1gb parallel nor flash - micross components ecommerce system · 8 read and auto select ... internal...
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MYX28F00AM29EWHRevision 1.0 - 11/14/2014
*Advanced information. Subject to change without notice.
1
1Gb Parallel NOR FlashMYX28F00AM29EWH*
Form #: CSI-D-685 Document 003
1Gb - 64M x 16 Parallel NOR Flash Embedded Memory
Features
• TinLeadBallmetallurgySn63Pb37
• Supplyvoltage
� VCC=2.7–3.6V(program,erase,read)
� VCCQ=1.65–VCC(I/Obuffers)
• Asynchronousrandom/pageread
� Pagesize:16wordsor32bytes
� Pageaccess:25ns
� Randomaccess:100ns(FortifiedBGA)
• Bufferprogram:512-wordprogrambuffer
• Programtime
� 0.88μsperbyte(1.14MB/s)TYPwhenusingfull512-wordbuffersizeinbufferprogram
• Memoryorganization
� Uniformblocks:128-Kbytesor64-Kwordseach
• Program/erasecontroller
� Embeddedbyte(x8)/word(x16)programalgorithms
• Program/erasesuspendandresumecapability
� ReadfromanotherblockduringaPROGRAMSUSPENDoperation
� ReadorprogramanotherblockduringanERASESUSPENDoperation
• BLANKCHECKoperationtoverifyanerasedblock
• Unlockbypass,blockerase,chiperase,andwritetobuffercapability
� Fastbuffered/batchprogramming
� Fastblock/chiperase
• VPP/WP#pinprotection
• Protectsfirstorlastblockregardlessofblockprotectionsettings
Options Marking
• Configuration
� 64Megx16 00A
• FBGApackage(Sn63/Pb37) BG
� 64-ballFBGA(13mmx11mm) PC
• Operatingtemperature
� Industrial(–40°C≤TC≤+85°C) IT
• Softwareprotection
� Volatileprotection
� Nonvolatileprotection
� Passwordprotection
� Passwordaccess
• Extendedmemoryblock
� 128-word(256-byte)blockforpermanent,secureidentification
� Programmedorlockedatthefactoryorbythecustomer
• Lowpowerconsumption:Standbymode
• JESD47-compliant
� 100,000minimumERASEcyclesperblock
� Dataretention:20years(TYP)
• 65nmmultilevelcell(MLC)processtechnology
• Greenpackage(Halogen-free)
MYX28F00AM29EWHRevision 1.0 - 11/14/2014
*Advanced information. Subject to change without notice.
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1Gb Parallel NOR FlashMYX28F00AM29EWH*
Form #: CSI-D-685 Document 003
Contents
1 General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
2 Signal Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
3 Signal Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
4 Memory Organization . . . . . . . . . . . . . . . . . . . . . . . . . . .64.1 MemoryConfiguration . . . . . . . . . . . . . . . . . . . . . . . . . 6
5 Bus Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .75.1 Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
5.2 Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
5.3 Standby . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
5.4 OutputDisable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
5.5 Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
6 Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .96.1 DataPollingRegister . . . . . . . . . . . . . . . . . . . . . . . . . . 9
6.2 LockRegister . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
7 StandardCommandDefinitions Address-Data Cycles . . . . . . . . . . . . . . . . . . . . . . . . . .12
8 READ and AUTO SELECT Operations . . . . . . . . . . . . . . .148.1 READ/RESETCommand . . . . . . . . . . . . . . . . . . . . . . . 14
8.2 READCFICommand . . . . . . . . . . . . . . . . . . . . . . . . . 14
8.3 AUTOSELECTCommand . . . . . . . . . . . . . . . . . . . . . . 15
9 Bypass Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . .159.1 UNLOCKBYPASSCommand . . . . . . . . . . . . . . . . . . . . 15
9.2 UNLOCKBYPASSRESETCommand . . . . . . . . . . . . . . 16
10 Program Operations . . . . . . . . . . . . . . . . . . . . . . . . . . .1610.1 PROGRAMCommand . . . . . . . . . . . . . . . . . . . . . . . . . 16
10.2 UNLOCKBYPASSPROGRAMCommand . . . . . . . . . . . 16
10.3 WRITETOBUFFERPROGRAMCommand . . . . . . . . . . 16
10.4 UNLOCKBYPASSWRITETOBUFFERPROGRAM Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
10.5 WRITETOBUFFERPROGRAMCONFIRMCommand . . . 17
10.6 BUFFEREDPROGRAMABORTANDRESETCommand . . 17
10.7 PROGRAMSUSPENDCommand . . . . . . . . . . . . . . . . . 17
10.8 PROGRAMRESUMECommand . . . . . . . . . . . . . . . . . . 18
11 Erase Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1811.1 CHIPERASECommand . . . . . . . . . . . . . . . . . . . . . . . 18
11.2 UNLOCKBYPASSCHIPERASECommand . . . . . . . . . . 18
11.3 BLOCKERASECommand . . . . . . . . . . . . . . . . . . . . . . 18
11.4 UNLOCKBYPASSBLOCKERASECommand . . . . . . . . . 18
11.5 ERASESUSPENDCommand . . . . . . . . . . . . . . . . . . . . 19
11.6 ERASERESUMECommand . . . . . . . . . . . . . . . . . . . . . 19
12 BLANK CHECK Operation . . . . . . . . . . . . . . . . . . . . . . . .1912.1 BLANKCHECKCommands . . . . . . . . . . . . . . . . . . . . . 19
13 BlockProtectionCommandDefinitions Address-Data Cycles . . . . . . . . . . . . . . . . . . . . . . . . . .20
14 Protection Operations . . . . . . . . . . . . . . . . . . . . . . . . . .2214.1 LOCKREGISTERCommands . . . . . . . . . . . . . . . . . . . . 23
14.2 PASSWORDPROTECTIONCommands . . . . . . . . . . . . . 23
14.3 NONVOLATILEPROTECTIONCommands . . . . . . . . . . . 23
14.4 NONVOLATILEPROTECTIONBITLOCKBITCommands . 24
14.5 VOLATILEPROTECTIONCommands . . . . . . . . . . . . . . 24
14.6 EXTENDEDMEMORYBLOCKCommands . . . . . . . . . . . 24
14.7 EXITPROTECTIONCommand . . . . . . . . . . . . . . . . . . . 24
15 Device Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2515.1 HardwareProtection . . . . . . . . . . . . . . . . . . . . . . . . . 25
15.2 SoftwareProtection . . . . . . . . . . . . . . . . . . . . . . . . . . 25
15.3 VolatileProtectionMode . . . . . . . . . . . . . . . . . . . . . . . 26
15.4 NonvolatileProtectionMode . . . . . . . . . . . . . . . . . . . . 26
15.5 PasswordProtectionMode . . . . . . . . . . . . . . . . . . . . . 27
15.6 PasswordAccess . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
16 Common Flash Interface . . . . . . . . . . . . . . . . . . . . . . . .27
17 Power-Up and Reset Characteristics . . . . . . . . . . . . . .28
18 Absolute Ratings and Operating Conditions . . . . . . . .30
19 DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . .32
20 Read AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . .34
21 Write AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . .37
22 Accelerated Program, Data Polling/Toggle AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . .45
23 Program/Erase Characteristics . . . . . . . . . . . . . . . . . .48
24 Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . .49
25 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . .50
MYX28F00AM29EWHRevision 1.0 - 11/14/2014
*Advanced information. Subject to change without notice.
3
1Gb Parallel NOR FlashMYX28F00AM29EWH*
Form #: CSI-D-685 Document 003
1 General Description
The device is an asynchronous, uniform block, parallel NOR Flash memory device. READ, ERASE, andPROGRAMoperationsareperformedusingasinglelow-voltagesupply.Uponpower-up,thedevicedefaultstoreadarraymode.
Themainmemoryarray isdivided intouniformblocks thatcanbeerased independentlyso thatvaliddatacanbepreservedwhileolddataispurged.PROGRAMandERASEcommandsarewrittentothecommandinterfaceofthememory.Anon-chipprogram/erasecontrollersimplifiestheprocessofprogrammingorerasingthememorybytakingcareofallspecialoperationsrequiredtoupdatethememorycontents.TheendofaPROGRAMorERASEoperationcanbedetectedandanyerrorconditioncanbeidentified.ThecommandsetrequiredtocontrolthedeviceisconsistentwithJEDECstandards.
CE#, OE#, and WE# control the bus operation of the device and enable a simple connection to mostmicroprocessors,oftenwithoutadditionallogic.
Thedevicesupportsasynchronousrandomreadandpagereadfromallblocksofthearray.Italsofeaturesaninternalprogrambufferthatimprovesthroughputbyprogramming512wordsviaonecommandsequence.A128-wordextendedmemoryblockoverlapsaddresseswitharrayblock0.Userscanprogramthisadditionalspace and thenprotect it to permanently secure the contents. Thedevice also features different levels ofhardwareandsoftwareprotectiontosecureblocksfromunwantedmodification.
Figure 1: Logic Diagram
General DescriptionThe device is an asynchronous, uniform block, parallel NOR Flash memory device.READ, ERASE, and PROGRAM operations are performed using a single low-voltage sup-ply. Upon power-up, the device defaults to read array mode.
The main memory array is divided into uniform blocks that can be erased independent-ly so that valid data can be preserved while old data is purged. PROGRAM and ERASEcommands are written to the command interface of the memory. An on-chip program/erase controller simplifies the process of programming or erasing the memory by takingcare of all special operations required to update the memory contents. The end of aPROGRAM or ERASE operation can be detected and any error condition can be identi-fied. The command set required to control the device is consistent with JEDEC stand-ards.
CE#, OE#, and WE# control the bus operation of the device and enable a simple con-nection to most microprocessors, often without additional logic.
The device supports asynchronous random read and page read from all blocks of thearray. It also features an internal program buffer that improves throughput by program-ming 512 words via one command sequence. A 128-word extended memory block over-laps addresses with array block 0. Users can program this additional space and thenprotect it to permanently secure the contents. The device also features different levels ofhardware and software protection to secure blocks from unwanted modification.
Refer to TN-13-30, System Design Considerations with Micron Flash Memory, for de-tails on system design and VCC and VCCQ signals.
Figure 1: Logic Diagram
VCC VCCQ
A[MAX:0]
WE#
VPP/WP#
DQ[14:0]
DQ15/A-1
VSS
15
CE#
OE#
RST#
BYTE#
RY/BY#
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR FlashGeneral Description
PDF: 09005aef849b4b09m29ew_256mb_2gb.pdf - Rev. C 9/14 EN 8 Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2012 Micron Technology, Inc. All rights reserved.
MYX28F00AM29EWHRevision 1.0 - 11/14/2014
*Advanced information. Subject to change without notice.
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1Gb Parallel NOR FlashMYX28F00AM29EWH*
Form #: CSI-D-685 Document 003
2 Signal Assignments
Figure 2: 64-Ball Fortified BGAFigure 5: 64-Ball Fortified BGA
A
B
C
D
E
F
G
H
1
RFU
A26
RFU
RFU
RFU
VCCQ
RFU
RFU
2
A3
A4
A2
A1
A0
CE#
OE#
VSS
3
A7
A17
A6
A5
D0
D8
D9
D1
4
RY/BY#
VPP/WP#
A18
A20
D2
D10
D11
D3
5
WE#
RST#
A21
A19
D5
D12
VCC
D4
6
A9
A8
A10
A11
D7
D14
D13
D6
7
A13
A12
A14
A15
A16
BYTE#
D15/A-1
VSS
8
RFU
A22
A23
VCCQ
VSS
A24
A25
RFU
Top view – ball side down
Notes: 1. A-1 is the least significant address bit in x8 mode.2. A23 is valid for 256Mb and above; otherwise, it is RFU.3. A24 is valid for 512Mb and above; otherwise, it is RFU.4. A25 is valid for 1Gb and above; otherwise, it is RFU.5. A26 is valid for 2Gb only; otherwise it is RFU.
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR FlashSignal Assignments
PDF: 09005aef849b4b09m29ew_256mb_2gb.pdf - Rev. C 9/14 EN 11 Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2012 Micron Technology, Inc. All rights reserved.
Notes:
1. A-1istheleastsignificantaddressbitinx8mode.
2. A25isvalidfor1Gbandabove;otherwise,itisRFU.
3. A26isvalidfor2Gbonly;otherwiseitisRFU.
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1Gb Parallel NOR FlashMYX28F00AM29EWH*
Form #: CSI-D-685 Document 003
3 Signal Descriptions
Thesignaldescriptiontablebelowisacomprehensivelistofsignalsforthisdevicefamily.Allsignalslistedmaynotbesupportedonthisdevice.SeeSignalAssignmentsforinformationspecifictothisdevice.
Table 1: Signal Descriptions
Name Type Description
A[MAX:0] InputAddress:SelectsthecellsinthearraytoaccessduringREADoperations.DuringWRITEoperations,theycontrolthecommandssenttothecommandinterfaceoftheprogram/erasecontroller.
CE# InputChip enable:Activatesthedevice,enablingREADandWRITEoperationstobeperformed.WhenCE#isHIGH,thedevicegoestostandbyanddataoutputsareHigh-Z.
OE# Input Output enable:ActiveLOWinput.OE#LOWenablesthedataoutputbuffersduringREADcycles.WhenOE#isHIGH,dataoutputsareHigh-Z.
WE# Input Write enable:ControlsWRITEoperationstothedevice.AddressislatchedonthefallingedgeofWE#anddataislatchedontherisingedge.
VPP/WP# InputVPP/Write Protect:ProvidesWRITEPROTECTfunctionandVPPHfunction.Thesefunctionsprotectthelowestorhighestblockandenablethedevicetoenterunlockbypassmode,respectively.(RefertoHardwareProtectionandBypassOperationsfordetails.)
