chapter 0 introduction - ncu

Chapter 0Introduction

Jin-Fu LiAdvanced Reliable Systems (ARES) Laboratory

Department of Electrical EngineeringNational Central University

Jhongli, Taiwan

Advanced Reliable Systems (ARES) Lab.

Jin-Fu Li, EE, NCU 2

Applications of ICsConsumer Electronics Automotive Electronics

Green Power Electronics Biomedical Electronics



System on Chip

SOC a product class and design style that integrates

technology and design elements from other system driver classes (microprocessor unit, embedded memory, analog/mixed-signal component—as well as reprogrammable logic) into a wide range of high-complexity, high-value semiconductor products (ITRS 2011)



Trends for SOC Consumer Portable Driver

Source: ITRS 2011



SOC Consumer Portable Driver Architecture

Source: ITRS 2011



SOC Consumer Portable Design Complexity

Source: ITRS 2011



SOC Consumer Portable Power Consumption

Source: ITRS 2011



SOC Consumer Portable Processing Performance

Source: ITRS 2011



Source: ITRS 2010



Modern SOC Design Challenges

Power issue: Energy consumption, power dissipation,

power delivery Reliability issue Variability Soft error (single-event upset) Device degradation

Yield issue Y=e -AD

….

Multi-core chip architecture Use multiple identical cores to design a chip

Network-on-chip communication infrastructure Multiple point-to-point data links interconnected by switches (i.e.,

routers)



Architecture of Current SOC Chips

Source: IEEE Computer, 2005.

DDR2Controller

DDR2Controller

μ Engine

Source: IEEE Micro, 2007.

RAM unit

Compute unit



Examples

Source: IEEE JSSC, 2006.

SPARC V9 (Sun) Cell Processor (IBM)


Teraflops processor (Intel)



4x4 mesh built with Xpipeslibrary components

Niagara2 (Sun)




Cell Processor (JSSC, Jan. 2006)



Example: Niagara2 & POWER6 (JSSC, 2008)Niagara2 (Sun) POWER6 (IBM)

Design-for-Testability Features:

1. 32 Scans + ATPG2. BIST for arrays 3. ….

Design-for-Testability Features:

1. Logic BIST2. BIST for arrays 3. BISR for arrays4. …



Example: SPARC (JSSC, 2011)

Process: TSMC 40nmMetal layers (Cu): 11Transistor types: 4# of Cores: 166MB L2 cacheDie area: 377mm2

# of pins: 2117



Number of Transistors per Microprocessor Chip

Source: Proceedings of IEEE, May 2012.



Transistor Cost




Downsizing Rates of Audio/Video Products




Fundamental Elements of Electronic Systems

Computation

Data (Content) Communication

Processor (multi-core architecture)

Memory Interface; Bus; Network



3D Integration Technology

Technology evolution Bipolar CMOS Multicore 3D integration +

System-in-package (3D-SiP) System-in-package stacking dies using bonding wires

Source: ISQED, 2008.



Emerging IC Design Technology▬3D IC 3D integration stacking dies using through

silicon via (TSV)

Source: IBM, 2008.

Energy/Power

Processor

Memory Stack

RFADCDAC

NanoDeviceMEMS

Other Sensors,Imagers

Chemical &Bio Sensors

Source: Proceedings of IEEE, Jan. 2009



Advantages of 3D IC: Heterogeneous Integration

Combine disparate technologies DRAM, flash, RF, etc.

Combine different technology nodes For example: 65nm technology and

45nm technology

Energy/Power

Processor

Memory Stack

RFADCDAC

NanoDeviceMEMS

Other Sensors,Imagers

Chemical &Bio Sensors

Source: Proceedings of IEEE, Jan. 2009



Advantages of 3D IC: Low Power & Small Form Factor

SIP

3D-IC

SOBPower

Technology



Advantages of 3D IC: High Bandwidth

3D IC allows much more IO resources than 2D IC For example, Stacking of processor and memory

Memory

CPU

Bandwidth is limited by IOs

CPU

Memory

Many TSVs are allowed for high bandwidth transportation



Applications of 3D ICs

Memory wall

Sh

ort-term M

idiu

m-term

Long

-term

Memory capacitySmart or Trusted Memory

Heterogeneous Integration

Heterogeneous Integration & High Complexity Systems (terabyte of internet traffic/sec; petabytes of data stored in the cloud; etc.)

Source: Proceedings of IEEE

Source: Proceedings of IEEE



Possible Applications: Smart Phone

An important development direction is the interaction with the user, and sensor-based smartphones. Motion sensors, accelerometers and gesture reading devices should improve a lot this interaction, and combined with the connectivity widespread, it should create a new set of opportunities for consumers. Unfortunately, an aspect which won't mean a major leap in smartphonesdevelopment is battery life.

Augmented Reality Map



Possible Applications: Automotive Cloud Service System

Source: IEEE Computer, June 2012.

Requirement: high bandwidth (real time) and low power; small form factor



Possible Applications: Active Safety for Automotive

Source: IEEE Computer, June 2012.

Subaru introduced the EyeSight system version 2, introduced in 2010, which can stop a vehicle traveling at up to 30 km/h via a stereo camera mounted inside the front window. A 3D image processor analyzes the images that two cameras capture and estimates the distance to the obstacle.



Possible Applications: Healthcare


Adhesive-bandage-type sensor

Bionic ear



Possible Applications: Healthcare




Possible Applications: Superspecs

Source: Mail Online, 2012.



Challenges of 3D-IC Implementations

Yield Design for resiliency

Thermal Can we overcome it?

Test Reliability…

Source: IBM, 2008.



What will You Learn from This Course?


Memory array

Testing

Memory

Link Input/Output

To/from network

Processor

Control

Datapath

Input

Output

CPU I/O

Low-Power Design

Chip Architecture

Subsystems

chapter 0 introduction - ncu

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