the luxtera epic program “electronic and photonic

Luxtera, Inc. OIDA

The Luxtera EPIC ProgramThe Luxtera EPIC Program

““Electronic and Photonic Electronic and Photonic Integrated CircuitsIntegrated Circuits””

March 5, 2007

Cary GunnCTO, Co-founder

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4. TITLE AND SUBTITLE Electronic and Photonic Integrated Circuits

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13. SUPPLEMENTARY NOTES DARPA Microsystems Technology Symposium held in San Jose, California on March 5-7, 2007.Presentations, The original document contains color images.

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2Luxtera, Inc. Luxtera Confidential

Luxtera CMOS Photonics TechnologyLuxtera CMOS Photonics TechnologyFlip-chip bonded lasers

wavelength 1550nmpassive alignmentnon-modulated = low cost/reliable

Silicon Optical Filters - DWDMelectrically tunableintegrated w/ control circuitryenables >100Gb in single mode fiber

Complete 10G Receive PathGe photodetectorstrans-impedance amplifiersoutput driver circuitry

Ceramic Package

Fiber cable plugs here

Silicon 10G Modulatorsdriven with on-chip circuitryhighest quality signallow loss, low power consumption

The Toolkit is Complete10Gb modulators and receiversIntegration with CMOS electronicsCost effective, reliable light sourceStandard packaging technology


Trailblazer in Silicon PhotonicsTrailblazer in Silicon PhotonicsMission:

• Deliver photonic solutions manufactured in a mainstream CMOS fabrication, test and assembly processes to provide customers with high performance optical solutions at price points traditionally associated with copper

Funded: November 2001

Location: Carlsbad, CA

Staff: 57

Top Tier Investors:• August Capital

• New Enterprise associates

• Sevin Rosen Funds

• Three Corporate Investors

Intellectual Property:• >100 Patents Filed For

• 40 Issued


Unbroken String of IndustryUnbroken String of Industry’’s Firstss Firsts

2001 – The first CMOS waveguide and

Fiber-to-the-Chip Coupler

2002 – The first CMOS photonics in standard

130 nm SOI-CMOS process

2003 – The first CMOS 10G Modulator

2004 – First Laser bonded to a CMOS die

2005 – First wafer scale optical probing

2005 – First single chip dual XFP transceiver

2006 – First monolithic CMOS 4x10G WDM

2007 – Major announcements coming… ?


CMOS Photonics FoundryCMOS Photonics FoundryLuxtera uses FSL’s 0.13µm SOI process

• Same process used to construct their PowerPC™ embedded microprocessors

• Very high yield, high volume, mature process

Design environment is Cadence at the system/subsystem level

• Device design done on 200 node cluster running 3D FDTD

• Can perform LVS, DRC on optical circuits

Philosophy: Started with existing electronics design manual, and make the optics fit – requires extensive characterization, simulation, compromise

• ~80 films in a CMOS process, need to understand optical properties of ALL of them


Example CMOS Photonics Chips:

Two independent 10Gb transceivers

on a single die(contains

complete PHY circuitry)

A single 40Gb WDM transceiver4λ x 10Gb

(PMD circuits only)

Aurora Pulsar

Luxtera, Inc. OIDA

Component Level TechnologyComponent Level Technology


The fiber coupling problemThe fiber coupling problem

Single mode fiber has 10µm diameter core, cross section of 80µm²

A “good” SOI waveguide has cross sectional area of 0.1µm²

Coupling efficiency is approx. the ratio of the areas: 0.1/80 = 0.1% (-30dB)

Better than 50% (-3dB) desired

fiber

waveguide


10um fiber core

waveguides

Holographic Lens


Holographic Lens EvolutionHolographic Lens Evolution

Wavelength (µm)

Inse

rtion

Los

s (d

B) Today’s

D.O.R.

Firstdesign

Seconddesign

Thirddesign

Bestdesign


Wafer-scale testing

Low cost Fiber to the Chip attachFlip-chip mounted lasers

Vertical optical coupling enables…

LuxteraLuxtera’’s key to Fibers key to Fiber--toto--thethe--chip: chip: connecting the micro and connecting the micro and nanonano scalesscales


Routing Routing -- Waveguide LossWaveguide Loss

-0.10

-0.05

0.00

0.05

0.10

0.15

0.20

0.25

0.30

Passive split double SOI Passive split DPS deep

Wav

egui

de L

oss

(dB

/cm

)

Process 2Process 1

Waveguide Loss no longer a major issue


Electrically Tunable Arrayed Waveguide Grating (AWG)Electrically Tunable Arrayed Waveguide Grating (AWG)

calibrationlight in

light out (more taps to the right)

DAC array

opticalAWG


Electrically tunable AWG resultsElectrically tunable AWG results

BEFORE TUNING AFTER TUNING

1550 1551 1552 1553 1554 1555 1556-45

-40

-35

-30

-25

-20

-15

Wavelength (nm)

Rec

eive

d po

wer

(dB

m)

1550 1551 1552 1553 1554 1555 1556-45

-40

-35

-30

-25

-20

-15

Wavelength (nm)

Rec

eive

d po

wer

(dB

m)


Modulator with integrated driverModulator with integrated driver

CMOS Optical Modulator with Differential DriverISSCC 2006, A Huang, et al.