BYTE# InputByte/word organization select:Switchesbetweenx8andx16busmodes.WhenBYTE#isLOW,thedeviceisinx8mode;whenHIGH,thedeviceisinx16mode.Underbyteconfiguration,BYTE#shouldnotbetoggledduringanyWRITEoperation.Caution:Thispincannotbefloated.
RST# InputReset:Appliesahardwareresettothedevicecontrollogicandplacesitinstandby,whichisachievedbyholdingRST#LOWforatleasttPLPH.AfterRST#goesHIGH,thedeviceisreadyforREADandWRITEoperations(aftertPHELortPHWL,whicheveroccurslast).
DQ[7:0] I/OData I/O:OutputsthedatastoredattheselectedaddressduringaREADoperation.DuringWRITEoperations,theyrepresentthecommandssenttothecommandinterfaceoftheinternalstatemachine.
DQ[14:8] I/OData I/O:OutputsthedatastoredattheselectedaddressduringaREADoperationwhenBYTE#isHIGH.WhenBYTE#isLOW,thesepinsarenotusedandareHigh-Z.DuringWRITEoperations,thesebitsarenotused.Whenreadingthedatapollingregister,thesebitsshouldbeignored.
DQ15/A-1 I/OData I/O or address input:Whenthedeviceoperatesinx16busmode,thispinbehavesasdataI/O,togetherwithDQ[14:8].Whenthedeviceoperatesinx8busmode,thispinbehavesastheleastsignificantbitoftheaddress.Exceptwherestatedexplicitlyotherwise,DQ15=dataI/O(x16mode);A-1=addressinput(x8mode).
RY/BY# Output
Ready busy:Open-drainoutputthatcanbeusedtoidentifywhenthedeviceisperformingaPROGRAMorERASEoperation.DuringPROGRAMorERASEoperations,RY/BY#isLOW,andisHigh-Zduringreadmode,autoselectmode,anderasesuspendmode.Theuseofanopen-drainoutputenablestheRY/BY#pinsfromseveraldevicestobeconnectedtoasinglepull-upresistortoVCCQ.Alowvaluewillthenindicatethatone(ormore)ofthedevicesis(are)busy.A10KOhmorbiggerresistorisrecommendedaspull-upresistortoachieve0.1VVOL.
VCC Supply
Supply voltage:ProvidesthepowersupplyforREAD,PROGRAM,andERASEoperations.ThedeviceisdisabledwhenVCC ≤ VLKO.Iftheprogram/erasecontrollerisprogrammingorerasingduringthistime,thentheoperationabortsandthecontentsbeingalteredwillbeinvalid. A0.1μFand0.01μFcapacitorshouldbeconnectedbetweenVCCandVSStodecouplethecurrentsurgesfromthepowersupply.ThePCBtrackwidthsmustbesufficienttocarrythecurrentsrequiredduringPROGRAMandERASEoperations(seeDCCharacteristics).
VCCQ SupplyI/O supply voltage:ProvidesthepowersupplytotheI/OpinsandenablesalloutputstobepoweredindependentlyfromVCC.A0.1μFand0.01μFcapacitorshouldbeconnectedbetweenVCCQandVSStodecouplethecurrentsurgesfromthepowersupply.
VSS Supply Ground:AllVSSpinsmustbeconnectedtothesystemground.
RFU —Reserved for future use:ReservedbyMicrossforfuturedevicefunctionalityandenhancement.TheseshouldbetreatedinthesamewayasaDNUsignal.
DNU — Do not use:Donotconnecttoanyothersignal,orpowersupply;mustbeleftfloating.
NC — No connect:Nointernalconnection;canbedrivenorfloated.
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1Gb Parallel NOR FlashMYX28F00AM29EWH*
Form #: CSI-D-685 Document 003
4 Memory Organization
4 .1 MemoryConfiguration
Themainmemoryarrayisdividedinto128KBor64KWuniformblocks.
Table 2: Blocks [1023:0]
Block Block SizeAddress Range (x8)
Block SizeAddress Range (x16)
Start End Start End
1023 128KB 7FE0000h 7FFFFFFh 64KW 3FF0000h 7FFFFFFh
⋮ ⋮ ⋮ ⋮ ⋮
511 3FE0000h 3FFFFFFh 1FF0000h 1FFFFFFh
⋮ ⋮ ⋮ ⋮ ⋮
255 1FE0000h 1FFFFFFh 0FF0000h 0FFFFFFh
⋮ ⋮ ⋮ ⋮ ⋮
127 0FE0000h 0FFFFFFh 07F0000h 07FFFFFh
⋮ ⋮ ⋮ ⋮ ⋮
63 07E0000h 07FFFFFh 03F0000h 03FFFFFh
⋮ ⋮ ⋮ ⋮ ⋮
8 0000000h 001FFFFh 0000000h 000FFFFh
Note:
1. 1Gbdevice=Blocks0–1023
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1Gb Parallel NOR FlashMYX28F00AM29EWH*
Form #: CSI-D-685 Document 003
5 Bus Operations
Table 3: Bus Operations
Notes1and2applytoentiretable.
Operation CE# OE# WE# RST#VPP/WP#
8-Bit Mode 16-Bit Mode
A[MAX:0],DQ15/A-1
DQ[14:8] DQ[7:0] A[MAX:0]DQ15/A-1,DQ[14:0]
READ L L H H X Celladdress High-Z Dataoutput Celladdress Dataoutput
WRITE L H L H H3 Commandaddress
High-Z Datainput4Commandaddress
Datainput4
STANDBY H X X H X X High-Z High-Z X High-Z
OUTPUTDISABLE
L H H H X X High-Z High-Z X High-Z
RESET X X X L X X High-Z High-Z X High-Z
Notes:
1. Typicalglitchesoflessthan3nsonCE#,OE#,WE#,andRST#areignoredbythedeviceanddonotaffectbusoperations.
2. H=LogiclevelHIGH(VIH);L=LogiclevelLOW(VIL);X=HIGHorLOW.
3. IfWP#isLOW,thenthehighestorthelowestblockremainsprotected,dependingonlineitem.
4. Datainputisrequiredwhenissuingacommandsequenceorwhenperformingdatapollingorblockprotection.
5 .1 Read
BusREADoperationsreadfromthememorycells,registers,orCFIspace.ToacceleratetheREADoperation,thememoryarraycanbereadinpagemodewheredataisinternallyreadandstoredinapagebuffer.
Pagesizeis16words(32bytes)andisaddressedbyaddressinputsA[3:0]inx16busmodeandA[3:0]plusDQ15/A-1inx8busmode.TheextendedmemoryblocksandCFIareadonotsupportpagereadmode.
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1Gb Parallel NOR FlashMYX28F00AM29EWH*
Form #: CSI-D-685 Document 003
AvalidbusREADoperationinvolvessettingthedesiredaddressontheaddressinputs,takingCE#andOE#LOW,andholdingWE#HIGH.ThedataI/Oswilloutputthevalue.IfCE#goesHIGHandreturnsLOWforasubsequentaccess,arandomreadaccessisperformandtACCortCEisrequired.(SeeACCharacteristicsfordetailsaboutwhentheoutputbecomesvalid.)
5 .2 Write
BusWRITEoperationswritetothecommandinterface.AvalidbusWRITEoperationbeginsbysettingthedesiredaddressontheaddressinputs.TheaddressinputsarelatchedbythecommandinterfaceonthefallingedgeofCE#orWE#,whicheveroccurslast.ThedataI/OsarelatchedbythecommandinterfaceontherisingedgeofCE#orWE#,whicheveroccursfirst.OE#mustremainHIGHduringtheentirebusWRITEoperation(SeeACCharacteristicsfortimingrequirementdetails).
5 .3 Standby
DrivingCE#HIGH in readmodecauses thedevice toenterstandbyanddata I/Os tobeHigh-Z (SeeDCCharacteristics).
DuringPROGRAMorERASEoperations, thedevicewillcontinue touse theprogram/erasesupplycurrent(ICC3)untiltheoperationcompletes.WhenCE#isHIGH,thedevicecannotbeplacedintostandbymodeduringaPROGRAM/ERASEoperation.
5 .4 Output Disable
DataI/OsareHigh-ZwhenOE#isHIGH.
5 .5 Reset
DuringresetmodethedeviceisdeselectedandtheoutputsareHigh-Z.Thedeviceis inresetmodewhenRST#isLOW.Thepowerconsumptionisreducedtothestandbylevel,independentlyfromCE#,OE#,orWE#inputs.
WhenRST#isHIGH,atimeoftPHELisrequiredbeforeaREADoperationcanaccessthedevice,andadelayoftPHWLisrequiredbeforeawritesequencecanbeinitiated.
Afterthiswake-upinterval,normaloperationisrestored,thedevicedefaultstoreadarraymode,andthedatapollingregisterisreset.
IfRST#isdrivenLOWduringaPROGRAM/ERASEoperationoranyotheroperationthatrequireswritingtothedevice,theoperationwillabortwithintPLRH,andmemorycontentsattheabortedblockoraddressarenolongervalid.
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1Gb Parallel NOR FlashMYX28F00AM29EWH*
Form #: CSI-D-685 Document 003
6 Registers
6 .1 Data Polling Register
Table 4: Data Polling Register Bit Definitions
Note1appliestoentiretable.
Bit Name Settings Description Notes
DQ7Datapolling
bit
0or1,depending
onoperations
Monitorswhethertheprogram/erasecontrollerhassuccessfullycompleteditsoperation,orhasrespondedtoanERASESUSPENDoperation.
2,4
DQ6 TogglebitToggles:0to1;1to0;and
soon
Monitorswhethertheprogram,erase,orblankcheckcontrollerhassuccessfullycompleteditsoperations,orhasrespondedtoanERASESUSPENDoperation.DuringaPROGRAM/ERASE/BLANKCHECKoperation,DQ6togglesfrom0to1,1to0,andsoon,witheachsuccessiveREADoperationfromanyaddress.
3,4,5
DQ5 Errorbit0=Success 1=Failure
Identifieserrorsdetectedbytheprogram/erasecontroller.DQ5issetto1whenaPROGRAM,BLOCKERASE,orCHIPERASEoperationfailstowritethecorrectdatatothememory,orwhenaBLANKCHECKoperationfails.
4,6
DQ3Erasetimer
bit
0=Erasenotinprogress 1=Eraseinprogress
Identifiesthestartofprogram/erasecontrolleroperationduringaBLOCKERASEcommand.Beforetheprogram/erasecontrollerstarts,thisbitsetto0,andadditionalblockstobeerasedcanbewrittentothecommandinterface.
4
DQ2Alternativetogglebit
Toggles:0to1;1to0;and
soon
DuringCHIPERASE,BLOCKERASE,andERASESUSPENDoperations,DQ2togglesfrom0to1,1to0,andsoon,witheachsuccessiveREADoperationfromaddresseswithintheblocksbeingerased.
3,4
DQ1Bufferedprogramabortbit
1=AbortIndicatesaBUFFERPROGRAMoperationabort.TheBUFFEREDPROGRAMABORTandRESETcommandmustbeissuedtoreturnthedevicetoreadmode(seeWRITETOBUFFERPROGRAMcommand).
Notes:
1. ThedatapollingregistercanbereadduringPROGRAM,ERASE,orERASESUSPENDoperations;theREADoperationoutputsdataonDQ[7:0].
2. ForaPROGRAMoperationinprogress,DQ7outputsthecomplementofthebitbeingprogrammed.ForaBUFFERPROGRAMoperation,DQ7outputsthecomplementofthebitforthelastwordbeingprogrammedinthewritebuffer.ForaREADoperationfromtheaddresspreviouslyprogrammedsuccessfully,DQ7outputsexistingDQ7data.ForaREADoperationfromaddresseswithblockstobeerasedwhileanERASESUSPENDoperationisinprogress,DQ7outputs0;uponsuccessfulcompletion
MYX28F00AM29EWHRevision 1.0 - 11/14/2014
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1Gb Parallel NOR FlashMYX28F00AM29EWH*
Form #: CSI-D-685 Document 003
oftheERASESUSPENDoperation,DQ7outputs1.ForanERASEoperationinprogress,DQ7outputs0;uponERASEoperation’ssuccessfulcompletion,DQ7outputs1.
3. AftersuccessfulcompletionofaPROGRAM,ERASE,orBLANKCHECKoperation,thedevicereturnstoreadmode.
4. Duringerasesuspendmode,READoperationstoaddresseswithinblocksnotbeingerasedoutputmemoryarraydataasifinreadmode.Aprotectedblockistreatedthesameasablocknotbeingerased.SeetheToggleFlowchartformoreinformation.
5. Duringerasesuspendmode,DQ6toggleswhenaddressingacellwithinablockbeingerased.Thetogglingstopswhentheprogram/erasecontrollerhassuspendedtheERASEoperation.SeetheToggleFlowchartformoreinformation.
6. WhenDQ5issetto1,aREAD/RESET(F0h)commandmustbeissuedbeforeanysubsequentcommand.
Table 5: Operations and Corresponding Bit Settings
Note1appliestoentiretable.
