [Ref: 610] 8,656700 8,62 [Ref: 610] 8,605800 8,54 [Ref: 610] 8,554900 8,46 [Ref: 610] 8,5061000 8,40 [Ref: 610] 8,457

1083 liquid 8,00 [Ref: 607]Volume change on freezing - 4,92%

* Calculated according to the formula dt=d20/(1+3αΔt), where α is the coefficient oflinear expansion. Underlined density values were used as a basis for calculations.

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Electrical conductivity of CuETP, CuETP1 according to KME [Ref: 417]

The influence of impurities on the electrical conductivity of CuETP [Ref: 24, 56, 26, 27]

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Electrical resistivity vs strain of Cu-ETP wires in drawn and annealed state [Ref: 600]

Resistivity measurements for the ETP copper wire before and after annealing at 260°C(Physics Laboratory ENICA, Biskra) [Ref: 601]

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Theoretical and measured values of thermal conductivity of ETP copper at the ambienttemperature [Ref: 603]

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Applications

Main applications

Typical uses: produced in all forms except pipe and used for building fronts, downspouts,flashing, gutters, roofing, screening, spouting, gaskets, radiators, busbars, electricalwire, stranded conductors, contacts, radio parts, switches, terminals, ball floats, butts,cotter pins, nails, rivets, soldering copper, tacks, chemical process equipment, kettles,pans, printing rolls, rotating bands, roadbed expansion plates, vats. Automotive industry:radiators, gaskets. Builders hardware: cotter pins, butts, ball floats, tacks, solderingcopper, rivets. Consumer: christmas ornaments. Electrical industry: transformer coils,switches, terminals, contacts, radio parts, busbars, terminal connectors, conductors,stranded conductors, cable strip. Fasteners. Industrial: printed circuit boards, stampedparts, pressure vessels, chemical process, equipment, chlorine cells, chimney capscreens, heat exchangers, printing rolls, anodes, rotating bands, pans, vats, heat sinks.Architecture: downspouts, flashing, roofing, gutters, building fronts, skylight frames,kitchen countertops.Preferred applications: transformer, fuse, relay box, punshed screen, cable strip, currentcarrying capacity. Literature: [Ref: 316, 409, 410, 411, 412, 413, 414, 325, 411, 254,342, 340, 415, 268, 347, 343, 345, 344, 143, 341, 346]

Kinds of semi-finished products/final products

Forms Available: sheet, strip, plate for locomotive fireboxes, rod for locomotive staybolts,flat products, rod, bar and shapes, wire, conductors, tubular products, miscellaneous

CuETP (C11000)Product Specification Literature

Plate for locomotivefireboxes ASME SB11 [Ref: 428]

Rod SAE J463 [Ref: 429]MIL-C-12166 [Ref: 430]

Rod for locomotivestaybolts ASME SB12 [Ref: 431]

Sheet and strip AMS 4500 [Ref: 432]

WireAMS 4701 [Ref: 433]MIL-W-3318 [Ref: 434]MIL-W-6712 [Ref: 435]

ASTM and federal specifications for CuETP (C11000)

Product and condition Specification numberASTM Federal

Flat products:- General requirementsfor copper and copperalloy plate, sheet, strip

and rolled bar

B248 [Ref: 436] -

- Sheet, strip, plate androlled bar B152 [Ref: 373] QQ-C-576 [Ref: 389]

- Sheet, lead coated B101 [Ref: 437] -

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- Sheet and strip forbuilding construction B370 [Ref: 388] -

- Strip and flat wire B272 [Ref: 375] QQ-C-502 [Ref: 381]- Foil, strip and sheet for

printed circuits B451 [Ref: 438] -

Rod, bar and shapes:- General requirementsfor copper and copper

alloy rod, bar and shapesB249 [Ref: 334] -

- Rod, bar and shapes B133 [Ref: 372] QQ-C-502 [Ref: 381],QQ-C-576 [Ref: 389]

- Rod, hot rolled B49 [Ref: 348] -- Rod, bar and shapes for

forging B124 [Ref: 380] QQ-C-502 [Ref: 381]

- Busbars, rods andshapes B187 [Ref: 374] QQ-B-825 [Ref: 440]

Wire- General requirementsfor copper and copper

alloy wireB250 [Ref: 441] -

- Hard drawn- Tinned

B1 [Ref: 385]B246 [Ref: 400]

QQ-W-343 [Ref: 404]-

- Medium-hard drawn- Tinned

B2 [Ref: 386]B246 [Ref: 400]

QQ-W-343 [Ref: 404]-

- Soft- Lead alloy coated- Nickiel coated

- Rectangular and square- Tinned

B3 [Ref: 387]B189 [Ref: 399]B355 [Ref: 403]

B48 [Ref: 371], B272[Ref: 375]

B33 [Ref: 396]

QQ-W-343 [Ref: 404]----

- Silver coated B298 [Ref: 402] -

- Trolley B47 [Ref: 442], B116[Ref: 398] -

Conductors- Bunch stranded B174 [Ref: 444]

- Concentric-lay stranded B8 [Ref: 445], B226 [Ref:446], B496 [Ref: 447]

- Conductors for electronicequipment

B286 [Ref: 401], B470[Ref: 397]

- Rope-lay stranded B172 [Ref: 448], B173[Ref: 449]

- Composite conductors(copper plus copper-clad

steel)B229 [Ref: 450]

Tubular products- Bus pipe and tube B188 [Ref: 379] QQ-B-825 [Ref: 440]

- Pipe - WW-P-377 [Ref: 451]- Welded copper tube B477 [Ref: 452]

Miscellaneous- Standard classification of

copper B224 [Ref: 453] -

- Electrolytic Cu wirebars,cakes, slabs, billets,ingots and ingot bars

B5 [Ref: 454] -

- Anodes - QQ-A-673 [Ref: 455]- Die forgings B283 [Ref: 456] -

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EN specification for CuETP (C11000)

