wb300 englis
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www.wagenbrett.de
ISIT
Fraunhofer InstitutSiliziumtechnologie
Device qualification at ISITDevice qualification at ISIT
Solder Ball Attach WB-300
www.wagenbrett.de
ISIT
Fraunhofer InstitutSiliziumtechnologie
Device qualification at ISITDevice qualification at ISIT
Solder Ball Attach WB-300
www.wagenbrett.de
ISIT
Fraunhofer InstitutSiliziumtechnologie
• unlimited umber of balls
• standard SMD stencil tooling
• throughput ca. 20 substrates / h
• ball diameter : 760 – 250 µm
• series production
Vakuum Feeding Gravity Feeding
• number of balls limited
• tooling expensive, long supplytime
• throughput ca. 4 substrates / h
• ball diameter : 760 – 300 µm
• prototyping
PlacementAlignment
www.wagenbrett.de
ISIT
Fraunhofer InstitutSiliziumtechnologie
Wagenbrett WBWagenbrett WB--300300• application of solder spheres300 µm - 760 µm Ø
• wafer 4“- 300 mm, PCB
• qualified for WLP-CSPproduction at Fraunhofer ISIT
• 52.000 solder balls per 6“-wafer,500 µm Pitch, 300 µm Ø
• throughput: typ. 21 wafer/h
• Yield: 99,994 %
www.wagenbrett.de
ISIT
Fraunhofer InstitutSiliziumtechnologie
Wagenbrett WBWagenbrett WB--300300• ball attach after UBM and grinding
• ball fixation with stencil printed tacky flux
• positioned balls are tolerant to waferhandling
• rework is possible after flux print and ball attach
www.wagenbrett.de
ISIT
Fraunhofer InstitutSiliziumtechnologie
Wagenbrett WBWagenbrett WB--300300• “Gravity Feeding“ works with excessive
ball numbers
• multiple balling runs with the same ballsis uncritical
• 3 point adjust is very effective for fastsubstrate exchange
• surplus balls run off the stencil by tilting
• stencil cleaning is usually not requiredduring the processing!
www.wagenbrett.de
ISIT
Fraunhofer InstitutSiliziumtechnologie
Wagenbrett WBWagenbrett WB--300300
monitor
X,Y, Θ adjust
cameras
stencil
machine control
cross hairs generator (optional)
www.wagenbrett.de
ISIT
Fraunhofer InstitutSiliziumtechnologie
semi automatic machine conceptsemi automatic machine concept
• simplified process control concept for ease of operation
• robust substrate vacuum fixation
• controlled roll off of surplus solder balls without operatorintervention
www.wagenbrett.de
ISIT
Fraunhofer InstitutSiliziumtechnologie
substrate preadjustsubstrate preadjust
exchangable vacuum plate cavity for
vacuum tweezer
universal fixation of different substrate diameters up to 300 mm
preadjust with 3 points
customer specific vacuum plates on request
ESD-conform design
www.wagenbrett.de
ISIT
Fraunhofer InstitutSiliziumtechnologie
solder ball mangementsolder ball mangement
Surplus balls are removed by stencil tilting!
stencil
wafer flux deposit
solder ball
distance
www.wagenbrett.de
ISIT
Fraunhofer InstitutSiliziumtechnologie
solder ball mangementsolder ball mangement
• ESD-conform ball container forsurplus balls
• very low risk of ball defects
• reduced number of manualhandling
• solder ball management workswith SAC lead free alloys, tested with 300 µm Ø, 500 µm Ø
www.wagenbrett.de
ISIT
Fraunhofer InstitutSiliziumtechnologie
machine setupmachine setup
• easy machine setupwith precision heightadjust gauge
• available as option
www.wagenbrett.de
ISIT
Fraunhofer InstitutSiliziumtechnologie
Experience in balling througput Experience in balling througput WBWB--300 solder ball attach tool300 solder ball attach tool
processing time for ball attach < 3 minutes/wafernew tooling setup < 10 minutesnumber of missing balls in mean: 2 balls per 52000 balls placed, equals 99,994 % yieldquality is nearly independet of operatorlow demand on operator qualificationattached balls can be reworked if necessary
www.wagenbrett.de
ISIT
Fraunhofer InstitutSiliziumtechnologie
statistics of missing balls for statistics of missing balls for ball attach with WBball attach with WB--300300
0
1
2
3
4
5
6
W1
W2
W3
W4
W5
W6
W7
W8
W9
W10
W11
W12
W13
W14
W15
W16
W17
W18
W19
W20
W21
W22
W23
W24
Wafer Nummer
Number of missing balls after reflow
Example of 2 lots á 24 wafers
52000 solder balls per wafer,
6“, 300 µm Ø, pitch 500 µm
Yield
100 %
99,998 %
99,996 %
99,994 %
99,992 %
99,990 %
www.wagenbrett.de
ISIT
Fraunhofer InstitutSiliziumtechnologie
solder ball attach on alternative solder ball attach on alternative substratessubstrates
FR4 substrate silicon die
www.wagenbrett.de
ISIT
Fraunhofer InstitutSiliziumtechnologie
application specific modifications application specific modifications WBWB--300300
machine options:ESD-blowercross hair generatorcustom design vacuum platereduction frameprecision height adjust gaugeapplication training at ISIT