Operation Address DQ7 DQ6 DQ5 DQ3 DQ2 DQ1 RY/BY# Notes
PROGRAM Anyaddress DQ7# Toggle 0 – – 0 0 2
BLANK CHECK Anyaddress 1 Toggle 0 – – 0 0
CHIPERASE Anyaddress 0 Toggle 0 1 Toggle – 0
BLOCK ERASE beforetime-out
Erasingblock 0 Toggle 0 0 Toggle – 0
Non-erasingblock 0 Toggle 0 0 Notoggle – 0
BLOCK ERASEErasingblock 0 Toggle 0 1 Toggle – 0
Non-erasingblock 0 Toggle 0 1 Notoggle – 0
PROGRAMSUSPENDProgrammingblock Invalidoperation High-Z
Nonprogrammingblock Outputsmemoryarraydataasifinreadmode High-Z
ERASESUSPENDErasingblock 1 NoToggle 0 – Toggle – High-Z
Non-erasingblock Outputsmemoryarraydataasifinreadmode High-Z
PROGRAMduringERASESUSPEND
Erasingblock DQ7# Toggle 0 – Toggle – 0 2
Non-erasingblock DQ7# Toggle 0 – NoToggle – 0 2
BUFFEREDPROGRAMABORT Anyaddress DQ7# Toggle 0 – – 1 High-Z
PROGRAMError Anyaddress DQ7# Toggle 1 – – – High-Z 2
ERASE Error Anyaddress 0 Toggle 1 1 Toggle – High-Z
BLANK CHECK Error Anyaddress 0 Toggle 1 1 Toggle – High-Z
Notes:
1. Unspecifieddatabitsshouldbeignored.
2. DQ7#forbufferprogramisrelatedtothelastaddresslocationloaded.
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6 .2 Lock Register
Table 6: Lock Register Bit Definitions
Note1appliestoentiretable.
Bit Name Settings Description Notes
DQ2
Passwordprotectionmodelock
bit
0=Passwordprotectionmodeenabled;1=Passwordprotectionmodedisabled
(Default)
Placesthedevicepermanentlyin passwordprotectionmode.
2
DQ1
Nonvolatileprotectionmodelock
bit
0=Nonvolatileprotectionmodeenabledwithpasswordprotectionmodepermanentlydisabled;1=Nonvolatileprotectionmode
enabled(Default)
Placesthedeviceinnonvolatileprotectionmodewithpasswordprotectionmodepermanentlydisabled.When
shippedfromthefactory,thedevicewilloperateinnonvolatileprotectionmode,andthememoryblocksareunprotected.
2
DQ0
Extendedmemory block
protectionbit
0=Protected 1=Unprotected(Default)
Ifthedeviceisshippedwiththeextendedmemoryblockunlocked,theblockcanbeprotectedbysettingthisbitto0.TheextendedmemoryblockprotectionstatuscanbereadinautoselectmodebyissuinganAUTOSELECTcommand.
Notes:
1. Thelockregisterisa16-bit,one-timeprogrammableregister.DQ[15:3]arereservedandaresettoadefaultvalueof1.
2. Thepasswordprotectionmodelockbitandnonvolatileprotectionmodelockbitcannotbothbeprogrammedto0.Anyattempttoprogramonewhiletheotherisprogrammedcausestheoperationtoabort,andthedevicereturnstoreadmode.Thedeviceisshippedfromthefactorywiththedefaultsetting.
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7 Standard Command Definitions – Address-Data Cycles
Table 7: Standard Command Definitions – Address-Data Cycles, 8-Bit and 16-Bit
Note1appliestoentiretable.
Command and Code/Subcode
Bus Size
Address and Data Cycles
Notes1st 2nd 3rd 4th 5th 6th
A D A D A D A D A D A D
READ and AUTO SELECT Operations
READ/RESET(F0h)
x8X F0 2
AAA AA 555 55 X F0
x16X F0
555 AA 2AA 55 X F0
READCFI(98h)x8 AAA
98x16 555
AUTOSELECT(90h)x8 AAA
AA555
55AAA
90 Note3 Note34,5
x16 555 2AA 555
BYPASS Operations
UNLOCKBYPASS(20h)x8 AAA
AA555
55AAA
20x16 555 2AA 555
UNLOCKBYPASSRESET(90h/00h)
x8X 90 X 0
x16
PROGRAM Operations
PROGRAM(A0h)x8 AAA
AA555
55AAA
A0 PA PDx16 555 2AA 555
UNLOCKBYPASS PROGRAM(A0h)
x8X A0 PA PD 6
x16
WRITETOBUFFER PROGRAM(25h)
x8 AAAAA
55555 BAd 25 BAd N PA PD 7,8,9
x16 555 2AA
UNLOCKBYPASSWRITETOBUFFERPROGRAM(25h)
x8BAd 25 BAd N PA PD 6
x16
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Command and Code/Subcode
Bus Size
Address and Data Cycles
Notes1st 2nd 3rd 4th 5th 6th
A D A D A D A D A D A D
WRITETOBUFFERPROGRAMCONFIRM(29h)
x8BAd 29 7
x16
BUFFEREDPROGRAM ABORTandRESET(F0h)
x8 AAAAA
55555
AAAF0
x16 555 2AA 555
PROGRAMSUSPEND(B0h)x8
X B0x16
PROGRAMRESUME(30h)x8
X 30x16
ERASE Operations
CHIPERASE(80/10h)x8 AAA
AA555
55AAA
80AAA
AA555
55AAA
10x16 555 2AA 555 555 2AA 555
UNLOCKBYPASS CHIPERASE(80/10h)
x8X 80 X 10
6
x16
BLOCKERASE(80/30h)x8 AAA
AA555
55AAA
80AAA
AA555
55 BAd 30 10x16 555 2AA 555 555 2AA
UNLOCKBYPASSBLOCKERASE(80/30h)
x8X 80 BAd 30 6
x16
ERASESUSPEND(B0h)x8
X B0x16
ERASERESUME(30h)x8
X 30x16
BLANK CHECK Operations
BLANK CHECK SETUP(EB/76h)
x8 AAAAA
55555 BAd EB BAd 76 BAd 0 BAd 0
x16 555 2AA
BLANKCHECKCONFIRM andREAD(29h)
x8BAd 29
x16
Notes:
1. A=Address;D=Data;X=“Don’tCare;”BAd=Anyaddressintheblock;N+1=numberofwords(x16)/bytes(x8)tobeprogrammed;PA=Programaddress;PD=Programdata;Grayshading=Not
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applicable.Allvaluesinthetablearehexadecimal.Somecommandsrequirebothacommandcodeandsubcode.Forthe2Gbdevice,theset-upcommandmustbeissuedforeachselecteddie.
2. Afullthree-cycleRESETcommandsequencemustbeusedtoresetthedeviceintheeventofabufferedprogramaborterror(DQ1=1).
3. ThesecellsrepresentREADcycles(versusWRITEcyclesfortheothers).
4. AUTOSELECTenablesthedevicetoreadthemanufacturercode,devicecode,blockprotectionstatus,andextendedmemoryblockprotectionindicator.
5. AUTOSELECTaddressesanddataarespecifiedintheElectronicSignaturetableandtheExtendedMemoryBlockProtectiontable.
6. ForanyUNLOCKBYPASSERASE/PROGRAMcommand,thefirsttwoUNLOCKcyclesareunnecessary.
7. BAdmustbethesameastheaddressloadedduringtheWRITETOBUFFERPROGRAM3rdand4thcycles.
8. WRITETOBUFFERPROGRAMoperation:maximumcycles=261(x8)and517(x16).UNLOCKBYPASSWRITETOBUFFERPROGRAMoperation:maximumcycles=259(x8),515(x16).WRITETOBUFFERPROGRAMoperation:N+1=numberofwords(x16)/bytes(x8)tobeprogrammed;maximumbuffersize=256bytes(x8)and1024bytes(x16).
9. Forx8,A[MAX:7]addresspinsshouldremainunchangedwhileA[6:0]andA-1pinsareusedtoselectabytewithintheN+1bytepage.Forx16,A[MAX:9]addresspinsshouldremainunchangedwhileA[8:0]pinsareusedtoselectawordwithintheN+1wordpage.
10. BLOCKERASEaddresscyclescanextendbeyondsixaddress-datacycles,dependingonthenumberofblockstoerase.
8 READ and AUTO SELECT Operations
8 .1 READ/RESET Command
TheREAD/RESET(F0h)commandreturnsthedevicetoreadmodeandresetstheerrorsinthedatapollingregister.OneorthreebusWRITEoperationscanbeusedtoissuetheREAD/RESETcommand.Note:Afullthree-cycleRESETcommandsequencemustbeusedtoresetthedeviceintheeventofabufferedprogramaborterror(DQ1=1).
8 .2 READ CFI Command
TheREADCFI(98h)commandputsthedeviceinreadCFImodeandisonlyvalidwhenthedeviceisinreadarrayorautoselectmode.OnebusWRITEcycleisrequiredtoissuethecommand.
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8 .3 AUTO SELECT Command
Atpower-uporafterahardwarereset,thedeviceisinreadmode.ItcanthenbeputinautoselectmodebyissuinganAUTOSELECT(90h)command.Autoselectmodeenablesthefollowingdeviceinformationtoberead:
• Electronicsignature,whichincludesmanufactureranddevicecodeinformation.
• Blockprotection,whichincludestheblockprotectionstatusandextendedmemoryblockprotectionindicator.
ThedevicecannotenterautoselectmodewhenaPROGRAMorERASEoperation is inprogress(RY/BY#LOW).However,autoselectmodecanbeenteredifthePROGRAMorERASEoperationhasbeensuspendedbyissuingaPROGRAMSUSPENDorERASESUSPENDcommand.
Autoselectmodeisexitedbyperformingareset.ThedevicereturnstoreadmodeunlessitenteredautoselectmodeafteranERASESUSPENDorPROGRAMSUSPENDcommand, inwhichcase it returnstoeraseorprogramsuspendmode.
9 Bypass Operations
9 .1 UNLOCK BYPASS Command
TheUNLOCKBYPASS(20h)commandisusedtoplacethedeviceinunlockbypassmode.ThreebusWRITEoperationsarerequiredtoissuetheUNLOCKBYPASScommand.
Whenthedeviceentersunlockbypassmode,thetwoinitialUNLOCKcyclesrequiredforastandardPROGRAMorERASEoperationarenotneeded,thusenablingfastertotalprogramorerasetime.
TheUNLOCKBYPASScommand isused in conjunctionwithUNLOCKBYPASSPROGRAMorUNLOCKBYPASSERASEcommandstoprogramorerasethedevicefasterthanwithstandardPROGRAMorERASEcommands.Whenthecycletimetothedeviceislong,considerabletimesavingscanbegainedbyusingthesecommands.Wheninunlockbypassmode,onlythefollowingcommandsarevalid:
• TheUNLOCKBYPASSPROGRAMcommandcanbeissuedtoprogramaddresseswithinthedevice.
• TheUNLOCKBYPASSBLOCKERASEcommandcanthenbeissuedtoeraseoneormorememoryblocks.
• TheUNLOCKBYPASSCHIPERASEcommandcanbeissuedtoerasethewholememoryarray.
• TheUNLOCKBYPASSWRITETOBUFFERPROGRAMcommandcanbeissuedtospeeduptheprogrammingoperation.
• TheUNLOCKBYPASSRESETcommandcanbeissuedtoreturnthedevicetoreadmode.
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9 .2 UNLOCK BYPASS RESET Command
TheUNLOCKBYPASSRESET(90/00h)commandisusedtoreturntoread/resetmodefromunlockbypassmode.TwobusWRITEoperationsarerequiredtoissuetheUNLOCKBYPASSRESETcommand.TheREAD/RESETcommanddoesnotexitfromunlockbypassmode.
10 Program Operations
10 .1 PROGRAM Command
ThePROGRAM(A0h)commandcanbeusedtoprogramavaluetooneaddressinthememoryarray.ThecommandrequiresfourbusWRITEoperations,andthefinalWRITEoperationlatchestheaddressanddataintheinternalstatemachineandstartstheprogram/erasecontroller.Afterprogramminghasstarted,busREADoperationsoutputthedatapollingregistercontent.
10 .2 UNLOCK BYPASS PROGRAM Command
Whenthedeviceisinunlockbypassmode,theUNLOCKBYPASSPROGRAM(A0h)commandcanbeusedtoprogramone address in thememory array. The command requires twobusWRITEoperations insteadof four required by a standard PROGRAMcommand; the finalWRITE operation latches the address anddataandstartstheprogram/erasecontroller (ThestandardPROGRAMcommandrequiresfourbusWRITEoperations).ThePROGRAMoperationusingtheUNLOCKBYPASSPROGRAMcommandbehavesidenticallytothePROGRAMoperationusingthePROGRAMcommand.Theoperationcannotbeaborted.AbusREADoperationtothememoryoutputsthedatapollingregister.
10 .3 WRITE TO BUFFER PROGRAM Command
The WRITE TO BUFFER PROGRAM (25h) command makes use of the program buffer to speed upprogramminganddramatically reducessystemprogramming timecompared to thestandardnon-bufferedPROGRAMcommand.256Mbthrough2Gbdevicessupporta512-wordmaximumprogrambuffer.
10 .4 UNLOCK BYPASS WRITE TO BUFFER PROGRAM Command
Whenthedeviceisinunlockbypassmode,theUNLOCKBYPASSWRITETOBUFFER(25h)commandcanbeusedtoprogramthedeviceinfastprogrammode.ThecommandrequirestwobusWRITEoperationsfewerthanthestandardWRITETOBUFFERPROGRAMcommand.
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10 .5 WRITE TO BUFFER PROGRAM CONFIRM Command
TheWRITETOBUFFERPROGRAMCONFIRM (29h) command is used toconfirmaWRITETOBUFFERPROGRAMcommandandtoprogramthen+1words/bytesloadedintheprogrambufferbythiscommand.
10 .6 BUFFERED PROGRAM ABORT AND RESET Command
ABUFFEREDPROGRAMABORTANDRESET(F0h)commandmustbeissuedtoresetthedevicetoreadmodewhentheBUFFERPROGRAMoperationisaborted.Thebufferprogrammingsequencecanbeabortedinthefollowingways:
• LoadavaluethatisgreaterthanthepagebuffersizeduringthenumberoflocationstoprogramintheWRITETOBUFFERPROGRAMcommand.
