The CBM-MVD prototype Realization amp beam test

Michal KozielGoethe-Universitaumlt Frankfurt

mkozielgside

Detector Workshop March 25th-26th 2013 at GSI

2

Outline

CBM experiment and its requirements

Prototyping the CBM-MVD

Mechanical integration

Readout electronics and DAQ

Data analysis

Summary and outlook

3

Required performances (SIS-100)

Radiation tolerance

gt 1013neqcm2 amp gt1 Mrad

Read-out speed gt 30 kframess

Intrinsic resolution lt 5 microm

Operation in vacuum

bdquoLightrdquo support and cooling

Material budget ~ 03 X0

CBM-MVD will- improve secondary vertex resolution- background rejection in di-electron measurements- host highly granular silicon pixel sensors featuring

fast read-out excellent spatial resolution and robustness to radiation environment

The MVD ndash required performances

MVD

Up to 4 stations

4

Sensor RampD

DAQ

Mechanical integration

Sensor RampD

Syst

em in

tegr

ation

Research fields towards the MVD

Data analysis

IKF infrastructure

Class 1000 (ISO 6) clean room

Grey room Electronic workshop Mechanical workshop Equipment

bull Manual wire-bonderbull Probe stationbull 3 microscopesbull Powerful cooling

systembull Vacuum chamber

Prototype highlights

Develop cooling and support with low material budget employing advances materials

Develop sensor readout system capable to handle high data rates

20082010

Material budget~ 245 X0

SensorMIMOSA-20

~200 framessfew 1011 neqcm2 amp

~300 kRad750microm thick

Cooling amp supportTPG+RVC foam

Material budget~ 03 X0

SensorMIMOSA-26 AHR

~10 kframess~1013 neqcm2 amp gt300 kRad

50microm thinReadout

CPdigitalhigh data rates

Cooling amp supportpCVD diamond (thermal grade)

ReadoutSerialanalog

will meet all requirements

Sensor synergy with ALICE (diff geometry)

Readout speed ~30 kframess

Radiation tol gt1013 neqcm2 amp gt1 Mrad

Demonstrator

Prototype

Final

frac12 () of 1st station4 sensors

2012

gt2015

Progress towards the MVD

Sensor 50 microm

Al heat sink

CVD diamond

Flex Cable 200 microm

FEB

FEB

Encapsulation

Wirebonds

Glue

200 microm

Future MVD alternated sensors

6

Main features- in pixel amplification- binary charge encoding - discriminator for each column - 0-suppression logic- pitch 184 μm- sim 07 million pixels

MIMOSA-26 AHR 035 microm process High Resistivity (HR) EPI (1 kΩcm)

Sensors for the MVD prototype

Bending radius ~30 cmSize 212 x 106 mm2

Possible issues

Internal stress -gt long-term reliability

Yield after assembly

Sensor pre-selection with probe cards

bull Positioning

Aspects addressed during prototyping phase

Sensor

CarrierGlue FPC

FPC

Sensor integration on CVD diamond

Readout amp controlbull Scalability bull Reliability

bull Adhesive bonding

bull Wire bondingbull Encapsulation

FPC

FPCDouble sided

sensor integration

Micro-trackingBeam T1

T2

T3

T4

DUTmicro-tracking

ro

Plane 2

Plane 1

Plane 4

Plane 3DUT

CoolingFront scintillator

Back scintillator

bull Cooling optimization

8

Test beam setup at

T1 T2 T3 T4DUT

Beam

Material budget 0053 X0

Material budget 0053 X0

200 μm CVD diamond 1 mm Al

200 μm CVD diamond

9

DAQ

10

FPC

based on MIMOSA-26 AHR

FEB

clockstartresetJTAG

converterboard

converterboard

converterboard

readout controller

board

driver board

FEB

sensors

readout controller

board

FEB

LVDS 1m4x 80 Mbits

LVDS4 x 80 Mbits

FPC

2 Gbitsoptical fiber to theMVD network

FPC

Slow control board

Dedicated DAQ

Hubreadout

controller board

readout controller

board

PCGeneral purpose add-on HADES TRB V2

~30 m Synergy with HADES

11

Tests before beam time

Stability runs Slow control cross-check Tests with radioactive sources Threshold scans Cooling check Test with long cables

Fully operational setup ready for travelling to CERN

Laboratory setup

Corresponding fluence 24 kHzcm2 (limited by source)

12

Full beam setup at SPS

Huber cooling system

DAQ

Beam telescope

FEE

13

DAQ performance during beam tests

The Readout Network was proven to be highly scalable

All sensors are synchronized No deviations detected within 10 ns precision

DAQ runs very stable No network errors no data loss (5 days of tests)

bull Data rates 6 MBs - 25 MBs but also overload test with +100 MBs

bull JTAG passed also all tests (100 000 programming cycles per chain)

bull In total 2TB of data stored

12 sensors running in parallel

259 260

Frame number Frame number

110 ms

~9 s

CERN-SPSSpill structure

40 s9 s

Peak fluence 350-400 kHzcm 2

20 of MIMOSA-26 computing resources used

Factor of 1000 away from peak fluence AuAu 25AGeV

Limited by beam

14

Data analysis

15

Data analysis

Data analysis flow1 Cluster analysis2 3D alignment3 Track selection with the 4-plane telescope

(straight lines)4 Response of DUT to charged particles

20 ndash 120 GeV PionsCERN SPS North Hall

Plane 1Plane 2

Beam setup

beam

Plane 3Plane 4DUT

bull Detection efficiency Fake Hit Rate Spatial resolution as a function of threshold voltage (DUT)

bull 4 inclination angles of 0 30 45 60

bull Temperature (-6 +6 +17 C) amp threshold scans

bull High beam intensity runs (in average up to 10 hitsframe but due to the non-uniform beam it could also be ~100 hits some of frames ndash to be confirmed)

16

Cluster shape studies

1 23 4

5

6

7

8

Top 8 most frequently observed cluster shapes

Cluster classification will be used for further FPGA-based data compressionCenter of gravity used to compute the ldquohitrdquo position

Cluster multiplicity studies

17

PRELIMINARY

Charge = 80EPIth[μm] cos [e-]

EPI

Sensingdiode

18

Detection Efficiency (DUT)

prob

e

V threshold

V threshold

Ampl

itude

time

NOISE = individual pixel feature

signalnoise

bdquosaferdquo region

ExampleFHR lt 10-5

Efficiency gt 95

PRELIMINARY

19

Spatial Resolution (DUT)

Result for the DUT

σx= 33 micromσY= 33 microm

Spatial resolution DUT only

X (r

ow) b

ack

sens

or

Al heat sink

FEB

FEB

200 microm

Front sensor

Back sensor

π-Correlation back - front

X (row) front sensor

Reproducing the intrinsic parameters of the sensors validates the concept of the prototype

PRELIMINARY

20

Summary amp outlook

Summary

21

Mechanical integration

Achieved An ultra low material budget (03 X0) double-sided micro-tracking

device 2x2 sensors CVD Diamond glue amp FPC Development of tools amp assembly procedures

DAQAchieved

Synchronization Reliability Scalability Slow control amp monitoring tools Data quality

Dataanalysis

Achieved package for alignment and data analysis for test beam setup

(telescope-DUT) online monitoring software (test beam setup)

22

Outlook p 1

DAQ

Dataanalysis

Towards the CBM-MVD Interface to the CBM DAQ Optical data link between FEE and DAQ board

Towards the CBM-MVD Optimizing the digitizer based on data on sensor response Performance studies of physics cases allowing for more realistic

studies on detector performance

Mechanical integration

Towards the CBM-MVD Vacuum compatibility and integration into the CBM-MVD vacuum box

design the MVD platform in the target vacuum chamber cable routing finalize services (LV cooling)

Improve in heat transfer Quality assurance while assembling (yields)

Outlook p 2

23

Expertise needed in the future Glue dedicated radiation tolerant reworkable

dispensing techniques Vacuum feed-through concepts MVD stations

positioning Cooling CO2 or conventional

Mechanical integration

Synergy with FAIR

experiment (and

beyond) needed

How to move the MVD stations in vacuum

24

Thank you for your attention

• Slide 1
• Outline
• Slide 3
• Slide 4
• Slide 5
• Slide 6
• Slide 7
• Slide 8
• Slide 9
• Slide 10
• Tests before beam time
• Slide 12
• DAQ performance during beam tests
• Slide 14
• Data analysis
• Slide 16
• Cluster multiplicity studies
• Detection Efficiency (DUT)
• Spatial Resolution (DUT)
• Slide 20
• Summary
• Outlook p 1
• Outlook p 2
• Slide 24

2

Outline

CBM experiment and its requirements

Prototyping the CBM-MVD

Mechanical integration

Readout electronics and DAQ

Data analysis

Summary and outlook

3

Required performances (SIS-100)

Radiation tolerance

gt 1013neqcm2 amp gt1 Mrad

Read-out speed gt 30 kframess

Intrinsic resolution lt 5 microm

Operation in vacuum

bdquoLightrdquo support and cooling

Material budget ~ 03 X0

CBM-MVD will- improve secondary vertex resolution- background rejection in di-electron measurements- host highly granular silicon pixel sensors featuring

fast read-out excellent spatial resolution and robustness to radiation environment

The MVD ndash required performances

MVD

Up to 4 stations

4

Sensor RampD

DAQ

Mechanical integration

Sensor RampD

Syst

em in

tegr

ation

Research fields towards the MVD

Data analysis

IKF infrastructure

Class 1000 (ISO 6) clean room

Grey room Electronic workshop Mechanical workshop Equipment

bull Manual wire-bonderbull Probe stationbull 3 microscopesbull Powerful cooling

systembull Vacuum chamber

Prototype highlights

Develop cooling and support with low material budget employing advances materials

Develop sensor readout system capable to handle high data rates

20082010

Material budget~ 245 X0

SensorMIMOSA-20

~200 framessfew 1011 neqcm2 amp

~300 kRad750microm thick

Cooling amp supportTPG+RVC foam

Material budget~ 03 X0

SensorMIMOSA-26 AHR

~10 kframess~1013 neqcm2 amp gt300 kRad

50microm thinReadout

CPdigitalhigh data rates

Cooling amp supportpCVD diamond (thermal grade)

ReadoutSerialanalog

will meet all requirements

Sensor synergy with ALICE (diff geometry)

Readout speed ~30 kframess

Radiation tol gt1013 neqcm2 amp gt1 Mrad

Demonstrator

Prototype

Final

frac12 () of 1st station4 sensors

2012

gt2015

Progress towards the MVD

Sensor 50 microm

Al heat sink

CVD diamond

Flex Cable 200 microm

FEB

FEB

Encapsulation

Wirebonds

Glue

200 microm

Future MVD alternated sensors

6

Main features- in pixel amplification- binary charge encoding - discriminator for each column - 0-suppression logic- pitch 184 μm- sim 07 million pixels

MIMOSA-26 AHR 035 microm process High Resistivity (HR) EPI (1 kΩcm)

Sensors for the MVD prototype

Bending radius ~30 cmSize 212 x 106 mm2

Possible issues

Internal stress -gt long-term reliability

Yield after assembly

Sensor pre-selection with probe cards

bull Positioning

Aspects addressed during prototyping phase

Sensor

CarrierGlue FPC

FPC

Sensor integration on CVD diamond

Readout amp controlbull Scalability bull Reliability

bull Adhesive bonding

bull Wire bondingbull Encapsulation

FPC

FPCDouble sided

sensor integration

Micro-trackingBeam T1

T2

T3

T4

DUTmicro-tracking

ro

Plane 2

Plane 1

Plane 4

Plane 3DUT

CoolingFront scintillator

Back scintillator

bull Cooling optimization

8

Test beam setup at

T1 T2 T3 T4DUT

Beam

Material budget 0053 X0

Material budget 0053 X0

200 μm CVD diamond 1 mm Al

200 μm CVD diamond

9

DAQ

10

FPC

based on MIMOSA-26 AHR

FEB

clockstartresetJTAG

converterboard

converterboard

converterboard

readout controller

board

driver board

FEB

sensors

readout controller

board

FEB

LVDS 1m4x 80 Mbits

LVDS4 x 80 Mbits

FPC

2 Gbitsoptical fiber to theMVD network

FPC

Slow control board

Dedicated DAQ

Hubreadout

controller board

readout controller

board

PCGeneral purpose add-on HADES TRB V2

~30 m Synergy with HADES

11

Tests before beam time

Stability runs Slow control cross-check Tests with radioactive sources Threshold scans Cooling check Test with long cables

Fully operational setup ready for travelling to CERN

Laboratory setup

Corresponding fluence 24 kHzcm2 (limited by source)

