analog design in sub-100nm technologies

47
Analog Design in Sub-100nm Technologies Boris Murmann [email protected] June 29, 2006

Upload: others

Post on 04-Feb-2022

2 views

Category:

Documents


0 download

TRANSCRIPT

Analog Design in Sub-100nm Technologies

Boris [email protected] 29, 2006

2

History

?

Pederson/Wooley, ca. 1970

Wooley/Boser, ca. 1988

Boser/Murmann, ca. 2003

?

Pederson, ca. 1951

3

Outline

Impact of scaling on analog performance metrics

How to improve analog performance using digital gates

Digitally assisted A/D converters

4

Quotes[Vertregt, ESSCIRC 2004]

"Significant power efficiency improvements are predicted as a result of scaling to deep sub-micron technology nodes."

[Annema, IEEE J. Solid-State Circuits, 12/2005 ]"In summary: unlike digital designs, analog circuits can benefit from technology scaling if the supply voltages are not scaled down."

[Nauta, ESSCIRC 2005]"The evolution of CMOS technology will continue for many years to come, which is beneficial for digital circuits but which is not so for analog."

5

List of ConcernsReduced supply voltage

Low intrinsic gain

Variability

Distortion

Gate leakage

Isolation

Cost (mask & wafer)

Model accuracy

6

Technology Benchmarking

gs

mT C

g21fπ

=Transit frequency

Transconductorefficiency

Available signal swing

Intrinsic gain

D

mIg

ds

mgg

7

gm/ID and fT trends

gm/IDessentially unaffected by scaling

Very high fTin recent technologies

Enables RF CMOS

-0.4 -0.2 0 0.2 0.4 0.60

200

400

600

800

1000

1200(b)

VGS-Vt [V]

(gm

/I D)*

f T [GH

z*S

/A]

-0.2 -0.1 0 0.1 0.2 0.3 0.4 0.5 0.60

10

20

30

40(a)

g m/I D

[S/A

]

VGS-Vt [V]-0.2 -0.1 0 0.1 0.2 0.3 0.4 0.5 0.6

0

40

80

120

160

f T [GH

z]

180nm130nm90nm

180nm130nm90nm

8

Available Signal Swing

0

1

2

3

4

5

0.50um 0.35um 0.25um 0.18um 0.12um 90nm 65nm 45nm 32nm

Technology Node

V DD [V

]

> 4kT/q

> 4kT/q

VDD

qkT8V SwingAvailable DD −<

9

Noise Limited Circuit Performance

C/kTSwingDR

Cg

BWIVP2

mDDD ∝∝⋅∝

D

m2

DDDD I

gVSwingV

PDRBW

⋅⎟⎟⎠

⎞⎜⎜⎝

⎛⋅∝

Low VDD is generally bad news, butAnalog designers have worked hard to maintain or even improve Swing/VDD

Typical ADC in 0.5μm: Swing/VDD=2/5Typical ADC in 90nm: Swing/VDD=0.5/1

How about gm/ID?

10

Leveraging fT

ExamplefT = 50GHz, 130nm: gm/ID = 8S/A, 90nm: gm/ID = 16S/A

For "fixed-speed" applications, high fT can be leveraged to mitigate low VDD penalty

-0.2 -0.1 0 0.1 0.2 0.3 0.4 0.5 0.60

10

20

30

40g m

/I D [S

/A]

VGS-Vt [V]-0.2 -0.1 0 0.1 0.2 0.3 0.4 0.5 0.6

0

40

80

120

160

f T [GH

z]

180nm130nm90nm

11

Further ConsiderationsAnalog building blocks are never completely limited by thermal noise

Not uncommon to have ~50% dynamic powerDecreases with scaling

Designers are continuing to develop/refine low-voltage design techniques

Recent publications show very good analog building block performance at 1V

Bottom lineAnalog design is challenging at 1V, but it's neither impossible nor detrimental

12

Intrinsic GainA real issue

How to design a high-gain op-amp with devices that have intrinsic gain of ~10?

How much worse does this get at 45nm/65nm?

0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.60

50

100

150

200

250(a)

VDS [V]

I D [ μ

A]

0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.60

10

20

30

40

50(b)

VDS [V]

g m/g

ds

180nm130nm90nm

180nm130nm90nm

(VGS-Vt=100mV)

13

Intrinsic Gain in the Near Future

Pretty bad…

SolutionsUse non-minimum length device (NML-device)Use asymmetric device without drain-side pocket implant (A-device)Or, don't try to build op-amps in these technologies…

More later

0 0.2 0.4 0.6 0.8 10

5

10

15

VDS [V]

g m/g

ds45nm (TCAD)65nm (TCAD)90nm (BSIM4)(VGS-Vt=100mV)

14

Intrinsic Gain of Alternate Devices (45nm)

For both NML and A-device Lphysical=80nm (Lphysical=24nm for minimum length device)

Great, lots of gain!But how about fT?

