basic semiconductor processes devices in semiconductor...
TRANSCRIPT
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EE 434Lecture 11
Basic Semiconductor Processes Devices in Semiconductor Processes
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Quiz 9 The top view of a device fabricated in a bulk CMOS process is shown in the figure below
a) Identify the deviceb) Sketch a cross-section along the AA’ section line
Metal 1
Poly 1
Active
p-select
n-well
Contact
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And the number is ….
631
24578
9
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Quiz 9 Solution a) p-channel MOS Transistor
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• Process Flow is a “recipe” for the process– Shows what can and can not be made – Gives insight into performance capabilities and limitations
• Back-End Processes– Die attach options (eutectic, preform,conductive epoxy)
• Stresses the die
– Bonding• Wire bonding• Bump bonding
– Packaging• Many packaging options• Package Costs can be large so defective die should be
eliminated before packaging
Review from Last Time
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Guard Rings and Bulk Attachment
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Packaging
1. Many variants in packages now available2. Considerable development ongoing on developing
packaging technology3. Cost can vary from few cents to tens of dollars4. Must minimize product loss after packaged5. Choice of package for a product is serious business6. Designer invariably needs to know packaging plans
and package models
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Packaging
www.necel.com
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Packaging
www.necel.com
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Basic Semiconductor Processes
MOS (Metal Oxide Semiconductor)
1. NMOS n-ch2. PMOS p-ch3. CMOS n-ch & p-ch– Basic Device: MOSFET– Niche Device: MESFET– Other Devices: Diode
BJTResistorsCapacitorsSchottky Diode
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Basic Semiconductor Processes
1. T2L2. ECL3. I2L4. Linear ICs
– Basic Device: BJT (Bipolar Junction Transistor)– Niche Devices: HBJT (Heterojunction Bipolar Transistor)
HBT– Other Devices: Diode
ResistorCapacitorSchottky DiodeJFET (Junction Field Effect Transistor)
Bipolar
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Basic Semiconductor Processes
• Thin and Thick Film Processes– Basic Device: Resistor
• BiMOS or BiCMOS– Combines both MOS & Bipolar Processes– Basic Devices: MOSFET & BJT
• SiGe– BJT with HBT implementation
• SiGe / MOS– Combines HBT & MOSFET technology
• SOI / SOS (Silicon on Insulator / Silicon on Sapphire)• Twin-Well & Twin Tub CMOS
– Very similar to basic CMOS but more optimal transistor char.
Other Processes
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Summary of Devices by Processes• Standard CMOS Process
– MOS Transistors• n-channel• p-channel
– Capacitors– Resistors– Diodes– BJT (in some processes)
• npn• pnp
– JFET (in some processes)• n-channel• p-channel
• Standard Bipolar Process– BJT
• npn• pnp
– JFET • n-channel• p-channel
– Diodes– Resistors– Capacitors
• Niche Devices– Photodetectors (photodiodes, phototransistors, photoresistors)– MESFET– HBT– Schottky Diode (not Shockley)
– MEM Devices– ….
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Basic Devices• Devices in Standard Processes
– MOS Transistors• n-channel• p-channel
– Capacitors– Resistors– Diodes– BJT (in some processes)
• npn• pnp
• Niche Devices– Photodetectors– MESFET– Schottky Diode (not Shockley)
– MEM Devices– ….
Primary Consideration in This Course
Limited Consideration in This Course
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Basic Devices and Device Models
• Resistor• Diode• Capacitor• MOSFET• BJT
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Basic Devices and Device Models
• Resistor• Diode • Capacitor• MOSFET• BJT
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Resistors• Generally thin-film devices• Almost any thin-film layer can be used as a resistor
– Diffused resistors– Poly Resistors– Metal Resistors– “Thin-film” adders (SiCr or NiCr)
• Subject to process variations, gradient effects and local randomvariations
• Often temperature and voltage dependent– Ambient temperature– Local Heating
• Nonlinearities often a cause of distortion when used in circuits• Trimming possible resistors
– Laser,links,switches
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Resistor Model
V
W d
L
I
IV
R =Model:
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Resistivity
• Volumetric measure of conduction capability of a material
LR
Areais A
L
AR=ρ
for homogeneousmaterial,ρ ⊥ A, R, Lunits : ohm cm
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Sheet Resistance
R
W d
L
L
RW R = ( for d << w, d << L ) units : ohms /
for homogeneous materials, R
is independent of W, L, R
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Relationship between ρ and R
d WA ×=L
AR=ρ
RW
A=ρL
RW R =
RxdRW
dW R
WA ===ρ
Number of squares, NS, often used instead of L / W in determining resistance of film resistors
R=RNS
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Example 1
W
R = ?
L
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Example 1
W
L
SNWL =
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Example 1
.4 8 7 6 5 4 3 2 1
R = ?
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Example 1
.4 8 7 6 5 4 3 2 1
R = R(8.4)
R = ?
NS=8.4
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Corners in Film Resistors
Rule of Thumb: .55 squares for each corner
Corner
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Example 2Determine R if R
= 100 Ω /
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Example 2
1 2 3 4 5 6 .55
1 2 3 4 5 6 7 .55
1
2
3
NS=17.1R = (17.1) R
R = 1710 Ω
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Resistivity of Materials used in Semiconductor Processing
• Cu: 1.7E-6 Ωcm• Al: 2.7E-4 Ωcm• Gold: 2.4E-6 Ωcm• Platinum: 3.0E-6 Ωcm• n-Si: .25 to 5 Ωcm• intrinsic Si: 2.5E5 Ωcm• SiO2: E14 Ωcm
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Temperature CoefficientsUsed for indicating temperature sensitivity of resistors & capacitors
Cppm dT
dR
R
1TCR
610
tempop.
°
=
This diff eqn can easily be solved if TCR is a constant
( ) ( ) TCR10
TT
12
612
TRTR−
= e
( ) ( ) ( )
−+≈61212 10
TCRTT1 TRTR
For a resistor:
Identical Expressions for Capacitors
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Voltage CoefficientsUsed for indicating voltage sensitivity of resistors & capacitors
Vppm dVdR
R1
VCR
610
voltage ref
=
This diff eqn can easily be solved if VCR is a constant
( ) ( ) VCRVV
12
12
VRVR 610
−
= e
( ) ( ) ( )
−+≈ 61212 10VCR
VV VRVR 1
For a resistor:
Identical Expressions for Capacitors
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Temperature and Voltage Coefficients
• Temperature and voltage coefficients often quite large for diffused resistors
• Temperature and voltage coefficients often quite small for poly and metal resistors