12

Full beam setup at SPS

Huber cooling system

DAQ

Beam telescope

FEE

13

DAQ performance during beam tests

The Readout Network was proven to be highly scalable

All sensors are synchronized No deviations detected within 10 ns precision

DAQ runs very stable No network errors no data loss (5 days of tests)

bull Data rates 6 MBs - 25 MBs but also overload test with +100 MBs

bull JTAG passed also all tests (100 000 programming cycles per chain)

bull In total 2TB of data stored

12 sensors running in parallel

259 260

Frame number Frame number

110 ms

~9 s

CERN-SPSSpill structure

40 s9 s

Peak fluence 350-400 kHzcm 2

20 of MIMOSA-26 computing resources used

Factor of 1000 away from peak fluence AuAu 25AGeV

Limited by beam

14

Data analysis

15

Data analysis

Data analysis flow1 Cluster analysis2 3D alignment3 Track selection with the 4-plane telescope

(straight lines)4 Response of DUT to charged particles

20 ndash 120 GeV PionsCERN SPS North Hall

Plane 1Plane 2

Beam setup

beam

Plane 3Plane 4DUT

bull Detection efficiency Fake Hit Rate Spatial resolution as a function of threshold voltage (DUT)

bull 4 inclination angles of 0 30 45 60

bull Temperature (-6 +6 +17 C) amp threshold scans

bull High beam intensity runs (in average up to 10 hitsframe but due to the non-uniform beam it could also be ~100 hits some of frames ndash to be confirmed)

16

Cluster shape studies

1 23 4

5

6

7

8

Top 8 most frequently observed cluster shapes

Cluster classification will be used for further FPGA-based data compressionCenter of gravity used to compute the ldquohitrdquo position

Cluster multiplicity studies

17

PRELIMINARY

Charge = 80EPIth[μm] cos [e-]

EPI

Sensingdiode

18

Detection Efficiency (DUT)

prob

e

V threshold

V threshold

Ampl

itude

time

NOISE = individual pixel feature

signalnoise

bdquosaferdquo region

ExampleFHR lt 10-5

Efficiency gt 95

PRELIMINARY

19

Spatial Resolution (DUT)

Result for the DUT

σx= 33 micromσY= 33 microm

Spatial resolution DUT only

X (r

ow) b

ack

sens

or

Al heat sink

FEB

FEB

200 microm

Front sensor

Back sensor

π-Correlation back - front

X (row) front sensor

Reproducing the intrinsic parameters of the sensors validates the concept of the prototype

PRELIMINARY

20

Summary amp outlook

Summary

21

Mechanical integration

Achieved An ultra low material budget (03 X0) double-sided micro-tracking

device 2x2 sensors CVD Diamond glue amp FPC Development of tools amp assembly procedures

DAQAchieved

Synchronization Reliability Scalability Slow control amp monitoring tools Data quality

Dataanalysis

Achieved package for alignment and data analysis for test beam setup

(telescope-DUT) online monitoring software (test beam setup)

22

Outlook p 1

DAQ

Dataanalysis

Towards the CBM-MVD Interface to the CBM DAQ Optical data link between FEE and DAQ board

Towards the CBM-MVD Optimizing the digitizer based on data on sensor response Performance studies of physics cases allowing for more realistic

studies on detector performance

Mechanical integration

Towards the CBM-MVD Vacuum compatibility and integration into the CBM-MVD vacuum box

design the MVD platform in the target vacuum chamber cable routing finalize services (LV cooling)

Improve in heat transfer Quality assurance while assembling (yields)

Outlook p 2

23

Expertise needed in the future Glue dedicated radiation tolerant reworkable

dispensing techniques Vacuum feed-through concepts MVD stations

positioning Cooling CO2 or conventional

Mechanical integration

Synergy with FAIR

experiment (and

beyond) needed

How to move the MVD stations in vacuum

24

Thank you for your attention

• Slide 1
• Outline
• Slide 3
• Slide 4
• Slide 5
• Slide 6
• Slide 7
• Slide 8
• Slide 9
• Slide 10
• Tests before beam time
• Slide 12
• DAQ performance during beam tests
• Slide 14
• Data analysis
• Slide 16
• Cluster multiplicity studies
• Detection Efficiency (DUT)
• Spatial Resolution (DUT)
• Slide 20
• Summary
• Outlook p 1
• Outlook p 2
• Slide 24

3

Required performances (SIS-100)

Radiation tolerance

gt 1013neqcm2 amp gt1 Mrad

Read-out speed gt 30 kframess

Intrinsic resolution lt 5 microm

Operation in vacuum

bdquoLightrdquo support and cooling

Material budget ~ 03 X0

CBM-MVD will- improve secondary vertex resolution- background rejection in di-electron measurements- host highly granular silicon pixel sensors featuring

fast read-out excellent spatial resolution and robustness to radiation environment

The MVD ndash required performances

MVD

Up to 4 stations

4

Sensor RampD

DAQ

Mechanical integration

Sensor RampD

Syst

em in

tegr

ation

Research fields towards the MVD

Data analysis

IKF infrastructure

Class 1000 (ISO 6) clean room

Grey room Electronic workshop Mechanical workshop Equipment

bull Manual wire-bonderbull Probe stationbull 3 microscopesbull Powerful cooling

systembull Vacuum chamber

Prototype highlights

Develop cooling and support with low material budget employing advances materials

Develop sensor readout system capable to handle high data rates

20082010

Material budget~ 245 X0

SensorMIMOSA-20

~200 framessfew 1011 neqcm2 amp

~300 kRad750microm thick

Cooling amp supportTPG+RVC foam

Material budget~ 03 X0

SensorMIMOSA-26 AHR

~10 kframess~1013 neqcm2 amp gt300 kRad

50microm thinReadout

CPdigitalhigh data rates

Cooling amp supportpCVD diamond (thermal grade)

ReadoutSerialanalog

will meet all requirements

Sensor synergy with ALICE (diff geometry)

Readout speed ~30 kframess

Radiation tol gt1013 neqcm2 amp gt1 Mrad

Demonstrator

Prototype

Final

frac12 () of 1st station4 sensors

2012

gt2015

Progress towards the MVD

Sensor 50 microm

Al heat sink

CVD diamond

Flex Cable 200 microm

FEB

FEB

Encapsulation

Wirebonds

Glue

200 microm

Future MVD alternated sensors

6

Main features- in pixel amplification- binary charge encoding - discriminator for each column - 0-suppression logic- pitch 184 μm- sim 07 million pixels

MIMOSA-26 AHR 035 microm process High Resistivity (HR) EPI (1 kΩcm)

Sensors for the MVD prototype

Bending radius ~30 cmSize 212 x 106 mm2

Possible issues

Internal stress -gt long-term reliability

Yield after assembly

Sensor pre-selection with probe cards

bull Positioning

Aspects addressed during prototyping phase

Sensor

CarrierGlue FPC

FPC

Sensor integration on CVD diamond

Readout amp controlbull Scalability bull Reliability

bull Adhesive bonding

bull Wire bondingbull Encapsulation

FPC

FPCDouble sided

sensor integration

Micro-trackingBeam T1

T2

T3

T4

DUTmicro-tracking

ro

Plane 2

Plane 1

Plane 4

Plane 3DUT

CoolingFront scintillator

Back scintillator

bull Cooling optimization

8

Test beam setup at

T1 T2 T3 T4DUT

Beam

Material budget 0053 X0

Material budget 0053 X0

200 μm CVD diamond 1 mm Al

200 μm CVD diamond

9

DAQ

10

FPC

based on MIMOSA-26 AHR

FEB

clockstartresetJTAG

converterboard

converterboard

converterboard

readout controller

board

driver board

FEB

sensors

readout controller

board

FEB

LVDS 1m4x 80 Mbits

LVDS4 x 80 Mbits

FPC

2 Gbitsoptical fiber to theMVD network

FPC

Slow control board

Dedicated DAQ

Hubreadout

controller board

readout controller

board

PCGeneral purpose add-on HADES TRB V2

~30 m Synergy with HADES

11

Tests before beam time

Stability runs Slow control cross-check Tests with radioactive sources Threshold scans Cooling check Test with long cables

Fully operational setup ready for travelling to CERN

Laboratory setup

Corresponding fluence 24 kHzcm2 (limited by source)

12

Full beam setup at SPS

Huber cooling system

DAQ

Beam telescope

FEE

13

DAQ performance during beam tests

The Readout Network was proven to be highly scalable

All sensors are synchronized No deviations detected within 10 ns precision

DAQ runs very stable No network errors no data loss (5 days of tests)

bull Data rates 6 MBs - 25 MBs but also overload test with +100 MBs

bull JTAG passed also all tests (100 000 programming cycles per chain)

bull In total 2TB of data stored

12 sensors running in parallel

259 260

Frame number Frame number

110 ms

~9 s

CERN-SPSSpill structure

40 s9 s

Peak fluence 350-400 kHzcm 2

20 of MIMOSA-26 computing resources used

Factor of 1000 away from peak fluence AuAu 25AGeV

Limited by beam

14

Data analysis

15

Data analysis

Data analysis flow1 Cluster analysis2 3D alignment3 Track selection with the 4-plane telescope

(straight lines)4 Response of DUT to charged particles

20 ndash 120 GeV PionsCERN SPS North Hall

Plane 1Plane 2

Beam setup

beam

Plane 3Plane 4DUT

bull Detection efficiency Fake Hit Rate Spatial resolution as a function of threshold voltage (DUT)

bull 4 inclination angles of 0 30 45 60

bull Temperature (-6 +6 +17 C) amp threshold scans

bull High beam intensity runs (in average up to 10 hitsframe but due to the non-uniform beam it could also be ~100 hits some of frames ndash to be confirmed)

16

Cluster shape studies

1 23 4

5

6

7

8

Top 8 most frequently observed cluster shapes

Cluster classification will be used for further FPGA-based data compressionCenter of gravity used to compute the ldquohitrdquo position

Cluster multiplicity studies

17

PRELIMINARY

Charge = 80EPIth[μm] cos [e-]

EPI

Sensingdiode

18

Detection Efficiency (DUT)

prob

e

V threshold

V threshold

Ampl

itude

time

NOISE = individual pixel feature

signalnoise

bdquosaferdquo region

ExampleFHR lt 10-5

Efficiency gt 95

PRELIMINARY

19

Spatial Resolution (DUT)

Result for the DUT

σx= 33 micromσY= 33 microm

Spatial resolution DUT only

X (r

ow) b

ack

sens

or

Al heat sink

FEB

FEB

200 microm

Front sensor

Back sensor

π-Correlation back - front

X (row) front sensor

Reproducing the intrinsic parameters of the sensors validates the concept of the prototype

PRELIMINARY

20

Summary amp outlook

Summary

21

Mechanical integration

Achieved An ultra low material budget (03 X0) double-sided micro-tracking

device 2x2 sensors CVD Diamond glue amp FPC Development of tools amp assembly procedures

DAQAchieved

Synchronization Reliability Scalability Slow control amp monitoring tools Data quality

Dataanalysis

Achieved package for alignment and data analysis for test beam setup

(telescope-DUT) online monitoring software (test beam setup)

22

Outlook p 1

DAQ

Dataanalysis

Towards the CBM-MVD Interface to the CBM DAQ Optical data link between FEE and DAQ board

Towards the CBM-MVD Optimizing the digitizer based on data on sensor response Performance studies of physics cases allowing for more realistic

studies on detector performance

Mechanical integration

Towards the CBM-MVD Vacuum compatibility and integration into the CBM-MVD vacuum box

design the MVD platform in the target vacuum chamber cable routing finalize services (LV cooling)

Improve in heat transfer Quality assurance while assembling (yields)

Outlook p 2

23

Expertise needed in the future Glue dedicated radiation tolerant reworkable

dispensing techniques Vacuum feed-through concepts MVD stations

positioning Cooling CO2 or conventional

Mechanical integration

Synergy with FAIR

experiment (and

beyond) needed

How to move the MVD stations in vacuum

24

Thank you for your attention

• Slide 1
• Outline
• Slide 3
• Slide 4
• Slide 5
• Slide 6
• Slide 7
• Slide 8
• Slide 9
• Slide 10
• Tests before beam time
• Slide 12
• DAQ performance during beam tests
• Slide 14
• Data analysis
• Slide 16
• Cluster multiplicity studies
• Detection Efficiency (DUT)
• Spatial Resolution (DUT)
• Slide 20
• Summary
• Outlook p 1
• Outlook p 2
• Slide 24

4

Sensor RampD

DAQ

Mechanical integration

Sensor RampD

Syst

em in

tegr

ation

Research fields towards the MVD

Data analysis

IKF infrastructure

Class 1000 (ISO 6) clean room

Grey room Electronic workshop Mechanical workshop Equipment

bull Manual wire-bonderbull Probe stationbull 3 microscopesbull Powerful cooling

systembull Vacuum chamber

Prototype highlights

Develop cooling and support with low material budget employing advances materials

Develop sensor readout system capable to handle high data rates

20082010

Material budget~ 245 X0

SensorMIMOSA-20

~200 framessfew 1011 neqcm2 amp

~300 kRad750microm thick

Cooling amp supportTPG+RVC foam

Material budget~ 03 X0

SensorMIMOSA-26 AHR

~10 kframess~1013 neqcm2 amp gt300 kRad

50microm thinReadout

CPdigitalhigh data rates

Cooling amp supportpCVD diamond (thermal grade)

