the challenges of the new global scenario paolo prinetto politecnico di torino (italy) university of...

The challenges of The challenges of the new global the new global

scenarioscenario

The challenges of The challenges of the new global the new global

scenarioscenario

Paolo PRINETTOPolitecnico di Torino (Italy)

University of Illinois at Chicago, IL (USA)

[email protected] [email protected]

www.testgroup.polito.it

Lecture

1.1

2 I.1

Goal

The lecture is aimed at outlining where most of today designers’ constraints come from.

Thus it first presents the current trends in the microelectronic industries, with particular emphasis on System-on-a-Chip.

It then outlines the various phases of a product life cycle, focusing on Concurrent Engineering approaches.

3 I.1

Homework

Students are warmly invited to visit:

web pages related to microelectronic trends, such as:

The International Technology Roadmap for Semiconductors home page at

http://public.itrs.net

http://public.itrs.net/



4 I.1

Homework (cont’d)

web pages related to on-going standardization activities on System-on-a-Chip, such as:

VSI Alliance home page at

http://www.vsi.org/IEEE P1500 Standard for Embedded Core Test (SECT) home page at

http://grouper.ieee.org/groups/1500/

http://www.vsi.org/

http://grouper.ieee.org/groups/1500/

5 I.1

Further readings

No particular suggestion

Waves of electronic computingWaves of electronic computing

1960 1970 1980 1990 2000 2010

Time sharing

Batch

MainframeMainframeSystemsSystems


1960 1970 1980 1990

PC

Word processing

Web

e-Commerce

PC basedPC basedSystemsSystems

Time sharing

Batch


2000 2010


1960 1970 1980 1990 2000 2010

PC

Word processing

Web

e-Commerce

PC basedPC basedSystemsSystems

Time sharing

Batch


EmbeddedEmbeddedSystemsSystems

Telecommunication & Network

Portable Consumer Products

Multimedia

Embedded Control

Two forces working in conjunction in electronics industry


Consumerizatio

n

Consumerizatio

n

Miniaturization

Miniaturization

11 I.1

Consumerization of the microelectronic industry

High volumes

Consumerizatio

n

Consumerizatio

n

Consumerizatio

n

Consumerizatio

n

Consumerizatio

n

Consumerizatio

n

12 I.1

Some facts ...

50 millions of Pentium produced every year (1 Pentium every 0.6 s!!)

100 millions of PC and 3 millions of servers sell in ‘99

...

PentiumPentium® Pro ProProcessor Processor

®®RR

Consumerizatio

n

Consumerizatio

n

Consumerizatio

n

Consumerizatio

n

Consumerizatio

n

Consumerizatio

n

13 I.1


High volumes High costs for design and production

Consumerizatio

n

Consumerizatio

n

Consumerizatio

n

Consumerizatio

n

Consumerizatio

n

Consumerizatio

n

14 I.1

High costs for design

0

100

200

300

400

500

# D

esig

ners

4004 80286 Pentium Pentium 3

Consumerizatio

n

Consumerizatio

n

Consumerizatio

n

Consumerizatio

n

Consumerizatio

n

Consumerizatio

n

15 I.1

High costs for productionConsumerizatio

n

Consumerizatio

n

Consumerizatio

n

Consumerizatio

n

Consumerizatio

n

Consumerizatio

n

16 I.1

High costs for productionConsumerizatio

n

Consumerizatio

n

Consumerizatio

n

Consumerizatio

n

Consumerizatio

n

Consumerizatio

n

$ 2+ US Billions !!!

ATE cost

ATE costThe chip

to be tested is inserted here !!

ATE cost

$ 6+ US Millions

The chip to be tested is inserted here !!

20 I.1

Some facts: Pentium Intel

For End-of-Production test, Intel uses 300 ATEs for VLSI:

if aligned, they formed a 2 Km queue

they have, globally, 60,000 pin drivers

they consume, globally, 7.5 MW.