• WritetoanaddressinadifferentblockthantheonespecifiedduringtheWRITEBUFFERLOADcommand.
• Writeanaddress/datapairtoadifferentwritebufferpagethantheoneselectedbythestartingaddressduringtheprogrambufferdataloadingstageoftheoperation.
• WritedataotherthantheCONFIRMcommandafterthespecifiednumberofdataloadcycles.
The abort condition is indicatedbyDQ1=1,DQ7=DQ7# (for the last address location loaded),DQ6=toggle,andDQ5=0(allofwhicharedatapollingregisterbits).ABUFFEREDPROGRAMABORTandRESETcommandsequencemustbewrittentoresetthedeviceforthenextoperation.
Note:Thefullthree-cycleBUFFEREDPROGRAMABORTandRESETcommandsequenceisrequiredwhenusingbufferprogrammingfeaturesinunlockbypassmode.
10 .7 PROGRAM SUSPEND Command
ThePROGRAMSUSPEND(B0h)commandcanbeusedtointerruptaprogramoperationsothatdatacanbereadfromanotherblock.WhenthePROGRAMSUSPENDcommandisissuedduringaprogramoperation,thedevicesuspends theoperationwithin theprogramsuspend latency timeandupdates thedatapollingregisterbits.
Aftertheprogramoperationhasbeensuspended,datacanbereadfromanyaddress.However,dataisinvalidwhenreadfromanaddresswhereaprogramoperationhasbeensuspended.
ThePROGRAMSUSPENDcommandmayalsobe issuedduringaPROGRAMoperationwhileanerase issuspended.Inthiscase,datamaybereadfromanyaddressnotinerasesuspendorprogramsuspendmode.
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10 .8 PROGRAM RESUME Command
ThePROGRAMRESUME(30h)commandmustbeissuedtoexitaprogramsuspendmodeandresumeaPROGRAMoperation.ThecontrollercanuseDQ7orDQ6datapollingbits todetermine thestatusof thePROGRAMoperation.AfteraPROGRAMRESUMEcommandis issued,subsequentPROGRAMRESUMEcommands are ignored. Another PROGRAM SUSPEND command can be issued after the device hasresumedprogramming.
11 Erase Operations
11 .1 CHIP ERASE Command
TheCHIPERASE(80/10h)commanderasestheentirechip.SixbusWRITEoperationsarerequiredtoissuethecommandandstarttheprogram/erasecontroller.
Protectedblocksarenoterased.Ifallblocksareprotected,thedataremainsunchanged.Noerrorisreportedwhenprotectedblocksarenoterased.
DuringtheCHIPERASEoperation, thedevice ignoresallothercommands, includingERASESUSPEND. Itisnotpossibletoaborttheoperation.AllbusREADoperationsduringCHIPERASEoutputthedatapollingregisteronthedataI/Os.
11 .2 UNLOCK BYPASS CHIP ERASE Command
Whenthedeviceisinunlockbypassmode,theUNLOCKBYPASSCHIPERASE(80/10h)commandcanbeusedtoeraseallmemoryblocksatonetime.ThecommandrequiresonlytwobusWRITEoperationsinsteadofsixusingthestandardCHIPERASEcommand.ThefinalbusWRITEoperationstartstheprogram/erasecontroller.
11 .3 BLOCK ERASE Command
TheBLOCKERASE(80/30h)commanderasesa listofoneormoreblocks. Itsetsallbits in theselected,unprotectedblocksto1.Allprevious,selected,unprotectedblocksdataintheselectedblocksislost.
11 .4 UNLOCK BYPASS BLOCK ERASE Command
Whenthedeviceisinunlockbypassmode,theUNLOCKBYPASSBLOCKERASE(80/30h)commandcanbeusedtoeraseoneormorememoryblocksatatime.ThecommandrequirestwobusWRITEoperationsinsteadofsixusingthestandardBLOCKERASEcommand.ThefinalbusWRITEoperationlatchestheaddressoftheblockandstartstheprogram/erasecontroller.
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Toerasemultipleblocks(afterthefirsttwobusWRITEoperationshaveselectedthefirstblockinthelist),eachadditionalblockinthelistcanbeselectedbyrepeatingthesecondbusWRITEoperationusingtheaddressoftheadditionalblock.
11 .5 ERASE SUSPEND Command
TheERASESUSPEND(B0h)commandtemporarilysuspendsaBLOCKERASEoperation.OnebusWRITEoperationisrequiredtoissuethecommand.Theblockaddressis“Don’tCare.”
11 .6 ERASE RESUME Command
The ERASE RESUME (30h) command restarts the program/erase controller after an ERASESUSPENDoperation.
Thedevicemustbe inreadarraymodebeforetheRESUMEcommandwillbeaccepted.Anerasecanbesuspendedandresumedmorethanonce.
12 BLANK CHECK Operation
12 .1 BLANK CHECK Commands
TwocommandsarerequiredtoexecuteaBLANKCHECKoperation:BLANKCHECKSETUP(EB/76h)andBLANKCHECKCONFIRMANDREAD(29h).
TheBLANKCHECKoperationdetermineswhetheraspecifiedblockisblank(thatis,completelyerased).ItcanalsobeusedtodeterminewhetherapreviousERASEoperationwassuccessful,includingERASEoperationsthatmighthavebeeninterruptedbypowerloss.
TheBLANKCHECKoperationchecksforcellsthatareprogrammedorover-erased.Ifitfindsany,itreturnsafailurestatus,indicatingthattheblockisnotblank.Ifitreturnsapassingstatus,theblockisguaranteedblank(all1s)andisreadytoprogram.
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13 Block Protection Command Definitions – Address-Data Cycles
Table 8: Block Protection Command Definitions – Address-Data Cycles, 8-Bit and 16-Bit
Notes1and2applytoentiretable.
Command and Code/Subcode
Bus Size
Address and Data CyclesNotes1st 2nd 3rd 4th
…nth
A D A D A D A D A D
LOCK REGISTER Commands
ENTERLOCKREGISTER COMMANDSET(40h)
x8 AAA AA 555 55 AAA40 3
x16 555 AA 2AA 55 555
PROGRAMLOCK REGISTER(A0h)
x8X A0 X Data 5
x16
READLOCKREGISTERx8
X Data 4,5,6x16
EXITLOCKREGISTER(90h/00h)
x8X 90 X 00 3
x16
PASSWORD PROTECTION Commands
ENTERPASSWORDPROTECTIONCOMMAND
SET(60h)
x8 AAA AA 555 55 AAA60 3
x16 555 AA 2AA 55 555
PROGRAMPASSWORD(A0h)
x8X A0 PWAn PWDn 7
x16
READPASSWORDx8 00 PWD0 01 PWD1 2 PWD2 3 PWD3
…7 PWD7 4,6,8,
9x16 00 PWD0 01 PWD1 2 PWD2 3 PWD3
UNLOCKPASSWORD(25h/03h)
x800 25 00 3 00 PWD0 01 PWD1 … 00 29 8,10
x16
EXITPASSWORDPROTECTION(90h/00h)
x8X 90 X 0 3
x16
NONVOLATILE PROTECTION Commands
ENTERNONVOLATILEPROTECTIONCOMMAND
SET(C0h)
x8 AAA AA 555 55 AAAC0 3
x16 555 AA 2AA 55 555
PROGRAMNONVOLATILEPROTECTIONBIT(A0h)
x8X A0 BAd 00 11
x16
READNONVOLATILEPROTECTIONBITSTATUS
x8BAd
READ(DQ0)
4,6,11x16
CLEARALLNONVOLATILEPROTECTIONBITS
(80h/30h)
x8X 80 00 30 12
x16
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Command and Code/Subcode
Bus Size
Address and Data CyclesNotes1st 2nd 3rd 4th
…nth
A D A D A D A D A D
NONVOLATILE PROTECTION BIT LOCK BIT Commands
ENTERNONVOLATILEPROTECTIONBITLOCKBIT
COMMANDSET(50h)
x8 AAA AA 555 55 AAA50 3
x16 555 AA 2AA 55 555
PROGRAMNONVOLATILEPROTECTIONBIT LOCKBIT(A0h)
x8X A0 X 00
x16
READNONVOLATILEPROTECTIONBITLOCK
BITSTATUS
x8X
READ(DQ0)
4,6, 11x16
EXITNONVOLATILEPROTECTIONBITLOCKBIT
(90h/00h)
x8X 90 X 00 3
x16
VOLATILE PROTECTION Commands
ENTERVOLATILEPROTECTIONCOMMAND
SET(E0h)
x8 AAA AA 555 55 AAAE0 3
x16 555 AA 2AA 55 555
PROGRAMVOLATILEPROTECTIONBIT(A0h)
x8X A0 BAd 00 11
x16
READVOLATILEPROTECTIONBITSTATUS
x8BAd
READ(DQ0)
4,6x16
CLEARVOLATILEPROTECTIONBIT(A0h)
x8X A0 BAd 01 11
x16
EXITVOLATILEPROTECTION(90h/00h)
x8X 90 X 00 3
x16
EXTENDED MEMORY BLOCK Operations
ENTEREXTENDEDMEMORYBLOCK(88h)
x8 AAAAA
55555
AAA88
x16 555 2AA 555
PROGRAMEXTENDEDMEMORYBLOCK(A0h)
x8 AAAAA
55555
AAAA0
Wordaddress
datax16 555 2AA 555
READEXTENDED MEMORY BLOCK
x8 Wordaddress
datax16
EXITEXTENDEDMEMORYBLOCK(90h/00h)
x8 AAAAA
55555 555 90 X 00
x16 555 2AA
Notes:
1. Key:A=AddressandD=Data;X=“Don’tCare;”BAd=Anyaddressintheblock;PWDn=Passwordbytes,n=0to7(×8)/words0to3(×16);PWAn=Passwordaddress,n=0to7(×8)/0to3(×16);PWDn=Passwordwords,n=0to3(×16);PWAn=Passwordaddress,n=0to3(×16);Gray=Notapplicable.Allvaluesinthetablearehexadecimal.
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2. DQ[15:8]are“Don’tCare”duringUNLOCKandCOMMANDcycles.A[MAX:16]are“Don’tCare”duringUNLOCKandCOMMANDcycles,unlessanaddressisrequired.
3. TheENTERcommandsequencemustbeissuedpriortoanyoperation.ItdisablesREADandWRITEoperationsfromandtoblock0.READandWRITEoperationsfromandtoanyotherblockareallowed.Also,whenanENTERCOMMANDSETcommandisissued,anEXITCOMMANDSETcommandmustbeissuedtoreturnthedevicetoREADmode.
4. READREGISTER/PASSWORDcommandshavenocommandcode;CE#andOE#aredrivenLOWanddataisreadaccordingtoaspecifiedaddress.
5. Data=Lockregistercontent.
6. AlladdresscyclesshownforthiscommandareREADcycles.
7. OnlyoneportionofthepasswordcanbeprogrammedorreadbyeachPROGRAMPASSWORDcommand.
8. Eachportionofthepasswordcanbeenteredorreadinanyorderaslongastheentire64-bitpasswordisenteredorread.
9. Forthex8READPASSWORDcommand,thenth(andfinal)addresscycleequalsthe8thaddresscycle.Fromthe5thtothe8thaddresscycle,thevaluesforeachaddressanddatapaircontinuethepatternshowninthetableasfollows:forx8,addressanddata=04andPWD4;05andPWD5;06andPWD6;07andPWD7.
10. Forthex8UNLOCKPASSWORDcommand,thenth(andfinal)addresscycleequalsthe11thaddresscycle.Fromthe5thtothe10thaddresscycle,thevaluesforeachaddressanddatapaircontinuethepatternshowninthetableasfollows:addressanddata=02andPWD2;03andPWD3;04andPWD4;05andPWD5;06andPWD6;07andPWD7.Forthex16UNLOCKPASSWORDcommand,thenth(andfinal)addresscycleequalsthe7thaddresscycle.Forthe5thand6thaddresscycles,thevaluesfortheaddressanddatapaircontinuethepatternshowninthetableasfollows:addressanddata=02andPWD2;03andPWD3.
11. Bothnonvolatileandvolatileprotectionbitsettingsareasfollows:Protectedstate=00;Unprotectedstate=01.
12. TheCLEARALLNONVOLATILEPROTECTIONBITScommandprogramsallnonvolatileprotectionbitsbeforeerasure.Thispreventsover-erasureofpreviouslyclearednonvolatileprotectionbits.
14 Protection Operations
BlockscanbeprotectedindividuallyagainstaccidentalPROGRAM,orERASEoperationsonboth8-bitand16-bitconfigurations.
Memory block and extended memory block protection is configured through the lock register (see LockRegistersection).
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14 .1 LOCK REGISTER Commands
After the ENTER LOCK REGISTER COMMAND SET (40h) command has been issued, all bus READ orPROGRAMoperationscanbeissuedtothelockregister.ThePROGRAMLOCKREGISTER(A0h)commandallowsthelockregistertobeconfigured.
TheprogrammeddatacanthenbecheckedwithaREADLOCKREGISTERcommandbydrivingCE#andOE#LOWwiththeappropriateaddressdataontheaddressbus.
14 .2 PASSWORD PROTECTION Commands
After the ENTER PASSWORD PROTECTION COMMAND SET (60h) command has been issued, thecommandsrelatedtopasswordprotectionmodecanbeissuedtothedevice.ThePROGRAMPASSWORD(A0h)commandisusedtoprogramthe64-bitpasswordusedinthepasswordprotectionmode.
TheREADPASSWORDcommandisusedtoverifythepasswordusedinpasswordprotectionmode.