Number Title - products

EN 13601Copper and copper alloys. Copperrod, bar and wire for general

electrical purposes

EN 13600 Copper and copper alloys. Seamlesscopper tubes for electrical purposes

EN 13602Copper and copper alloys. Drawn,

round copper wire for themanufacture of electrical conductors

EN 1652Copper and copper alloys. Plate,sheet, strip and circles for general

purposes

EN 1976 Copper and copper alloys. Castunwrought copper products

EN 1977 Copper and copper alloys. Copperdrawing stock (wire rod)

EN 13599Copper and copper alloys. Copperplate, sheet and strip for electrical

purposes

EN 13605Copper and copper alloys. Copper

profiles and profiled wire for electricalpurposes

EN 12165 Copper and copper alloys. Wroughtand unwrought forging stock

EN 12420 Copper and copper alloys. Forgings

EN 13148 Copper and copper alloys. Hot-diptinned strip

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Chemical composition

Chemical composition Value CommentsAg [wt.%] 0,0009As [wt.%] 6E-05Bi [wt.%] 1E-05Cd [wt.%] 1E-06Co [wt.%] 3E-06Cr [wt.%] 9E-06Cu [wt.%] 99,97884 CalculatedFe [wt.%] 0,00016Mn [wt.%] 4E-06Ni [wt.%] 0,00017O2 [wt.%] 0,019P [wt.%] 0,0002Pb [wt.%] 7E-05S [wt.%] 0,00028Sb [wt.%] 6E-05Se [wt.%] 1E-05Sn [wt.%] 3E-05Te [wt.%] 2E-05Zn [wt.%] 0,00018

[Ref: 567]

* Chemical composition measured for wire rod (diameter 8.00 mm) obtained fromContirod technology

Composition limits: 99.90 Cu min (silver counted as copper). Silver has little effect onmechanical and electrical properties but does raise the recrystallization temperature andtends to produce a fine-grain copper. Iron as present in commercial copper, has no effecton mechanical properties, but even traces of iron can cause C11000 to be slightlyferromagnetic. Sulfur causes spewing and unsoundness, and is kept below 0.003% inordinary refinery practice. Selenium and tellurium are usually considered undesirableimpurities but may be added to improve machinability. Bismuth creates brittleness inamounts greater than 0.001%. Lead should not be present in amounts greater than0.005% if the copper is to be hot rolled. Cadmium is rarely present; its effect is totoughen copper without much loss in conductivity. Arsenic decreases the conductivity ofcopper noticeably, although it is often added intentionally to copper not used in electricalservice because it increases the toughness and heat resistance of the metal. Antimony issometimes added to the copper when a high recrystallization temperature is desired[Ref: 316, 409, 412, 254, 415, 343, 344]

Chemical composition of CuETP according to EN 1976, EN 1977

Chemical composition, wt%Other named elements Cu1) Bi O Pb

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max max min(As + Bi + Cd + Co + Cr + Fe + Mn + Ni +O + P + Pb + S + Sb + Se + Si + Sn + Te

+ Zn) maximum 0,03%99,90 0,0005 0,00402) 0,005

1) Including Ag with maximum 0,015%2)Maximum permissible oxygen 0,060%

Literature: [Ref: 335, 336]

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Chemical composition of CuETP1 according to EN 1976, EN 1977

Chemical composition, wt%Ag As Bi Cd Co Cr Fe Mn Ni O P Pb S Sb Se Si Sn Te Zn Cumax.0,0025

0,00051)

0,00022)

-1) -3) -1)0,00103)

-1) -3) 0,0400 -1) 0,00

050,0015 0,0004

1)

0,0002 2) -3) -3) 0,00

02 -3) -

1) (As + Cd + Cr + Mn + P + Sb) maximum 0,0015%2) (Bi + Se + Te) maximum 0,0003%, including (Se + Te) maximum 0,00030%

3) (Co + Fe + Ni + Si + Sn + Zn) maximum 0,0020%Literature: [Ref: 335, 336]

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Mechanical properties

Mechanical properties Value CommentsUTS [MPa] 220-395

YS [MPa]69-36580-120120-220

Soft AnnealedMechanicalhardened

Elongation [%] 4-55

Hardness

10-6240-9525-644847

HRBHRFHR30THK

HB (99,996 Cuannealed,grain size0,07mm)

Young’s modulus [GPa]115

115-130109,46-131

O60 temperCold-worked(H) temper

Kirchhoff’s modulus [GPa]

4444-49464848,3

O60 temperCold-worked(H) temper

Poisson ratio 0,33[Ref: 316, 409, 254, 342, 340, 415, 268, 343, 344, 143, 346,417, 418, 419, 420, 421, 422, 423, 66, 267, 355, 91, 354, 406,596, 598, 602, 603, 605]

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Variation of tensile properties with amount of cold reduction by rolling for Cu-ETP(C11000) and similar coppers (Cu-ETP1) [Ref: 254]

Variation of hardness with amount of cold reduction by rolling for Cu-ETP (C11000) andsimilar coppers (Cu-ETP1) [Ref: 254]

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Mechanical properties of CuETP, CuETP1 according to KME [Ref: 417]

Temper UTS, MPa YS, MPa Elongation A50, % Hardness HV

R220 (a) 220 - 260 < 140 33 40 - 65R240 240 - 300 ≥ 180 8 65 - 95R290 290 - 360 ≥ 250 4 90 - 110R360 ≥ 360 ≥ 320 2 ≥ 110

(a) Annealed

Mechanical properties of CuETP wire rod (diameter 8.0mm) used in electrical application[Ref: 316, 254, 343, 344, 143, 346, 417, 418, 419, 420, 421, 422, 423, 66, 267, 355,91, 354, 357, 358]