ReadoutSerialanalog

will meet all requirements

Sensor synergy with ALICE (diff geometry)

Readout speed ~30 kframess

Radiation tol gt1013 neqcm2 amp gt1 Mrad

Demonstrator

Prototype

Final

frac12 () of 1st station4 sensors

2012

gt2015

Progress towards the MVD

Sensor 50 microm

Al heat sink

CVD diamond

Flex Cable 200 microm

FEB

FEB

Encapsulation

Wirebonds

Glue

200 microm

Future MVD alternated sensors

6

Main features- in pixel amplification- binary charge encoding - discriminator for each column - 0-suppression logic- pitch 184 μm- sim 07 million pixels

MIMOSA-26 AHR 035 microm process High Resistivity (HR) EPI (1 kΩcm)

Sensors for the MVD prototype

Bending radius ~30 cmSize 212 x 106 mm2

Possible issues

Internal stress -gt long-term reliability

Yield after assembly

Sensor pre-selection with probe cards

bull Positioning

Aspects addressed during prototyping phase

Sensor

CarrierGlue FPC

FPC

Sensor integration on CVD diamond

Readout amp controlbull Scalability bull Reliability

bull Adhesive bonding

bull Wire bondingbull Encapsulation

FPC

FPCDouble sided

sensor integration

Micro-trackingBeam T1

T2

T3

T4

DUTmicro-tracking

ro

Plane 2

Plane 1

Plane 4

Plane 3DUT

CoolingFront scintillator

Back scintillator

bull Cooling optimization

8

Test beam setup at

T1 T2 T3 T4DUT

Beam

Material budget 0053 X0

Material budget 0053 X0

200 μm CVD diamond 1 mm Al

200 μm CVD diamond

9

DAQ

10

FPC

based on MIMOSA-26 AHR

FEB

clockstartresetJTAG

converterboard

converterboard

converterboard

readout controller

board

driver board

FEB

sensors

readout controller

board

FEB

LVDS 1m4x 80 Mbits

LVDS4 x 80 Mbits

FPC

2 Gbitsoptical fiber to theMVD network

FPC

Slow control board

Dedicated DAQ

Hubreadout

controller board

readout controller

board

PCGeneral purpose add-on HADES TRB V2

~30 m Synergy with HADES

11

Tests before beam time

Stability runs Slow control cross-check Tests with radioactive sources Threshold scans Cooling check Test with long cables

Fully operational setup ready for travelling to CERN

Laboratory setup

Corresponding fluence 24 kHzcm2 (limited by source)

12

Full beam setup at SPS

Huber cooling system

DAQ

Beam telescope

FEE

13

DAQ performance during beam tests

The Readout Network was proven to be highly scalable

All sensors are synchronized No deviations detected within 10 ns precision

DAQ runs very stable No network errors no data loss (5 days of tests)

bull Data rates 6 MBs - 25 MBs but also overload test with +100 MBs

bull JTAG passed also all tests (100 000 programming cycles per chain)

bull In total 2TB of data stored

12 sensors running in parallel

259 260

Frame number Frame number

110 ms

~9 s

CERN-SPSSpill structure

40 s9 s

Peak fluence 350-400 kHzcm 2

20 of MIMOSA-26 computing resources used

Factor of 1000 away from peak fluence AuAu 25AGeV

Limited by beam

14

Data analysis

15

Data analysis

Data analysis flow1 Cluster analysis2 3D alignment3 Track selection with the 4-plane telescope

(straight lines)4 Response of DUT to charged particles

20 ndash 120 GeV PionsCERN SPS North Hall

Plane 1Plane 2

Beam setup

beam

Plane 3Plane 4DUT

bull Detection efficiency Fake Hit Rate Spatial resolution as a function of threshold voltage (DUT)

bull 4 inclination angles of 0 30 45 60

bull Temperature (-6 +6 +17 C) amp threshold scans

bull High beam intensity runs (in average up to 10 hitsframe but due to the non-uniform beam it could also be ~100 hits some of frames ndash to be confirmed)

16

Cluster shape studies

1 23 4

5

6

7

8

Top 8 most frequently observed cluster shapes

Cluster classification will be used for further FPGA-based data compressionCenter of gravity used to compute the ldquohitrdquo position

Cluster multiplicity studies

17

PRELIMINARY

Charge = 80EPIth[μm] cos [e-]

EPI

Sensingdiode

18

Detection Efficiency (DUT)

prob

e

V threshold

V threshold

Ampl

itude

time

NOISE = individual pixel feature

signalnoise

bdquosaferdquo region

ExampleFHR lt 10-5

Efficiency gt 95

PRELIMINARY

19

Spatial Resolution (DUT)

Result for the DUT

σx= 33 micromσY= 33 microm

Spatial resolution DUT only

X (r

ow) b

ack

sens

or

Al heat sink

FEB

FEB

200 microm

Front sensor

Back sensor

π-Correlation back - front

X (row) front sensor

Reproducing the intrinsic parameters of the sensors validates the concept of the prototype

PRELIMINARY

20

Summary amp outlook

Summary

21

Mechanical integration

Achieved An ultra low material budget (03 X0) double-sided micro-tracking

device 2x2 sensors CVD Diamond glue amp FPC Development of tools amp assembly procedures

DAQAchieved

Synchronization Reliability Scalability Slow control amp monitoring tools Data quality

Dataanalysis

Achieved package for alignment and data analysis for test beam setup

(telescope-DUT) online monitoring software (test beam setup)

22

Outlook p 1

DAQ

Dataanalysis

Towards the CBM-MVD Interface to the CBM DAQ Optical data link between FEE and DAQ board

Towards the CBM-MVD Optimizing the digitizer based on data on sensor response Performance studies of physics cases allowing for more realistic

studies on detector performance

Mechanical integration

Towards the CBM-MVD Vacuum compatibility and integration into the CBM-MVD vacuum box

design the MVD platform in the target vacuum chamber cable routing finalize services (LV cooling)

Improve in heat transfer Quality assurance while assembling (yields)

Outlook p 2

23

Expertise needed in the future Glue dedicated radiation tolerant reworkable

dispensing techniques Vacuum feed-through concepts MVD stations

positioning Cooling CO2 or conventional

Mechanical integration

Synergy with FAIR

experiment (and

beyond) needed

How to move the MVD stations in vacuum

24

Thank you for your attention

• Slide 1
• Outline
• Slide 3
• Slide 4
• Slide 5
• Slide 6
• Slide 7
• Slide 8
• Slide 9
• Slide 10
• Tests before beam time
• Slide 12
• DAQ performance during beam tests
• Slide 14
• Data analysis
• Slide 16
• Cluster multiplicity studies
• Detection Efficiency (DUT)
• Spatial Resolution (DUT)
• Slide 20
• Summary
• Outlook p 1
• Outlook p 2
• Slide 24

20082010

Material budget~ 245 X0

SensorMIMOSA-20

~200 framessfew 1011 neqcm2 amp

~300 kRad750microm thick

Cooling amp supportTPG+RVC foam

Material budget~ 03 X0

SensorMIMOSA-26 AHR

~10 kframess~1013 neqcm2 amp gt300 kRad

50microm thinReadout

CPdigitalhigh data rates

Cooling amp supportpCVD diamond (thermal grade)

ReadoutSerialanalog

will meet all requirements

Sensor synergy with ALICE (diff geometry)

Readout speed ~30 kframess

Radiation tol gt1013 neqcm2 amp gt1 Mrad

Demonstrator

Prototype

Final

frac12 () of 1st station4 sensors

2012

gt2015

Progress towards the MVD

Sensor 50 microm

Al heat sink

CVD diamond

Flex Cable 200 microm

FEB

FEB

Encapsulation

Wirebonds

Glue

200 microm

Future MVD alternated sensors

6

Main features- in pixel amplification- binary charge encoding - discriminator for each column - 0-suppression logic- pitch 184 μm- sim 07 million pixels

MIMOSA-26 AHR 035 microm process High Resistivity (HR) EPI (1 kΩcm)

Sensors for the MVD prototype

Bending radius ~30 cmSize 212 x 106 mm2

Possible issues

Internal stress -gt long-term reliability

Yield after assembly

Sensor pre-selection with probe cards

bull Positioning

Aspects addressed during prototyping phase

Sensor

CarrierGlue FPC

FPC

Sensor integration on CVD diamond

Readout amp controlbull Scalability bull Reliability

bull Adhesive bonding

bull Wire bondingbull Encapsulation

FPC

FPCDouble sided

sensor integration

Micro-trackingBeam T1

T2

T3

T4

DUTmicro-tracking

ro

Plane 2

Plane 1

Plane 4

Plane 3DUT

CoolingFront scintillator

Back scintillator

bull Cooling optimization

8

Test beam setup at

T1 T2 T3 T4DUT

Beam

Material budget 0053 X0

Material budget 0053 X0

200 μm CVD diamond 1 mm Al

200 μm CVD diamond

9

DAQ

10

FPC

based on MIMOSA-26 AHR

FEB

clockstartresetJTAG

converterboard

converterboard

converterboard

readout controller

board

driver board

FEB

sensors

readout controller

board

FEB

LVDS 1m4x 80 Mbits

LVDS4 x 80 Mbits

FPC

2 Gbitsoptical fiber to theMVD network

FPC

Slow control board

Dedicated DAQ

Hubreadout

controller board

readout controller

board

PCGeneral purpose add-on HADES TRB V2

~30 m Synergy with HADES

11

Tests before beam time

Stability runs Slow control cross-check Tests with radioactive sources Threshold scans Cooling check Test with long cables

Fully operational setup ready for travelling to CERN

Laboratory setup

Corresponding fluence 24 kHzcm2 (limited by source)

12

Full beam setup at SPS

Huber cooling system

DAQ

Beam telescope

FEE

13

DAQ performance during beam tests

The Readout Network was proven to be highly scalable

All sensors are synchronized No deviations detected within 10 ns precision

DAQ runs very stable No network errors no data loss (5 days of tests)

bull Data rates 6 MBs - 25 MBs but also overload test with +100 MBs

bull JTAG passed also all tests (100 000 programming cycles per chain)

bull In total 2TB of data stored

12 sensors running in parallel

259 260

Frame number Frame number

110 ms

~9 s

CERN-SPSSpill structure

40 s9 s

Peak fluence 350-400 kHzcm 2

20 of MIMOSA-26 computing resources used

Factor of 1000 away from peak fluence AuAu 25AGeV

Limited by beam

14

Data analysis

15

Data analysis

Data analysis flow1 Cluster analysis2 3D alignment3 Track selection with the 4-plane telescope

(straight lines)4 Response of DUT to charged particles

20 ndash 120 GeV PionsCERN SPS North Hall

Plane 1Plane 2

Beam setup

beam

Plane 3Plane 4DUT

bull Detection efficiency Fake Hit Rate Spatial resolution as a function of threshold voltage (DUT)

bull 4 inclination angles of 0 30 45 60

bull Temperature (-6 +6 +17 C) amp threshold scans

bull High beam intensity runs (in average up to 10 hitsframe but due to the non-uniform beam it could also be ~100 hits some of frames ndash to be confirmed)

16

Cluster shape studies

1 23 4

5

6

7

8

Top 8 most frequently observed cluster shapes

Cluster classification will be used for further FPGA-based data compressionCenter of gravity used to compute the ldquohitrdquo position

Cluster multiplicity studies

17

PRELIMINARY

Charge = 80EPIth[μm] cos [e-]

EPI

Sensingdiode

18

Detection Efficiency (DUT)

prob

e

V threshold

V threshold

Ampl

itude

time

NOISE = individual pixel feature

signalnoise

bdquosaferdquo region

ExampleFHR lt 10-5

Efficiency gt 95

PRELIMINARY

19

Spatial Resolution (DUT)

Result for the DUT

σx= 33 micromσY= 33 microm

Spatial resolution DUT only

X (r

ow) b

ack

sens

or

Al heat sink

FEB

FEB

200 microm

Front sensor

Back sensor

π-Correlation back - front

X (row) front sensor

Reproducing the intrinsic parameters of the sensors validates the concept of the prototype

PRELIMINARY

20

Summary amp outlook

Summary

21

Mechanical integration

Achieved An ultra low material budget (03 X0) double-sided micro-tracking

device 2x2 sensors CVD Diamond glue amp FPC Development of tools amp assembly procedures

DAQAchieved

Synchronization Reliability Scalability Slow control amp monitoring tools Data quality

Dataanalysis

Achieved package for alignment and data analysis for test beam setup

(telescope-DUT) online monitoring software (test beam setup)

22

Outlook p 1

DAQ

Dataanalysis

Towards the CBM-MVD Interface to the CBM DAQ Optical data link between FEE and DAQ board