TheUNLOCKPASSWORD(25/03h)commandisusedtoclearthenonvolatileprotectionbitlockbit,allowingthenonvolatileprotectionbitstobemodified.TheUNLOCKPASSWORDcommandmustbe issued,alongwiththecorrectpassword,andrequiresa1μsdelaybetweensuccessiveUNLOCKPASSWORDcommandsinordertopreventhackersfromcrackingthepasswordbytryingallpossible64-bitcombinations.Ifthisdelaydoesnotoccur,thelatestcommandwillbeignored.Approximately1μsisrequiredforunlockingthedeviceafterthevalid64-bitpasswordhasbeenprovided.
14 .3 NONVOLATILE PROTECTION Commands
After the ENTER NONVOLATILE PROTECTION COMMAND SET (C0h) command has been issued, thecommandsrelatedtononvolatileprotectionmodecanbeissuedtothedevice.
AblockcanbeprotectedfromprogramorerasebyissuingaPROGRAMNONVOLATILEPROTECTIONBIT(A0h)command,alongwiththeblockaddress.Thiscommandsetsthenonvolatileprotectionbit to0 foragivenblock.
ThestatusofanonvolatileprotectionbitforagivenblockorgroupofblockscanbereadbyissuingaREADNONVOLATILEMODIFYPROTECTIONBITcommand,alongwiththeblockaddress.
ThenonvolatileprotectionbitsareerasedsimultaneouslybyissuingaCLEARALLNONVOLATILEPROTECTIONBITS(80/30h)command.Nospecificblockaddressisrequired.Ifthenonvolatileprotectionbitlockbitissetto0,thecommandfails.
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14 .4 NONVOLATILE PROTECTION BIT LOCK BIT Commands
After theENTERNONVOLATILEPROTECTIONBITLOCKBITCOMMANDSET (50h)commandhasbeenissued,thecommandsthatallowthenonvolatileprotectionbitlockbittobesetcanbeissuedtothedevice.
ThePROGRAMNONVOLATILEPROTECTIONBITLOCKBIT(A0h)commandisusedtosetthenonvolatileprotectionbitlockbitto0,thuslockingthenonvolatileprotectionbitsandpreventingthemfrombeingmodified.
TheREADNONVOLATILEPROTECTIONBITLOCKBITSTATUScommandisusedtoreadthestatusofthenonvolatileprotectionbitlockbit.
14 .5 VOLATILE PROTECTION Commands
After theENTERVOLATILEPROTECTIONCOMMANDSET (E0h)commandhasbeen issued,commandsrelatedtothevolatileprotectionmodecanbeissuedtothedevice.
ThePROGRAMVOLATILEPROTECTIONBIT(A0h)commandindividuallysetsavolatileprotectionbitto0foragivenblock.Ifthenonvolatileprotectionbitforthesameblockisset,theblockislockedregardlessofthevalueofthevolatileprotectionbit.(SeetheBlockProtectionStatustable.)
ThestatusofavolatileprotectionbitforagivenblockcanbereadbyissuingaREADVOLATILEPROTECTIONBITSTATUScommandalongwiththeblockaddress.
TheCLEARVOLATILEPROTECTIONBIT(A0h)commandindividuallyclears(setsto1)thevolatileprotectionbitforagivenblock.Ifthenonvolatileprotectionbitforthesameblockisset,theblockislockedregardlessofthevalueofthevolatileprotectionbit.(SeetheBlockProtectionStatustable.)
14 .6 EXTENDED MEMORY BLOCK Commands
The device has one extra 128-word extendedmemory block that can be accessed only by the ENTEREXTENDEDMEMORYBLOCK(88h)command.Theextendedmemoryblockis128words(x16)or256bytes(x8). It isusedasasecurityblocktoprovideapermanent128-bitsecurity identificationnumberortostoreadditionalinformation.
14 .7 EXIT PROTECTION Command
The EXIT PROTECTION COMMAND SET (90/00h) command is used to exit the lock register, passwordprotection, nonvolatile protection, volatile protection, and nonvolatile protection bit lock bit command setmodesandreturnthedevicetoreadmode.
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15 Device Protection
15 .1 Hardware Protection
The VPP/WP# function provides a hardware method of protecting either the highest/lowest block. WhenVPP/WP#isLOW,PROGRAMandERASEoperationsoneitheroftheseblockoptionsis ignoredtoprovideprotection.WhenVPP/WP#isHIGH,thedevicerevertstothepreviousprotectionstatusforthehighest/lowestblock.PROGRAMandERASEoperationscanmodifythedataineitheroftheseblockoptionsunlessblockprotectionisenabled.
Note:MicrosshighlyrecommendsdrivingVPP/WP#HIGHorLOW.IfasystemneedstofloattheVPP/WP#pin,withoutapull-up/pull-downresistorandnocapacitor,thenaninternalpull-upresistorisenabled.
Table 9: VPP/WP# Functions
VPP/WP# Settings Function
VILHighest/lowestblockisprotected;fora2Gbdevice,boththehighestandthelowestblocksarehardware-protected(block0andblock2047).
VIH Highest/lowestblockorthetop/bottomtwoblocksareunprotectedunlesssoftwareprotectionisactivated.
15 .2 Software Protection
Foursoftwareprotectionmodesareavailable:
• Volatileprotection
• Nonvolatileprotection
• Passwordprotection
• Passwordaccess
Thedeviceisshippedwithallblocksunprotected.Onfirstuse,thedevicedefaultstothenonvolatileprotectionmodebutcanbeactivatedineitherthenonvolatileprotectionorpasswordprotectionmode.
The desired protectionmode is activated by setting either the nonvolatile protectionmode lock bit or thepasswordprotectionmodelockbitofthelockregister.Bothbitsareone-time-programmableandnonvolatile;therefore,aftertheprotectionmodehasbeenactivated,itcannotbechanged,andthedeviceissetpermanentlytooperateintheselectedprotectionmode.Itisrecommendedthatthedesiredsoftwareprotectionmodebeactivatedwhenfirstprogrammingthedevice.
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Forthelowestandhighestblocks,ahigherlevelofblockprotectioncanbeachievedbylockingtheblocksusingnonvolatileprotectionmodeandholdingVPP/WP#LOW.Blockswithvolatileprotectionandnonvolatileprotectioncancoexistwithinthememoryarray.Iftheuserattemptstoprogramoreraseaprotectedblock,thedeviceignoresthecommandandreturnstoreadmode.
Theblockprotectionstatuscanbe readbyperforminga readelectronicsignatureorby issuinganAUTOSELECTcommand.
15 .3 Volatile Protection Mode
Volatileprotectionenablesthesoftwareapplicationtoprotectblocksagainstinadvertentchangeandcanbedisabledwhenchangesareneeded.Volatileprotectionbitsareuniqueforeachblockandcanbeindividuallymodified.Volatileprotectionbitscontroltheprotectionschemeonlyforunprotectedblockswhosenonvolatileprotection bits are cleared to 1. Issuing a PROGRAMVOLATILE PROTECTIONBIT or CLEAR VOLATILEPROTECTIONBITcommandsets to0orclears to1 thevolatileprotectionbitsandplacestheassociatedblocksintheprotected(0)orunprotected(1)state,respectively.Thevolatileprotectionbitcanbesetorclearedasoftenasneeded.
Whenthedeviceisfirstshipped,orafterapower-uporhardwarereset,thevolatileprotectionbitsdefaultto1(unprotected).
15 .4 Nonvolatile Protection Mode
Anonvolatileprotectionbitisassignedtoeachblock.EachofthesebitscanbesetforprotectionindividuallybyissuingaPROGRAMNONVOLATILEPROTECTIONBITcommand.Also,eachdevicehasoneglobalvolatilebitcalledthenonvolatileprotectionbitlockbit;itcanbesettoprotectallnonvolatileprotectionbitsatonce.Thisglobalbitmustbesetto0onlyafterallnonvolatileprotectionbitsareconfiguredtothedesiredsettings.Whensetto0,thenonvolatileprotectionbitlockbitpreventschangestothestateofthenonvolatileprotectionbits.Whenclearedto1,thenonvolatileprotectionbitscanbesetandclearedusingthePROGRAMNONVOLATILEPROTECTIONBITandCLEARALLNONVOLATILEPROTECTIONBITScommands,respectively.
Nosoftwarecommandunlocksthenonvolatileprotectionbitlockbitunlessthedeviceisinpasswordprotectionmode;innonvolatileprotectionmode,thenonvolatileprotectionbitlockbitcanbeclearedonlybytakingthedevicethroughahardwareresetorpower-up.
Nonvolatileprotectionbitsstatuscannotbechangedthroughahardwareresetorapower-down/power-upsequence.Nonvolatileprotectionbitscannotbeclearedindividually;theymustbeclearedallatonceusingaCLEARALLNONVOLATILEPROTECTIONBITScommand.
Ifoneofthenonvolatileprotectionbitsneedstobecleared(unprotected),additionalstepsarerequired:First,thenonvolatileprotectionbitlockbitmustbeclearedto1,usingeitherapower-cycleorhardwarereset.Then,thenonvolatileprotectionbitscanbechangedtoreflectthedesiredsettings.Finally,thenonvolatileprotectionbitlockbitmustbesetto0tolockthenonvolatileprotectionbits.Thedevicenowwilloperatenormally.
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Toachievethebestprotection,thePROGRAMNONVOLATILEPROTECTIONLOCKBITcommandshouldbeexecutedearlyinthebootcode,andthebootcodeshouldbeprotectedbyholdingVPP/WP#LOW.
NonvolatileprotectionbitsandvolatileprotectionbitshavethesamefunctionwhenVPP/WP#isHIGHorwhenVPP/WP#isatthevoltageforprogramacceleration(VPPH).
15 .5 Password Protection Mode
Thepasswordprotectionmodeprovidesahigher levelofsecurity than thenonvolatileprotectionmodebyrequiring a 64-bit password to unlock the nonvolatile protection bit lock bit. In addition to this passwordrequirement,thenonvolatileprotectionbitlockbitissetto0afterpower-upandresettomaintainthedeviceinpasswordprotectionmode.
Executing the UNLOCK PASSWORD command by entering the correct password clears the nonvolatileprotectionbitlockbit,enablingtheblocknonvolatileprotectionbitstobemodified.Ifthepasswordprovidedisincorrect,thenonvolatileprotectionbitlockbitremainslocked,andthestateofthenonvolatileprotectionbitscannotbemodified.
Note:Thereisnomeanstoverifythepasswordafterpasswordprotectionmodeisenabled.Ifthepasswordislostafterenablingthepasswordprotectionmode,thereisnowaytoclearthenonvolatileprotectionbitlockbit.
15 .6 Password Access
Password access is a security enhancement that protects information stored in themain array blocks bypreventing content alteration or reads until a valid 64-bit password is received.Password accessmaybecombinedwithnonvolatileand/orvolatileprotectiontocreateamulti-tieredsolution.
16 Common Flash Interface
ThecommonFlashinterface(CFI)isaJEDEC-approved,standardizeddatastructurethatcanbereadfromtheFlashmemorydevice.Itallowsasystem’ssoftwaretoquerythedevicetodeterminevariouselectricalandtimingparameters,density information,and functionssupportedby thememory.Thesystemcan interfaceeasilywiththedevice,enablingthesoftwaretoupgradeitselfwhennecessary.
WhentheREADCFIcommandisissued,thedeviceentersCFIquerymodeandthedatastructureisreadfrommemory.Thequerydataisalwayspresentedonthelowestorderdataoutputs(DQ[7:0]),andtheotherdataoutputs(DQ[15:8])aresetto0.
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17 Power-Up and Reset Characteristics
Table 10: Power-Up Specifications
ParameterSymbol
Min Unit NotesLegacy JEDEC
VCCHIGHtoVCCQHIGH – tVCHVCQH 0 μs 1
VCCHIGHtorisingedgeofRST# tVCS tVCHPH 300 μs 2,3
VCCQHIGHtorisingedgeofRST# tVIOS tVCQHPH 0 μs 2,3
RST#HIGHtochipenableLOW tRH tPHEL 50 ns
RST#HIGHtowriteenableLOW – tPHWL 150 ns
Figure 3: Power-Up Timing
Power-Up and Reset Characteristics
Table 22: Power-Up Specifications
Parameter
Symbol
Min Unit NotesLegacy JEDEC
VCC HIGH to VCCQ HIGH – tVCHVCQH 0 µs 1
VCC HIGH to rising edge of RST# tVCS tVCHPH 300 µs 2, 3
VCCQ HIGH to rising edge of RST# tVIOS tVCQHPH 0 µs 2, 3
RST# HIGH to chip enable LOW tRH tPHEL 50 ns
RST# HIGH to write enable LOW – tPHWL 150 ns
Notes: 1. VCC should attain VCC,min from VSS simultaneously with or prior to applying VCCQ, VPPduring power up. VCC should attain VSS during power down.
2. If RST# is not stable for tVCS or tVIOS, the device will not allow any READ or WRITE oper-ations, and a hardware reset is required.
3. Power supply transitions should only occur when RST# is LOW.
Figure 14: Power-Up Timing
tRH
tVIOS
tVCS
tPHWL
tVCHVCQH
VCCQ
VCC
CE#
RST#
WE#
VSSQ
VSS
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR FlashPower-Up and Reset Characteristics
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Table 11: Reset AC Specifications
Condition/ParameterSymbol
Min Max Unit NotesLegacy JEDEC
RST#LOWtoreadmodeduringprogramorerase tREADY tPLRH – 32 μs 1
RST#pulsewidth tRP tPLPH 100 – ns
RST#HIGHtoCE#LOW,OE#LOW tRH tPHEL,tPHGL 50 – ns 1
RST#LOWtostandbymodeduringreadmodetRPD
– 10 – μs
RST#LOWtostandbymodeduringprogramorerase 50 – μs
RY/BY#HIGHtoCE#LOW,OE#LOW tRB tRHEL,tRHGL 0 – ns 1
Note1:Sampledonly;not100%tested.