[K. Thompson, Vice president Intel, ITC’95]

PentiumPentium® Pro ProProcessor Processor

®®RR

Consumerizatio

n

Consumerizatio

n

Consumerizatio

n

Consumerizatio

n

Consumerizatio

n

Consumerizatio

n

21 I.1


High volumes

High costs for design and production

Lower prices of the final products

Consumerizatio

n

Consumerizatio

n

Consumerizatio

n

Consumerizatio

n

Consumerizatio

n

Consumerizatio

n

22 I.1

Some facts ...

Since 1Q’97, the price of PCs decreases of 6% every quarter.

Consumerizatio

n

Consumerizatio

n

Consumerizatio

n

Consumerizatio

n

Consumerizatio

n

Consumerizatio

n

23 I.1


High volumes

High costs for design and production

Low prices of the final products

High dependability (reliability & availability)

Consumerizatio

n

Consumerizatio

n

Consumerizatio

n

Consumerizatio

n

Consumerizatio

n

Consumerizatio

n


Miniaturization

Miniaturization

25 I.1

Moore’s law

Processor transistor counts doubles every two years

a new technology every 9 months !!

System-on-a-chip (SoC)

Miniaturization

Miniaturization

Miniaturization

Miniaturization

Miniaturization

Miniaturization

26 I.1

Pentium 4

1.5 GHz 2 GHz in 3Q01

0.18 0.13 in 4Q01

42 M transistor

Miniaturization

Miniaturization

Miniaturization

Miniaturization

Miniaturization

Miniaturization

27 I.1

Intel Press release

“Researchers at Intel Corp. have built what they claim is the smallest and fastest CMOS transistor, measuring 30nm in size and three atom thick. The gate oxides used to build these transistors are three atomic layers thick.

Intel believes this new development will allow the company within the next five to 10 years to build microprocessors containing more than 400 million transistors, running at 10GHz and operating at less than 1V.

To rationalize this scale, Intel said more than 100,000 of these gates would need to be stacked to achieve the thickness of a sheet of paper and that they could compute 2 million calculations in the time it takes a bullet to travel one inch.”

Miniaturization

Miniaturization

Miniaturization

Miniaturization

Miniaturization

Miniaturization

28 I.1

0

20

40

60

80

100

1998 2000

Years

% o

f IC

wit

h <

0.3

5 m

icro

nVery deep sub-micron ICs

Miniaturization

Miniaturization

Miniaturization

Miniaturization

Miniaturization

Miniaturization

29 I.1

System - chipMiniaturizatio

n

Miniaturization

Miniaturization

Miniaturization

Miniaturization

Miniaturization

30 I.1

System-on-chipMiniaturizatio

n

Miniaturization

Miniaturization

Miniaturization

Miniaturization

Miniaturization

31 I.1

SoCs trend

tt

32 I.1

SoCs trend

Yesterday’s PCBs

(System-on-a-board)

tt

33 I.1

SoCs trend

Today’s chips (System-on-a-chip)

tt

Yesterday’s PCBs

(System-on-a-board)

34 I.1

SoCs trend

Tomorrow’s re-usable IPs

Today’s chips (System-on-a-chip)

tt

Yesterday’s PCBs

(System-on-a-board)

35 I.1

What are embedded cores

Pre-designed, pre-verified functional blocks, also termed IP (Intellectual Property), or macro.

36 I.1

Characteristics of Core-based SoCs

Reusable cores replacing existing COTS ICs

Core representation at different hardware description level (soft, firm, hard)

Embedded cores available from diverse sources

Design efficiency achieved by ease of plug & play (a lot of standardization activities are currently going on).

