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CKC Symposium 2006.9.27
Seung-Beck Lee
Division of Electronics and Computer Engineering &Department of Nanotechnology, Hanyang University, Seoul, Korea
Seung-Beck Lee
Division of Electronics and Computer Engineering &Department of Nanotechnology, Hanyang University, Seoul, Korea
Nanodevices using Nanomaterials :
Carbon Nanotube Thin-Films&
Nanoparticle Assembly
Nanodevices using Nanomaterials :
Carbon Nanotube Thin-Films&
Nanoparticle Assembly
D. G. Hasko and G. A. C. JonesD. G. Hasko and G. A. C. JonesCavendish Laboratory, University of Cambridge, Cambridge, U.K.Cavendish Laboratory, University of Cambridge, Cambridge, U.K.
CKC Symposium 2006.9.27
Heong-Suk Jeon, Chi-Won Cho, Bonghyun Park, and Seung-Beck Lee
Division of Electronics and Computer Engineering &Department of Nanotechnology, Hanyang University, Seoul, Korea
Heong-Suk Jeon, Chi-Won Cho, Bonghyun Park, and Seung-Beck Lee
Division of Electronics and Computer Engineering &Department of Nanotechnology, Hanyang University, Seoul, Korea
Template Assisted Electrostatic Assembly of Colloidal Au Nanoparticles Template Assisted Electrostatic Assembly of Colloidal Au Nanoparticles
D. G. Hasko and G. A. C. JonesD. G. Hasko and G. A. C. JonesCavendish Laboratory, University of Cambridge, Cambridge, U.K.Cavendish Laboratory, University of Cambridge, Cambridge, U.K.
CKC Symposium 2006.9.27
Motivation
• As more memories are packed closer together, the charge on neighboring memory start to affect charge coupling in the floating gate changing the threshold voltage shift.
Parasitic Capacitive CouplingFlash Memory ScalingOne limit of Flash memory scaling
CKC Symposium 2006.9.27
• Using pre-synthesized nanoparticles, size distribution may be reduced
Si nanowire split gate nano-floating gate memorySi nanowire split gate nano-floating gate memory
Gate
Gate
Au colloidalnanoparticles
Nanowire
Source Drain
Motivation
• Si nanowire geometry may increase floating gate charge induced scattering by limiting the transport channel to 1D
• Using nanoparticles, parasitic coupling may be reduced• Using metallic nanoparticles, charge density may be increased
CKC Symposium 2006.9.27
OutlineOutline
• Nanoparticle Floating-Gate Characteristics• Nanoparticle Floating-Gate Characteristics
• Summary• Summary
Nanoscale Floating-Gate Memory using Colloidal Au Nanoparticles Electrostatically Assembled on Si Nanowires
Nanoscale Floating-Gate Memory using Colloidal Au Nanoparticles Electrostatically Assembled on Si Nanowires
• Nanoparticle Assembly•• Nanoparticle AssemblyNanoparticle Assembly
• Template Assisted Electrostatic Assembly• Template Assisted Electrostatic Assembly
CKC Symposium 2006.9.27
Nanoparticle Assembly
• Au nanoparticle assembly on amino functionalized oxide surfaces
Surface functionalization
CKC Symposium 2006.9.27
Nanoparticle Assembly
• Increased sedimentation time increases Au nanoparticle density with localized sedimentation
Surface functionalization
More than 6 hours deposition time Too Slow
6 h6 h 6 h
CKC Symposium 2006.9.27
• Spin-coating on ATPS results in relatively even distribution
5 nm Au nanocrystal spin-coating at 3000 rpm 30 sec
2 times : even distribution
AFM study
10 times : Thickness increase
Nanoparticle Assembly
• However, difficult to increase density above 1010 without agglomeration
Spin-Coating on APTS
CKC Symposium 2006.9.27
Si
SiO2
100 nm
2 min electrophoresis
200 nm
10 min electrophoresis
Nanoparticle Assembly
Electrostatic assembly (electric field guided assembly)