Material CuETP

Production technology - Contirod, Southwire,Continuus Properzi

ChemicalcompositionCu + Ag

[%wt] 99,95 - 99,97 99,98

Content byweight ofelements

[ppm] 150 25

Oxygen [ppm] 150 - 400 160 - 200UTS [MPa] 220 - 240 220

Elongation A250 [%] 40 - 45 45 - 50Ductility [mm] 0,2 0,05

Mechanical properties of CuETP, CuETP1 wire rod [Ref: 567]

Productiontechnology

YS UTS Elongation A250[MPa] [MPa] [%]

Contirod 140,0 220,7 42,3

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Tensile stress characteristic of CuETP wire rod (diameter 8.0mm) from Contirodtechnology [Ref: 567]

Tensile stress characteristic of CuETP wire rod (diameter 8.0mm) by Fujiwara [Ref: 357]

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Tensile stress characteristic of Cu-ETP wires (diameter 0.5-8.0 mm) after drawingprocess [Ref: 567]

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Tensile stress characteristic of Cu-ETP wires (diameter 0.5-8.0 mm) after drawingprocess [Ref: 567]

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UTS/YS ratio vs strain of Cu-OFE wires (diameter 0,5-8.0 mm) after drawing process[Ref: 567]

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Elongation A250 vs strain of Cu-ETP wires (diameter 0,5-8.0 mm) after drawing process[Ref: 567]

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Tensile stress characteristic of Cu-ETP wires (diameter 0.5-8.0 mm) after drawingprocess -logarithmic system [Ref: 567]

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Tensile stress characteristic of Cu-ETP wires (diameter 0.5-8.0 mm) after drawingprocess -logarithmic system [Ref: 567]

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Elongation vs strain of ETP copper (Cu min = 99,97% mass) wires in drawn and annealedstate [Ref: 600]

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Ultimate tensile strength vs strain of ETP copper (Cu min = 99,97% mass) wires indrawn and annealed state [Ref: 600]

Elongation and ultimate tensile strength of ETP copper before and after annealing [Ref:601]

ε [%] Before annealing After annealingA [%] Rm [N/mm2] A [%] Rm [N/mm2]

0 39 235 39 23347,97 4 322 40 23971,64 2,5 414 38 24591,66 2 464 38 253

Influence of grain size on tensile properties of ETP copper [Ref: 415]

Grain size [mm] UTS [MPa] 0,5% Proof Stress[MPa]

Reduction in area[%]

0,03 248 104 770,15 234 93 62

Vickers microhardness curve of the ETP copper wire after cold wire drawing [601]

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Evolution of the Vickers microhardness of the ETP copper wire (after annealing at 260°C)as a function of holding time [Ref: 601]

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Hardness HBW of ETP copper (applying Brinell Hardness tester with the ball of 2,5 mmand load of 625 N) [Ref: 603]

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Microhardness of ETP copper in the present study [Ref: 609] and ETP copper [Ref: 610]as

functions of N and corresponding equivalent strain, before and after normalization(diameter of wire 1mm).

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Remark: The relation H vs wr depends on the crystal structure of the pure metals.

Dependence of the hardness at room temperature on the total specific heat capacity wr

for ETP copper (Kgm/cm3=KG/mm2) [Ref: 415]

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Influence of various additional elements on the elastic modulus of copper [Ref: 130]

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Effect of homologous temperature on Young’s modulus E of ETP copper [Ref: 415]

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The dependence Young’s modulus E versus specific heat capacity wr at room temperature[Ref: 415]

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Typical mechanical properties of CuETP, CuETP1 [Ref: 316, 409, 254, 340, 268, 344, 91, 354]

Temper UTS,MPa

YS (a),MPa Elongation in A50, %

Hardness Shearstrength,MPa

Fatiguestrength (b),

MPaHRF HRB HR30T

Flat products, 1 mm thickOS050 220 69 45 40 - - 150 -OS025 235 76 45 45 - - 160 76H00 250 195 60 60 10 25 170 -H01 260 205 70 70 25 36 170 -H02 290 250 84 84 40 50 180 90H04 345 310 90 90 50 57 195 90H08 380 345 94 94 60 63 200 97H10 395 365 95 95 62 64 200 -H20 235 69 45 45 - - 160 -

Flat products, 6 mm thickOS050 220 69 50 40 - - 150 -H00 250 195 40 60 10 - 170 -H01 260 205 35 70 25 - 170 -H04 345 310 12 90 50 - 195 -M20 220 60 50 40 - - 150 -

Flat products, 25 mm thickH04 310 275 20 85 45 - 180 -

Rod, 6 mm in diameterH80(40%) 380 345 10 94 60 - 200 -

Rod, 25 mm in diameterOS050 220 69 55 40 - - 150 -H80(35%) 330 305 16 87 47 - 185 115(c)

M20 220 69 55 40 - - 150 -Rod, 50 mm in diameter

H80(16%) 310 275 20 85 45 - 180 -

Wire, 2 mm in diameterOS050 240 - 35(d) - - - 165 -

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H04 280 - 1.5(e) - - - 200 -H08 455 - 1.5(e) - - - 230 -

Tube, 25 mm outside diameter, 1.65 mm wall thicknessOS050 220 69 45 40 - - 150 -OS025 235 76 45 45 - - 160 -H55(15%) 275 220 25 77 35 45 180 -

H80(40%) 380 345 8 95 60 63 200 -

Shapes, 13 mm in diameterOS050 220 69 50 40 - - 150 -H80(15%) 275 220 30 - 35 - 180 -

M20 220 69 50 40 - - 150 -M30 220 69 50 40 - - 150 -(a) At 0.5% extension under load. (b) At 108 cycles. (c) At 3 × 108 cycles in a rotating beam test. (d) Elongation in 254 mm. (e)

Elongation in 1500 mm.

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Mechanical properties of CuETP, CuETP1 (flat, round, square, hexagonal) according to EN13601 by Aurubis [Ref: 418]

MetallurgicalState D

Dimensions, mm Hardness

UTSMPa

YS,MPa

ElongationRound, square,hexagonal Thickness Width HB HV A100

[%]A[%]From up

to To From Upto To From Up

to To Min. Max. Min. Max.

