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    Silicon Gate Technology and

    Ion Implantati

    on

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    ION IMPLANTATION

    Ion Implantation is an alternative to deposition/diffusion

    and is used to produce a shallow surface region of dopant

    atoms deposited into a silicon wafer.

    In this process a beam of impurity ions is accelerated to

    kinetic energies in the range of several tens of kV and is

    directed to the surface of the silicon.

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    The impurity atoms enter the crystal, they give up their

    energy to the lattice in collisions and finally come to rest

    at some average penetration depth, called the projected

    range expressed in micro meters.

    Depending on the impurity and its implantation energy,

    the range in a given semiconductor may vary from a few

    hundred angstroms to about 1micro meter.

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    ION IMPLANTATION SYSTEM

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    The ions are generated and repelled from their source in

    a diverging beam that is focused before if passes through

    a mass separator that directs only the ions of the desired

    species through a narrow aperture.

    A second lens focuses this resolved beam which then

    passes through an accelerator that brings the ions to their

    required energy before they strike the target and become

    implanted in the exposed areas of the silicon wafers.

    The accelerating voltages may be from 20 kV to as much

    as 250 kV.

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    ADVANTAGES:

    Ion implantation provides much more precise control

    over the density of dopants deposited into the wafer, and

    hence the sheet resistance.

    Due to precise control over doping concentration, it is

    possible to have very low values of dosage so that very

    large values of sheet resistance can be obtained. These

    high sheet resistance values are useful for obtaining

    large-value resistors for ICs.

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    Another advantage of ion implantation is that it can be

    done at relatively low temperatures, this means that

    doped layers can be implanted without disturbing

    previously diffused regions. This means a lesser

    tendency for lateral spreading.

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    THE SILICON GATE TECHNOLOGY

    The Silicon Gate Technology was the worlds first

    commercial MOS self-aligned-gate process technology.

    Before this technology, the control gate of the MOS

    transistor was made with aluminum instead of

    polycrystalline silicon.

    Aluminum-gate MOS transistors were three to four

    times slower, consumed twice as much silicon area,

    had higher leakage current and lower reliability

    compared with silicon-gate transistors

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    Faggin created the silicon gate technology in 1968 while

    working in the R&D Laboratories of Fairchild

    Semiconductor in Palo Alto, CA.

    A transistor gate is formed wherever polysilicon crosses

    diffusion (semiconductor) with oxide between these

    layers.

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    PROCESS OF FABRICATION

    STEP 1:

    Si-substrate

    Pure Si single crystal

    - - - - - - - - - - - - - - - - - - - - - - - -

    - - - - - - - - - - - - - - - - - - - - - - - - -- - - - - - - - - - - - - - - - - - - - - - - - - -

    - - - - - - - - - - - - - - - - - - - - - - - - -

    P-type impurity is lightly doped

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    STEP 2:

    Thick SiO2(1 m)

    - - - - - - - - - - - - - - - - - - - - - - - -

    - - - - - - - - - - - - - - - - - - - - - - - - -- - - - - - - - - - - - - - - - - - - - - - - - - -

    - - - - - - - - - - - - - - - - - - - - - - - - -

    Fig. (4) Photoresist is depositedover SiO2 layer

    Thick SiO2(1 m)

    Photoresist

    - - - - - - - - - - - - - - - - - - - - - - - -- - - - - - - - - - - - - - - - - - - - - - - - -- - - - - - - - - - - - - - - - - - - - - - - - - -

    - - - - - - - - - - - - - - - - - - - - - - - - -

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    STEP 3:

    Thick SiO2(1 m)

    UV Light

    Mask-1

    - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -- - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -

    -- - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -- - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -

    Photoresist

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    Thick SiO2(1 m)

    - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -- - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -

    -- - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -

    - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -

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    STEP 4:

    UV Light

    Mask-2

    - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -- - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -

    -- - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -- - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -

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    Thick SiO2(1 m)

    Thin SiO2(0.1 m)

    Polysilicon used as GATE(1 2 m)

    - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -- - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -

    -- - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -

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    STEP 5

    - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -- - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -

    -- - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -- - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -

    Thick SiO2

    (1 m)

    Thin SiO2(0.1 m)

    GATE

    - - -- - -n+

    - - - -- -

    n+

    SOURCE DRAIN

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    ADVANTAGES OF SILICON GATE

    TECHNOLOGY

    FAST AND LOW POWER CONSUMING:

    the drastic reduction of the overlap

    capacitances between the gate electrode and the source

    and drain junctions.

    COST-EFFECTIVE

    RELIABLE

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    THANKYOU