Figure 4: Reset AC Timing – No PROGRAM/ERASE Operation in Progress
Table 23: Reset AC Specifications
Condition/Parameter
Symbol
Min Max Unit NotesLegacy JEDEC
RST# LOW to read mode during program orerase
tREADY tPLRH – 32 µs 1
RST# pulse width tRP tPLPH 100 – ns
RST# HIGH to CE# LOW, OE# LOW tRH tPHEL, tPHGL 50 – ns 1
RST# LOW to standby mode during read mode tRPD – 10 – µs
RST# LOW to standby mode during program orerase
50 – µs
RY/BY# HIGH to CE# LOW, OE# LOW tRB tRHEL, tRHGL 0 – ns 1
Note: 1. Sampled only; not 100% tested.
Figure 15: Reset AC Timing – No PROGRAM/ERASE Operation in Progress
tRH
RY/BY#
CE#, OE#
RST#
tRP
Figure 16: Reset AC Timing During PROGRAM/ERASE Operation
tRB
RY/BY#
CE#, OE#
RST#
tRP
tRH
tREADY
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR FlashPower-Up and Reset Characteristics
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Figure 5: Reset AC Timing During PROGRAM/ERASE Operation
Table 23: Reset AC Specifications
Condition/Parameter
Symbol
Min Max Unit NotesLegacy JEDEC
RST# LOW to read mode during program orerase
tREADY tPLRH – 32 µs 1
RST# pulse width tRP tPLPH 100 – ns
RST# HIGH to CE# LOW, OE# LOW tRH tPHEL, tPHGL 50 – ns 1
RST# LOW to standby mode during read mode tRPD – 10 – µs
RST# LOW to standby mode during program orerase
50 – µs
RY/BY# HIGH to CE# LOW, OE# LOW tRB tRHEL, tRHGL 0 – ns 1
Note: 1. Sampled only; not 100% tested.
Figure 15: Reset AC Timing – No PROGRAM/ERASE Operation in Progress
tRH
RY/BY#
CE#, OE#
RST#
tRP
Figure 16: Reset AC Timing During PROGRAM/ERASE Operation
tRB
RY/BY#
CE#, OE#
RST#
tRP
tRH
tREADY
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR FlashPower-Up and Reset Characteristics
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18 Absolute Ratings and Operating Conditions
Stressesgreaterthanthoselistedmaycausepermanentdamagetothedevice.Thisisastressratingonly,andfunctionaloperationofthedeviceattheseoranyotherconditionsoutsidethoseindicatedintheoperationalsectionsof this specification isnot implied.Exposure toabsolutemaximum ratingconditions forextendedperiodsmayadverselyaffectreliability.
Table 12: Absolute Maximum/Minimum Ratings
Parameter Symbol Min Max Unit Notes
Temperatureunderbias TBIAS –50 125 °C
Storagetemperature TSTG –65 150 °C
Supplyvoltage VCC –2 VCC + 2 V 1,2
Input/outputsupplyvoltage VCCQ –2 VCCQ + 2 V 1,2
Programvoltage VPPH –0 .6 14 .5 V 3
Notes:
1. Duringsignaltransitions,minimumvoltagemayundershootto−2Vforperiodslessthan20ns.
2. Duringsignaltransitions,maximumvoltagemayovershoottoVCC+2Vforperiodslessthan20ns.
3. VPPHmustnotremainat12Vformorethan80hourscumulative.
Table 13: Operating Conditions
Parameter Symbol Min Max Unit
Supplyvoltage VCC 2 .7 3 .6 V
Input/outputsupplyvoltage(VCCQ ≤ VCC) VCCQ 1 .65 3 .6 V
Programvoltage VPP –2 .0 12 .5 V
Ambientoperatingtemperature TA –40 85 °C
Loadcapacitance CL 30 pF
Inputriseandfalltimes – – 10 ns
Inputpulsevoltages – 0toVCCQ V
Inputandoutputtimingreferencevoltages – VCCQ/2 V
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Figure 6: AC Measurement Load Circuit
Figure 17: AC Measurement Load Circuit
CL
VCCQ
25kΩ
Deviceundertest
0.1µF
VCC
25kΩ
Note: 1. CL includes jig capacitance.
Figure 18: AC Measurement I/O Waveform
VCCQ
0V
VCCQ/2
Table 26: Input/Output Capacitance
Parameter Symbol Test Condition Min Max Unit
Input capacitance for 256Mb and 512Mb CIN VIN = 0V 3 8 pF
Input capacitance for 1Gb 4 9 pF
Input capacitance for 2Gb 8 18 pF
Output capacitance COUT VOUT = 0V 3 6 pF
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR FlashAbsolute Ratings and Operating Conditions
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Figure 7: AC Measurement I/O Waveform
Figure 17: AC Measurement Load Circuit
CL
VCCQ
25kΩ
Deviceundertest
0.1µF
VCC
25kΩ
Note: 1. CL includes jig capacitance.
Figure 18: AC Measurement I/O Waveform
VCCQ
0V
VCCQ/2
Table 26: Input/Output Capacitance
Parameter Symbol Test Condition Min Max Unit
Input capacitance for 256Mb and 512Mb CIN VIN = 0V 3 8 pF
Input capacitance for 1Gb 4 9 pF
Input capacitance for 2Gb 8 18 pF
Output capacitance COUT VOUT = 0V 3 6 pF
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR FlashAbsolute Ratings and Operating Conditions
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Table 14: Input/Output Capacitance
Parameter Symbol Test Condition Min Max Unit
Inputcapacitancefor256Mband512Mb
CIN VIN=0V
3 8 pF
Inputcapacitancefor1Gb 4 9 pF
Inputcapacitancefor2Gb 8 18 pF
Outputcapacitance COUT VOUT=0V 3 6 pF
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19 DC Characteristics
Table 15: DC Current Characteristics
Parameter Symbol Conditions Min Typ Max Unit Notes
Inputleakagecurrent ILI 0V ≤ VIN ≤ VCC – – ±1 µA 1
Outputleakagecurrent ILO 0V ≤ VOUT ≤ VCC – – ±1 µA
VCCreadcurrent
RandomreadICC1
CE#=VIL,OE#=VIH,f=5MHz – 26 31 mA
Pageread CE#=VIL,OE#=VIH,f=13MHz – 12 16 mA
VCCstandbycurrent
256Mb
ICC2CE#=VCCQ±0.2V, RST#=VCCQ ±0 .2V
– 65 210 µA
512Mb – 70 225 µA
1Gb – 75 240 µA
2Gb – 150 480 µA
VCCprogram/erase/ blankcheckcurrent
ICC3Program/erasecontrolleractive
VPP/WP#=VIL or VIH – 35 50 mA 2
VPP/WP#=VPPH – 35 50 mA
VPPcurrent
ReadIPP1 VPP/WP#≤ VCC
– 0 .2 5 µA
Standby – 2 15 µA
Reset IPP2 RST#=VSS ±0 .2V – 0 .2 5 µA
PROGRAMoperationongoing
IPP3VPP/WP#=12V±5% – 0 .05 0 .10 mA
VPP/WP#=VCC – 0 .05 0 .10 mA
ERASEoperationongoing
IPP4VPP/WP#=12V±5% – 0 .05 0 .10 mA
VPP/WP#=VCC – 0 .05 0 .10 mA
Notes:
1. Themaximuminputleakagecurrentis±5μAontheVPP/WP#pin.
2. Sampledonly;not100%tested.
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Table 16: DC Voltage Characteristics
Parameter Symbol Conditions Min Typ Max Unit Notes
InputLOWvoltage VIL VCC ≥ 2 .7V –0 .5 - 0 .8 V
InputHIGHvoltage VIH VCC ≥ 2 .7V 0 .7VCCQ - VCCQ + 0 .4 V
OutputLOWvoltage VOL
IOL=100μA,VCC=VCC,min,
VCCQ=VCCQ,min
0 .85VCCQ - 0 .15VCCQ V
OutputHIGHvoltage VOH
IOH=100μA,VCC=VCC,min,
VCCQ=VCCQ,min
- V
VoltageforVPP/WP#programacceleration VPPH - 11 .5 - 12 .5 V
Program/eraselockoutsupplyvoltage VLKO - 2 .3 - V 1
Note:
1. Sampledonly;not100%tested.
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20 Read AC Characteristics
Table 17: Read AC Characteristics
ParameterSymbol
Condition Package Min Max Unit NotesLegacy JEDEC
Addressvalidtonextaddressvalid tRC tAVAV CE#=VIL,OE#=VILFortifiedBGA 100 – ns
TSOP 110 – ns
Addressvalidtooutputvalid tACC tAVQV CE#=VIL,OE#=VILFortifiedBGA – 100 ns
TSOP – 110 ns
Addressvalidtooutputvalid(page) tPAGE tAVQV1 CE#=VIL,OE#=VILFortifiedBGA – 25 ns
TSOP – 25 ns
CE#LOWtooutputtransition tLZ tELQX OE#=VILFortifiedBGA 0 – ns 1
TSOP 0 – ns 1
CE#LOWtooutputvalid tCE tELQV OE#=VILFortifiedBGA – 100 ns
TSOP – 110 ns
OE#LOWtooutputtransition tOLZ tGLQX CE#=VILFortifiedBGA 0 – ns 1
TSOP 0 – ns 1
OE#LOWtooutputvalid tOE tGLQV CE#=VILFortifiedBGA – 25 ns
TSOP – 25 ns
CE#HIGHtooutputHigh-Z tHZ tEHQZ OE#=VILFortifiedBGA – 20 ns 1
TSOP – 20 ns 1
OE#HIGHtooutputHigh-Z tDF tGHQZ CE#=VILFortifiedBGA – 15 ns 1
TSOP – 15 ns 1
CE#HIGH,OE#HIGH,oraddresstransitiontooutputtransition
tOH
tEHQX,tGHQX,tAXQX
–FortifiedBGA 0 – ns
TSOP 0 – ns
CE#LOWtoBYTE#LOW tELFL tELBL –FortifiedBGA – 10 ns
TSOP – 10 ns
CE#LOWtoBYTE#HIGH tELFH tELBH –FortifiedBGA – 10 ns
TSOP – 10 ns
BYTE#LOWtooutputvalid tFLQV tBLQV –FortifiedBGA – 1 μs
TSOP – 1 μs
BYTE#HIGHtooutputvalid tFHQV tBHQV –FortifiedBGA – 1 μs
TSOP – 1 μs
Note:
1. Sampledonly;not100%tested.
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Figure 8: Random Read AC Timing (8-Bit Mode)Figure 19: Random Read AC Timing (8-Bit Mode)
Valid
Valid
tACC
tRC
tOH
tCE
tELFL
tLZ
tOH
tHZ
tOLZ tOH
tOE tDF
A[MAX:0]/A-1
CE#
OE#
DQ[7:0]
BYTE#
Figure 20: Random Read AC Timing (16-Bit Mode)
Valid
Valid
tACC
tRC
tOH
tCE
tELFH
tLZ
tOH
tHZ
tOLZ tOH
tOE tDF
A[MAX:0]
CE#
OE#
DQ[15:0]
BYTE#
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR FlashRead AC Characteristics
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Figure 9: Random Read AC Timing (16-Bit Mode)
Figure 19: Random Read AC Timing (8-Bit Mode)
Valid
Valid
tACC
tRC
tOH
tCE
tELFL
tLZ
tOH
tHZ
tOLZ tOH
tOE tDF
A[MAX:0]/A-1
CE#
OE#
DQ[7:0]
BYTE#
Figure 20: Random Read AC Timing (16-Bit Mode)
Valid
Valid
tACC
tRC
tOH
tCE
tELFH
tLZ
tOH
tHZ
tOLZ tOH
tOE tDF
A[MAX:0]
CE#
OE#
DQ[15:0]
BYTE#
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR FlashRead AC Characteristics
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Figure 10: BYTE# Transition Read AC TimingFigure 21: BYTE# Transition Read AC Timing
Data-out
Data-out
Valid
Valid
tACC tOH
tFHQV
tBLQX
High-Z
A[MAX:0]
A–1
BYTE#
DQ[7:0]
DQ[15:8]1
Figure 22: Page Read AC Timing
Valid
Valid Valid Valid ValidValid Valid Valid
tACC
tCE
tPAGE
tOH
tHZ
tOHtOE
tDF
A[MAX:4]
A[3:0]
CE#
OE#
DQ[15:0] Valid Valid Valid Valid Valid Valid Valid
Note: 1. Page size is 16 words (32 bytes) and is addressed by address inputs A[3:0] in x16 busmode and A[3:0] plus DQ15/A−1 in x8 bus mode.
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR FlashRead AC Characteristics
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Figure 11: Page Read AC Timing
Figure 21: BYTE# Transition Read AC Timing
Data-out
Data-out
Valid
Valid
tACC tOH
tFHQV
tBLQX
High-Z
A[MAX:0]
A–1
BYTE#
DQ[7:0]
DQ[15:8]1
Figure 22: Page Read AC Timing
Valid
Valid Valid Valid ValidValid Valid Valid
tACC
tCE
tPAGE
tOH
tHZ
tOHtOE
tDF
A[MAX:4]
A[3:0]
CE#
OE#
DQ[15:0] Valid Valid Valid Valid Valid Valid Valid
Note: 1. Page size is 16 words (32 bytes) and is addressed by address inputs A[3:0] in x16 busmode and A[3:0] plus DQ15/A−1 in x8 bus mode.