D 2 - 80 0.5 - 40 1 - 200 Cold drawn product without any specific mechanical propertiesH035 (a) 2 - 80 0.5 - 40 1 - 200 35 65 35 65 - - - -

R200 (a) 2 - 80 1,0 - 40 5 - 200 - - - - 200 Max.120 25 35

H065 2 - 80 0,5 - 40 1 - 200 65 90 70 95 - - - -

R250 2 - 10 1,0 - 10 5 - 200 - - - - 250 Min.200 8 12

R250 2 10 30 - - - - - - - - - - 250 Min.180 - 15

R230 - 30 80 - 10 40 - 10 200 - - - - 230 Min.160 - 18

H085 2 - 40 0,5 - 20 1 - 120 85 110 90 115 - - - -H075 - 40 80 - 20 40 - 20 160 75 100 80 105 - - - -

R300 2 - 20 1,0 - 10 5 - 120 - - - - 300 Min.260 5 8

R280 - 20 40 - 10 20 - 10 120 - - - - 280 Min.240 - 10

R260 - 40 80 - 20 40 - 20 160 - - - - 260 Min.220 - 12

H100 2 - 10 0,5 - 5 1 - 120 100 - 110 - - - - -

R350 2 - 10 1,0 - 5 5 - 120 - - - - 350 Min.320 3 5

(a) Annealed

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Mechanical properties of CuETP, CuETP1 according to EN13606 by Aurubis [Ref: 418]

Metallurgical StateDimensions, mm Hardness UTS MPa YS,

MPa

ElongationThickness Width HB HV A100 [%] A

[%]Max. Max. Min. Max. Min. Max. Min.D 50 180 Same as drawn

H035 (a) 50 180 35 65 35 70 - - - -R200 (a) 50 180 - - - - 200 Max. 120 25 35H065 10 150 65 95 70 100 - - -R240 10 150 - - - - 240 Min. 160 - 15H080 5 100 80 115 85 120 - - - -R280 5 100 - - - - 280 Min. 240 - 8

(a) Annealed

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Exploitation properties

Heat resistance

Mechanical and electrical properties vs temperatures

Effect of low temperatures on the mechanical properties of Cu-ETP [Ref: 592]

Remarks: As can be seen from the table, ETP copper (FCC metal) preserve ductility atlow temperatures.

Metal andcrystalstructure

Materialcondition

Temperature[°C]

Tensilestrength/yield limit[Mpa]

Elongation[%]

Reduction ofarea [%]

Cu 99,90; K12Bar 10mm,annealed at800°C

17 - 29 70-191 - 41 72-253 - 48 48

Influence of temperature on the mechanical properties of annealed (600°C), forged ETPcopper [Ref: 415]

Temperature [°C] Tensile Strength[MPa] Elongation [%] Reduction in area

[%]20 220,0 32 67-75160 184,0 32 71300 132,0 30 50410 85,0 19 24555 48,5 14 19650 33,0 15 20790 19,0 14 34970 8,0 6 15

Mechanical properties of ETP copper as a function of temperature (-180°C to +600°C)[Ref: 415]

Temperature [°C] Tensile Strength[MPa] Elongation [%] Reduction in area

[%]-180 408 58 72-120 288 45 70-80 270 47 74-40 236 47 77-20 220 48 7620* 190 36 67300 183 42 62400 150 43 74500 130 45 75600 115 37 65

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* Above zero temperature measurements were performed with wire speciments of 5mmdiameter and 160mm length.

Influence of impurity content on tensile properties of ETP copper annealed at 700°C,30min. [Ref: 415]

Remarks: A stronger change in tensile strength and elongation was observed only for Feaddition with a content of more than one percent. For all impurities, with the exception ofthose mentioned above (>1%), tensile strength was 220 to 262 MPa and elongation wasabout 45 to 67%, which indicated good ductility properties.

Content [%]Tensilestrength[MPa]

Elongation[%]

Reduction ofarea [%]

0,016 O2 227 54 770,04 224 50 720,06 227 56 700,09 231 53 650,27 241 49 570,36 259 55 39

0,016 O2 0,053 As 220 57 720,005 0,093 224 57 700,003 0,036 227 60 790,009 0,06 234 55 620,013 0,86 238 56 660,006 1,04 238 59 790,008 O2 0,0035 Sb 220 63 750,013 0,021 224 63 740,005 0,046 224 60 720,015 0,042 234 49 730,016 0,22 231 67 770,014 0,47 234 58 660,015 O2 0,002 Bi 224 66 680,016 0,006 231 62 720,015 0,015 231 64 720,014 O2 0,06 Fe 227 57 730,003 0,20 224 60 730,004 0,40 234 60 800,008 0,73 262 52 800,005 0,96 252 45 820,004 1,32 301 30 790,007 1,80 311 29 79

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Dependence of tensile strength of ETP copper on its homologous temperature Th [Ref:415]

Mechanical properties vs temperature of Cu-ETP wire rod (diameter 8.0mm) after 1 hour

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annealing process (At temperatures from 100 °C to 400 °C the UTS of Cu-ETP wire rod isstable, whilein the temperature range of 500 °C to 900 decreases) [Ref: 567]

Elongation A250 vs temperature of Cu-ETP wire rod (diameter 8.0mm) after 1 hourannealing process [Ref: 567]

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Variation of tensile properties and grain size of electrolytic tough pitch copper (Cu-ETP)and similar coppers (Cu-ETP1) [Ref: 254]

44

Short-time elevated-temperature tensile properties of Cu-ETP (C11000) and similarcoppers (Cu-ETP1) [Ref: 254]

Low-temperature tensile properties of Cu-ETP (C11000) and similar coppers (Cu-ETP1)[Ref: 254]

45

Remark: For ETP copper, as for pure aluminium (both FCC metals), the differencebetween the Rm and Re magnitudes is larger at low temperature than at roomtemperature, unlike the BCC metals Cr, Ta and V.