37 I.1

SoC market growth

1998 9.0

1999 11.0

2000 14.5

2001 19.0

2002 24.0

2003 32.0

Worldwide revenue (B of $)

[Dataquest]

38 I.1

Example: A mixed signal modem(board implementation)

RAMRAMROMROM

Micro-Micro-controllercontroller

ROMROM

DSPDSP

CoDecCoDec

TransmissionTransmissionmediummedium

DataDataterminalterminal

39 I.1

TransmissionTransmissionmediummedium

DataDataterminalterminal

DSPDSPcorecore

RAMRAMROMROM

InterfaceInterfacelogiclogic

CoDecCoDec

Example: A mixed signal model(SoC implementation)

Target ApplicationsTarget Applications

1960 1970 1980 1990 2000 2010

PC

Word processing

Web

e-Commerce

Time sharing

Batch




Multimedia

Embedded Control


1960 1970 1980 1990 2000 2010

PC

Word processing

Web

e-Commerce

Time sharing

Batch




Multimedia

Embedded Control

ATM switches, ATM switches, Bridges, Modems, Bridges, Modems,

Routers, …Routers, …


1960 1970 1980 1990 2000 2010

PC

Word processing

Web

e-Commerce

Time sharing

Batch




Multimedia

Embedded Control



Cellular phones, Cellular phones, PDAs, Pagers, PDAs, Pagers, Organizers, …Organizers, …


1960 1970 1980 1990 2000 2010

PC

Word processing

Web

e-Commerce

Time sharing

Batch




Multimedia

Embedded Control




Digital Cameras, Digital Cameras, Games, …Games, …


1960 1970 1980 1990 2000 2010

PC

Word processing

Web

e-Commerce

Time sharing

Batch




Multimedia

Embedded Control




Digital Cameras, Digital Cameras, Games, …Games, …

Automotive, Automotive, Smart cards, Smart cards, Printers, …Printers, …

45 I.1

What are the What are the consequences ?consequences ?

46 I.1

Just few reminds ...

Product life cycle

Time to Market

Time to Volume

Time to Money

Market Window

47 I.1

t

The product The product life-cyclelife-cycle

48 I.1

t


User’sUser’srequirementsrequirements

49 I.1

t



DesignDesign

50 I.1

t



ProductionProduction

DesignDesign

51 I.1

t




DesignDesign

In-fieldIn-fieldoperationoperation

52 I.1

t




DesignDesign

In-fieldIn-fieldoperationoperation

Re-cyclingRe-cycling

53 I.1

t

Time-To-Time-To-MarketMarket( TTM )( TTM )


DesignDesign


Time to MarketTime to MarketTTMTTM

Time to VolumeTime to VolumeTTVTTV

Time to MoneyTime to MoneyTT$TT$

RevenuesRevenuesCostsCosts

ProfitsProfits

55 I.1

Smaller market Smaller market windowswindows

Which are the What are theconsequences ?consequences ?

56 I.1

Smaller market windows

1980

5 y

57 I.1


1980

5 y

1 y

1990

58 I.1


1980

5 y

1 y

1990

< 6 m

2000

59 I.1

Dramatic shrink of Dramatic shrink of products life-cycleproducts life-cycle

What are the What are the consequences ?consequences ?What are the What are the

consequences ?consequences ?

60 I.1

What should What should we do?we do?

61 I.1

To survive, you must To survive, you must be able to meet the be able to meet the

trends.trends.

What should What shouldwe do?we do?

62 I.1

The real challenge:The real challenge:

To meet user quality To meet user quality requirements for your requirements for your

new productsnew products


63 I.1

The set of properties The set of properties and characteristics of and characteristics of a product (a service) a product (a service)

capable of capable of guaranteeing guaranteeing customer’s customer’s satisfaction.satisfaction.

Quality

ISO8402

64 I.1

The The qualityquality of any product or of any product or service is what the customer service is what the customer

says it issays it is..

The The qualityquality of any product or of any product or service is what the customer service is what the customer

says it issays it is..