• Electric-field applied between the substrate and the cathode guides the charged nanoparticles towards the substrate
• The process is much faster than convection drying or sedimentation methods
• Selective deposition is also possible• 2 min process produces ~ 1011 cm-2 density
CKC Symposium 2006.9.27
NFG CharacteristicsNFG Characteristics
SiSiO2
Si
PMMA
• Silicon-on-Insulator wafer (SIMOX)(n~1x1014/cm2) n-type Si : 70 nm, SiO2 : 100 nm
• PMMA resist spin-coatingA4 (4%PMMA in Anisole)5000 rpm for 30 sec, Thickness ~ 200 nm
• Electron-Beam Lithography10 nm spot size at 80 kV, 10 pA800 μC/cm2 exposure dosage
Reactive Ion Etching
SiCl4 (20 sccm) + CF4 (20 sccm) 20 mTorr, 300 W, 40 secSi 2.3 nm/s, SiO20.8 nm/s etch rates
• Dry Oxidation1000 oC for 10 min ~15 nm thermal oxide
Nanofabrication done at Microelectronics Research Centre, Cavendish Laboratory
CKC Symposium 2006.9.27
50 nmGate
Gate
Si nanowire
Si
SiO2
100 nm 200 nm
Selective Electrostatic AssemblySelective Electrostatic Assembly
NFG CharacteristicsNFG Characteristics
Selective Electrostatic AssemblySelective Electrostatic Assembly
CKC Symposium 2006.9.27
NFG CharacteristicsNFG Characteristics
10-9
10-8
10-7
10-6
-4 -2 0 2 4VGS (V)
I DS/
W (A
/μm
)
VDS = 2 V
nanoparticledensity
~ 1011 /cm2
VDS = 1.4 V
10-9
10-8
10-7
10-6
-4 -2 0 2 4
I DS/
W (A
/μm
)
VGS (V)
Before Au nanoparticle assembly
Measurements performed in vacuum at room temperatures
• Original device characteristics shows hysteresis due to surface charge• After Au nanoparticle electrostatic assembly, the threshold voltage shift is increased from 0.14 to 1.9 resulting in ΔVT ~ 1.5 V
Nanoscale Floating-Gate Memory Characteristics
CKC Symposium 2006.9.27
OutlineOutline
S D
G
Singe Nanoparticle Memory(?)
• Requires a method to place individual nanoparticles in predesignated locations
CKC Symposium 2006.9.27
• Template assisted electrostatic assembly of 20 nm Au nc in 60 nm line pattern• nc diameter dnc / linewidth lW = 0.33 ; nc number per column ~ 2 • Selectivity to Al surface over resist surface is very high• High nc density resulted in multilayer nc assembly with fluctuation in layer number
Template Assisted Electrostatic AssemblyTemplate Assisted Electrostatic Assembly
Si
Si
AlOxPMMA
Template Assisted Electrostatic Assembly
Capillary force
CKC Symposium 2006.9.27
Single Nanocrystal Array assemblySingle Nanocrystal Array assembly
CKC Symposium 2006.9.27
• Template assisted nc electrostatic assembly of 20 nm Au nc in square array pattern• nc diameter dnc / linewidth lW = 0.5 ; average site density ~ 1.3 • High percentage(>70%) of holes filled with a single nanocrystal• Density fluctuation is reduced by limiting the template dimensions
40 nm40 nm
Single Nanocrystal Array assemblySingle Nanocrystal Array assembly
1 μm1 μm
Template Assisted Electrostatic AssemblyTemplate Assisted Electrostatic Assembly
CKC Symposium 2006.9.27
Summary
40 nm40 nm
• We have demonstrated electrostatic selective assembly of colloidal Au nanoparticles on Si nanowires
• Nanoscale Floating Gate Memory characteristics were investigated with high threshold voltage shift, however retention time needs to be increased
• By using template assisted electrostatic assembly, it may be also be possible to use a single nanocrystal for NFGM
• Template assisted electrostatic assembly demonstrates that by using electrostatic assembly on patterned surfaces selective deposition of Au nanoparticles on device position may be possible
S D
G
Singe Nanoparticle Memory(?)