Effect of temperature on the tensile strength Rm and yield limit Re of Cu-ETP [Ref: 415]

46

Tension stress characteristic of Cu-ETP wires (diameter 0.5-8.0 mm) obtained from wirerod after annealing process [Ref: 567]

47

Tensile stress characteristic of Cu-ETP wires (diameter 0.5-8.0 mm) obtained from wirerod after annealing process [Ref: 567]

Elongation vs strain of Cu-ETP wires (diameter 0.5-8.0 mm) obtained from wire rod afterannealing process [Ref: 567]

48

Remarks: The diagrams lack a physical yield point.

Compression diagrams at 20°C and -180°C of Cu-ETP ductile at low temperatures [Ref:415]

Effect of elevated temperatures on the Knoop hardness HK of ETP copper [Ref: 415]

Temperature [°C] Knoop hardness HK [kg/mm2]20 48100 47200 36300 28,8400 22,3500 27,5600 10700 8800 7,4900 3,5

49

Softening resistance of Cu-ETP [Ref: 417]

Microhardness dependence on the annealing temperature for ETP copper samplessubjected to ECAP with and without back pressure (BP) [Ref: 606]

50

Dependence of the Knoop hardness HK at 0°K (-273,15°C) on the total molar heatcapacity W0 for ETP copper [Ref: 593]

Thermal expansion and enthalpy of Cu-ETP. (a) Total thermal expansion from -190 °C.(b) Enthalpy (heat content) above 0 °C [Ref: 254]

51

Thermal conductivity of Cu-ETP in different temperature [Ref: 254, 340, 415, 344, 267,91, 406]

Temperature Thermal conductivityK °C W/m·K4.2 -268.8 30020 -253 53077 -196 550194 -79 400273 0 390373 100 380573 300 370973 700 300

Effect of temperature on the thermal conductivity of ETP copper [Ref: 415]

Temperature Thermal conductivityK °C W/m·K100 -173,15 483200 -73,15 413300 26,85 398400 126,85 392600 326,85 383800 526,85 3711000 726,85 3571200 926,85 3421400 1126,85 1671600 1326,85 174

52

Thermal conductivity measurements derived from the thermal diffusivity data for ETPcopper [Ref: 607]

53

Differential Scanning Calorimetry (DSC) of ETP copper (Differential scanning calorimetryDSC measurements were carried out in order to find out the reason for the change in theTC slope at 200 °C - Fig. above) [Ref: 607]

54

Thermal conductivity of ETP copper vs temperature (temperature range -200 to +25°Cand range +50 to +600 °C). Measurements were performed by two methods. Firstmethod was based on the axial stationary heat flow in the temperature interval -200 to+25°C, namely from thetemperature of liquid nitrogen to room temperature. Secondapplied method of measurements in the temperature range +50 to +600 °C, was basedon indirect measurements at 50, 100, 200, 400 and 600°C, where thermal diffusivity onthe nonlinear mathematical Cape-Lehman model was calculated, taking into accountradiation losses, an atmosphere of protective gas-argon and the covering of samples withgraphite on both sides [Ref: 603]

55

Comparison between the nominal thermal conductivity curve for ETP copper RRR 50(solid line) and the control sample. In theinset four different runs are displayed, showingthe reproducibility of our measurements and allowing a better determination of the peaktemperature [Ref: 608]

56

Thermal conductivity of the ETP copper. The three lines display the thermal conductivityof copper for diferent levels of RRR in order to evaluate those of the copper within thesamples [Ref: 608]

Effect of temperature on the electrical resistivity of ETP copper [Ref: 415]

Temperature Electrical resistivity,µΩcmK °C

100 -173,15 0,348200 -73,15 1,046300 26,85 1,725400 126,85 2,402600 326,85 3,792800 526,85 5,2621000 726,85 6,8581200 926,85 8,6261400 1126,85 21,011600 1326,85 23,42

Electrical resistivity of ETP copper at subsero temperatures [Ref: 415]

57

Temperature Electrical resistivity,µΩcmK °C

1 -272,15 0,00220 -253,15 0,002840 -233,15 0,023960 -213,15 0,097180 -193,15 0,215100 -173,15 0,348150 -123,15 0,699200 -73,15 1,046273 -0,15 1,543

Softening resistance of cold drawn Cu-ETP wires [Ref: 567]

58

Softening resistance of cold drawn Cu-OFE wires[Ref: 567]

Effect of the content of different elements added to ETP copper on its recrystallizationtemperature [Ref: 415]

Remarks: The effect of foreign atoms on the recrystallization temperature is stronglyconnected with the type of foreign atoms. Inclusion of foreign atoms mostly increases therecrystallization temperature. In some rare cases (Al, Fe and Bi) impurities decrease therecrystallization temperature. The largest increase of this temperature was for 0,24% Sn(Δt=170°C).

Content [%] Recrystallization temperature[°C]

0,24 Sn 3750,24 Ag 3400,19 Pb 3250,24 Mg 3200,36 P 3250,19 Cd 3000,06 Sb 2800,21 S 2750,14 As 2500,21 Ni 2500,20 Au 2500,06 Si 2450,33 Zn 2200,027 Bi 2000,21 Fe 1900,12 Al. 150

Recrystallization temperature of ETP copper t = 205°C

59

Increase in the recrystallization temperature of ETP copper (205°C) by the addition of0,01 atomic percent of the indicated element [Ref: 415]

Remarks: For Te and Se, the increase in the recrystallization temperature is very high.