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR FlashRead AC Characteristics
PDF: 09005aef849b4b09m29ew_256mb_2gb.pdf - Rev. C 9/14 EN 62 Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2012 Micron Technology, Inc. All rights reserved.
Note:
1. Pagesizeis16words(32bytes)andisaddressedbyaddressinputsA[3:0]inx16busmodeandA[3:0]plusDQ15/A−1inx8busmode.
MYX28F00AM29EWHRevision 1.0 - 11/14/2014
*Advanced information. Subject to change without notice.
37
1Gb Parallel NOR FlashMYX28F00AM29EWH*
Form #: CSI-D-685 Document 003
21 Write AC Characteristics
Table 18: WE#-Controlled Write AC Characteristics
ParameterSymbol
Package Min Typ Max Unit NotesLegacy JEDEC
Addressvalidtonextaddressvalid tWC tAVAVFortifiedBGA 100 – – ns
TSOP 110 – – ns
CE#LOWtoWE#LOW tCS tELWLFortifiedBGA 0 – – ns
TSOP 0 – – ns
WE#LOWtoWE#HIGHtWP tWLWH FortifiedBGA 35 – – ns
TSOP 35 – – ns
InputvalidtoWE#HIGH tDS tDVWHFortifiedBGA 30 – – ns 1
TSOP 30 – – ns 1
WE#HIGHtoinputtransition tDH tWHDXFortifiedBGA 0 – – ns
TSOP 0 – – ns
WE#HIGHtoCE#HIGH tCH tWHEHFortifiedBGA 0 – – ns
TSOP 0 – – ns
WE#HIGHtoWE#LOW tWPH tWHWLFortifiedBGA 20 – – ns
TSOP 20 – – ns
AddressvalidtoWE#LOW tAS tAVWLFortifiedBGA 0 – – ns
TSOP 0 – – ns
WE#LOWtoaddresstransition tAH tWLAXFortifiedBGA 45 – – ns
TSOP 45 – – ns
OE#HIGHtoWE#LOW – tGHWLFortifiedBGA 0 – – ns
TSOP 0 – – ns
WE#HIGHtoOE#LOW tOEH tWHGLFortifiedBGA 0 – – ns
TSOP 0 – – ns
Program/erasevalidtoRY/BY#LOW tBUSY tWHRLFortifiedBGA – – 30 ns 2
TSOP – – 30 ns 2
VCCHIGHtoCE#LOW tVCS tVCHELFortifiedBGA 300 – – μs
TSOP 300 – – μs
WRITETOBUFFERPROGRAM opera-tion(512words)
tWHWH1 tWHWH1
FortifiedBGA – 900 – μs
TSOP – 900 – μs
PROGRAMoperation (singlewordorbyte)
FortifiedBGA – 210 – μs
TSOP – 210 – μs
Notes:
1. Theuser’swritetimingmustcomplywiththisspecification.AnyviolationofthiswritetimingspecificationmayresultinpermanentdamagetotheNORFlashdevice.
2. Sampledonly;not100%tested.
MYX28F00AM29EWHRevision 1.0 - 11/14/2014
*Advanced information. Subject to change without notice.
38
1Gb Parallel NOR FlashMYX28F00AM29EWH*
Form #: CSI-D-685 Document 003
Figure 12: WE#-Controlled Program AC Timing (8-Bit Mode)Figure 23: WE#-Controlled Program AC Timing (8-Bit Mode)
AAAh PA PA
3rd Cycle 4th Cycle READ CycleData PollingtWC tWC
tAS
tWP
tDStWHWH1
tDF
tWPH
tAH
tCEtCS
tGHWL tOE
tDH
tOH
tCH
A[MAX:0]/A-1
CE#
OE#
WE#
DQ[7:0] A0h PD DQ7# DOUT DOUT
Notes: 1. Only the third and fourth cycles of the PROGRAM command are represented. The PRO-GRAM command is followed by checking of the data polling register bit and by a READoperation that outputs the data (DOUT) programmed by the previous PROGRAM com-mand.
2. PA is the address of the memory location to be programmed. PD is the data to be pro-grammed.
3. DQ7 is the complement of the data bit being programmed to DQ7 (See Data Polling Bit[DQ7]).
4. See the following tables for timing details: Read AC Characteristics, WE#-ControlledWrite AC Characteristics, and CE#-Controlled Write AC Characteristics.
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR FlashWrite AC Characteristics
PDF: 09005aef849b4b09m29ew_256mb_2gb.pdf - Rev. C 9/14 EN 64 Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2012 Micron Technology, Inc. All rights reserved.
Notes:
1. OnlythethirdandfourthcyclesofthePROGRAMcommandarerepresented.ThePROGRAMcommandisfollowedbycheckingofthedatapollingregisterbitandbyaREADoperationthatoutputsthedata(DOUT)programmedbythepreviousPROGRAMcommand.
2. PAistheaddressofthememorylocationtobeprogrammed.PDisthedatatobeprogrammed.
3. DQ7isthecomplementofthedatabitbeingprogrammedtoDQ7(SeeDataPollingBit[DQ7]).
4. Seethefollowingtablesfortimingdetails:ReadACCharacteristics,WE#-ControlledWriteACCharacteristics,andCE#-ControlledWriteACCharacteristics.
MYX28F00AM29EWHRevision 1.0 - 11/14/2014
*Advanced information. Subject to change without notice.
39
1Gb Parallel NOR FlashMYX28F00AM29EWH*
Form #: CSI-D-685 Document 003
Figure 13: WE#-Controlled Program AC Timing (16-Bit Mode)Figure 24: WE#-Controlled Program AC Timing (16-Bit Mode)
555h PA PA
3rd Cycle 4th Cycle READ CycleData PollingtWC tWC
tAS
tWP
tDS
tDFtWHWH1
tWPH
tAH
tCEtCS
tGHWL tOE
tDH
tOH
tCH
A[MAX:0]
CE#
OE#
WE#
DQ[15:0] A0h PD DQ7# DOUT DOUT
Notes: 1. Only the third and fourth cycles of the PROGRAM command are represented. The PRO-GRAM command is followed by checking of the data polling register bit and by a READoperation that outputs the data (DOUT) programmed by the previous PROGRAM com-mand.
2. PA is the address of the memory location to be programmed. PD is the data to be pro-grammed.
3. DQ7 is the complement of the data bit being programmed to DQ7 (See Data Polling Bit[DQ7]).
4. See the following tables for timing details: Read AC Characteristics, WE#-ControlledWrite AC Characteristics, and CE#-Controlled Write AC Characteristics.
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR FlashWrite AC Characteristics
PDF: 09005aef849b4b09m29ew_256mb_2gb.pdf - Rev. C 9/14 EN 65 Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2012 Micron Technology, Inc. All rights reserved.
Notes:
1. OnlythethirdandfourthcyclesofthePROGRAMcommandarerepresented.ThePROGRAMcommandisfollowedbycheckingofthedatapollingregisterbitandbyaREADoperationthatoutputsthedata(DOUT)programmedbythepreviousPROGRAMcommand.
2. PAistheaddressofthememorylocationtobeprogrammed.PDisthedatatobeprogrammed.
3. DQ7isthecomplementofthedatabitbeingprogrammedtoDQ7(SeeDataPollingBit[DQ7]).
4. Seethefollowingtablesfortimingdetails:ReadACCharacteristics,WE#-ControlledWriteACCharacteristics,andCE#-ControlledWriteACCharacteristics.
MYX28F00AM29EWHRevision 1.0 - 11/14/2014
*Advanced information. Subject to change without notice.
40
1Gb Parallel NOR FlashMYX28F00AM29EWH*
Form #: CSI-D-685 Document 003
Table 19: CE#-Controlled Write AC Characteristics
ParameterSymbol
Package Min Typ Max Unit NotesLegacy JEDEC
Addressvalidtonextaddressvalid tWC tAVAVFortifiedBGA 100 – – ns
TSOP 110 – – ns
WE#LOWtoCE#LOW tWS tWLELFortifiedBGA 0 – – ns
TSOP 0 – – ns
CE#LOWtoCE#HIGH tCP tELEHFortifiedBGA 35 – – ns
TSOP 35 – – ns
InputvalidtoCE#HIGH tDS tDVEHFortifiedBGA 30 – – ns 1
TSOP 30 – – ns 1
CE#HIGHtoinputtransition tDH tEHDXFortifiedBGA 0 – – ns
TSOP 0 – – ns
CE#HIGHtoWE#HIGH tWH tEHWHFortifiedBGA 0 – – ns
TSOP 0 – – ns
CE#HIGHtoCE#LOW tCPH tEHELFortifiedBGA 20 – – ns
TSOP 20 – – ns
AddressvalidtoCE#LOW tAS tAVELFortifiedBGA 0 – – ns
TSOP 0 – – ns
CE#LOWtoaddresstransition tAH tELAXFortifiedBGA 45 – – ns
TSOP 45 – – ns
OE#HIGHtoCE#LOW – tGHELFortifiedBGA 0 – – ns
TSOP 0 – – ns
WRITETOBUFFERPROGRAM operation(512words)
tWHWH1 tWHWH1
FortifiedBGA – 900 – μs
TSOP – 900 – μs
PROGRAMoperation (singlewordorbyte)
FortifiedBGA – 210 – μs
TSOP – 210 – μs
Note:
1. Theuser’swritetimingmustcomplywiththisspecification.AnyviolationofthiswritetimingspecificationmayresultinpermanentdamagetotheNORFlashdevice.
MYX28F00AM29EWHRevision 1.0 - 11/14/2014
*Advanced information. Subject to change without notice.
41
1Gb Parallel NOR FlashMYX28F00AM29EWH*
Form #: CSI-D-685 Document 003
Figure 14: CE#-Controlled Program AC Timing (8-Bit Mode)Figure 25: CE#-Controlled Program AC Timing (8-Bit Mode)
AAAh PA PA
3rd Cycle 4th Cycle Data PollingtWC
tAS
tCP
tDStWHWH1
tCPH
tAH
tWS
tGHEL
tDH
tWH
A[MAX:0]/A-1
WE#
OE#
CE#
DQ[7:0] A0h PD DQ7# DOUT
Notes: 1. Only the third and fourth cycles of the PROGRAM command are represented. The PRO-GRAM command is followed by checking of the data polling register bit.
2. PA is the address of the memory location to be programmed. PD is the data to be pro-grammed.
3. DQ7 is the complement of the data bit being programmed to DQ7 (See Data Polling Bit[DQ7]).
4. See the following tables for timing details: Read AC Characteristics, WE#-ControlledWrite AC Characteristics, and CE#-Controlled Write AC Characteristics.
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR FlashWrite AC Characteristics
PDF: 09005aef849b4b09m29ew_256mb_2gb.pdf - Rev. C 9/14 EN 67 Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2012 Micron Technology, Inc. All rights reserved.
Notes:
1. OnlythethirdandfourthcyclesofthePROGRAMcommandarerepresented.ThePROGRAMcommandisfollowedbycheckingofthedatapollingregisterbit.
2. PAistheaddressofthememorylocationtobeprogrammed.PDisthedatatobeprogrammed.
3. DQ7isthecomplementofthedatabitbeingprogrammedtoDQ7(SeeDataPollingBit[DQ7]).
4. Seethefollowingtablesfortimingdetails:ReadACCharacteristics,WE#-ControlledWriteACCharacteristics,andCE#-ControlledWriteACCharacteristics.
MYX28F00AM29EWHRevision 1.0 - 11/14/2014
*Advanced information. Subject to change without notice.
42
1Gb Parallel NOR FlashMYX28F00AM29EWH*
Form #: CSI-D-685 Document 003
Figure 15: CE#-Controlled Program AC Timing (16-Bit Mode)Figure 26: CE#-Controlled Program AC Timing (16-Bit Mode)
555h PA PA
3rd Cycle 4th Cycle Data PollingtWC
tAS
tCP
tDStWHWH1
tCPH
tAH
tWS
tGHEL
tDH
tWH
A[MAX:0]
WE#
OE#
CE#
DQ[15:0] A0h PD DQ7# DOUT
Notes: 1. Only the third and fourth cycles of the PROGRAM command are represented. The PRO-GRAM command is followed by checking of the data polling register bit.
2. PA is the address of the memory location to be programmed. PD is the data to be pro-grammed.
3. DQ7 is the complement of the data bit being programmed to DQ7 (See Data Polling Bit[DQ7]).
4. See the following tables for timing details: Read AC Characteristics, WE#-ControlledWrite AC Characteristics, and CE#-Controlled Write AC Characteristics.
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR FlashWrite AC Characteristics
PDF: 09005aef849b4b09m29ew_256mb_2gb.pdf - Rev. C 9/14 EN 68 Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2012 Micron Technology, Inc. All rights reserved.
Notes:
1. OnlythethirdandfourthcyclesofthePROGRAMcommandarerepresented.ThePROGRAMcommandisfollowedbycheckingofthedatapollingregisterbit.
2. PAistheaddressofthememorylocationtobeprogrammed.PDisthedatatobeprogrammed.
3. DQ7isthecomplementofthedatabitbeingprogrammedtoDQ7(SeeDataPollingBit[DQ7]).
4. Seethefollowingtablesfortimingdetails:ReadACCharacteristics,WE#-ControlledWriteACCharacteristics,andCE#-ControlledWriteACCharacteristics.
MYX28F00AM29EWHRevision 1.0 - 11/14/2014
*Advanced information. Subject to change without notice.