(VGS-Vt=100mV)

0 0.2 0.4 0.6 0.8 10

50

100

150( )

VDS [V]

g m/g

dsMin. lengthNML-deviceA-device

(VGS-Vt=100mV)

15

gm/ID and fT for Alternate Devices (45nm)fT much lower than for minimum length 45-nm device

But still better than minimum length device in 90nm…

Who needs fT > 200GHz in an op-amp…?

-0.2 -0.1 0 0.1 0.2 0.3 0.4 0.50

1000

2000

3000

4000

5000(b)

VGS-Vt [V]

(gm

/I D)*

f T [GH

z*S

/A]

-0.2 -0.1 0 0.1 0.2 0.3 0.4 0.50

10

20

30

40(a)

VGS-Vt [V]

g m/I D

[S/A

]

-0.2 -0.1 0 0.1 0.2 0.3 0.4 0.50

200

400

600

800

f T [GH

z]

Minimum lengthNML-deviceA-device

Minimum lengthNML-deviceA-device

16

Variability (1)

[Courtesy A. Bowling, Texas Instruments]

17

Variability (2)

Device mismatch larger than process corner variations!For small "digital" transistors…

[Marcel Pelgrom, Philips]

18

Variability (3)Analog

A well known problemDesigners are used to "caring" about mismatch

Lots of options and potential solutions

Layout techniques, analog or digital calibration, dynamic element matching, larger device area, …

Usually care about matching for a few up to a few hundred transistors

Digital

A "new" problemSignificant impact on achievable performance, yield, design methodology, EDA, …

Big difference compared to analog

Care about millions if not billions of devices!

19

Outline

Impact of scaling on analog performance metrics

How to improve analog performance using digital gates

Digitally assisted A/D converters

20

"Mostly Digital" or "Digitally Assisted" Analog

Based on minimalistic analog circuits

Achieve precision/performance by means of added digital processing

ExamplesMostly digital PLLsPower amplifiers with digital pre-distortionDigital radio processor architecture (TI)Digitally corrected ADCs…

21

Motivation from Energy PerspectiveDoes "digital assistance" make sense?

Interesting metric to look atHow many digital gates can you toggle for the energy needed in one A/D conversion?

ExampleTwo-input NAND gate in 90nm CMOS consumes2.5 fJ/operation10-bit ADC consumes 0.25 nJ/conversionEnergy equivalent number of gates

0.25nJ/2.5fJ = 100,000

22

Impact of Technology Scaling

0

50000

100000

150000

200000

250000

300000

350000

0.00.10.20.30.40.50.60.70.8Feature Size L [μm]

Ener

gy E

quiv

alen

t Num

ber o

f Gat

es6 bits

8 bits

10bits12 bits

14 bits

16 bits

23

Leveraging Digital Assistance (1)

Power Dissipation

Speed

Matching LinearityNoise

PrecisionNon-Fundamental

24

Leveraging Digital Assistance (2)Can correct deterministic, repeatable error using digital processor

Important considerationsImpractical to correct for arbitrary errors

Must limit "sloppiness" through judicious analog design

Must be able to adjust correction functions over time

Errors will depend on operating conditions, circuit age, etc.

25

Example: Pipeline ADC

Bottleneck: Highly linear gain element

26

Open-Loop Gain Element

+ Lower noise

+ Increased signal range

+ Lower power

+ Faster

– NonlinearUse post-processor to linearize!

Open-Loop AmplifierConventional Precision Amplifier

27

Digital Nonlinearity Correction

Calibration of digital inverse is accomplished by adjusting parameters such that signal statistics at output are independent of Vmod

Algorithm continuously tracks variations in amplifier polynomial

28

Proof of Concept Prototype

Open-loop amplifier only in first, most critical stageAmplifier power savings ~4x

Judicious analog/digital co-designOnly two corretion parameters (linear and cubic amplifier error)

~8000 Gates

[Murmann, JSSC 12/2003]

29

Digital Linearity Correction

0 1000 2000 3000 4000-20

-10

0

10

20

Code

INL

[LS

B]

Post-Proc. OFFPost-Proc. ON

Code

30

Amplifier Waveforms

Typically settle to within small % error of final value

Most of IBIAS is shunted to ground through the amplifier for t>2τ

31

Exploiting Incomplete Settling

IdeaSettle for only 1.5τ to improve power efficiency (or speed)Use digital processing to correct for settling error (in addition to nonlinearity)