Added element Increase in recrystallizationtemperature [°C]

Ni 0Co 15Fe 15Ag 80Sn 180Te 240

Influence of temperature on Young’s modulus (E) of annealed ETP copper [Ref: 415]

Temperature [°C] Young's modulus [GPa]-183 13620 129400 111600 95,1950 65

60

Relation between hardness and Young’s modulus of ETP copper at -200°C [Ref: 415]

Long-therm heat resistance, e.g. Arrhenius curve

61

Mechanical properties vs temperature of Cu-ETP wire rod (diameter 8.0mm) after 24hours annealing process [Ref: 567]

62

Elongation A250 vs temperature of Cu-ETP wire rod (diameter 8.0mm) after 24 hoursannealing process [Ref: 567]

63

Percentage reduction of area vs temperature of Cu-ETP wire rod (diameter 8.0mm) after24 hours annealing process [Ref: 567]

Half- softening temperature

Half-softening temperature of Cu-ETP wire [Ref: 567]

Diameter of wire Strain Half-softeningtemperature

[mm] [-] [°C]7,0 0,28 2655,5 0,76 2104,5 1,16 2102,5 2,38 1750,5 5,59 125

Corrosion resistance

Hydrogen embrittlement resistance

CuETP (C11000) is subjected to embrittlement when heated to 370 °C or above in areducing atmosphere, as in annealing, brazing or welding. If hydrogen or carbonmonoxide is present in the reducing atmosphere embrittlement can be rapid. Literature:[Ref: 316, 409, 410, 411, 412, 413, 414, 325, 411, 254, 340, 268, 343, 143, 346, 335,336, 417, 418, 419, 420, 421, 422, 423, 267, 354, 424, 425, 426, 427, 92]

64

Other kind of corrosion elements

www.copper.org

Type ofcorrosion Suitability Literature

Atmospheric Good[Ref: 254, 340, 415, 344,417, 419, 420, 421, 422,

423, 267, 406]Marine

environment Good [Ref: 254, 268, 344, 418,423]

Stress crack Good [Ref: 254, 340, 415, 344]

Hydrogenembrittlement

CuETP (C11000) is subjected toembrittlement when heated to 370 °C orabove in a reducing atmosphere, as in

annealing, brazing or welding. If hydrogenor carbon monoxide is present in the

reducing atmosphere embrittlement can berapid

[Ref: 316, 409, 410, 411,412, 413, 414, 325, 411,254, 340, 268, 343, 143,346, 335, 336, 417, 418,419, 420, 421, 422, 423,267, 354, 242, 425, 426,

427, 92]

Electrolytic Good [Ref: 254, 340, 268, 347,423, 406]

65

Other

C11000 has excellent corrosion resistanceto weathering and very good resistance to

many chemicals. It is often usedspecifically for corrosion resistance. It issuitable for use with most waters, and canbe used underground because it resists soilcorrosion. It resists non-oxidising mineraland organic acids, caustic solutions and

saline solutions. Depending onconcentration and specific conditions ofexposure, copper generally resists: acidsmineral acids such as hydrochloric andsulphuric acids; organic acids such asacetic acid (including acetates and

vinegar), carbolic, citric, formic, oxalic,tartaric and fatty acids; acidic solutions

containing sulphur, such as the sulphurousacid and sulphite solutions used in pulp

mills. Alkalies fused sodium and potassiumhydroxide; concentrated and dilute caustic

solutions. Salt solutions aluminiumchloride, aluminium sulphate, calciumchloride, copper sulphate, sodiumcarbonate, sodium nitrate, sodium

sulphate, zinc sulphate. Waters all potablewaters, many industrial and mine waters,

seawater and brackish water. Thecorrosion resistance of C11000 is notadequate for: ammonia, amines and

ammonium salts; oxidizing acids such aschromic and nitric acids and their salts;

ferric chloride; persulphates andperchlorates; mercury and mercury salts.Copper may also corrode in aerated nonoxidising acids such as sulphuric and aceticacids, although it is practically immunefrom these acids if air is completely

excluded. Copper is not suitable for usewith acetylene, which can react to form anacetylide which is explosive. C11000 isconsidered to be immune to stress

corrosion cracking in ammonia and thesimilar media which cause season cracking

in brass and other copper alloys.

[Ref: 254, 342, 268, 347,344, 346, 417, 421, 66,

267, 354]

ETP copper corrosion in the formic and carboxylic acid

Two experiments were performed in which the relative humidity was kept constantduring a major part of the exposure and only the formic acid concentration was varied.Three Cu-500 nm and three Cu-85 nm sensors were exposed to air at 80% and 60% RH,respectively, with increasing acid concentrations. It should be noted that due to the useof different permeation tubes with formic acid, the concentrations were slightly differentin the two experiments. An example of the corrosion depth record for a Cu-500 nmsensor is plotted in Fig. below. The other records were similar. The experiment started inclean air at 15% RH. The corrosion rate was below the detection limit until the relativehumidity was increased to 70%. The corrosion rate stabilized at about 0.01 nm/day after

66

4 days and did not change even though the relative humidity was increased to 80% RH.Formic acid did not have a dramatic effect on copper corrosion when present atconcentrations from 10 to 220 ppb. When the formic acid concentration was increased to460 ppb, the corrosion rate changed to 0.05 nm/day. It stayed at this level at 1000 ppbas well. An additional increase in the corrosion rate to 0.14 nm/day was recorded at themaximal formic acid concentration of 1590 ppb. The corrosion rate decreased graduallyto low values when the formic acid concentration was lowered to 190, 80 and 0 ppb. Cu-85 nm sensors were used in a similar experiment with a lower maximal relative humidityof 60%. Corrosion rates extracted from stabilized parts of the corrosion depth vs. timerecords are given in Table below. Analogously to the previous experiment at 80% RH, thecorrosion rate of copper only increased above about 0.01 nm/day when the concentrationof formic acid was raised from 210 ppb to 420 ppb. Indeed, the increase was strongerunder the wetter conditions. Whereas the corrosion rate continued to increase in morecontaminated air at 80% RH, it remained nearly constant at 0.04 ± 0.01 nm/day at 60%RH until the formic acid concentration was raised to 2880 ppb [Ref: 604].

