x-ray inspection of bgas
TRANSCRIPT
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X-Ray Inspection of BGAs
November 2017
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X-Ray Inspection-BGAs IPC-A-610 G Criteria
You DO NOT HAVE to x-ray BGAs according to the IPC-A-610G
CHOICEA.Develop process. Validate process using x-ray. Sample plan inspection. Need to have objective
evidenceOR
B. Inspect via x-ray
Note: X-ray equipment not intended for electronic assemblies or not properly set up can damage sensitive assemblies
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Collapsing Soldering Balls
Note 1. Design induced voids, e.g., microvia in land, are excluded from this criteria. In such cases acceptance criteria shall be established between the manufacturer and user.
Note 2. Manufacturers may use test or analysis to develop alternate acceptance criteria for voiding that consider the end-use environment.
Feature Classes 1,2,3 X-Ray
Alignment Solder ball offset does not violate minimum electrical clearance.
Can scan to see separation of balls or use built-in metrology tools
Solder Ball Spacing
Solder ball offset does not violate minimum electrical clearance.
Can scan to see separation of balls or use built-in metrology tools
Soldered Connections
No solder bridging; BGA solder balls contact and wet to the land forming a continuous elliptical round or pillar connection.
No non-common connections of solder balls. Telltale sign is same ball volume/area based on min amd max set oints
Voids 30% or less voiding of any ball in the x-ray image area.1,2
Modern x-ray can measure
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Non-Collapsing Soldering Balls
Note 1. Design induced voids, e.g., microvia in land, are excluded from this criteria. In such cases acceptance criteria shall be established between the manufacturer and user.
Note 2. Manufacturers may use test or analysis to develop alternate acceptance criteria for voiding that consider the end-use environment.
Feature Classes 1,2,3 X-Ray
Alignment Solder ball offset does not violate minimum electrical clearance.
Can scan to see separation of balls or use built-in metrology tools
Soldered Connections
No solder bridging; BGA solder balls contact and wet to the land forming a continuous elliptical round or pillar connection.
No non-common connections of solder balls. Telltale sign is same ball volume/area based on min and max set points
Voids No to little voiding
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IPC-7095 Inspection Guidelines
NOTE: These are guidelines (suggestions)
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Oblique View
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Know What You Are Looking For
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Know What You Are Looking For
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Open
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Short
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Short
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Broken Wire Bond
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Voiding
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Starved Solder Joint
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Non Uniform Collapse
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Solder Anomolies
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Uneven HeatingSmaller
Larger
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Measurement and QC
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iPhone 4 Example