virtual fabrication changing the trajectory of chip ...201… · • virtual fabrication enables...
TRANSCRIPT
Virtual Fabrication – Changing the Trajectory of Chip Manufacturing
Dinesh R. Bettadapur Vice President, Business Development
Presentation Outline
• Problem Statement
• Solution: Virtual Fabrication
• Virtual Fabrication Value Triangle #1
• Use Cases
• Virtual Fabrication Value Triangle #2
• Use Cases
• Summary
2 DB CASPA AC 2016
Logic Complexity is Going Way Up
Gate All-Around
Nanowires
Planar
Transistor
3D
FinFET
Device
Dramatic Increase in Structural Device Complexity
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Memory Complexity is Skyrocketing!
3D NAND – 36L 3D NAND – 48L 3D NAND – 72L
Memory Structures ≈ High Rise Buildings!
4 DB CASPA AC 2016
Exploding R&D Wafer Budgets
5 DB CASPA AC 2016
Exponential Increase in Development Wafer Runs
Exploding Process Development & Fab Costs
New Process Cost: > $2B & New Fab Cost: > $5B 6 DB CASPA AC 2016
Old Paradigm: Build & Test
Experimental Lots:
Splits, Short-Loops
FEOL/BEOL or Full-Flow
Characterization:
Inline Metrology
Offline Physical Analysis
Electrical Testing
Feedback:
Engineering Analysis
POR Change
Test-Chip Design:
Characterization structures for
known/expected targets and challenges
Repeat Every
~1-3 Months
New Test-Chip:
New & updated targets
Unexpected challenges
Repeat Every
~1 Year
“Cycles of Learning”
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Old Paradigm Applied to Advanced Process Development
8
More processes to monitor
More test-chip structures!!!
Longer fab cycle time
More wafers required to cover options
More tests and measurements More complex problems to solve
MUST ELIMINATE CYCLES OF LEARNING TO ACCELERATE DEVELOPMENT
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Single Exposure vs. Multi-Patterning
9
Litho Steps Etch Steps Deposition
Steps Multi
Patterning 1 9 12 DB CASPA AC 2016
Litho Steps Etch Steps Deposition
Steps Single
Exposure 1 1 1
Solution: Virtual Fabrication
• Virtual Fabrication is a powerful virtualization technology based on advanced 3D process modeling & simulation – • Process visualization (FEOL, MOL, BEOL)
• Integrated process effects at each unit process step
• Process variation impact on device yield
• Benefits – • Significantly reduced wafer costs
• Elimination of multiple cycles of learning
• High speed process-predictive simulation
• Broad set of applications –
• Research Path finding Yield ramp up
DB CASPA AC 2016
Virtual Fabrication Value Triangle #1
Virtual
Fabrication
Vendors
IDMs and
Foundries
Equipment
Companies
Tool Spec, Process Equipment
Unit Process Requirements
Advanced Chip Manufacturing Requires Higher Degree of Collaboration 11 DB CASPA AC 2016
Use Case: Cross Wafer Uniformity Improvement
Unit Process Variations Integrated Process Effects 12 DB CASPA AC 2016
Use Case: Process Variation Reduction
SEMICON West 2014 & IEDM 2015
Virtual Fabrication is used to prioritize and synchronize
inline specifications for variation reduction
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• Evaluation of new 7nm integration schemes
• Two RMG schemes: PMOS 1st and NMOS 1st
Use Case: 7nm Process Branch Decision
"RMG nMOS 1st Process Enabling 10x Lower Gate Resistivity in N7 Bulk FinFETs", VLSI Symposium 2015
Virtual Fabrication is used to evaluate parallel integration
schemes optimal process decision
• NMOS 1st shows significant advantages
• Clear gap fill benefits and HfO2 not exposed
• No barrier is needed
• Better resistivity (extracted from transmission lines)
14 DB CASPA AC 2016
Use Case: Memory & Logic Defect Prediction Studies
Mandrel Litho Defects
1 = Resist Bubble
2 = Scumming
3 = Scumming
Block Litho Defects
4 = Scumming
5 = Resist Bubble
Completed Mx Module
1,3,5 = No Impact
2 = Single-Break Open
4 = Double-Break Open
Virtual Fabrication is used to model defect evolution and predict future process impact 15 DB CASPA AC 2016
Virtual Fabrication Value Triangle #2
Virtual
Fabrication
Vendors
Foundries
Fabless
Design
Houses
Manufacturable Designs
Design rules, Encrypted process parameters,
Yielding wafers
Win-Win-Win Partnership 16 DB CASPA AC 2016
Use Case: Design-Technology Co-Optimization
Silicon-Accurate
Geometry in 3D
3D Search for Process Failures
M1-V1-M2
BEOL Braid
Design and
Layout in 2D
Iterate virtually through design-manufacturing
cycles
Adjust Design Rules
and Specify Waivers
Min Insulator Failures Net ID and Count Min Line Width
Failures
3D Search for Process Failures
17 DB CASPA AC 2016
Use Case: 3D DTC
Virtual Fabrication Enables 3D Design Technology Checking
Signoff
2D Single-Level Checks:
Litho Printability
Pattern Density
etc.
2D DRC
3D DTC Checks:
Minimum Insulator
Contact Area
etc.
Process &
Variation
Data
3D DTC
18 DB CASPA AC 2016
Use Case: BEOL Process Variability Analysis
• Virtual Fabrication detects contact opens or shorts
Baseline
two electrical contacts (two colors)
Via over etch
results in contact short (one color)
CONTACT 1
Via under etch
results in contact open (multiple colors)
CONTACT 1 CONTACT 2 1 CONTACT 2 3 4 5 6 7 8 9
Metal contact area limitation Metal line width limitation Metal line spacing limitation
*Blue color indicates violation
• Virtual Fabrication detects high resistance interconnect failures*
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Use Case: Litho Process Variability Prediction
© Coventor, Inc. Confidential
3D resist contours for M1
Full M1 process integration
Dose: -10%
Defocus: -50nm
Dose: +10%
Defocus: +50nm
Net counts identifies
short and open failures
Space checks highlights
proximity failures
Virtual Fabrication Enables Accurate Prediction of Integrated Structural Failures
Materials checks locate
high resistance regions
20 DB CASPA AC 2016
Summary
• Process complexity and process development costs are growing exponentially for sub-20nm chip manufacturing
• Process complexity drivers: Complex device architectures (FinFET, 3D NAND, GAA), Complex patterning schemes (quad patterning), and Complex structures (BEOL passives, Memory)
• Old paradigms of build & test and silo-based unit process development are simply too expensive and time consuming!
• Virtual Fabrication is an innovative and powerful integrated process modeling technology that can enable significantly lower wafer costs and reduced cycles of learning
• Virtual Fabrication enables broad array of use cases in Process R&D and Chip Manufacturing
• Virtual Fabrication has been widely adopted by the world’s leading foundries, memory makers, logic manufacturers, and equipment companies
21 DB CASPA AC 2016