CMOS Optical Modulator PerformanceCMOS Optical Modulator Performance

10G Eye

10G

Rolloff >20GHz


Second Generation TechnologySecond Generation Technology


Ring modulators = high density/bandwidth Ring modulators = high density/bandwidth

30 um radius ring

Many Tb per mm²

2000x smaller than electronic PHY

Bus Waveguide

Ring Waveguide

High-speed modulation region(pn diode)

High-speed electrical signalGround Ground

CW light in

27 1527.5 1528 1528.5 1529 1529.5

A B Transmission A-> B

Wavelength (nm)

LASER

NOTCH FILTER


Ring Modulators Work at 10GRing Modulators Work at 10G

0 5 10 15 20-6

-5

-4

-3

-2

-1

0

1

Frequency (GHz)

12GHz rolloff

EO

Res

pons

e (d

B)

10G


Small Tunable Optical Filter for WDMSmall Tunable Optical Filter for WDM

InputDropThru

Filter occupies 30x30µm area

Tunable filters allow:Dynamic reconfigurationOperation over wide temperature range Tuning Current (mA)


GeGe detectors at 10Gbpsdetectors at 10Gbps

Eye diagram at 10Gb/s, 1550nm, 3V reverse bias, no TIA

Ge

Si

High speed deviceTypical performance @ 50C, 1550nm, 3V reverse biasResponsivity 0.5A/WDark current 30uACapacitance 30fFBandwidth 14 GHz

Low speed deviceTypical performance @ 50C, 1550nm, 3V reverse biasResponsivity 0.4A/WDark current 3nABandwidth 5 GHz

Heterojunctionwaveguide photodetector

Luxtera, Inc. OIDA

Commercial Commercial Applications of Applications of

Luxtera TechnologyLuxtera Technology


Sampling Now:Sampling Now:

TwoTwo 10G transceivers on a 10G transceivers on a

single diesingle die


XFPXFP

Aurora Aurora –– the First Productthe First Product2 2 XFP Modules in a single ChipXFP Modules in a single Chip

AuroraAurora ¼¼ size of XFPsize of XFP

Over 50% lower costOver 50% lower cost

Up to 2,000m reachUp to 2,000m reach

XFP compliant XFP compliant managementmanagement

XFPXFP


Flipchip Bonded Non-Modulated

Lasers

Integrated Photodetectors

Silicon Modulators and Drivers

Complete Receiver, TIA,

CDR

Optical Fiber to the Chip Coupling

Fiber Connects Here


EPIC Program Progress EPIC Program Progress ––MultiwavelengthMultiwavelength TransceiversTransceivers


100Gb Transceiver 100Gb Transceiver –– Prototypes Oct 2008Prototypes Oct 2008

Mux

10G Mod10G Mod

10G ModD

emux

10G Ge10G Ge

10G Ge

Mod Drivers

TIAs

λ1

I/O

I/O

100Gb Data In

100Gb Data Out

TX Fiber – 100Gb

RX Fiber – 100Gb

Bias and Control

...

...

......

...

λ2

λ10

PH

Y

PH

Y

PH

Y

PH

Y

PH

Y

PH

Y

≤ 4W≤ 40 mm2

0-70 C


Snapshot of fabricated Snapshot of fabricated Pulsar diePulsar die

Low speed PDs

For control system

4-ch Optical mux

Optical demuxes

High speed PDs

Holographic lenses

One TX/RX channel

Single-chip 40 Gb/stransceiver


WDM WDM mux/demuxmux/demux

IL = 1.5dB

Crosstalk ~20dB

Bias and Control algorithm implemented off-chip

λ1 λ2 λ3 λ4

Ch 1 Ch 3 Ch 2 Ch 4


ResultsResults

Tx 3 Output Tx 3 Rx 1

Tx 3 Rx 2 Tx 3 Rx 4


Can we do a 10Tb transceiver in a 1cm die? Can we do a 10Tb transceiver in a 1cm die? (That(That’’s 1000 10Gb s 1000 10Gb TRXsTRXs, each 316x316, each 316x316µµm!)m!)

Total Area (mm²): 0.1000

Modulator 0.0036 (3.6%)

Demux: 0.0009 (1%)

Mux: 0.0009 (1%)

Detector: 0.0001 (.1%)

Optical Routing: 0.0050 (5%)

----------------------------------------------------

Area remaining for 0.0886 (89%)

transceiver electronics

Luxtera has demonstrated the optics for a 10Tb transceiver in a 1cm² die


Conclusion: CMOS Photonics Chips Are Working

Two independent 10Gb transceivers

on a single die(contains

complete PHY circuitry)

A single 40Gb WDM transceiver4λ x 10Gb

(PMD circuits only)

Aurora Pulsar


ConclusionsConclusionsDARPA EPIC Program has already been a success -- Silicon Photonics Technology is working – currently sampling to customers

Technology offers the performance of optics, at the price of copper

There are many technical advantages for silicon photonics to achieve low cost

• CMOS Manufacturing

• Wafer scale testability of optics and electronics

• Built-In Self Test

• Simplified packaging approach

• Many channels can be put in a single package

Longwave (1300-1600nm), single-mode fiber will become the lowest cost alternative

the luxtera epic program “electronic and photonic

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