yole st l3g3250 3-axis gyroscope april 2012 sample

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2012 by SYSTEM PLUS CONSULTING, all rights reserved. STMicro L3G3250A 3-Axis MEMS Gyroscope 1

9 rue Alfred Kastler - BP 10748 - 44307 Nantes Cedex 3 - France

Phone : +33 (0) 240 180 916 - email : [email protected] - website : www.systemplus.fr

April 2012 - Version 1

Written by: Romain FRAUX

DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic

estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is

made of the contents of this report. The quoted trademarks are property of their owners.
http://www.systemplus.fr/http://www.systemplus.fr/http://www.systemplus.fr/http://www.systemplus.fr/


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Table of Contents

Glossary

1. Overview / Introduction............4 Executive Summary Reverse Costing Methodology

2. STMicroelectronics Company Profile..........6 ST Profile ST key fabs, assembly and R&D locations ST MEMS Gyroscopes Portfolio L3G3250A Characteristics ST Business Model

3. L3G3250A Physical Analysis..................13 Physical Analysis Methodology Package Characteristics & Markings Package Pin-Out Package X-Ray Package Cross-Section Package Opening ASIC Dimensions ASIC Markings ASIC Cross-Section ASIC Process Characteristics MEMS Dimensions MEMS Markings MEMS Bond Pads Opening MEMS Bond Pads MEMS Cap Opening MEMS Cap MEMS Sensing Area MEMS Cross-section MEMS Process Characteristics Physical Data Summary

4. Manufacturing Process Flow...59 Global Overview ASIC Process Flow Description of the ASIC Wafer Fabrication Unit MEMS Process Overview MEMS Sensor Process Flow MEMS Cap Process Flow MEMS Wafer Bonding Process Flow Description of the MEMS Wafer Fabrication Unit

5. Cost Analysis.....75 Synthesis of the Cost Analysis Main Steps of Economic Analysis Yields Explanation Yields Hypotheses Die per wafer & Probe Test ASIC Front-End : Hypotheses ASIC Front-End Cost ASIC Back-End 0 : Probe Test, Backgrinding & Dicing ASIC Dies Cost MEMS Front-End : Hypotheses MEMS Front-End Cost MEMS Front-End Cost per Process Steps MEMS Front-End : Equipment Cost per Family MEMS Front-End : Material Cost per Family MEMS Back-End 0 : Probe Test & Dicing MEMS Die Cost (Front End + Back End 0) Back-End 1 : Packaging Cost Back-End 1 : Final test & Calibration Cost L3G3250A Component Cost (FE + BE 0 + BE 1)

6. Estimated Price Analysis..........100 Definition of Prices Manufacturer Financial Ratios L3G3250A Estimated Manufacturer Price L3G3250A Estimated Selling Price

Contact.......107
http://www.systemplus.fr/http://www.systemplus.fr/


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Executive Summary

This full reverse costing study has been conducted to provide insight on technology

data, manufacturing cost and selling price of the STMicroelectronics L3G3250A

component.

The L3G3250A is a 3-axis MEMS gyroscope manufactured using a surface

micromachining process (THELMA process).

It is suitable for further applications:

Gaming and virtual reality input devices

Motion control with MMI (man-machine interface)

GPS navigation systems

Appliances and robotics

Compatible with SMD process, the L3G3250A is provided in a 3.5x3x1.0mm LGA 16-

pin package.


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Reverse Costing Methodology

The reverse costing analysis is conducted in 3 phases:

Package is analyzed and measured.

The dies are extracted in order to get overall data: dimensions, main

blocks, pad number and pin out, die marking

Set up of the manufacturing process.

Setup of the manufacturing environment

Cost simulation of the process steps with different year scenarios

Supply Chain Analysis

Analysis of the selling price

Teardown

analysis

Costing

analysis

Sellingprice

analysis


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Packages X-Ray


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Package OpeningSEM view

Package Opening


7/17 2012 by SYSTEM PLUS CONSULTING, all rights reserved. STMicro L3G3250A 3-Axis MEMS Gyroscope 7

MEMS Cap Opening

MEMS with Cap removed OverviewSEM View



ST's 3-Axis Gyroscope MEMS Dies Comparison



MEMS - Cross-Section

MEMS cap cross-sectionSEM View



Sensor Process Flow



Si wafer

Thinning 300m

Isolation oxide

(Oxide1) deposit

Si wafer

Buried Poly (Poly1)deposition

Ion implantation

Pattern & etch

Si wafer

Sacrificial oxide(Oxide 2) deposit

Pattern & etch

Si wafer

Structural Layer(Poly 2) deposit

CMP & ion implant

Sensor Process Flow 1/2



ASIC Front-End Cost

Probe Test Cost

Backgrinding & Dicing Cost

We perform the economic analysis of the ASIC with the IC Price+ software.

We perform the economic analysis of the MEMS and the packaging with the MEMS CoSim+ software.

Packaging Cost

Final Test & Calibration Cost

Component Cost

MEMS Front-End Cost

Probe Test Cost

Dicing Cost

Main steps of economic analysis

L3G3250A

Back-End 0

Back-End 1

Front-End
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ASIC Die Cost (Front-End + Back-End 0)



MEMS Front-End Cost



MEMS FE Cost per Process Steps (1/2)

Sensor Manufacturing Steps Cost (Simu lated with MEMS CoSim+ Cost Simulation Tool)



L3G3250A Component Cost (FE+BE 0+BE 1)


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L3G3250A Estimated Selling Price (Medium Yield)

yole st l3g3250 3-axis gyroscope april 2012 sample

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