Towards the CBM-MVD Optimizing the digitizer based on data on sensor response Performance studies of physics cases allowing for more realistic

studies on detector performance

Mechanical integration

Towards the CBM-MVD Vacuum compatibility and integration into the CBM-MVD vacuum box

design the MVD platform in the target vacuum chamber cable routing finalize services (LV cooling)

Improve in heat transfer Quality assurance while assembling (yields)

Outlook p 2

23

Expertise needed in the future Glue dedicated radiation tolerant reworkable

dispensing techniques Vacuum feed-through concepts MVD stations

positioning Cooling CO2 or conventional

Mechanical integration

Synergy with FAIR

experiment (and

beyond) needed

How to move the MVD stations in vacuum

24

Thank you for your attention

• Slide 1
• Outline
• Slide 3
• Slide 4
• Slide 5
• Slide 6
• Slide 7
• Slide 8
• Slide 9
• Slide 10
• Tests before beam time
• Slide 12
• DAQ performance during beam tests
• Slide 14
• Data analysis
• Slide 16
• Cluster multiplicity studies
• Detection Efficiency (DUT)
• Spatial Resolution (DUT)
• Slide 20
• Summary
• Outlook p 1
• Outlook p 2
• Slide 24

6

Main features- in pixel amplification- binary charge encoding - discriminator for each column - 0-suppression logic- pitch 184 μm- sim 07 million pixels

MIMOSA-26 AHR 035 microm process High Resistivity (HR) EPI (1 kΩcm)

Sensors for the MVD prototype

Bending radius ~30 cmSize 212 x 106 mm2

Possible issues

Internal stress -gt long-term reliability

Yield after assembly

Sensor pre-selection with probe cards

bull Positioning

Aspects addressed during prototyping phase

Sensor

CarrierGlue FPC

FPC

Sensor integration on CVD diamond

Readout amp controlbull Scalability bull Reliability

bull Adhesive bonding

bull Wire bondingbull Encapsulation

FPC

FPCDouble sided

sensor integration

Micro-trackingBeam T1

T2

T3

T4

DUTmicro-tracking

ro

Plane 2

Plane 1

Plane 4

Plane 3DUT

CoolingFront scintillator

Back scintillator

bull Cooling optimization

8

Test beam setup at

T1 T2 T3 T4DUT

Beam

Material budget 0053 X0

Material budget 0053 X0

200 μm CVD diamond 1 mm Al

200 μm CVD diamond

9

DAQ

10

FPC

based on MIMOSA-26 AHR

FEB

clockstartresetJTAG

converterboard

converterboard

converterboard

readout controller

board

driver board

FEB

sensors

readout controller

board

FEB

LVDS 1m4x 80 Mbits

LVDS4 x 80 Mbits

FPC

2 Gbitsoptical fiber to theMVD network

FPC

Slow control board

Dedicated DAQ

Hubreadout

controller board

readout controller

board

PCGeneral purpose add-on HADES TRB V2

~30 m Synergy with HADES

11

Tests before beam time

Stability runs Slow control cross-check Tests with radioactive sources Threshold scans Cooling check Test with long cables

Fully operational setup ready for travelling to CERN

Laboratory setup

Corresponding fluence 24 kHzcm2 (limited by source)

12

Full beam setup at SPS

Huber cooling system

DAQ

Beam telescope

FEE

13

DAQ performance during beam tests

The Readout Network was proven to be highly scalable

All sensors are synchronized No deviations detected within 10 ns precision

DAQ runs very stable No network errors no data loss (5 days of tests)

bull Data rates 6 MBs - 25 MBs but also overload test with +100 MBs

bull JTAG passed also all tests (100 000 programming cycles per chain)

bull In total 2TB of data stored

12 sensors running in parallel

259 260

Frame number Frame number

110 ms

~9 s

CERN-SPSSpill structure

40 s9 s

Peak fluence 350-400 kHzcm 2

20 of MIMOSA-26 computing resources used

Factor of 1000 away from peak fluence AuAu 25AGeV

Limited by beam

14

Data analysis

15

Data analysis

Data analysis flow1 Cluster analysis2 3D alignment3 Track selection with the 4-plane telescope

(straight lines)4 Response of DUT to charged particles

20 ndash 120 GeV PionsCERN SPS North Hall

Plane 1Plane 2

Beam setup

beam

Plane 3Plane 4DUT

bull Detection efficiency Fake Hit Rate Spatial resolution as a function of threshold voltage (DUT)

bull 4 inclination angles of 0 30 45 60

bull Temperature (-6 +6 +17 C) amp threshold scans

bull High beam intensity runs (in average up to 10 hitsframe but due to the non-uniform beam it could also be ~100 hits some of frames ndash to be confirmed)

16

Cluster shape studies

1 23 4

5

6

7

8

Top 8 most frequently observed cluster shapes

Cluster classification will be used for further FPGA-based data compressionCenter of gravity used to compute the ldquohitrdquo position

Cluster multiplicity studies

17

PRELIMINARY

Charge = 80EPIth[μm] cos [e-]

EPI

Sensingdiode

18

Detection Efficiency (DUT)

prob

e

V threshold

V threshold

Ampl

itude

time

NOISE = individual pixel feature

signalnoise

bdquosaferdquo region

ExampleFHR lt 10-5

Efficiency gt 95

PRELIMINARY

19

Spatial Resolution (DUT)

Result for the DUT

σx= 33 micromσY= 33 microm

Spatial resolution DUT only

X (r

ow) b

ack

sens

or

Al heat sink

FEB

FEB

200 microm

Front sensor

Back sensor

π-Correlation back - front

X (row) front sensor

Reproducing the intrinsic parameters of the sensors validates the concept of the prototype

PRELIMINARY

20

Summary amp outlook

Summary

21

Mechanical integration

Achieved An ultra low material budget (03 X0) double-sided micro-tracking

device 2x2 sensors CVD Diamond glue amp FPC Development of tools amp assembly procedures

DAQAchieved

Synchronization Reliability Scalability Slow control amp monitoring tools Data quality

Dataanalysis

Achieved package for alignment and data analysis for test beam setup

(telescope-DUT) online monitoring software (test beam setup)

22

Outlook p 1

DAQ

Dataanalysis

Towards the CBM-MVD Interface to the CBM DAQ Optical data link between FEE and DAQ board

Towards the CBM-MVD Optimizing the digitizer based on data on sensor response Performance studies of physics cases allowing for more realistic

studies on detector performance

Mechanical integration

Towards the CBM-MVD Vacuum compatibility and integration into the CBM-MVD vacuum box

design the MVD platform in the target vacuum chamber cable routing finalize services (LV cooling)

Improve in heat transfer Quality assurance while assembling (yields)

Outlook p 2

23

Expertise needed in the future Glue dedicated radiation tolerant reworkable

dispensing techniques Vacuum feed-through concepts MVD stations

positioning Cooling CO2 or conventional

Mechanical integration

Synergy with FAIR

experiment (and

beyond) needed

How to move the MVD stations in vacuum

24

Thank you for your attention

• Slide 1
• Outline
• Slide 3
• Slide 4
• Slide 5
• Slide 6
• Slide 7
• Slide 8
• Slide 9
• Slide 10
• Tests before beam time
• Slide 12
• DAQ performance during beam tests
• Slide 14
• Data analysis
• Slide 16
• Cluster multiplicity studies
• Detection Efficiency (DUT)
• Spatial Resolution (DUT)
• Slide 20
• Summary
• Outlook p 1
• Outlook p 2
• Slide 24

bull Positioning

Aspects addressed during prototyping phase

Sensor

CarrierGlue FPC

FPC

Sensor integration on CVD diamond

Readout amp controlbull Scalability bull Reliability

bull Adhesive bonding

bull Wire bondingbull Encapsulation

FPC

FPCDouble sided

sensor integration

Micro-trackingBeam T1

T2

T3

T4

DUTmicro-tracking

ro

Plane 2

Plane 1

Plane 4

Plane 3DUT

CoolingFront scintillator

Back scintillator

bull Cooling optimization

8

Test beam setup at

T1 T2 T3 T4DUT

Beam

Material budget 0053 X0

Material budget 0053 X0

200 μm CVD diamond 1 mm Al

200 μm CVD diamond

9

DAQ

10

FPC

based on MIMOSA-26 AHR

FEB

clockstartresetJTAG

converterboard

converterboard

converterboard

readout controller

board

driver board

FEB

sensors

readout controller

board

FEB

LVDS 1m4x 80 Mbits

LVDS4 x 80 Mbits

FPC

2 Gbitsoptical fiber to theMVD network

FPC

Slow control board

Dedicated DAQ

Hubreadout

controller board

readout controller

board

PCGeneral purpose add-on HADES TRB V2

~30 m Synergy with HADES

11

Tests before beam time

Stability runs Slow control cross-check Tests with radioactive sources Threshold scans Cooling check Test with long cables

Fully operational setup ready for travelling to CERN

Laboratory setup

Corresponding fluence 24 kHzcm2 (limited by source)

12

Full beam setup at SPS

Huber cooling system

DAQ

Beam telescope

FEE

13

DAQ performance during beam tests

The Readout Network was proven to be highly scalable

All sensors are synchronized No deviations detected within 10 ns precision

DAQ runs very stable No network errors no data loss (5 days of tests)

bull Data rates 6 MBs - 25 MBs but also overload test with +100 MBs

bull JTAG passed also all tests (100 000 programming cycles per chain)

bull In total 2TB of data stored

12 sensors running in parallel

259 260

Frame number Frame number

110 ms

~9 s

CERN-SPSSpill structure

40 s9 s

Peak fluence 350-400 kHzcm 2

20 of MIMOSA-26 computing resources used

Factor of 1000 away from peak fluence AuAu 25AGeV

Limited by beam

14

Data analysis

15

Data analysis

Data analysis flow1 Cluster analysis2 3D alignment3 Track selection with the 4-plane telescope

(straight lines)4 Response of DUT to charged particles

20 ndash 120 GeV PionsCERN SPS North Hall

Plane 1Plane 2

Beam setup

beam

Plane 3Plane 4DUT

bull Detection efficiency Fake Hit Rate Spatial resolution as a function of threshold voltage (DUT)

bull 4 inclination angles of 0 30 45 60

bull Temperature (-6 +6 +17 C) amp threshold scans

bull High beam intensity runs (in average up to 10 hitsframe but due to the non-uniform beam it could also be ~100 hits some of frames ndash to be confirmed)

16

Cluster shape studies

1 23 4

5

6

7

8

Top 8 most frequently observed cluster shapes

Cluster classification will be used for further FPGA-based data compressionCenter of gravity used to compute the ldquohitrdquo position

Cluster multiplicity studies

17

PRELIMINARY

Charge = 80EPIth[μm] cos [e-]

EPI

Sensingdiode

18

Detection Efficiency (DUT)

prob

e

V threshold

V threshold

Ampl

itude

time

NOISE = individual pixel feature

signalnoise

bdquosaferdquo region

ExampleFHR lt 10-5

Efficiency gt 95

PRELIMINARY

19

Spatial Resolution (DUT)

Result for the DUT

σx= 33 micromσY= 33 microm

Spatial resolution DUT only

X (r

ow) b

ack

sens

or

Al heat sink

FEB

FEB

200 microm

Front sensor

Back sensor

π-Correlation back - front

X (row) front sensor

Reproducing the intrinsic parameters of the sensors validates the concept of the prototype

PRELIMINARY

20

Summary amp outlook

Summary

21

Mechanical integration

Achieved An ultra low material budget (03 X0) double-sided micro-tracking

device 2x2 sensors CVD Diamond glue amp FPC Development of tools amp assembly procedures

DAQAchieved

Synchronization Reliability Scalability Slow control amp monitoring tools Data quality

Dataanalysis

Achieved package for alignment and data analysis for test beam setup

(telescope-DUT) online monitoring software (test beam setup)

22

Outlook p 1

DAQ

Dataanalysis

Towards the CBM-MVD Interface to the CBM DAQ Optical data link between FEE and DAQ board

Towards the CBM-MVD Optimizing the digitizer based on data on sensor response Performance studies of physics cases allowing for more realistic

studies on detector performance

Mechanical integration

Towards the CBM-MVD Vacuum compatibility and integration into the CBM-MVD vacuum box

design the MVD platform in the target vacuum chamber cable routing finalize services (LV cooling)

Improve in heat transfer Quality assurance while assembling (yields)

Outlook p 2

23

Expertise needed in the future Glue dedicated radiation tolerant reworkable

dispensing techniques Vacuum feed-through concepts MVD stations

positioning Cooling CO2 or conventional

Mechanical integration

Synergy with FAIR

experiment (and

beyond) needed

How to move the MVD stations in vacuum

24

Thank you for your attention

• Slide 1
• Outline
• Slide 3
• Slide 4
• Slide 5
• Slide 6
• Slide 7
• Slide 8
• Slide 9
• Slide 10
• Tests before beam time
• Slide 12
• DAQ performance during beam tests
• Slide 14
• Data analysis
• Slide 16
• Cluster multiplicity studies
• Detection Efficiency (DUT)
• Spatial Resolution (DUT)
• Slide 20
• Summary
• Outlook p 1
• Outlook p 2
• Slide 24

