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© 2015 TechSearch International, Inc.
IoT and the Impact on MEMS and Sensors Packaging
E. Jan Vardaman President and Founder
TechSearch International, Inc.
www.techsearchinc.com
© 2015 TechSearch International, Inc.
What is IoT?
• Internet of Things…..Cisco’s Internet of Everything
• IoT means connectivity – More than just WiFi – Does the growth of IoT increase the demand for
MEMs and Sensors? – What special packages are required for MEMS and
Sensors in Connected Devices?
© 2015 TechSearch International, Inc.
Connected Device Market: It’s Growing
• Market growth for connected devices according to Cisco • Morgan Stanley wearable electronics growth rate of 154% • Shipments projected to increase from 6 million units in 2013 to
248 million units in 2017
© 2015 TechSearch International, Inc.
Growth Drives MEMS and Sensors
• MEMS and sensors growth driven by growth in wearable electronics • Many different packages for wearable electronics
© 2015 TechSearch International, Inc.
IoT: More Than Just a Watch or Fitness Band!
• Collection data • Monitoring data • Storing data (medical
record, mobile payment information, industrial info, driving data, insurance data, etc.)
• Analyzing data • Yes, IoT means
connectivity • Yes, and keeping data
secure
Source: Progressive.
Progressive Snapshot Morgan Stanley reports over 6 years 10 billion miles worth of driving data (100+ terabytes) collected
© 2015 TechSearch International, Inc.
MEMS and Sensors for Connected Devices
• Accelerometers and Gyroscopes for motion sensing
• Pressure sensors • High precision light sensors to accurately
measure blood flow • Sensors to accurately calculate heart rate • Blood pressure monitors (need higher
accuracy) • Glucose monitoring • Pulse monitors for runners etc. • Others…….. • But, sensors have to function properly!!
– Many examples of heart rate or blood pressure sensors that don’t measure accurately
– Limits product adoption: “Users will stop using the devices and enterprises will not adopt the technology if data is not accurate”
MEMS Accelerometer STMicroelectronics
© 2015 TechSearch International, Inc.
Low-Power Optimized MCU for Fitness Band
• Trade-off in design is power vs. performance • Processor is constantly analyzing data from sensor • Device does not get to go into “sleep mode” • Improved battery life becomes key to product success
Bluetooth LE!transceiver System logic
Sensor subsystem
UART
GPO
USB!host/!OTG
Timers
NVM/!SRAM
ADC/!DAC
CPU
I2C SPI
Sensors• Accelerometer!• Compass
• Heart rate!• Gyroscope
MCU
Customer/!third-party IP
Other!DesignWare IP
ARC and!subsystem IP
Source: Synopsys via Semiconductor Engineering
© 2015 TechSearch International, Inc.
Recent MEMS Developments
• Wafer level technology being adopted – Cavendish Kinetics with its RF MEMS tuning solution for LTE
smartphones and wearable devices using STATS ChipPAC WLP for small form factor
– Die thickness after back grinding 0.39 mm – Total package height + solder ball 0.55 mm – Lead count of 9 – 2X higher data rates and improved battery life (40%) – Future RF antenna developments
• TSMC developments in MEMS – SoC and MEMS in one chip (CMOS integration, deposition of
material on top of silicon) – Last year accelerometer (motion sensor) – This year pressure sensors – Future gyroscope – Future monolithic microphone
© 2015 TechSearch International, Inc.
Apple’s Watch Board and Packages
• Almost no leadframe packages • Mostly area array packages
– FBGAs – WLPs
• Expected to use WiFi module with WLP • No board space available: Need greater use of WLP or System-in-Package (SiP)
Source: Apple.
© 2015 TechSearch International, Inc.
Sensor Examples in Apple’s Watch
• STMicroelectronics digital gyroscope and accelerometer
– Reported by Chipworks to be packaged in 3mm x 3mm LGA
– 6 axis sensor in a single component
– MEMS sensor and control ASIC stacked together
– Wire bonded • STMicroelectronics optical
emitter/sensor encoder die • Knowles microphone
Source: Apple.
© 2015 TechSearch International, Inc.
System-in-Package: Key to Connected Devices • Apple Watch SiP reported by
Chipworks to have >30 components – Some multiple die such as PoP – Package is only 26 mm x 28 mm – Overmolded
• Renesas and Link Labs radio module for machine-to-machine communication
– Renesas microcontroller – Semtech long distance radio
transceiver – Applications including security
monitoring, agricultural monitoring, home automation, smart meters
• Samsung Electronics Artik modules – Contains processors, memory,
communication chips, and software
– All essential elements for connected gadgets
Source: Samsung.