Corrosion depth measured in air containing formic acid using a Cu-500 nm sensor;numbers give concentration of formic acid in ppb and relative humidity in per cent [Ref:604]

Corrosion rate of ETP copper sensors after stabilization in the presence of formic acid[Ref: 604]

c(HCOOH), ppb Corrosion rate, vcorr, nm/day60% RH 80% RH

0 0,014±0,003 0,010±0,00530-60 0,013±0,003 0,013±0,002

67

80-100 0,013±0,002 0,009±0,003210-220 0,015±0,003 0,012±0,001420-460 0,050±0,014 0,053±0,0031000-1180 0,047±0,011 0,051±0,0021550-1590 0,034±0,005 0,143±0,0022880 0,043±0,003 -

Corrosion rates as a function of the relative humidity and carboxylic acid concentration;(a) copper and formic acid; experimental points:vcorr≤0,015 nm/day,0,015<v<sub>corr≤0,06nm/day,vcorr>0,06 nm/day [Ref: 604]

Rheological resistance

Stress relaxation

68

Relaxation at stress level 0.5 × Yield Strength [Ref: 419]

Stress relaxation curves for Cu-ETP (C11000) and similar coppers (Cu-ETP1). Data areH80 temper wire, 2 mm in diameter, and represent the time-temperature combinationnecessary to produce a 5% reduction in tensile strength [Ref: 254]

Creep

69

Creep properties of CuETP, CuETP1 (C11000)

Temper

Testingtemperature Stress Duration of

test

Totalextension(a) Intercept Minimum

creep rate

°C MPa h % % % per1000 h

Strip, 2.5mm thick

OS030130

55 2500 2.6 2.0 0.15100 2600 10.0 7.6 1.2140 170 29.8(b) - 39

175 55 2000 3.3 2.3 0.65100 350 15(b) 8.0 6.3

H01130

55 8250 0.20 0.15 0.01100 8600 0.67 0.26 0.042140 1750 2.4(b) 0.32 0.45

175 55 6850 1.14 0.14 0.088100 1100 2.0 0.22 0.66

H02 13055 7200 0.24 0.13 0.01100 8600 1.02 0.25 0.054140 4680 3.4(b) 0.36 0.27

175 55 1050 3.3(b) - 0.6

H06 13055 8250 1.58 0.08 0.035100 8700 7.31 0.16 0.055140 4030 11(b) 0.24 0.17

Rod, 3.2 mm diameter

OS025 260

2.5 6000 0.08 0.016 0.0114.1 6000 0.19 0.010 0.0307.2 6500 0.64 0.113 0.08013.8 6500 2.88 0.87 0.306

H08 205

7.2 6500 0.06 0.045 0.01114.5 6500 0.20 0.112 0.01228 6500 1.08 0.41 0.09750 6500 5.42 2.47 0.44

(a) Total extension is initial extension (not given in table) plus intercept plus the product ofminimum creep rate and duration.

(b) Rupture testLiterature: [Ref: 254]

Creep-rupture strength for ETP copper for 100 hours creep [Ref: 597]

Temperature, °C R100, MPa650 90730 40810 22

Wear resistance

Friction resistance

70

Values given below apply to any of the unalloyed copper in contact with the indicatedmaterials without lubrication of any kind between the contacting surfaces:

Opposing material Coefficient of frictionStatic Sliding

Carbon steel 0.53 0.36Cast iron 1.05 0.29Glass 0.68 0.53

Literature: [Ref: 254]

Fatigue resistance

Fatigue cracking

Temper Fatigue strength at 108 cycles ina reversed bending test , MPa

Flat products, 1 mm thickOS025 76H02 90H04 90H08 97

Rod, 25 mm in diameter

H80 (35%) 115 (At 3 × 108 cycles in a rotatingbeam test)

Literature: [Ref: 254]

Values shown in table are typical for all tough pitch, oxygen-free, phosphorus-deoxidizedand arsenical coppers. Copper does not exhibit an endurance limit under fatigue loadingand, on the average, will fracture in fatigue at the stated number of cycles whensubjected to an alternating stress equal to the corresponding fatigue strenght (see Fig.)[Ref: 254]

71

Rotating-beam fatigue strength of Cu-ETP (C11000) wire, 2 mm in diameter, H80 temper[Ref: 254]

The fatigue strength is defined as the maximum bending stress amplitude which amaterial withstands for 107 load cycles under symmetrical alternate load withoutbreaking. It is dependent on the temper tested and is about 1/3 of the tensile strength[Ref: 419].

Influence of impurity content on fatigue limit of ETP copper annealed at 700°C, 30min.[Ref: 415]

Content, % Fatigue limit, MPa0,016 O2 770,04 940,06 910,09 840,27 770,36 77

0,016 O2 0,053 As 980,005 0,093 1010,003 0,036 950,009 0,06 1010,013 0,86 1050,006 1,04 1080,008 O2 0,0035 Sb 840,013 0,021 910,005 0,046 910,015 0,042 910,016 0,22 1080,014 0,47 1220,015 O2 0,002 Bi 940,016 0,006 940,015 0,015 1050,014 O2 0,06 Fe 98

72

0,003 0,20 940,004 0,40 10,10,008 0,73 10,10,005 0,96 10,50,004 1,32 10,80,007 1,80 11,2

73

Fatigue factor S/Rm of ETP copper in annealed condition versus the homologoustemperature (T/Tmp = ratio of room temperature to melting point, in °K) [Ref: 415]

74

Remark: For FCC pure metals there exists a nearly common linear dependence of thefatigue limit on the tensile strength.

Fatigue limit versus tensile strength of recrystallized ETP copper [Ref: 415]

75

Remark: The fatigue limit depends on the tensile strength of the metal.

