brolis semiconductors: beyond state of the art technology
TRANSCRIPT
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Type‐I GaSb laser diodes (R&D):
2.00 2.25 2.50 2.75 3.00 3.25 3.50 3.75 4.00
WR WR WRWRWR
Inte
nsity
(a. u
.)
Wavelength (µm)
Room-temperatureWR- world record
WR
2002 2004 2006 2008 2010 20122,6
2,8
3,0
3,2
3,4
3,6
3,8
4,0
SUNYSUNY
WSI
Rest of the world K. Vizbaras et al. (WSI)
RT
Wav
elen
gth
(µm
)
Year
WSI
RT spectral coverage Technological momentum
First‐of‐a‐kind lasers demonstrated
We know how and why
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Core technology was developed at Walter Schottky Institut (WSI), Technische Universität München (TUM), Germany
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Business fields:
• Mid‐infrared semiconductor laser and detector manufacturingGaSb type‐I lasers for wavelengths 1800 nm‐3800 nm for gas sensing, biomedical,
industrial process control & monitoring, defense, research and space applications.
• Molecular beam epitaxy foundry serviceAlGaInAsSb material system, multi wafer growth up to 4 inch in diameter.
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Target applications:
Veeco Gen II Mod( WSI)
2 - 4 µm • Medical diagnostics, dermatology, material processing
• gas sensors, combustion process control
• Homeland security: night vision
Laser‘s charactaristics:
• RT;• CW;• Single mode;• mW to 1 W.
Country Disadvantages Advantages
Lithuania • No semiconductor industry;• No specialists;• Maybe market barriers.
• Known business environment;• Low start‐up and running costs;• EU structural funds;• Favorable taxation for R&D.
USA • Visa;• Competition in labor market;• High fixed and running costs.
• Well developed industry;• Defense grants;• State orders;• Biggest market.
Germany • Not locals;• High start‐up costs;• Competition in labor market;• High fixed and running costs.
• Well developed industry;• Bavaria state grants;• Big local market.
Where to start – up?
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Brolis Semiconductors
Moletu pl. 73LT‐14259 VilniusLITHUANIA
www.brolis‐semicon.cominfo@brolis‐semicon.com
• Company established in August, 2011;
• Investement agreement with Venture Capital fund LitCapital in January, 2012;
• 2.5 M EUR received from EU grants June, 2012
• 4.5 M EUR invested into state‐of‐the‐art R&D facility;
• Industrial R&D facility opened December, 2012;
• Number of employees: 1 (2011), 6 (2012), 7 (2013).
Molecular Beam Epitaxy facility: Veeco Gen200Edge
• Class ISO 6 cleanroom environment;• Al, Ga, In, As, Sb as source materials, Si, Te, Be as dopants• 14 x 2”, 7 x 3”, 4 x 4” wafer growth per single run• In‐situ metrology: RHEED, reflection, absorption• Fully automated
Wafer Qualification
• Class ISO 6 cleanroom environment;• HRXRD, k‐space mapping, wafer mapping• FTIR reflection, transmission (1000 nm – 25 000 nm)• Hall measurement, Microscopy• Low‐T Photoluminescence, RT Photoluminescence mapping
Device testing and packaging
• Class ISO 6 cleanroom environment;• Scribe & Break, Die bonding, Wire bonding• Laser diode L‐I‐V, spectral, lifetime• Low‐frequency noise• TO‐can hermetic welding
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Type‐I GaSb laser diodes: production prospects
Type Fabry‐Perot laser diodes DFB laser diodes
Power/emitter 5‐10 mW 0.5 – 1 W
Op. mode CW CW, QCW
Appearance Die, submount, TO‐can Die, bar, submount
Wavelength (nm) 2090, 2330, 2730, 3000 3300, 3400
2090, 2330, 3000, 3300, 3400
Availability date March, 2013 March, 2013 End of 2013