© 2015 TechSearch International, Inc.
Medical Connected Devices
Source: IPDiA.
• Traditional medical implantables
• From fitness accessory to clinical tool
• Wearable technology to help senior citizens remain mobile and live independent lives
• Non-invasive wearable transdermal microsystems for continuous monitoring
• Textiles for muscle stimulation, continuous ECG monitoring, etc.
• Wearables with sensors for targeted clinical applications in disease treatment
© 2015 TechSearch International, Inc.
No One Package Solution Fits All! • Packaging options (found in today’s products)
– BGA, FBGA – Flex circuit CSP – LGA (including MCM) – Chip-on-board (COB) – PoP – Stacked die CSP – Leadframe packages such as QFN, SOP, TSOP – Ceramic packages – Integrated passive devices – WLP – Embedded die – SiP
• Packaging options (emerging) – FO-WLP – MIS package (leadframe versions with mold compound
as underfill and substrate) • Cost/Performance trade-off determines adoption, but Cost
and Form Factor are key
© 2015 TechSearch International, Inc.
MEMS Package Requirements
• Specialized interface with outside world and exposure to corrosive gases or fluids such as pressure sensors, fluidic devices
• Vacuum packaging, hermeticity • Protection from moisture-sensitive capacitive devices
will get signal errors • High-temperature operation, such as in-cylinder
pressure sensors operating at 1,000°C • Challenging assembly processes, such as wire bonding
to vertical surfaces • Sensitivity to vibration and shock during processing
steps such as grinding or pick-and-place
© 2015 TechSearch International, Inc.
MEMS Packaging Complexity Many options and cost / performance considerations
Cavity or overmold?
Wire bond or flip chip?
Die attach method?
EMI shielding?
Laminate or leadframe?
Wire type, loop radius and gage?
Molded-in stress?
Leaded or not?
Encapsulation? Green material?
Stacked die or side-by-side?
How/what to test?
Source: Amkor Technology
© 2015 TechSearch International, Inc.
Amkor MEMS & Sensor Packaging Evolution
DLP® courtesy of TI
Broad range of point solutions
Focused platforms
Transition from Custom Packaging to
High Volume Manufacturing
ChipArray® -Cavity
MLF® -Cavity (in-line or FAM)
ChipArray® -Molded
MLF® -Molded
LF-Cavity (pre-mold or FAM)
WLCSP
Source: Amkor Technology
© 2015 TechSearch International, Inc.
MEMS Reliability • Failure modes and mechanisms are more complex • Number of potential failure modes and mechanisms is
larger • Some failures, such as collisions or sticking of movable
parts, are transient and thus hard to identify or locate • Packages contain multiple components and MEMS
device failure must be differentiated from an ASIC failure
• Failure criteria are device- and application-specific • Standard destructive failure analysis can result in
erroneous conclusions due to sample preparation problems, therefore physical analysis must often b combined with modeling to identify the most probable failure sites
• Monitoring instruments may be exposed to the loading conditions, such as temperature excursions, mechanical shock, or vibration, and may need to be checked for degradation themselves
© 2015 TechSearch International, Inc.
Connected Device Product Requirements?
• What are reliability requirements? – Lifetime? – Environmental exposure (UV light, sweat,
stress, washer/dryer, cleaning fluids, mud, dust, wafer, sunscreen, etc.)
• Fitness activity bands – Polymer encased electronics – Components must survive mold process
temperatures – Must withstand twist, bend, flex compression – Must not react with bodily and environmental
fluids • Need special reliability tests
– Drop test (is it shock proof?) – Thermal stress (simulation) – Is it moisture resistant?
© 2015 TechSearch International, Inc.
Conductive Fabrics • Knitting or weaving conductive threads into textiles
– Metalized threads with allow of silver, copper, tin, nickel – Deposition or coating of conductive polymers – Printing conductive inks – UK’s NPL development of stretch nylon fabric processed using its
technology (nano-silver coating of fibers)
Source: NPL.
© 2015 TechSearch International, Inc.
Conclusions
• Many different products
• Many different package types (traditional MEMS packages vs. new packages required for connected products)
• May need new reliability tests
• May need new materials to achieve realization of future product designs