Fatigue limit Stc of ETP copper versus tensile strength Rm at different temperatures [Ref:415]

76

Fatigue factor Stc/Rm of ETP copper at low temperatures [Ref: 415]

77

Dependence of fatigue limit σd and tensile strength Rm on the total heat capacity wr atroom temperature for ETP copper [Ref: 594]

Summary table of fatigue limits of ETP copper at room temperature [Ref: 595, 596, 415]

Metal Type ofmaterial

Correspondingmechanicalproperties in

MPaand

elongation, %

Fatigue limit,MPa

Basic numberof cycles References

Cu 99,98 Annealed at700°C rod

Rm=227El. 57%

Red of Area72%

ReversedBending 70 5∙102 [Ref: 595]

Cu 99,96 Annealed at710°C/30min.

Rm=203El. 60%


Cu 99,96 HC(high

conductivity)Annealed Rm=220

ReversedBending 76,5 3∙107 [Ref: 596]

78

Cu 99,92; 0,05O2(high

conductivity)

Annealed tapeCold-rolledtap, cold-worked 20%

Rm=228

ReversedBending 77,1Reversed

Bending 91,3

108

108

[Ref: 596][Ref: 596]

Cu 0,016 O2Annealed at700°C/30min.

Rm=227El. 54%

Red of Area77%

ReversedBending 77,1 5∙107 [Ref: 595]

Cu 0,17 O2

Rm=241El. 49%

Red of Area57%


Cu 0,008 O2;0,22 Sb

Annealed700°C/0,5h

Rm=231El. 67%

Red of Area77%


Cu 99,91electrolytic;0,032 Fe; 0,05

Zn

Rolled andannealed

Rm=244Red of Area

95%

ReversedBending 108Rotating Beam

74

2∙107 [Ref: 415]

Impact strength

Typical impact strength of Cu-ETP (Cu-ETP1)

Product and condition Impact strength, JCharpy V-notch

Hot rolled, annealed 96Charpy keyhole-notch

As-cast 11As-hot rolled 43Rod- Annealed

- Commercial temper5235

IzodRod- Annealed and drawn 30%

- Drawn 30%5445

Plate- As-hot rolled- Annealed 52

53(a)39(b)

Cold rolled 50% 26(a)12(b)

(a) Parallel to rolling direction. (b) Transverse to rolling directionLiterature: [Ref: 254]

79

Fabrication properties

Fabrication properties Value CommentsSoldering ExcellentBrazing Good

Hot dip tinning ExcellentElectrolytic tinning ExcellentElectrolytic silvering Excellent

Electrolytic nickel coating ExcellentLaser welding Less suitable

Oxyacetylene Welding NotRecommended

Gas Shielded Arc Welding NotRecommended

Coated Metal Arc Welding NotRecommended

Resistance welding Less suitable

Spot Weld NotRecommended

Seam Weld NotRecommended

Butt Weld GoodCapacity for Being Hot Formed Excellent

Forgeability Rating 65Machinability Rating 20 Less suitable

[Ref: 254, 340, 415, 268, 343, 344, 417, 418, 419, 422, 423,267, 91, 354, 406, 427]

80

Technological properties

Technological properties Value Comments Literature

Melting temperature [°C] 1083

[Ref: 316, 254, 342, 340,

415, 268, 344,143, 341, 417,418, 419, 420,421, 422, 423,267, 355, 91,354, 406, 603]

Casting temperature [°C] 1140-1200

[Ref: 316, 254, 342, 340,

415, 268, 343,344, 346, 417,418, 419, 420,421, 422, 423,66, 267, 355,91, 354, 406]

Annealling temperature [°C] 475-750

[Ref: 254, 340, 268, 344,

421, 422, 423,66, 267, 91,

357]

Stress relievieng temperature[°C] 150-200

[Ref: 254, 340, 268, 417,

418, 419, 423,267, 91, 354,

406]

Hot working temperature [°C] 750-875

[Ref: 254, 342, 340, 268,344, 66, 267,91, 406]

81

Time - temperature relationships for annealing Cu-ETP and similar coppers (Cu-ETP1)[Ref: 254]

82

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84

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438. ASTM B451-93 Specification for Copper Foil, Strip, and Sheet for PrintedCircuits and Carrier Tapes - (Withdrawn 1998, No Replacement)

440. QQ B 825 Bus Bar, Copper, Aluminum Or Aluminum Alloy -

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445. ASTM B8 - 11 Standard Specification for Concentric-Lay-Stranded CopperConductors, Hard, Medium-Hard, or Soft -

446. ASTM B226 - 11 Standard Specification for Cored, Annular, Concentric-Lay-Stranded Copper Conductors -

447. ASTM B496 - 04(2010)e1 Standard Specification for Compact RoundConcentric-Lay-Stranded Copper Conductors -

448. ASTM B172 - 10 Standard Specification for Rope-Lay-Stranded CopperConductors Having Bunch-Stranded Members, for Electrical Conductors -

449. ASTM B173 - 10 Standard Specification for Rope-Lay-Stranded CopperConductors Having Concentric-Stranded Members, for Electrical Conductors -

450. ASTM B229 - 12 Standard Specification for Concentric-Lay-Stranded Copperand Copper-Clad Steel Composite Conductors -

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455. QQA673 Anode, Plating -

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602. Continuously transposed cable. Product information - Essex, pages 2-13,Revision 2013-01

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604. Application of automated electrical resistance sensors for measurement ofcorrosion rate of copper, bronze and iron in model indoor atmospherescontaining short-chain volatile carboxylic acids - T. Prosek, M. Taube, F. Dubois, D.Thierry, Corrosion Science 87, 376-382, 2014

605. Hardness of FRHC-Cu determined by statistical analysis - J. Roa, M, Martinez,E. Rayon, N. Ferrer, F. Espiell, M. Segarra, Journal of Materials Engineering andPerformance, vol. 23 (2), 637-642, 2014

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cuetp - alloy sheet

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