CKC Symposium 2006.9.27
Highly Flexible and Transparent Single Wall Carbon Nanotube NetworkGas Sensors Fabricated on PDMS Substrates
Highly Flexible and Transparent Single Wall Carbon Nanotube NetworkGas Sensors Fabricated on PDMS Substrates
Chang-Seung Woo, Yoon-Sun Hwang, Chae-Hyun Lim, and Seung-Beck Lee
Division of Electronics and Computer Engineering &Department of Nanotechnology,Hanyang University, Seoul, Korea
D G Hasko and K B K TeoUniversity of Cambridge, Cambridge, U.K.
CKC Symposium 2006.9.27
Motivation
Future Electronics yet fully developedFuture Electronics yet fully developed
• RFID• Mobile Sensor Network• Wearable Electronics• Smart Dust• Bendable (Flexible) Electronics• Transparent Electronics
• RFID• Mobile Sensor Network• Wearable Electronics• Smart Dust• Bendable (Flexible) Electronics• Transparent Electronics
requires
Low power consumptionHigh sensitivityMechanical stabilityChemical stabilityFlexible, transparent substratesFlexible, transparent interconnectsCompatible with Si processingMass producible (at low cost)
Mobile, Wearable, Flexible, Transparent Mobile, Wearable, Flexible, Transparent
CKC Symposium 2006.9.27
Motivation
Carbon nanotube based Future ElectronicsCarbon nanotube based Future Electronics
Low power consumptionHigh sensitivityMechanical stabilityChemical stabilityFlexible, transparent substratesFlexible, transparent interconnectsCompatible with Si processingMass producible (at low cost)
Potential
CKC Symposium 2006.9.27
• Energy band structure and density of states (DOS)
Metallic nanotubes
m-n = 0, Eg=0
DOS
Semiconducting nanotubes(wide gap)
m-n <>3p, Eg= 0.5 ~ 1 eV
(small-gap semiconductingnanotubes) Zigzag metals
Structure of SWCNT
CKC Symposium 2006.9.27
OutlineOutline
• Film characteristics: Transparency & Conductivity• Film characteristics: Transparency & Conductivity
• Summary• Summary
Flexible and Transparent SWCNTNetwork Gas Sensors on PDMS substrates
Flexible and Transparent SWCNTNetwork Gas Sensors on PDMS substrates
• Fabrication: Flexible SWCNT thin film•• Fabrication: Fabrication: Flexible SWCNT thin filmFlexible SWCNT thin film
• Sensor Operation : NH3 Gas Sensing Operation• Sensor Operation : NH3 Gas Sensing Operation
CKC Symposium 2006.9.27
Alumina filter
500 nm500 nm
Alumina filter surface
Flexible Thin FilmFlexible Thin Film
SWCNT thin film fabrication by Vacuum Filteration
Dispersion: SWCNT bundles in 0.1% Sodium Dodecylbenzene -sulfonate (SDS) solution
Arc-discharge SWCNTusing Fe catalyst(Φ:1.3 ~ 1.7 nm, EG : 0.59 ~ 0.45 eV)Chem.Phys.Lett.373, 266 (2003)
High power ultrasonic agitation at 30 ~70 W(10 s pulses for 1 hour)
Hu et al., Nano Lett. 4, 2513 (2004)
1 inch
before
after
Vacuum
Moore et al.,Nano Lett. 3, 1379 (2003)(Whatman; 20 nm pore size)
Density Control : SWCNT density in solution and filteration volume determines the thin film density
CKC Symposium 2006.9.27
Transfer of SWCNT thin film to PDMS substrate surface
Flexible & Transparent SWCNT thin film
SWCNT Thin Film on PDMSFlexible Thin FilmFlexible Thin Film
1. PDMS mixed and placed in a vacuum chamber to remove air bubbles
2. Filter membrane placed on the surface of the uncured PDMS
3. PDMS curing in 100oC oven for 1 hour
PDMS poly(dimethyl siloxane)
4. Removal of the filter membrane
• Flexibility depends on PDMS thickness• Transparency depends on SWCNT density