65 I.1

Reduce your Reduce your Time-To-MarketTime-To-Market


66 I.1

The impact of delay on profits

Let’s consider a product characterized by:

market grow rate : 20%

annual price reduction rate : 12%

product life-cycle: 5 y

[McKinsey & Co]

67 I.1

Profit loss

-50.00%-40.00%-30.00%-20.00%-10.00%

0.00%

68 I.1

Profit loss

-50.00%-40.00%-30.00%-20.00%-10.00%

0.00%

Increase of component cost: 50%

69 I.1

Profit loss

-50.00%-40.00%-30.00%-20.00%-10.00%

0.00%

-3.5%


70 I.1

Profit loss

-50.00%-40.00%-30.00%-20.00%-10.00%

0.00%

-3.5%



71 I.1

Profit loss

-50.00%-40.00%-30.00%-20.00%-10.00%

0.00%

-3.5%

-22%



72 I.1

Profit loss

-50.00%-40.00%-30.00%-20.00%-10.00%

0.00%

-3.5%

-22%



6 months of delay in TTM

73 I.1

Profit loss

-50.00%-40.00%-30.00%-20.00%-10.00%

0.00%

-3.5%

-22%-33%



6 months of delay in TTM

74 I.1

How can we How can we reduce our reduce our

TTM ?TTM ?

75 I.1

Set up Set up Distributed Distributed Cooperative Working Cooperative Working

EEnvironmentsnvironments to support to support

Concurrent & Concurrent & Distributed Distributed EngineeringEngineering

How can How can wewereduce ourreduce our

TTM ?TTM ?

76 I.1

[Institute for Defense Analyses, USA]

Concurrent Engineering Concurrent Engineering is a is a systematic approach to the systematic approach to the

integrated, concurrent design of integrated, concurrent design of products and their related processes, products and their related processes, including manufacture and support.including manufacture and support.

77 I.1

[Institute for Defense Analyses, USA]

Concurrent Engineering Concurrent Engineering is intended to is intended to cause the developers, from the outset, to cause the developers, from the outset, to consider all the elements of the product consider all the elements of the product

life cycle from conception through life cycle from conception through disposal, including quality, cost, disposal, including quality, cost, schedule, and user requirements.schedule, and user requirements.

[IEEE Spectrum, July 1991]

78 I.1

Redo until rightRedo until right

Concurrent EngineeringConcurrent Engineering

79 I.1


First time rightFirst time right


80 I.1




TeamworkTeamwork

81 I.1




TeamworkTeamworkTeamworkTeamwork (TigerTeam) (TigerTeam)

82 I.1

TigerTeam

People from many departments collaborate over the life of a product to ensure that it reflects customers’ needs and desires.

83 I.1 Concurrent EngineeringConcurrent Engineering

Manufacturability

Diagnosability

Reliability

Integrability

TestabilityVerifiability

Re-cyclability

Design for X-abilityDesign for X-ability

84 I.1

Some examples ...

Boeing Corporation Airplane Group:

Boeing 777 (440 passengers) developed in 1.5 years less than 767:

2200 terminals

8 mainframes IBM 3090-600J

connected Seattle, Renton, Everett (DC), Wichita (KA), Philadelphia (PA) & partners like Mitsubishi, Kawasaki, Fuji

85 I.1

Some examples ...

FIAT:

300 people to design and set up the PUNTO production line

IBM, Apple, Motorola:

PowerPC 601: 12 months from agreement signature to the first chip.

86 I.1

Reduce your Reduce your design timedesign time


TTM ?TTM ?

87 I.1

Improve Improve designers designers

productivityproductivity


TTM ?TTM ?

88 I.1

Exploit chip Exploit chip complexitycomplexity


TTM ?TTM ?

89 I.1

System-on-chipMiniaturizatio

n

Miniaturization

Miniaturization

Miniaturization

Miniaturization

Miniaturization

90 I.1

Our next product must beOur next product must bebetter, smaller, cheaper, faster,better, smaller, cheaper, faster,

consume less power, &consume less power, &be ready for yesterday !!be ready for yesterday !!

the challenges of the new global scenario paolo prinetto politecnico di torino (italy) university of...

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