8

Test beam setup at

T1 T2 T3 T4DUT

Beam

Material budget 0053 X0

Material budget 0053 X0

200 μm CVD diamond 1 mm Al

200 μm CVD diamond

9

DAQ

10

FPC

based on MIMOSA-26 AHR

FEB

clockstartresetJTAG

converterboard

converterboard

converterboard

readout controller

board

driver board

FEB

sensors

readout controller

board

FEB

LVDS 1m4x 80 Mbits

LVDS4 x 80 Mbits

FPC

2 Gbitsoptical fiber to theMVD network

FPC

Slow control board

Dedicated DAQ

Hubreadout

controller board

readout controller

board

PCGeneral purpose add-on HADES TRB V2

~30 m Synergy with HADES

11

Tests before beam time

Stability runs Slow control cross-check Tests with radioactive sources Threshold scans Cooling check Test with long cables

Fully operational setup ready for travelling to CERN

Laboratory setup

Corresponding fluence 24 kHzcm2 (limited by source)

12

Full beam setup at SPS

Huber cooling system

DAQ

Beam telescope

FEE

13

DAQ performance during beam tests

The Readout Network was proven to be highly scalable

All sensors are synchronized No deviations detected within 10 ns precision

DAQ runs very stable No network errors no data loss (5 days of tests)

bull Data rates 6 MBs - 25 MBs but also overload test with +100 MBs

bull JTAG passed also all tests (100 000 programming cycles per chain)

bull In total 2TB of data stored

12 sensors running in parallel

259 260

Frame number Frame number

110 ms

~9 s

CERN-SPSSpill structure

40 s9 s

Peak fluence 350-400 kHzcm 2

20 of MIMOSA-26 computing resources used

Factor of 1000 away from peak fluence AuAu 25AGeV

Limited by beam

14

Data analysis

15

Data analysis

Data analysis flow1 Cluster analysis2 3D alignment3 Track selection with the 4-plane telescope

(straight lines)4 Response of DUT to charged particles

20 ndash 120 GeV PionsCERN SPS North Hall

Plane 1Plane 2

Beam setup

beam

Plane 3Plane 4DUT

bull Detection efficiency Fake Hit Rate Spatial resolution as a function of threshold voltage (DUT)

bull 4 inclination angles of 0 30 45 60

bull Temperature (-6 +6 +17 C) amp threshold scans

bull High beam intensity runs (in average up to 10 hitsframe but due to the non-uniform beam it could also be ~100 hits some of frames ndash to be confirmed)

16

Cluster shape studies

1 23 4

5

6

7

8

Top 8 most frequently observed cluster shapes

Cluster classification will be used for further FPGA-based data compressionCenter of gravity used to compute the ldquohitrdquo position

Cluster multiplicity studies

17

PRELIMINARY

Charge = 80EPIth[μm] cos [e-]

EPI

Sensingdiode

18

Detection Efficiency (DUT)

prob

e

V threshold

V threshold

Ampl

itude

time

NOISE = individual pixel feature

signalnoise

bdquosaferdquo region

ExampleFHR lt 10-5

Efficiency gt 95

PRELIMINARY

19

Spatial Resolution (DUT)

Result for the DUT

σx= 33 micromσY= 33 microm

Spatial resolution DUT only

X (r

ow) b

ack

sens

or

Al heat sink

FEB

FEB

200 microm

Front sensor

Back sensor

π-Correlation back - front

X (row) front sensor

Reproducing the intrinsic parameters of the sensors validates the concept of the prototype

PRELIMINARY

20

Summary amp outlook

Summary

21

Mechanical integration

Achieved An ultra low material budget (03 X0) double-sided micro-tracking

device 2x2 sensors CVD Diamond glue amp FPC Development of tools amp assembly procedures

DAQAchieved

Synchronization Reliability Scalability Slow control amp monitoring tools Data quality

Dataanalysis

Achieved package for alignment and data analysis for test beam setup

(telescope-DUT) online monitoring software (test beam setup)

22

Outlook p 1

DAQ

Dataanalysis

Towards the CBM-MVD Interface to the CBM DAQ Optical data link between FEE and DAQ board

Towards the CBM-MVD Optimizing the digitizer based on data on sensor response Performance studies of physics cases allowing for more realistic

studies on detector performance

Mechanical integration

Towards the CBM-MVD Vacuum compatibility and integration into the CBM-MVD vacuum box

design the MVD platform in the target vacuum chamber cable routing finalize services (LV cooling)

Improve in heat transfer Quality assurance while assembling (yields)

Outlook p 2

23

Expertise needed in the future Glue dedicated radiation tolerant reworkable

dispensing techniques Vacuum feed-through concepts MVD stations

positioning Cooling CO2 or conventional

Mechanical integration

Synergy with FAIR

experiment (and

beyond) needed

How to move the MVD stations in vacuum

24

Thank you for your attention

• Slide 1
• Outline
• Slide 3
• Slide 4
• Slide 5
• Slide 6
• Slide 7
• Slide 8
• Slide 9
• Slide 10
• Tests before beam time
• Slide 12
• DAQ performance during beam tests
• Slide 14
• Data analysis
• Slide 16
• Cluster multiplicity studies
• Detection Efficiency (DUT)
• Spatial Resolution (DUT)
• Slide 20
• Summary
• Outlook p 1
• Outlook p 2
• Slide 24

9

DAQ

10

FPC

based on MIMOSA-26 AHR

FEB

clockstartresetJTAG

converterboard

converterboard

converterboard

readout controller

board

driver board

FEB

sensors

readout controller

board

FEB

LVDS 1m4x 80 Mbits

LVDS4 x 80 Mbits

FPC

2 Gbitsoptical fiber to theMVD network

FPC

Slow control board

Dedicated DAQ

Hubreadout

controller board

readout controller

board

PCGeneral purpose add-on HADES TRB V2

~30 m Synergy with HADES

11

Tests before beam time

Stability runs Slow control cross-check Tests with radioactive sources Threshold scans Cooling check Test with long cables

Fully operational setup ready for travelling to CERN

Laboratory setup

Corresponding fluence 24 kHzcm2 (limited by source)

12

Full beam setup at SPS

Huber cooling system

DAQ

Beam telescope

FEE

13

DAQ performance during beam tests

The Readout Network was proven to be highly scalable

All sensors are synchronized No deviations detected within 10 ns precision

DAQ runs very stable No network errors no data loss (5 days of tests)

bull Data rates 6 MBs - 25 MBs but also overload test with +100 MBs

bull JTAG passed also all tests (100 000 programming cycles per chain)

bull In total 2TB of data stored

12 sensors running in parallel

259 260

Frame number Frame number

110 ms

~9 s

CERN-SPSSpill structure

40 s9 s

Peak fluence 350-400 kHzcm 2

20 of MIMOSA-26 computing resources used

Factor of 1000 away from peak fluence AuAu 25AGeV

Limited by beam

14

Data analysis

15

Data analysis

Data analysis flow1 Cluster analysis2 3D alignment3 Track selection with the 4-plane telescope

(straight lines)4 Response of DUT to charged particles

20 ndash 120 GeV PionsCERN SPS North Hall

Plane 1Plane 2

Beam setup

beam

Plane 3Plane 4DUT

bull Detection efficiency Fake Hit Rate Spatial resolution as a function of threshold voltage (DUT)

bull 4 inclination angles of 0 30 45 60

bull Temperature (-6 +6 +17 C) amp threshold scans

bull High beam intensity runs (in average up to 10 hitsframe but due to the non-uniform beam it could also be ~100 hits some of frames ndash to be confirmed)

16

Cluster shape studies

1 23 4

5

6

7

8

Top 8 most frequently observed cluster shapes

Cluster classification will be used for further FPGA-based data compressionCenter of gravity used to compute the ldquohitrdquo position

Cluster multiplicity studies

17

PRELIMINARY

Charge = 80EPIth[μm] cos [e-]

EPI

Sensingdiode

18

Detection Efficiency (DUT)

prob

e

V threshold

V threshold

Ampl

itude

time

NOISE = individual pixel feature

signalnoise

bdquosaferdquo region

ExampleFHR lt 10-5

Efficiency gt 95

PRELIMINARY

19

Spatial Resolution (DUT)

Result for the DUT

σx= 33 micromσY= 33 microm

Spatial resolution DUT only

X (r

ow) b

ack

sens

or

Al heat sink

FEB

FEB

200 microm

Front sensor

Back sensor

π-Correlation back - front

X (row) front sensor

Reproducing the intrinsic parameters of the sensors validates the concept of the prototype

PRELIMINARY

20

Summary amp outlook

Summary

21

Mechanical integration

Achieved An ultra low material budget (03 X0) double-sided micro-tracking

device 2x2 sensors CVD Diamond glue amp FPC Development of tools amp assembly procedures

DAQAchieved

Synchronization Reliability Scalability Slow control amp monitoring tools Data quality

Dataanalysis

Achieved package for alignment and data analysis for test beam setup

(telescope-DUT) online monitoring software (test beam setup)

22

Outlook p 1

DAQ

Dataanalysis

Towards the CBM-MVD Interface to the CBM DAQ Optical data link between FEE and DAQ board

Towards the CBM-MVD Optimizing the digitizer based on data on sensor response Performance studies of physics cases allowing for more realistic

studies on detector performance

Mechanical integration

Towards the CBM-MVD Vacuum compatibility and integration into the CBM-MVD vacuum box

design the MVD platform in the target vacuum chamber cable routing finalize services (LV cooling)

Improve in heat transfer Quality assurance while assembling (yields)

Outlook p 2

23

Expertise needed in the future Glue dedicated radiation tolerant reworkable

dispensing techniques Vacuum feed-through concepts MVD stations

positioning Cooling CO2 or conventional

Mechanical integration

Synergy with FAIR

experiment (and

beyond) needed

How to move the MVD stations in vacuum

24

Thank you for your attention

• Slide 1
• Outline
• Slide 3
• Slide 4
• Slide 5
• Slide 6
• Slide 7
• Slide 8
• Slide 9
• Slide 10
• Tests before beam time
• Slide 12
• DAQ performance during beam tests
• Slide 14
• Data analysis
• Slide 16
• Cluster multiplicity studies
• Detection Efficiency (DUT)
• Spatial Resolution (DUT)
• Slide 20
• Summary
• Outlook p 1
• Outlook p 2
• Slide 24

10

FPC

based on MIMOSA-26 AHR

FEB

clockstartresetJTAG

converterboard

converterboard

converterboard

readout controller

board

driver board

FEB

sensors

readout controller

board

FEB

LVDS 1m4x 80 Mbits

LVDS4 x 80 Mbits

FPC

2 Gbitsoptical fiber to theMVD network

FPC

Slow control board

Dedicated DAQ

Hubreadout

controller board

readout controller

board

PCGeneral purpose add-on HADES TRB V2

~30 m Synergy with HADES

11

Tests before beam time

Stability runs Slow control cross-check Tests with radioactive sources Threshold scans Cooling check Test with long cables

Fully operational setup ready for travelling to CERN

Laboratory setup

Corresponding fluence 24 kHzcm2 (limited by source)

12

Full beam setup at SPS

Huber cooling system

DAQ

Beam telescope

FEE

13

DAQ performance during beam tests

The Readout Network was proven to be highly scalable

All sensors are synchronized No deviations detected within 10 ns precision

DAQ runs very stable No network errors no data loss (5 days of tests)

bull Data rates 6 MBs - 25 MBs but also overload test with +100 MBs

bull JTAG passed also all tests (100 000 programming cycles per chain)

bull In total 2TB of data stored

12 sensors running in parallel

259 260

Frame number Frame number

110 ms

~9 s

CERN-SPSSpill structure

40 s9 s

Peak fluence 350-400 kHzcm 2

20 of MIMOSA-26 computing resources used

Factor of 1000 away from peak fluence AuAu 25AGeV

Limited by beam

14

Data analysis

15

Data analysis

Data analysis flow1 Cluster analysis2 3D alignment3 Track selection with the 4-plane telescope

(straight lines)4 Response of DUT to charged particles

20 ndash 120 GeV PionsCERN SPS North Hall

Plane 1Plane 2

Beam setup

beam

Plane 3Plane 4DUT

bull Detection efficiency Fake Hit Rate Spatial resolution as a function of threshold voltage (DUT)

bull 4 inclination angles of 0 30 45 60

bull Temperature (-6 +6 +17 C) amp threshold scans

bull High beam intensity runs (in average up to 10 hitsframe but due to the non-uniform beam it could also be ~100 hits some of frames ndash to be confirmed)

16

Cluster shape studies

1 23 4

5

6

7

8

Top 8 most frequently observed cluster shapes

Cluster classification will be used for further FPGA-based data compressionCenter of gravity used to compute the ldquohitrdquo position