43
1Gb Parallel NOR FlashMYX28F00AM29EWH*
Form #: CSI-D-685 Document 003
Figure 16: Chip/Block Erase AC Timing (8-Bit Mode)Figure 27: Chip/Block Erase AC Timing (8-Bit Mode)
AAAh
tWC
tAS
tWP
tDS
tWPH
tAH
tCS
tGHWL
tDH
tCH
A[MAX:0]/A–1
CE#
OE#
WE#
DQ[7:0] AAh
555h AAAh AAAhBAh1555hAAAh
55h 55hAAh80h 10h/30h
Notes: 1. For a CHIP ERASE command, the address is 555h, and the data is 10h; for a BLOCK ERASEcommand, the address is BAd, and the data is 30h.
2. BAd is the block address.3. See the following tables for timing details: Read AC Characteristics, WE#-Controlled
Write AC Characteristics, and CE#-Controlled Write AC Characteristics.
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR FlashWrite AC Characteristics
PDF: 09005aef849b4b09m29ew_256mb_2gb.pdf - Rev. C 9/14 EN 69 Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2012 Micron Technology, Inc. All rights reserved.
Notes:
1. ForaCHIPERASEcommand,theaddressis555h,andthedatais10h;foraBLOCKERASEcommand,theaddressisBAd,andthedatais30h.
2. BAdistheblockaddress.
3. Seethefollowingtablesfortimingdetails:ReadACCharacteristics,WE#-ControlledWriteACCharacteristics,andCE#-ControlledWriteACCharacteristics.
MYX28F00AM29EWHRevision 1.0 - 11/14/2014
*Advanced information. Subject to change without notice.
44
1Gb Parallel NOR FlashMYX28F00AM29EWH*
Form #: CSI-D-685 Document 003
Figure 17: Chip/Block Erase AC Timing (16-Bit Mode)Figure 28: Chip/Block Erase AC Timing (16-Bit Mode)
555h
tWC
tAS
tWP
tDS
tWPH
tAH
tCS
tGHWL
tDH
tCH
A[MAX:0]
CE#
OE#
WE#
DQ[15:0] AAh
2AAh 555h 555hBAh12AAh555h
55h 55hAAh80h 10h/30h
Notes: 1. For a CHIP ERASE command, the address is 555h, and the data is 10h; for a BLOCK ERASEcommand, the address is BAd, and the data is 30h.
2. BAd is the block address.3. See the following tables for timing details: Read AC Characteristics, WE#-Controlled
Write AC Characteristics, and CE#-Controlled Write AC Characteristics.
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR FlashWrite AC Characteristics
PDF: 09005aef849b4b09m29ew_256mb_2gb.pdf - Rev. C 9/14 EN 70 Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2012 Micron Technology, Inc. All rights reserved.
Notes:
1. ForaCHIPERASEcommand,theaddressis555h,andthedatais10h;foraBLOCKERASEcommand,theaddressisBAd,andthedatais30h.
2. BAdistheblockaddress.
3. Seethefollowingtablesfortimingdetails:ReadACCharacteristics,WE#-ControlledWriteACCharacteristics,andCE#-ControlledWriteACCharacteristics.
MYX28F00AM29EWHRevision 1.0 - 11/14/2014
*Advanced information. Subject to change without notice.
45
1Gb Parallel NOR FlashMYX28F00AM29EWH*
Form #: CSI-D-685 Document 003
22 Accelerated Program, Data Polling/Toggle AC Characteristics
Table 20: Accelerated Program and Data Polling/Data Toggle AC Characteristics
ParameterSymbol
Min Max UnitLegacy JEDEC
VPP/WP#risingorfallingtime – tVHVPP 250 – ns
AddresssetuptimetoCE#orOE#LOW tASO tAXGL 15 – ns
AddressholdtimefromOE#orCE#HIGH tAHT tGHAX,tEHAX 0 – ns
CE#HIGHtime tEPH tEHEL2 30 – ns
WE#HIGHtoOE#log(toggleanddatapolling) tOEH tWHGL2 20 – ns
OE#HIGHtime tOPH tGHGL2 20 – ns
Program/erasevalidtoRY/BY#LOW tBUSY tWHRL – 90 ns
Note:
1. Sampledonly;not100%tested.
Figure 18: Accelerated Program AC Timing
Accelerated Program, Data Polling/Toggle AC Characteristics
Table 32: Accelerated Program and Data Polling/Data Toggle AC Characteristics
Parameter
Symbol
Min Max UnitLegacy JEDEC
VPP/WP# rising or falling time – tVHVPP 250 – ns
Address setup time to CE# or OE# LOW tASO tAXGL 15 – ns
Address hold time from OE# or CE# HIGH tAHT tGHAX, tEHAX 0 – ns
CE# HIGH time tEPH tEHEL2 30 – ns
WE# HIGH to OE# log (toggle and data polling) tOEH tWHGL2 20 – ns
OE# HIGH time tOPH tGHGL2 20 – ns
Program/erase valid to RY/BY# LOW tBUSY tWHRL – 90 ns
Note: 1. Sampled only; not 100% tested.
Figure 29: Accelerated Program AC Timing
tVHVPPtVHVPP
VPPH
VIL or VIH
VPP/WP#
Figure 30: Data Polling AC Timing
DQ7#Data DQ7# Valid DQ7Data
Output flagData Output flag ValidDQ[6:0] Data
tHZ/tDFtCE
tOEtOPH
tCH
tBUSY
tOEH
CE#
OE#
WE#
DQ[6:0]
DQ7
RY/BY#
Notes: 1. DQ7 returns a valid data bit when the PROGRAM or ERASE command has completed.
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR FlashAccelerated Program, Data Polling/Toggle AC Characteristics
PDF: 09005aef849b4b09m29ew_256mb_2gb.pdf - Rev. C 9/14 EN 71 Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2012 Micron Technology, Inc. All rights reserved.
MYX28F00AM29EWHRevision 1.0 - 11/14/2014
*Advanced information. Subject to change without notice.
46
1Gb Parallel NOR FlashMYX28F00AM29EWH*
Form #: CSI-D-685 Document 003
Figure 19: Data Polling AC Timing
Accelerated Program, Data Polling/Toggle AC Characteristics
Table 32: Accelerated Program and Data Polling/Data Toggle AC Characteristics
Parameter
Symbol
Min Max UnitLegacy JEDEC
VPP/WP# rising or falling time – tVHVPP 250 – ns
Address setup time to CE# or OE# LOW tASO tAXGL 15 – ns
Address hold time from OE# or CE# HIGH tAHT tGHAX, tEHAX 0 – ns
CE# HIGH time tEPH tEHEL2 30 – ns
WE# HIGH to OE# log (toggle and data polling) tOEH tWHGL2 20 – ns
OE# HIGH time tOPH tGHGL2 20 – ns
Program/erase valid to RY/BY# LOW tBUSY tWHRL – 90 ns
Note: 1. Sampled only; not 100% tested.
Figure 29: Accelerated Program AC Timing
tVHVPPtVHVPP
VPPH
VIL or VIH
VPP/WP#
Figure 30: Data Polling AC Timing
DQ7#Data DQ7# Valid DQ7Data
Output flagData Output flag ValidDQ[6:0] Data
tHZ/tDFtCE
tOEtOPH
tCH
tBUSY
tOEH
CE#
OE#
WE#
DQ[6:0]
DQ7
RY/BY#
Notes: 1. DQ7 returns a valid data bit when the PROGRAM or ERASE command has completed.
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR FlashAccelerated Program, Data Polling/Toggle AC Characteristics
PDF: 09005aef849b4b09m29ew_256mb_2gb.pdf - Rev. C 9/14 EN 71 Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2012 Micron Technology, Inc. All rights reserved.
Notes:
1. DQ7returnsavaliddatabitwhenthePROGRAMorERASEcommandhascompleted.
2. Seethefollowingtablesfortimingdetails:ReadACCharacteristics,AcceleratedProgramandDataPolling/DataToggleACCharacteristics.
MYX28F00AM29EWHRevision 1.0 - 11/14/2014
*Advanced information. Subject to change without notice.
47
1Gb Parallel NOR FlashMYX28F00AM29EWH*
Form #: CSI-D-685 Document 003
Figure 20: Toggle/Alternative Toggle Bit Polling AC Timing
2. See the following tables for timing details: Read AC Characteristics, Accelerated Pro-gram and Data Polling/Data Toggle AC Characteristics.
Figure 31: Toggle/Alternative Toggle Bit Polling AC Timing
Toggle Toggle ToggleData Stoptoggling
OutputValid
tBUSY
tOPH tEPH
tOEH
CE#
WE#
OE#
DQ6/DQ2
RY/BY#
tOPH
tAHT tASO
tAHT
tDH
tASO
A[MAX:0]/A–1
tOE tCE
Notes: 1. DQ6 stops toggling when the PROGRAM or ERASE command has completed. DQ2 stopstoggling when the CHIP ERASE or BLOCK ERASE command has completed.
2. See the following tables for timing details: Read AC Characteristics, Accelerated Pro-gram and Data Polling/Data Toggle AC Characteristics.
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR FlashAccelerated Program, Data Polling/Toggle AC Characteristics
PDF: 09005aef849b4b09m29ew_256mb_2gb.pdf - Rev. C 9/14 EN 72 Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2012 Micron Technology, Inc. All rights reserved.
Notes:
1. DQ7returnsavaliddatabitwhenthePROGRAMorERASEcommandhascompleted.
2. Seethefollowingtablesfortimingdetails:ReadACCharacteristics,AcceleratedProgramandDataPolling/DataToggleACCharacteristics.
MYX28F00AM29EWHRevision 1.0 - 11/14/2014
*Advanced information. Subject to change without notice.
48
1Gb Parallel NOR FlashMYX28F00AM29EWH*
Form #: CSI-D-685 Document 003
23 Program/Erase Characteristics
Table 21: Program/Erase Characteristics
Notes1and2applytotheentiretable.
Parameter Buffer Size Byte Word Min Typ Max Unit Notes
Blockerase(128KB) – – – – 0 .8 4 s
Erasesuspendlatencytime – – – – 27 37 μs
Blockerasetimeout – – – – – 50 μs
Byteprogram
Single-byteprogram – – – – 210 456 μs
Bytewritetobufferprogram
64 64 – – 270 716 μs
128 128 – – 310 900 μs
256 256 – – 375 1140 μs
Effectivewritetobufferprogramperbyte
64 1 – – 4 .22 11 .2 μs
128 1 – – 2 .42 7 μs
256 1 – – 1 .46 4 .45 μs
Wordprogram
Single-wordprogram – – – – 210 456 μs
Wordwritetobufferprogram
32 – 32 – 270 716 μs
64 – 64 – 310 900 μs
128 – 128 – 375 1140 μs
256 – 256 – 505 1690 μs
512 – 512 – 900 3016 μs
Effectivewritetobufferprogramperword
32 – 1 – 8 .44 22 .4 μs
64 – 1 – 4 .84 14 .1 μs
128 – 1 – 2 .93 8 .9 μs
256 – 1 – 1 .97 6 .6 μs
512 – 1 – 1 .76 5 .89 μs
Programsuspendlatencytime – – – – 27 37 μs
Blankcheck – – – – 3 .2 – ms
Setnonvolatileprotectionbittime – – – – 210 456 μs
Clearnonvolatileprotectionbittime – – – – 0 .8 4 s
PROGRAM/ERASEcycles(perblock) – – – 100,000 – – cycles
Erasetosuspend – – – – 500 – μs 3
Notes:
1. Typicalvaluesmeasuredatroomtemperatureandnominalvoltages.
2. Typicalandmaximumvaluesaresampled,butnot100%tested.
3. ErasetosuspendisthetypicaltimebetweenaninitialBLOCKERASEorERASERESUMEcommandandasubsequentERASESUSPENDcommand.Violatingthespecificationrepeatedlyduringanyparticularblockerasemaycauseerasefailures.
MYX28F00AM29EWHRevision 1.0 - 11/14/2014
*Advanced information. Subject to change without notice.
49
1Gb Parallel NOR FlashMYX28F00AM29EWH*
Form #: CSI-D-685 Document 003
24 Package Dimensions
Figure 21: 64-Ball Fortified BGA – 11mm x 13mmFigure 33: 64-Ball Forti�ed BGA – 11mm x 13mm
Seatingplane
0.80 TYP
0.10
13.00 ±0.10
0.60 ±0.05
1.00TYP
3.00TYP
A
B
C
D
E
F
G
H
7.00 TYP
1.40 MAX1.00TYP
2.00 TYP 0.48 ±0.05
11.00 ±0.10
7.00 TYP
64X
8 7 6 5 4 3 2 1
Notes: 1. All dimensions are in millimeters.2. Only 2Gb (1Gb/1Gb) has A1 mark at the bottom.
256Mb, 512Mb, 1Gb, 2Gb: 3V Embedded Parallel NOR FlashPackage Dimensions
PDF: 09005aef849b4b09m29ew_256mb_2gb.pdf - Rev. C 9/14 EN 75 Micron Technology, Inc. reserves the right to change products or speci�cations without notice.
© 2012 Micron Technology, Inc. All rights reserved.
Notes:
1. Alldimensionsareinmillimeters.
MYX28F00AM29EWHRevision 1.0 - 11/14/2014
*Advanced information. Subject to change without notice.
50
1Gb Parallel NOR FlashMYX28F00AM29EWH*
Form #: CSI-D-685 Document 003
25 Ordering Information
Table 22: Ordering Information
Part Number Device Grade
MYX28F00AM29EWHBG-ITRL Industrial
MYX28F00AM29EWHRevision 1.0 - 11/14/2014
*Advanced information. Subject to change without notice.
51
1Gb Parallel NOR FlashMYX28F00AM29EWH*
Form #: CSI-D-685 Document 003
Document Title
1Gb - 64M x 16 Parallel NOR Flash Embedded Memory
Revision History
Revision # History Release Date Status
1 .0 Initialrelease November14,2014 Preliminary