vlsi - silicon gate technology
TRANSCRIPT
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Silicon Gate Technology and
Ion Implantati
on
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ION IMPLANTATION
Ion Implantation is an alternative to deposition/diffusion
and is used to produce a shallow surface region of dopant
atoms deposited into a silicon wafer.
In this process a beam of impurity ions is accelerated to
kinetic energies in the range of several tens of kV and is
directed to the surface of the silicon.
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The impurity atoms enter the crystal, they give up their
energy to the lattice in collisions and finally come to rest
at some average penetration depth, called the projected
range expressed in micro meters.
Depending on the impurity and its implantation energy,
the range in a given semiconductor may vary from a few
hundred angstroms to about 1micro meter.
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ION IMPLANTATION SYSTEM
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The ions are generated and repelled from their source in
a diverging beam that is focused before if passes through
a mass separator that directs only the ions of the desired
species through a narrow aperture.
A second lens focuses this resolved beam which then
passes through an accelerator that brings the ions to their
required energy before they strike the target and become
implanted in the exposed areas of the silicon wafers.
The accelerating voltages may be from 20 kV to as much
as 250 kV.
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ADVANTAGES:
Ion implantation provides much more precise control
over the density of dopants deposited into the wafer, and
hence the sheet resistance.
Due to precise control over doping concentration, it is
possible to have very low values of dosage so that very
large values of sheet resistance can be obtained. These
high sheet resistance values are useful for obtaining
large-value resistors for ICs.
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Another advantage of ion implantation is that it can be
done at relatively low temperatures, this means that
doped layers can be implanted without disturbing
previously diffused regions. This means a lesser
tendency for lateral spreading.
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THE SILICON GATE TECHNOLOGY
The Silicon Gate Technology was the worlds first
commercial MOS self-aligned-gate process technology.
Before this technology, the control gate of the MOS
transistor was made with aluminum instead of
polycrystalline silicon.
Aluminum-gate MOS transistors were three to four
times slower, consumed twice as much silicon area,
had higher leakage current and lower reliability
compared with silicon-gate transistors
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Faggin created the silicon gate technology in 1968 while
working in the R&D Laboratories of Fairchild
Semiconductor in Palo Alto, CA.
A transistor gate is formed wherever polysilicon crosses
diffusion (semiconductor) with oxide between these
layers.
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PROCESS OF FABRICATION
STEP 1:
Si-substrate
Pure Si single crystal
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P-type impurity is lightly doped
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STEP 2:
Thick SiO2(1 m)
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Fig. (4) Photoresist is depositedover SiO2 layer
Thick SiO2(1 m)
Photoresist
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STEP 3:
Thick SiO2(1 m)
UV Light
Mask-1
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Photoresist
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Thick SiO2(1 m)
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STEP 4:
UV Light
Mask-2
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Thick SiO2(1 m)
Thin SiO2(0.1 m)
Polysilicon used as GATE(1 2 m)
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STEP 5
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Thick SiO2
(1 m)
Thin SiO2(0.1 m)
GATE
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n+
SOURCE DRAIN
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ADVANTAGES OF SILICON GATE
TECHNOLOGY
FAST AND LOW POWER CONSUMING:
the drastic reduction of the overlap
capacitances between the gate electrode and the source
and drain junctions.
COST-EFFECTIVE
RELIABLE
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THANKYOU