digital light processing (dip)

SRI SHANMUGHACOLLEGE OF ENGINEERING & TECHNOLOGY

SANKARI,SALEM(D.T)

PRESENTED BY,

D.KIRUBASANKAR S.MOHAN

Contents:

IntroductionBasic components in DLPWorking of DLPAdvantagesApplications

IntroductionDLP-Digital Light Processing

Invented by DR.LARRY HORNBECK in 1987

Made by semiconductor material

It consist of One or Three chips methods

It is used in video projector

Basic components of DLPDMD chip (Digital Micromirror Device)

Light source

They are two methods

One chip system Three chip system

One chip systemPasses the light to chip(color wheel)

Three chip systemLight passes through prism

DMD chipIt is a semiconductor material

It is core components,miscroscopic mirror

Matrix of micro mirrors 1024 X 768mm

Size of the mirrors: 16 X 16 um

Light sourceHigh power LEDs or LASER source is used

It contain high pressure xenon arc lampLED based Ordinary LEDs doesn’t produce intensityLASER based• The first commercially LASER based DLP was

introduced in 2008

Working of DLP3-D printing process

Photopolymer resin.

Compare to stereo lithography DLP have much speed

Withstand the tensions and mechanical movement

High intensity LED’s are used

contd..Depending on the application DLP system

accept either digital or analogue signal.

AdvantagesLess maintenance than LCD

Low power consumption

All digital display from DLP chip

It is more reliable

DisadvantagesSome device contain noise

Viewer may have eye strain, headache and migraines.

ApplicationsDLP projectors

Holographic Data Storage

Printed Circuit Board (PCB) Manufacturing

Print Setting

Telephone lines

Future uses of DLPHigh definition image creation

3D visual display