Cluster multiplicity studies

17

PRELIMINARY

Charge = 80EPIth[μm] cos [e-]

EPI

Sensingdiode

18

Detection Efficiency (DUT)

prob

e

V threshold

V threshold

Ampl

itude

time

NOISE = individual pixel feature

signalnoise

bdquosaferdquo region

ExampleFHR lt 10-5

Efficiency gt 95

PRELIMINARY

19

Spatial Resolution (DUT)

Result for the DUT

σx= 33 micromσY= 33 microm

Spatial resolution DUT only

X (r

ow) b

ack

sens

or

Al heat sink

FEB

FEB

200 microm

Front sensor

Back sensor

π-Correlation back - front

X (row) front sensor

Reproducing the intrinsic parameters of the sensors validates the concept of the prototype

PRELIMINARY

20

Summary amp outlook

Summary

21

Mechanical integration

Achieved An ultra low material budget (03 X0) double-sided micro-tracking

device 2x2 sensors CVD Diamond glue amp FPC Development of tools amp assembly procedures

DAQAchieved

Synchronization Reliability Scalability Slow control amp monitoring tools Data quality

Dataanalysis

Achieved package for alignment and data analysis for test beam setup

(telescope-DUT) online monitoring software (test beam setup)

22

Outlook p 1

DAQ

Dataanalysis

Towards the CBM-MVD Interface to the CBM DAQ Optical data link between FEE and DAQ board

Towards the CBM-MVD Optimizing the digitizer based on data on sensor response Performance studies of physics cases allowing for more realistic

studies on detector performance

Mechanical integration

Towards the CBM-MVD Vacuum compatibility and integration into the CBM-MVD vacuum box

design the MVD platform in the target vacuum chamber cable routing finalize services (LV cooling)

Improve in heat transfer Quality assurance while assembling (yields)

Outlook p 2

23

Expertise needed in the future Glue dedicated radiation tolerant reworkable

dispensing techniques Vacuum feed-through concepts MVD stations

positioning Cooling CO2 or conventional

Mechanical integration

Synergy with FAIR

experiment (and

beyond) needed

How to move the MVD stations in vacuum

24

Thank you for your attention

• Slide 1
• Outline
• Slide 3
• Slide 4
• Slide 5
• Slide 6
• Slide 7
• Slide 8
• Slide 9
• Slide 10
• Tests before beam time
• Slide 12
• DAQ performance during beam tests
• Slide 14
• Data analysis
• Slide 16
• Cluster multiplicity studies
• Detection Efficiency (DUT)
• Spatial Resolution (DUT)
• Slide 20
• Summary
• Outlook p 1
• Outlook p 2
• Slide 24

11

Tests before beam time

Stability runs Slow control cross-check Tests with radioactive sources Threshold scans Cooling check Test with long cables

Fully operational setup ready for travelling to CERN

Laboratory setup

Corresponding fluence 24 kHzcm2 (limited by source)

12

Full beam setup at SPS

Huber cooling system

DAQ

Beam telescope

FEE

13

DAQ performance during beam tests

The Readout Network was proven to be highly scalable

All sensors are synchronized No deviations detected within 10 ns precision

DAQ runs very stable No network errors no data loss (5 days of tests)

bull Data rates 6 MBs - 25 MBs but also overload test with +100 MBs

bull JTAG passed also all tests (100 000 programming cycles per chain)

bull In total 2TB of data stored

12 sensors running in parallel

259 260

Frame number Frame number

110 ms

~9 s

CERN-SPSSpill structure

40 s9 s

Peak fluence 350-400 kHzcm 2

20 of MIMOSA-26 computing resources used

Factor of 1000 away from peak fluence AuAu 25AGeV

Limited by beam

14

Data analysis

15

Data analysis

Data analysis flow1 Cluster analysis2 3D alignment3 Track selection with the 4-plane telescope

(straight lines)4 Response of DUT to charged particles

20 ndash 120 GeV PionsCERN SPS North Hall

Plane 1Plane 2

Beam setup

beam

Plane 3Plane 4DUT

bull Detection efficiency Fake Hit Rate Spatial resolution as a function of threshold voltage (DUT)

bull 4 inclination angles of 0 30 45 60

bull Temperature (-6 +6 +17 C) amp threshold scans

bull High beam intensity runs (in average up to 10 hitsframe but due to the non-uniform beam it could also be ~100 hits some of frames ndash to be confirmed)

16

Cluster shape studies

1 23 4

5

6

7

8

Top 8 most frequently observed cluster shapes

Cluster classification will be used for further FPGA-based data compressionCenter of gravity used to compute the ldquohitrdquo position

Cluster multiplicity studies

17

PRELIMINARY

Charge = 80EPIth[μm] cos [e-]

EPI

Sensingdiode

18

Detection Efficiency (DUT)

prob

e

V threshold

V threshold

Ampl

itude

time

NOISE = individual pixel feature

signalnoise

bdquosaferdquo region

ExampleFHR lt 10-5

Efficiency gt 95

PRELIMINARY

19

Spatial Resolution (DUT)

Result for the DUT

σx= 33 micromσY= 33 microm

Spatial resolution DUT only

X (r

ow) b

ack

sens

or

Al heat sink

FEB

FEB

200 microm

Front sensor

Back sensor

π-Correlation back - front

X (row) front sensor

Reproducing the intrinsic parameters of the sensors validates the concept of the prototype

PRELIMINARY

20

Summary amp outlook

Summary

21

Mechanical integration

Achieved An ultra low material budget (03 X0) double-sided micro-tracking

device 2x2 sensors CVD Diamond glue amp FPC Development of tools amp assembly procedures

DAQAchieved

Synchronization Reliability Scalability Slow control amp monitoring tools Data quality

Dataanalysis

Achieved package for alignment and data analysis for test beam setup

(telescope-DUT) online monitoring software (test beam setup)

22

Outlook p 1

DAQ

Dataanalysis

Towards the CBM-MVD Interface to the CBM DAQ Optical data link between FEE and DAQ board

Towards the CBM-MVD Optimizing the digitizer based on data on sensor response Performance studies of physics cases allowing for more realistic

studies on detector performance

Mechanical integration

Towards the CBM-MVD Vacuum compatibility and integration into the CBM-MVD vacuum box

design the MVD platform in the target vacuum chamber cable routing finalize services (LV cooling)

Improve in heat transfer Quality assurance while assembling (yields)

Outlook p 2

23

Expertise needed in the future Glue dedicated radiation tolerant reworkable

dispensing techniques Vacuum feed-through concepts MVD stations

positioning Cooling CO2 or conventional

Mechanical integration

Synergy with FAIR

experiment (and

beyond) needed

How to move the MVD stations in vacuum

24

Thank you for your attention

• Slide 1
• Outline
• Slide 3
• Slide 4
• Slide 5
• Slide 6
• Slide 7
• Slide 8
• Slide 9
• Slide 10
• Tests before beam time
• Slide 12
• DAQ performance during beam tests
• Slide 14
• Data analysis
• Slide 16
• Cluster multiplicity studies
• Detection Efficiency (DUT)
• Spatial Resolution (DUT)
• Slide 20
• Summary
• Outlook p 1
• Outlook p 2
• Slide 24

12

Full beam setup at SPS

Huber cooling system

DAQ

Beam telescope

FEE

13

DAQ performance during beam tests

The Readout Network was proven to be highly scalable

All sensors are synchronized No deviations detected within 10 ns precision

DAQ runs very stable No network errors no data loss (5 days of tests)

bull Data rates 6 MBs - 25 MBs but also overload test with +100 MBs

bull JTAG passed also all tests (100 000 programming cycles per chain)

bull In total 2TB of data stored

12 sensors running in parallel

259 260

Frame number Frame number

110 ms

~9 s

CERN-SPSSpill structure

40 s9 s

Peak fluence 350-400 kHzcm 2

20 of MIMOSA-26 computing resources used

Factor of 1000 away from peak fluence AuAu 25AGeV

Limited by beam

14

Data analysis

15

Data analysis

Data analysis flow1 Cluster analysis2 3D alignment3 Track selection with the 4-plane telescope

(straight lines)4 Response of DUT to charged particles

20 ndash 120 GeV PionsCERN SPS North Hall

Plane 1Plane 2

Beam setup

beam

Plane 3Plane 4DUT

bull Detection efficiency Fake Hit Rate Spatial resolution as a function of threshold voltage (DUT)

bull 4 inclination angles of 0 30 45 60

bull Temperature (-6 +6 +17 C) amp threshold scans

bull High beam intensity runs (in average up to 10 hitsframe but due to the non-uniform beam it could also be ~100 hits some of frames ndash to be confirmed)

16

Cluster shape studies

1 23 4

5

6

7

8

Top 8 most frequently observed cluster shapes

Cluster classification will be used for further FPGA-based data compressionCenter of gravity used to compute the ldquohitrdquo position

Cluster multiplicity studies

17

PRELIMINARY

Charge = 80EPIth[μm] cos [e-]

EPI

Sensingdiode

18

Detection Efficiency (DUT)

prob

e

V threshold

V threshold

Ampl

itude

time

NOISE = individual pixel feature

signalnoise

bdquosaferdquo region

ExampleFHR lt 10-5

Efficiency gt 95

PRELIMINARY

19

Spatial Resolution (DUT)

Result for the DUT

σx= 33 micromσY= 33 microm

Spatial resolution DUT only

X (r

ow) b

ack

sens

or

Al heat sink

FEB

FEB

200 microm

Front sensor

Back sensor

π-Correlation back - front

X (row) front sensor

Reproducing the intrinsic parameters of the sensors validates the concept of the prototype

PRELIMINARY

20

Summary amp outlook

Summary

21

Mechanical integration

Achieved An ultra low material budget (03 X0) double-sided micro-tracking

device 2x2 sensors CVD Diamond glue amp FPC Development of tools amp assembly procedures

DAQAchieved

Synchronization Reliability Scalability Slow control amp monitoring tools Data quality

Dataanalysis

Achieved package for alignment and data analysis for test beam setup

(telescope-DUT) online monitoring software (test beam setup)

22

Outlook p 1

DAQ

Dataanalysis

Towards the CBM-MVD Interface to the CBM DAQ Optical data link between FEE and DAQ board

Towards the CBM-MVD Optimizing the digitizer based on data on sensor response Performance studies of physics cases allowing for more realistic

studies on detector performance

Mechanical integration

Towards the CBM-MVD Vacuum compatibility and integration into the CBM-MVD vacuum box

design the MVD platform in the target vacuum chamber cable routing finalize services (LV cooling)

Improve in heat transfer Quality assurance while assembling (yields)

Outlook p 2

23

Expertise needed in the future Glue dedicated radiation tolerant reworkable

dispensing techniques Vacuum feed-through concepts MVD stations

positioning Cooling CO2 or conventional

Mechanical integration

Synergy with FAIR

experiment (and

beyond) needed

How to move the MVD stations in vacuum

24

Thank you for your attention

• Slide 1
• Outline
• Slide 3
• Slide 4
• Slide 5
• Slide 6
• Slide 7
• Slide 8
• Slide 9
• Slide 10
• Tests before beam time
• Slide 12
• DAQ performance during beam tests
• Slide 14
• Data analysis
• Slide 16
• Cluster multiplicity studies
• Detection Efficiency (DUT)
• Spatial Resolution (DUT)
• Slide 20
• Summary
• Outlook p 1
• Outlook p 2
• Slide 24

13

DAQ performance during beam tests

The Readout Network was proven to be highly scalable

All sensors are synchronized No deviations detected within 10 ns precision

DAQ runs very stable No network errors no data loss (5 days of tests)

bull Data rates 6 MBs - 25 MBs but also overload test with +100 MBs

bull JTAG passed also all tests (100 000 programming cycles per chain)

bull In total 2TB of data stored

12 sensors running in parallel

259 260

Frame number Frame number

110 ms

~9 s

CERN-SPSSpill structure

40 s9 s

Peak fluence 350-400 kHzcm 2

20 of MIMOSA-26 computing resources used

Factor of 1000 away from peak fluence AuAu 25AGeV

Limited by beam

14

Data analysis

15

Data analysis

Data analysis flow1 Cluster analysis2 3D alignment3 Track selection with the 4-plane telescope

(straight lines)4 Response of DUT to charged particles

20 ndash 120 GeV PionsCERN SPS North Hall

Plane 1Plane 2

Beam setup

beam

Plane 3Plane 4DUT

bull Detection efficiency Fake Hit Rate Spatial resolution as a function of threshold voltage (DUT)

bull 4 inclination angles of 0 30 45 60

bull Temperature (-6 +6 +17 C) amp threshold scans

bull High beam intensity runs (in average up to 10 hitsframe but due to the non-uniform beam it could also be ~100 hits some of frames ndash to be confirmed)

16

Cluster shape studies

1 23 4

5

6

7

8

Top 8 most frequently observed cluster shapes

Cluster classification will be used for further FPGA-based data compressionCenter of gravity used to compute the ldquohitrdquo position