CKC Symposium 2006.9.27
SWCNT Thin Film on PDMSFlexible Thin FilmFlexible Thin Film
0.16 mg/ml5 μm5 μm
1 μm
• Due to some SWCNTs trapped in the nanoporesacting as ankersduring filter removal process, the SWCNT thin film transferred to the PDMS shows bundle ends lifted from the surface plain (grass like)
• Most of the SWCNT bundles have been transferred to the PDMS surface• For high density films, however, some percentage of SWCNTs remained untransferred
CKC Symposium 2006.9.27
Film characteristicsFilm characteristics
Transparency, Conductivity and Flexibility testing
SWCNT Thin Film on PDMS : Characterization
Visible range optical transparency depending on SWCNT density
Optical Transmittance
• Higher SWCNT density results in low transparency
• Frequency dependence is believed to be due to PDMS thickness
I-V characteristics during bending (thin film complete folded)
Mechanical deformation
• Only a small decrease in conductance is observed• Returns back to original state when stress is removed
Film Resistance
Electrical resistance of the SWCNT thin film on PDMS depending on SWCNT density
• 5 x 5 mm2 between Au contacts
• Not all of the bundles are making contact resulting in resistance saturation
• Linear I-V characteristics
10
20
30
40
50
60
70
80
90
400 450 500 550 600 650 700
0.04 mg/ml0.12 mg/ml0.16 mg/ml
Tran
spar
ency
(%)
Wavelength (nm)
Tran
smitt
ance
(%)
CKC Symposium 2006.9.27
Sensor OperationSensor Operation
NH3 gas sensitivity testing
Gas Sensing Measurement System
Flexible SWCNT Gas Sensor
Density dependent conductance change
• 5 min exposure to 1% NH3 results in ~ 10% change in film conductance
• The reduction in conductance shows variation on SWCNT density
CKC Symposium 2006.9.27
Tunneling
Sensor OperationSensor Operation
possible sensing mechanism
Effect of NH3 gas adsorption on SWCNT energy band
Flexible SWCNT Gas Sensor
EFEF
Metal p-type• Electron donation from NH3 raises the Fermi level
(direct adsorption) - reduced hole concentration• Adsorbed NH3 increases local scattering of holes
(adsorption on surfactant) - reduced carrier mobility
Tcnttot σσσ11
+=1
• Conduction in a network depends on nanotube interface properties and SWCNT density
High SWCNT density (percolation) 2D
• Many conduction paths – reduced scattering
Low SWCNT density ~ quasi 1D
• Few conduction paths – enhanced scattering
SWCNT network conduction reduced SWCNT density may increase sensitivity
(thermally assisted tunneling reduces the effect)
CKC Symposium 2006.9.27
Sensor OperationSensor Operation
Flexible SWCNT Gas Sensor
SWCNT density dependence
• There may be a correlation between SWCNT density and gas sensitivity due to the network conduction properties of SWCNT thin films
Low partial pressure detection
• It was possible to detect 10 ppm NH3 at 10 s exposure time ( 0.2 % conduction decrease)
• Bias voltage dependence within error margins
NH3 gas sensitivity testing
CKC Symposium 2006.9.27
Summary
Thank you very much!
Flexible SWCNT thin film on PDMS was fabricatedwith Grass like surface
Conductivity vs Density Flexible SWCNT Gas Sensor NH3 sensitivity
Density dependence 10 ppm level detection
Transparency vs Density
10
20
30
40
50
60
70
80
90
400 450 500 550 600 650 700
0.04 mg/ml0.12 mg/ml0.16 mg/ml
Tran
spar
ency
(%)
Wavelength (nm)