Volta

ge

0 2 4 6 8 10t/τ

Cur

ren t

IBIAS

SavingsIload

Vout

Incomplete Settling Conventional

32

00.5

11.5

22.5

33.5

44.5

0.1 1 2 3 4 5 6 7 8 9 10t/τ

Nor

mal

ized

1 Pow

er E

ffici

ency

0

Power Efficiency versus Settling

Assumptions:• kT/C noise limited• Constant

conversion rate

Optimal settling is around 1τ-1.5τ

1Normalized to power at 10τ settling.

33

Proof of Concept Circuit

Judicious analog design ensures that incomplete settling error is linear (or only weakly nonlinear)

Very easy to correct!

Vin1p

Vrefp

16

φ1

Col

16

Vcm

φ1e

Vcm

φconnect

open-loopamp

Vcm

φshort

φ2

Vcm

φ2e

*

* *

* = additional switches for glitch suppression

Vres1pVxpC2p

Stage 1 Stage 2 φ1e, φ1

φ2e, φ2

Dn

Vrefn

Dn

16

Dp

Dp

φshort

φconnectΔt

Vres1(Vres1p-Vres1n)

tsample

w/ additionalswitches

w/o additionalswitches

C1p[15:0]

Col Vres1n

[Iroaga & Murmann, VLSI 2006]

34

Pipeline Stage Power Breakdown

0

10

20

30

40

50

Pow

er [m

W]

AD9235 Open-Loop Open-Loop &Incomplete

Settling

FlashBiasingGmPost-Proc.

4x 16x

(0.35μm)

35

Calibration Problem RevisitedThe "sloppier" we make the analog portion of the ADC, the more parameters we need to estimate and track

Can become quite complex or even impossible without disturbing normal ADC operation

Idea: "System Embedded" postprocessing and calibration of ADC

Leverage redundancy and knowledge of certain input signal properties to estimate ADC errorsRe-use existing system resources for ADC calibration

36

Embedded ADC Calibration for OFDM

Communications protocol uses "pilot tones" to measure and equalize RF channel nonidealities

Why not use these pilots to "equalize" ADC?Errors in pilot signals can be used to estimate correction parameters for sloppy ADC

Example: Offset correction in time interleaved ADC

[Oh and Murmann, to appear, IEEE TCAS1]

37

Offset correction in Time Interleaved ADC

Offset corrections are adjusted sequentially to minimize errors seen in pilot tones

Coordinate descend algorithm

38

Typical Learning Curve

Steady state ripple due to communication channel noiseTradeoff: Ripple versus convergence rate

ENOB ≅ 5.8bits in AWGN channel with SNR = 20dB

~100ms

39

Comparator Circuit

Fully differential architecture

Low gain/low power pre-amp, primarily for common mode rejection

Dynamic latch with positive feedback for fast comparison

40

Pre-amp with Offset Adjustment

Offset DACCurrent modeOffset correction range ±8 LSB

Pre-amp Low gain (~2)CMRR > 20

41

Dynamic Latch

Calibration allows use of near minimum width devices for low power

42

Layout

Core area: 640μm x 550μm (0.18μm CMOS)

(a) ADC Core (b) full chip

43

Estimated Power (Post-Layout)500MS/s, 6-bit ADC

Power (mW)

Digital 9.0

Analog 3.6

Clock 3.6

Calibration(estimated) 0.4

Total 16.6

44

An Interesting Hike Lies Ahead…

Bag of Tricks

A

D

45

Cost – The "Real" End of The Roadmap?

Reference point: 30 mm2 die in 0.12μm CMOS

[Marcel Pelgrom, Philips][Marcel Pelgrom, Philips]

46

ConclusionsAnalog design in modern IC technologies is and always will be challenging

This is what keeps our job interesting…

New technologies means new solutionsMust continue to develop low voltage design techniquesMust continue to leverage digital capabilities for analog performance enhancements

Based on current roadmap, there is no fundamental reason why analog couldn't be implemented in "digital" technologies of the near future

Interesting questionsWill high performance digital circuits survive scaling?Can the IC industry continue to benefit from scaling despite thelarge anticipated wafer & mask costs?

47

Acknowledgements

Graduate StudentsYangjin Oh, Echere Iroaga, Jason Hu, Justin Kim, Pedram Lajevardi, Wei Xiong, Clay DaigleParastoo Nikaeen (Co-advising with Prof. Dutton)

Sponsors