Cluster multiplicity studies

17

PRELIMINARY

Charge = 80EPIth[μm] cos [e-]

EPI

Sensingdiode

18

Detection Efficiency (DUT)

prob

e

V threshold

V threshold

Ampl

itude

time

NOISE = individual pixel feature

signalnoise

bdquosaferdquo region

ExampleFHR lt 10-5

Efficiency gt 95

PRELIMINARY

19

Spatial Resolution (DUT)

Result for the DUT

σx= 33 micromσY= 33 microm

Spatial resolution DUT only

X (r

ow) b

ack

sens

or

Al heat sink

FEB

FEB

200 microm

Front sensor

Back sensor

π-Correlation back - front

X (row) front sensor

Reproducing the intrinsic parameters of the sensors validates the concept of the prototype

PRELIMINARY

20

Summary amp outlook

Summary

21

Mechanical integration

Achieved An ultra low material budget (03 X0) double-sided micro-tracking

device 2x2 sensors CVD Diamond glue amp FPC Development of tools amp assembly procedures

DAQAchieved

Synchronization Reliability Scalability Slow control amp monitoring tools Data quality

Dataanalysis

Achieved package for alignment and data analysis for test beam setup

(telescope-DUT) online monitoring software (test beam setup)

22

Outlook p 1

DAQ

Dataanalysis

Towards the CBM-MVD Interface to the CBM DAQ Optical data link between FEE and DAQ board

Towards the CBM-MVD Optimizing the digitizer based on data on sensor response Performance studies of physics cases allowing for more realistic

studies on detector performance

Mechanical integration

Towards the CBM-MVD Vacuum compatibility and integration into the CBM-MVD vacuum box

design the MVD platform in the target vacuum chamber cable routing finalize services (LV cooling)

Improve in heat transfer Quality assurance while assembling (yields)

Outlook p 2

23

Expertise needed in the future Glue dedicated radiation tolerant reworkable

dispensing techniques Vacuum feed-through concepts MVD stations

positioning Cooling CO2 or conventional

Mechanical integration

Synergy with FAIR

experiment (and

beyond) needed

How to move the MVD stations in vacuum

24

Thank you for your attention

• Slide 1
• Outline
• Slide 3
• Slide 4
• Slide 5
• Slide 6
• Slide 7
• Slide 8
• Slide 9
• Slide 10
• Tests before beam time
• Slide 12
• DAQ performance during beam tests
• Slide 14
• Data analysis
• Slide 16
• Cluster multiplicity studies
• Detection Efficiency (DUT)
• Spatial Resolution (DUT)
• Slide 20
• Summary
• Outlook p 1
• Outlook p 2
• Slide 24

14

Data analysis

15

Data analysis

Data analysis flow1 Cluster analysis2 3D alignment3 Track selection with the 4-plane telescope

(straight lines)4 Response of DUT to charged particles

20 ndash 120 GeV PionsCERN SPS North Hall

Plane 1Plane 2

Beam setup

beam

Plane 3Plane 4DUT

bull Detection efficiency Fake Hit Rate Spatial resolution as a function of threshold voltage (DUT)

bull 4 inclination angles of 0 30 45 60

bull Temperature (-6 +6 +17 C) amp threshold scans

bull High beam intensity runs (in average up to 10 hitsframe but due to the non-uniform beam it could also be ~100 hits some of frames ndash to be confirmed)

16

Cluster shape studies

1 23 4

5

6

7

8

Top 8 most frequently observed cluster shapes

Cluster classification will be used for further FPGA-based data compressionCenter of gravity used to compute the ldquohitrdquo position

Cluster multiplicity studies

17

PRELIMINARY

Charge = 80EPIth[μm] cos [e-]

EPI

Sensingdiode

18

Detection Efficiency (DUT)

prob

e

V threshold

V threshold

Ampl

itude

time

NOISE = individual pixel feature

signalnoise

bdquosaferdquo region

ExampleFHR lt 10-5

Efficiency gt 95

PRELIMINARY

19

Spatial Resolution (DUT)

Result for the DUT

σx= 33 micromσY= 33 microm

Spatial resolution DUT only

X (r

ow) b

ack

sens

or

Al heat sink

FEB

FEB

200 microm

Front sensor

Back sensor

π-Correlation back - front

X (row) front sensor

Reproducing the intrinsic parameters of the sensors validates the concept of the prototype

PRELIMINARY

20

Summary amp outlook

Summary

21

Mechanical integration

Achieved An ultra low material budget (03 X0) double-sided micro-tracking

device 2x2 sensors CVD Diamond glue amp FPC Development of tools amp assembly procedures

DAQAchieved

Synchronization Reliability Scalability Slow control amp monitoring tools Data quality

Dataanalysis

Achieved package for alignment and data analysis for test beam setup

(telescope-DUT) online monitoring software (test beam setup)

22

Outlook p 1

DAQ

Dataanalysis

Towards the CBM-MVD Interface to the CBM DAQ Optical data link between FEE and DAQ board

Towards the CBM-MVD Optimizing the digitizer based on data on sensor response Performance studies of physics cases allowing for more realistic

studies on detector performance

Mechanical integration

Towards the CBM-MVD Vacuum compatibility and integration into the CBM-MVD vacuum box

design the MVD platform in the target vacuum chamber cable routing finalize services (LV cooling)

Improve in heat transfer Quality assurance while assembling (yields)

Outlook p 2

23

Expertise needed in the future Glue dedicated radiation tolerant reworkable

dispensing techniques Vacuum feed-through concepts MVD stations

positioning Cooling CO2 or conventional

Mechanical integration

Synergy with FAIR

experiment (and

beyond) needed

How to move the MVD stations in vacuum

24

Thank you for your attention

• Slide 1
• Outline
• Slide 3
• Slide 4
• Slide 5
• Slide 6
• Slide 7
• Slide 8
• Slide 9
• Slide 10
• Tests before beam time
• Slide 12
• DAQ performance during beam tests
• Slide 14
• Data analysis
• Slide 16
• Cluster multiplicity studies
• Detection Efficiency (DUT)
• Spatial Resolution (DUT)
• Slide 20
• Summary
• Outlook p 1
• Outlook p 2
• Slide 24

15

Data analysis

Data analysis flow1 Cluster analysis2 3D alignment3 Track selection with the 4-plane telescope

(straight lines)4 Response of DUT to charged particles

20 ndash 120 GeV PionsCERN SPS North Hall

Plane 1Plane 2

Beam setup

beam

Plane 3Plane 4DUT

bull Detection efficiency Fake Hit Rate Spatial resolution as a function of threshold voltage (DUT)

bull 4 inclination angles of 0 30 45 60

bull Temperature (-6 +6 +17 C) amp threshold scans

bull High beam intensity runs (in average up to 10 hitsframe but due to the non-uniform beam it could also be ~100 hits some of frames ndash to be confirmed)

16

Cluster shape studies

1 23 4

5

6

7

8

Top 8 most frequently observed cluster shapes

Cluster classification will be used for further FPGA-based data compressionCenter of gravity used to compute the ldquohitrdquo position

Cluster multiplicity studies

17

PRELIMINARY

Charge = 80EPIth[μm] cos [e-]

EPI

Sensingdiode

18

Detection Efficiency (DUT)

prob

e

V threshold

V threshold

Ampl

itude

time

NOISE = individual pixel feature

signalnoise

bdquosaferdquo region

ExampleFHR lt 10-5

Efficiency gt 95

PRELIMINARY

19

Spatial Resolution (DUT)

Result for the DUT

σx= 33 micromσY= 33 microm

Spatial resolution DUT only

X (r

ow) b

ack

sens

or

Al heat sink

FEB

FEB

200 microm

Front sensor

Back sensor

π-Correlation back - front

X (row) front sensor

Reproducing the intrinsic parameters of the sensors validates the concept of the prototype

PRELIMINARY

20

Summary amp outlook

Summary

21

Mechanical integration

Achieved An ultra low material budget (03 X0) double-sided micro-tracking

device 2x2 sensors CVD Diamond glue amp FPC Development of tools amp assembly procedures

DAQAchieved

Synchronization Reliability Scalability Slow control amp monitoring tools Data quality

Dataanalysis

Achieved package for alignment and data analysis for test beam setup

(telescope-DUT) online monitoring software (test beam setup)

22

Outlook p 1

DAQ

Dataanalysis

Towards the CBM-MVD Interface to the CBM DAQ Optical data link between FEE and DAQ board

Towards the CBM-MVD Optimizing the digitizer based on data on sensor response Performance studies of physics cases allowing for more realistic

studies on detector performance

Mechanical integration

Towards the CBM-MVD Vacuum compatibility and integration into the CBM-MVD vacuum box

design the MVD platform in the target vacuum chamber cable routing finalize services (LV cooling)

Improve in heat transfer Quality assurance while assembling (yields)

Outlook p 2

23

Expertise needed in the future Glue dedicated radiation tolerant reworkable

dispensing techniques Vacuum feed-through concepts MVD stations

positioning Cooling CO2 or conventional

Mechanical integration

Synergy with FAIR

experiment (and

beyond) needed

How to move the MVD stations in vacuum

24

Thank you for your attention

• Slide 1
• Outline
• Slide 3
• Slide 4
• Slide 5
• Slide 6
• Slide 7
• Slide 8
• Slide 9
• Slide 10
• Tests before beam time
• Slide 12
• DAQ performance during beam tests
• Slide 14
• Data analysis
• Slide 16
• Cluster multiplicity studies
• Detection Efficiency (DUT)
• Spatial Resolution (DUT)
• Slide 20
• Summary
• Outlook p 1
• Outlook p 2
• Slide 24

16

Cluster shape studies

1 23 4

5

6

7

8

Top 8 most frequently observed cluster shapes

Cluster classification will be used for further FPGA-based data compressionCenter of gravity used to compute the ldquohitrdquo position

Cluster multiplicity studies

17

PRELIMINARY

Charge = 80EPIth[μm] cos [e-]

EPI

Sensingdiode

18

Detection Efficiency (DUT)

prob

e

V threshold

V threshold

Ampl

itude

time

NOISE = individual pixel feature

signalnoise

bdquosaferdquo region

ExampleFHR lt 10-5

Efficiency gt 95

PRELIMINARY

19

Spatial Resolution (DUT)

Result for the DUT

σx= 33 micromσY= 33 microm

Spatial resolution DUT only

X (r

ow) b

ack

sens

or

Al heat sink

FEB

FEB

200 microm

Front sensor

Back sensor

π-Correlation back - front

X (row) front sensor

Reproducing the intrinsic parameters of the sensors validates the concept of the prototype

PRELIMINARY

20

Summary amp outlook

Summary

21

Mechanical integration

Achieved An ultra low material budget (03 X0) double-sided micro-tracking

device 2x2 sensors CVD Diamond glue amp FPC Development of tools amp assembly procedures

DAQAchieved

Synchronization Reliability Scalability Slow control amp monitoring tools Data quality

Dataanalysis

Achieved package for alignment and data analysis for test beam setup

(telescope-DUT) online monitoring software (test beam setup)

22

Outlook p 1

DAQ

Dataanalysis

Towards the CBM-MVD Interface to the CBM DAQ Optical data link between FEE and DAQ board

Towards the CBM-MVD Optimizing the digitizer based on data on sensor response Performance studies of physics cases allowing for more realistic

studies on detector performance

Mechanical integration

Towards the CBM-MVD Vacuum compatibility and integration into the CBM-MVD vacuum box

design the MVD platform in the target vacuum chamber cable routing finalize services (LV cooling)

Improve in heat transfer Quality assurance while assembling (yields)

Outlook p 2

23

Expertise needed in the future Glue dedicated radiation tolerant reworkable

dispensing techniques Vacuum feed-through concepts MVD stations

positioning Cooling CO2 or conventional

Mechanical integration

Synergy with FAIR

experiment (and

beyond) needed

How to move the MVD stations in vacuum

24

Thank you for your attention

• Slide 1
• Outline
• Slide 3
• Slide 4
• Slide 5
• Slide 6
• Slide 7
• Slide 8
• Slide 9
• Slide 10
• Tests before beam time
• Slide 12
• DAQ performance during beam tests
• Slide 14
• Data analysis
• Slide 16
• Cluster multiplicity studies
• Detection Efficiency (DUT)
• Spatial Resolution (DUT)
• Slide 20
• Summary
• Outlook p 1
• Outlook p 2
• Slide 24

Cluster multiplicity studies

17

PRELIMINARY

Charge = 80EPIth[μm] cos [e-]

EPI

Sensingdiode

18

Detection Efficiency (DUT)

prob

e

V threshold

V threshold

Ampl

itude

time

NOISE = individual pixel feature

signalnoise

bdquosaferdquo region

ExampleFHR lt 10-5

Efficiency gt 95

PRELIMINARY

19

Spatial Resolution (DUT)

Result for the DUT

σx= 33 micromσY= 33 microm

Spatial resolution DUT only

X (r

ow) b

ack

sens

or

Al heat sink

FEB

FEB

200 microm

Front sensor

Back sensor

π-Correlation back - front

X (row) front sensor

Reproducing the intrinsic parameters of the sensors validates the concept of the prototype

PRELIMINARY

20

Summary amp outlook

Summary

21

Mechanical integration

Achieved An ultra low material budget (03 X0) double-sided micro-tracking

device 2x2 sensors CVD Diamond glue amp FPC Development of tools amp assembly procedures

DAQAchieved

Synchronization Reliability Scalability Slow control amp monitoring tools Data quality

Dataanalysis

Achieved package for alignment and data analysis for test beam setup

(telescope-DUT) online monitoring software (test beam setup)

22

Outlook p 1

DAQ

Dataanalysis

Towards the CBM-MVD Interface to the CBM DAQ Optical data link between FEE and DAQ board

Towards the CBM-MVD Optimizing the digitizer based on data on sensor response Performance studies of physics cases allowing for more realistic

studies on detector performance

Mechanical integration

Towards the CBM-MVD Vacuum compatibility and integration into the CBM-MVD vacuum box

design the MVD platform in the target vacuum chamber cable routing finalize services (LV cooling)

Improve in heat transfer Quality assurance while assembling (yields)

Outlook p 2

23

Expertise needed in the future Glue dedicated radiation tolerant reworkable

dispensing techniques Vacuum feed-through concepts MVD stations

positioning Cooling CO2 or conventional

Mechanical integration

Synergy with FAIR

experiment (and

beyond) needed

How to move the MVD stations in vacuum

24

Thank you for your attention

• Slide 1
• Outline
• Slide 3
• Slide 4
• Slide 5
• Slide 6
• Slide 7
• Slide 8
• Slide 9
• Slide 10
• Tests before beam time
• Slide 12
• DAQ performance during beam tests
• Slide 14
• Data analysis
• Slide 16
• Cluster multiplicity studies
• Detection Efficiency (DUT)
• Spatial Resolution (DUT)
• Slide 20
• Summary
• Outlook p 1
• Outlook p 2
• Slide 24

18

Detection Efficiency (DUT)

prob

e

V threshold

V threshold

Ampl

itude

time

NOISE = individual pixel feature

signalnoise

bdquosaferdquo region

ExampleFHR lt 10-5

Efficiency gt 95

PRELIMINARY

19

Spatial Resolution (DUT)

Result for the DUT

σx= 33 micromσY= 33 microm

Spatial resolution DUT only

X (r

ow) b

ack

sens

or

Al heat sink

FEB

FEB

200 microm

Front sensor

Back sensor

π-Correlation back - front

X (row) front sensor

Reproducing the intrinsic parameters of the sensors validates the concept of the prototype

PRELIMINARY

20

Summary amp outlook

Summary

21

Mechanical integration

Achieved An ultra low material budget (03 X0) double-sided micro-tracking

device 2x2 sensors CVD Diamond glue amp FPC Development of tools amp assembly procedures

DAQAchieved

Synchronization Reliability Scalability Slow control amp monitoring tools Data quality

Dataanalysis

Achieved package for alignment and data analysis for test beam setup

(telescope-DUT) online monitoring software (test beam setup)

22

Outlook p 1

DAQ

Dataanalysis

Towards the CBM-MVD Interface to the CBM DAQ Optical data link between FEE and DAQ board

Towards the CBM-MVD Optimizing the digitizer based on data on sensor response Performance studies of physics cases allowing for more realistic

studies on detector performance

Mechanical integration

Towards the CBM-MVD Vacuum compatibility and integration into the CBM-MVD vacuum box

design the MVD platform in the target vacuum chamber cable routing finalize services (LV cooling)

Improve in heat transfer Quality assurance while assembling (yields)

Outlook p 2

23

Expertise needed in the future Glue dedicated radiation tolerant reworkable

dispensing techniques Vacuum feed-through concepts MVD stations

positioning Cooling CO2 or conventional

Mechanical integration

Synergy with FAIR

experiment (and

beyond) needed

How to move the MVD stations in vacuum

24

Thank you for your attention

• Slide 1
• Outline
• Slide 3
• Slide 4
• Slide 5
• Slide 6
• Slide 7
• Slide 8
• Slide 9
• Slide 10
• Tests before beam time
• Slide 12
• DAQ performance during beam tests
• Slide 14
• Data analysis
• Slide 16
• Cluster multiplicity studies
• Detection Efficiency (DUT)
• Spatial Resolution (DUT)
• Slide 20
• Summary
• Outlook p 1
• Outlook p 2
• Slide 24

19

Spatial Resolution (DUT)

Result for the DUT

σx= 33 micromσY= 33 microm

Spatial resolution DUT only

X (r

ow) b

ack

sens

or

Al heat sink

FEB

FEB

200 microm

Front sensor

Back sensor

π-Correlation back - front

X (row) front sensor

Reproducing the intrinsic parameters of the sensors validates the concept of the prototype

PRELIMINARY

20

Summary amp outlook

Summary

21

Mechanical integration

Achieved An ultra low material budget (03 X0) double-sided micro-tracking

device 2x2 sensors CVD Diamond glue amp FPC Development of tools amp assembly procedures

DAQAchieved

Synchronization Reliability Scalability Slow control amp monitoring tools Data quality

Dataanalysis

Achieved package for alignment and data analysis for test beam setup

(telescope-DUT) online monitoring software (test beam setup)

22

Outlook p 1

DAQ

Dataanalysis

Towards the CBM-MVD Interface to the CBM DAQ Optical data link between FEE and DAQ board

Towards the CBM-MVD Optimizing the digitizer based on data on sensor response Performance studies of physics cases allowing for more realistic

studies on detector performance

Mechanical integration

Towards the CBM-MVD Vacuum compatibility and integration into the CBM-MVD vacuum box

design the MVD platform in the target vacuum chamber cable routing finalize services (LV cooling)

Improve in heat transfer Quality assurance while assembling (yields)

Outlook p 2

23

Expertise needed in the future Glue dedicated radiation tolerant reworkable

dispensing techniques Vacuum feed-through concepts MVD stations

positioning Cooling CO2 or conventional

Mechanical integration

Synergy with FAIR

experiment (and

beyond) needed

How to move the MVD stations in vacuum

24

Thank you for your attention

• Slide 1
• Outline
• Slide 3
• Slide 4
• Slide 5
• Slide 6
• Slide 7
• Slide 8
• Slide 9
• Slide 10
• Tests before beam time
• Slide 12
• DAQ performance during beam tests
• Slide 14
• Data analysis
• Slide 16
• Cluster multiplicity studies
• Detection Efficiency (DUT)
• Spatial Resolution (DUT)
• Slide 20
• Summary
• Outlook p 1
• Outlook p 2
• Slide 24

20

Summary amp outlook

Summary

21

Mechanical integration

Achieved An ultra low material budget (03 X0) double-sided micro-tracking

device 2x2 sensors CVD Diamond glue amp FPC Development of tools amp assembly procedures

DAQAchieved

Synchronization Reliability Scalability Slow control amp monitoring tools Data quality

Dataanalysis

Achieved package for alignment and data analysis for test beam setup

(telescope-DUT) online monitoring software (test beam setup)

22

Outlook p 1

DAQ

Dataanalysis

Towards the CBM-MVD Interface to the CBM DAQ Optical data link between FEE and DAQ board

Towards the CBM-MVD Optimizing the digitizer based on data on sensor response Performance studies of physics cases allowing for more realistic

studies on detector performance

Mechanical integration

Towards the CBM-MVD Vacuum compatibility and integration into the CBM-MVD vacuum box

design the MVD platform in the target vacuum chamber cable routing finalize services (LV cooling)

Improve in heat transfer Quality assurance while assembling (yields)

Outlook p 2

23

Expertise needed in the future Glue dedicated radiation tolerant reworkable

dispensing techniques Vacuum feed-through concepts MVD stations

positioning Cooling CO2 or conventional

Mechanical integration

Synergy with FAIR

experiment (and

beyond) needed

How to move the MVD stations in vacuum

24

Thank you for your attention

• Slide 1
• Outline
• Slide 3
• Slide 4
• Slide 5
• Slide 6
• Slide 7
• Slide 8
• Slide 9
• Slide 10
• Tests before beam time
• Slide 12
• DAQ performance during beam tests
• Slide 14
• Data analysis
• Slide 16
• Cluster multiplicity studies
• Detection Efficiency (DUT)
• Spatial Resolution (DUT)
• Slide 20
• Summary
• Outlook p 1
• Outlook p 2
• Slide 24

Summary

21

Mechanical integration

Achieved An ultra low material budget (03 X0) double-sided micro-tracking

device 2x2 sensors CVD Diamond glue amp FPC Development of tools amp assembly procedures

DAQAchieved

Synchronization Reliability Scalability Slow control amp monitoring tools Data quality

Dataanalysis

Achieved package for alignment and data analysis for test beam setup

(telescope-DUT) online monitoring software (test beam setup)

22

Outlook p 1

DAQ

Dataanalysis

Towards the CBM-MVD Interface to the CBM DAQ Optical data link between FEE and DAQ board

Towards the CBM-MVD Optimizing the digitizer based on data on sensor response Performance studies of physics cases allowing for more realistic

studies on detector performance

Mechanical integration

Towards the CBM-MVD Vacuum compatibility and integration into the CBM-MVD vacuum box

design the MVD platform in the target vacuum chamber cable routing finalize services (LV cooling)

Improve in heat transfer Quality assurance while assembling (yields)

Outlook p 2

23

Expertise needed in the future Glue dedicated radiation tolerant reworkable

dispensing techniques Vacuum feed-through concepts MVD stations

positioning Cooling CO2 or conventional

Mechanical integration

Synergy with FAIR

experiment (and

beyond) needed

How to move the MVD stations in vacuum

24

Thank you for your attention

• Slide 1
• Outline
• Slide 3
• Slide 4
• Slide 5
• Slide 6
• Slide 7
• Slide 8
• Slide 9
• Slide 10
• Tests before beam time
• Slide 12
• DAQ performance during beam tests
• Slide 14
• Data analysis
• Slide 16
• Cluster multiplicity studies
• Detection Efficiency (DUT)
• Spatial Resolution (DUT)
• Slide 20
• Summary
• Outlook p 1
• Outlook p 2
• Slide 24

22

Outlook p 1

DAQ

Dataanalysis

Towards the CBM-MVD Interface to the CBM DAQ Optical data link between FEE and DAQ board

Towards the CBM-MVD Optimizing the digitizer based on data on sensor response Performance studies of physics cases allowing for more realistic

studies on detector performance

Mechanical integration

Towards the CBM-MVD Vacuum compatibility and integration into the CBM-MVD vacuum box

design the MVD platform in the target vacuum chamber cable routing finalize services (LV cooling)

Improve in heat transfer Quality assurance while assembling (yields)

Outlook p 2

23

Expertise needed in the future Glue dedicated radiation tolerant reworkable

dispensing techniques Vacuum feed-through concepts MVD stations

positioning Cooling CO2 or conventional

Mechanical integration

Synergy with FAIR

experiment (and

beyond) needed

How to move the MVD stations in vacuum

24

Thank you for your attention

• Slide 1
• Outline
• Slide 3
• Slide 4
• Slide 5
• Slide 6
• Slide 7
• Slide 8
• Slide 9
• Slide 10
• Tests before beam time
• Slide 12
• DAQ performance during beam tests
• Slide 14
• Data analysis
• Slide 16
• Cluster multiplicity studies
• Detection Efficiency (DUT)
• Spatial Resolution (DUT)
• Slide 20
• Summary
• Outlook p 1
• Outlook p 2
• Slide 24

Outlook p 2

23

Expertise needed in the future Glue dedicated radiation tolerant reworkable

dispensing techniques Vacuum feed-through concepts MVD stations

positioning Cooling CO2 or conventional

Mechanical integration

Synergy with FAIR

experiment (and

beyond) needed

How to move the MVD stations in vacuum

24

Thank you for your attention

• Slide 1
• Outline
• Slide 3
• Slide 4
• Slide 5
• Slide 6
• Slide 7
• Slide 8
• Slide 9
• Slide 10
• Tests before beam time
• Slide 12
• DAQ performance during beam tests
• Slide 14
• Data analysis
• Slide 16
• Cluster multiplicity studies
• Detection Efficiency (DUT)
• Spatial Resolution (DUT)
• Slide 20
• Summary
• Outlook p 1
• Outlook p 2
• Slide 24

24

Thank you for your attention

• Slide 1
• Outline
• Slide 3
• Slide 4
• Slide 5
• Slide 6
• Slide 7
• Slide 8
• Slide 9
• Slide 10
• Tests before beam time
• Slide 12
• DAQ performance during beam tests
• Slide 14
• Data analysis
• Slide 16
• Cluster multiplicity studies
• Detection Efficiency (DUT)
• Spatial Resolution (DUT)
• Slide 20
• Summary
• Outlook p 1
• Outlook p 2
• Slide 24